When we said AMD was readying a presentation on their Ryzen 9 3950X CPUs to awe crowds at E3, we weren't thinking of something of this magnitude. But apparently, it's true: a Geekbench test result has shown AMD's $750, 16 core, 32 thread Ryzen 9 9 3950X beating Intel's 18 core, 36 thread $2,000 i9-9980XE monster. Now, you may be thinking: ok, it beat it because of AMD's announced 4.7 GHz boost, and did so only on single threaded performance, obviously... but you would be wrong.

The Geekbench scores show AMD's Ryzen 9 3950X delivering 5,868 points in single, and 61,072 points in multicore workloads. Intel's i9-9980XE, on the other hand, scores just 5,391 single core, and 46,876 multicore points (on average and at stock clocks of 3,000 MHz base and 3,400 MHz boost). This is an incredible performance difference (particularly in the multicore score), and was apparently done with an engineering sample for AMD's upcoming chip that didn't even run at its announced 4.3 GHz base and 4.7 GHz boost clocks, but at 3.3 GHz and 4.3 GHz respectively. AMD's 105 W TDP, 16 core chip beats Intel's 185 W TDP, 18 core one... Where has the world come? Take the usual dosage of NaCl, and let's keep things in perspective - even if AMD's Ryzen 9 3950X equals, and doesn't beat, Intel's i9-9980XE, it's still a huge win for the red company. Almost as big a win as that huge stone on Lisa's hand.

Intel has announced that Sandra Rivera will take on a new role as the company's chief people officer and executive vice president, reporting to CEO Bob Swan. She will lead the human resources organization and serve as steward of Intel's culture evolution as it transforms to a data-centric company. Previously, Rivera was responsible for the Network Platforms Group, and served as Intel's 5G executive sponsor.

"Sandra is a role model for an Intel that is customer obsessed, collaborative and fearless while firmly grounded in trust, transparency and inclusivity. I am thrilled that Sandra will lead this critical part of our strategy to power a data-centric world," Swan said. "In a company driven by deep, technical talent, Sandra is an excellent technical leader who builds successful businesses by first building great teams. I am confident Sandra, as chief people officer, will help us accelerate our transformation and position our Intel team to play a bigger role in our customers' success."

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is excited to announce that 23 overclocking records in various benchmark categories were broken during the Computex 2019 time frame, including the world record for the fastest memory frequency, all using G.SKILL DDR4 memory kits built with high performance Samsung 8Gb components, the latest Intel processors, and high performance motherboards.

This week at the G.SKILL Computex booth, a new world record for fastest memory frequency was set by Toppc, a renowned professional extreme overclocker, reaching an incredible DDR4-5886MHz using the Trident Z Royal memory on a MSI MPG Z390I GAMING EDGE AC motherboard and an Intel Core i9-9900K processor. At the end of Computex 2019, the top two results for the fastest memory frequency are set by team MSI using an identical hardware setup.

Last year, with the introduction of the Intel Z390 chipset, there was a spate of so-called "double capacity DIMMs" or DC DIMMs, tall memory modules with two rows of DRAM chips, which added up to 32 GB per DIMM. You needed a Z390 platform and a 9th generation Core processor that supported up to 128 GB of memory, to use these things. With the introduction of 16 Gb DDR4 DRAM chips by both Micron and Samsung, JEDEC-compliant 32 GB unbuffered DIMMs of standard height are finally possible, and ADATA put together the first of these, shown off at Computex 2019.

The AD4U2666732GX16 is a 32-gigabyte dual-rank unbuffered DIMM made using 16 Gb chips supplied by Micron Technology. The modules tick at JEDEC-standard DDR4-2666 speeds, at a module voltage of 1.2 Volts. ADATA didn't disclose timings. The 16 Gb DRAM chips are made by Micron in an advanced (3rd generation) 10 nm-class silicon fabrication process to achieve the desired transistor-density. 32 GB DIMMs are expected to hit critical-mass in 2H-2019/2020, with the advent of AMD's 3rd generation Ryzen "Matisse," and Intel's "Ice Lake-S" desktop processors. Memory manufacturers are also expected to put out speedy and highly-compatible single-rank 16-gigabyte DIMMs using 16 Gb chips, which could finally make 32 GB dual-channel the mainstream memory configuration, moving up from half a decade of 2x 8 GB.

ASUS today rolled out the latest in its series of M.2 NVMe RAID add-on cards, the Hyper M.2 x16 Card V2. A successor to a similar card ASUS released back in 2017, this one comes with improved electrical components, so each of its four slots is guaranteed to put out 14 Watts of power. The card splits a PCI-Express 3.0 x16 link to four M.2-22110 slots, each with PCI-Express 3.0 x4 wiring. There's no PCIe switch logic involved, so your motherboard is required to support PCIe lane segmentation (most HEDT motherboards since 2016 do). The card supports Intel VROC (virtual RAID on CPU), and is tested to work on AMD Ryzen Threadripper processors. ASUS didn't change the thermal solution. You still get a chunky aluminium shroud covering the whole card, and lateral-flow fan pushing air across the drives, which can be turned off. The company didn't reveal pricing.

AMD senior technical marketing manager Robert Hallock, responding to a specific question on Twitter, confirmed that the 3rd generation Ryzen processors do feature soldered integrated heatspreaders (IHS). Soldering as an interface material is preferred as it offers better heat transfer between the processor die and the IHS, as opposed to using a fluid TIM such as pastes. "Matisse" will be one of the rare few examples of a multi-chip module with a soldered IHS. The package has two kinds of dies, one or two 7 nm "Zen 2" 8-core CPU chiplets, and one 14 nm I/O Controller die.

The most similar example of such a processor would be Intel's "Clarkdale" (pictured below), which has its CPU cores sitting on a 32 nm die, while the I/O, including memory controller and iGPU, are on a separate 45 nm die. On-package QPI connects the two. Interestingly, Intel used two different sub-IHS interface materials for "Clarkdale." While the CPU die was soldered, a fluid TIM was used for the I/O controller die. It would hence be very interesting to see if AMD solders both kinds of dies under the "Matisse" IHS, or just the CPU chiplets. Going by Hallock's strong affirmative "Like a boss," we lean toward the possibility of all dies being soldered.Image Credit: TheLAWNOOB (OCN Forums)

At Computex 2019, we spotted three new socket LGA2066 motherboards from GIGABYTE, and several other manufacturers. At its Computex 2019 keynote, Intel announced that in Q3 2019, the company is launching new Core X series HEDT processor models "for creators." When combined with the handful new LGA2066 motherboard models we've spotted, it becomes highly likely that the processors Intel is launching this Fall could be LGA2066-compatible. Without further ado, the X299G Aorus Master, the X299G Aorus Xtreme Waterforce, and the X299G Designare 10G.

The X299G Aorus Master is different from the X299 Aorus Master launched last November, and the X299G Designare 10G is different from the X299 Designare EX launched way back in 2017. The X299G Aorus Xtreme Waterforce is the first "Xtreme" sub-branded LGA2066 product. What's common to these three boards is out-of-the-box support for the upcoming HEDT processor models, besides 9th generation "Skylake-X" Refresh processors, and the original "Skylake-X" chips.

Intel laid rest to speculation that post 9th generation, it could replace its Core brand with something else. The 10th generation Core processors, built around the 10 nm "Ice Lake" microachitecture, will feature the first noteworthy IPC increments since "Skylake" thanks to their new "Sunny Cove" CPU cores. These will also feature DLBoost, a fixed-function matrix-multiplication hardware that speeds up deep-neural net building and training by 5x, as well as certain AVX-512 instructions. The cores will be optimized to cope with 2.4 Gbps 802.11ax Wi-Fi and faster Ethernet standards. The first of these chips will target mobile computing platforms, and will be quad-core parts like the dies pictured below. To save notebook PCB real-estate, Intel will put the processor and PCH dies into a multi-chip module. It will be quite a wait for the desktop implementation, but at least you know what their case-badges look like.

While its honestly staggering see how many products ASUS had on display at Computex this year, I think the number of laptops might take the cake. They had just about everyone imaginable on hand except a kitchen sink. The ROG lineup was represented by the Zephyrus M GU502, Zephyrus S GX502, Zephyrus G GA502, Strix Hero III, Strix SCAR III, and last but not least the Mothership. Meanwhile, the TUF Gaming brand demoed the FX705DU and FX505DU. More surprising is the fact AMD's Ryzen 3750H makes an appearance not only in the TUF Gaming laptops but in the Zephyrus series as well bringing a bit more selection to the once Intel dominated mobile market.

Taking a closer look at the Republic of Gamers lineup and our attention is immediately drawn to the ROG Mothership which due to its design is the most unique laptop on display here. Featuring a detachable keyboard with RGB lighting, eight heat pipes, liquid metal cooling, 4K G-SYNC display, Intel i9-8950H CPU overclocked, NVIDIA GeForce RTX 2080, and NVMe SSDs, it stands out from the crowd. Gone is the traditional clamshell if you so choose without sacrificing performance. It definitely proves to be an eye-catching product.

ASUS is aware that a new sub-class of speculative execution side-channel vulnerabilities in Intel CPUs, called Microarchitectural Data Sampling (MDS), also known as ZombieLoad, RIDL, and Fallout, may allow information disclosure. Intel states that selected 8th and 9th Generation Intel Core processors, as well as the 2nd Generation Intel Xeon Scalable processor family, are not vulnerable to MDS. If you are using one of these processors, no further action is necessary.

For other Intel processors, ASUS is working closely with Intel to provide a solution in a forthcoming BIOS update. We recommend owners of affected products update both the BIOS and operating system as soon as these mitigations are available. Please find our first-wave model list below and download the appropriate BIOS update from the ASUS Support website. More details, including affected systems, will be added to this document as they become available.

ZADAK announced today the immediate worldwide release of their latest ultra-high-performance RGB gaming memory module, the SPARK RGB DDR4. Firmly aimed at the high-end PC enthusiasts and gamers market, the SPARK RGB DDR4 brings together powerful memory module, overclocking capability and top-notch design elements to form a valuable addition to the ZADAK DDR4 family that is compatible with high-end motherboards.

SPARK RGB DDR4 modules are available in kits ranging from 16GB (2x8GB) up to 64GB (4x16GB) with the top-end models running at 4133 MHz. Overclocking is made simple with XMP 2.0 support allowing users to select their preferred profile for stable and reliable overclocking.

Remember that ludicrous Gigabyte bundle that mixed the company's most outrageously expensive motherboard with a cherry-picked Intel Core i9-9900K overclocked to 5.1 GHz? Well, it's finally available, if that's your particular kind of beach, and the pricing is better than was expected. Solo, the motherboard sets you back $999, while a cherry-picked Intel Core i9-9900K at 5.1 GHz would set you back some $939 in houses such as Silicon Lottery. However, Gigabyte have confirmed that the bundle pricing for these components for the US stands at $1,699 - which really isn't too shabby, if you consider the motherboard to have sufficient bang for your buck.

As if the mother of all ironies, prior to its effective death-sentence dealt by the U.S. Department of Commerce, Huawei's server business developed an ambitious product roadmap for its Fusion Server family, aligning with Intel's enterprise processor roadmap. It describes in great detail the key features of these processors, such as core-counts, platform, and I/O. The "Sapphire Rapids" processor will introduce the biggest I/O advancements in close to a decade, when it releases sometime in 2021.

With an unannounced CPU core-count, the "Sapphire Rapids-SP" processor will introduce DDR5 memory support to the data-center, which aims to double bandwidth and memory capacity over the DDR4 generation. The processor features an 8-channel (512-bit wide) DDR5 memory interface. The second major I/O introduction is PCI-Express gen 5.0, which not only doubles bandwidth over gen 4.0 to 32 Gbps per lane, but also comes with a constellation of data-center-relevant features that Intel is pushing out in advance as part of the CXL Interconnect. CXL and PCIe gen 5 are practically identical.

The trade ban imposed on Chinese tech giant Huawei by the U.S. Department of Commerce, and ratified through an Executive Order by President Donald Trump, is cutting both ways. Not only are U.S. entities banned from importing products and services from Huawei, but also engaging in trade with them (i.e. selling to them). U.S. tech firms stare at a $11 billion revenue loss by early estimates. Wall Street firm Goldman Sachs compiled a list of companies impacted by the ban, and the extent of their revenue loss. It turns out that AMD isn't a small player, and in fact, stands to lose more revenue in absolute terms than even Microsoft. It earns RMB 268 million (USD $38.79 million) from Huawei, compared to Microsoft's RMB 198 million ($28.66 million). Intel's revenue loss is a little over double that of AMD at RMB 589 million ($84 million), despite its market-share dominance.

That's not all, AMD's exposure is higher than that of Intel, since sales to Huawei make up a greater percentage of AMD's revenues than it does Intel's. AMD exports not just client-segment products such as Ryzen processors and Radeon graphics, but possibly also EPYC enterprise processors for Huawei's server and SMB product businesses. NVIDIA is affected to a far lesser extent than Intel, AMD, and Microsoft. Qualcomm-Broadcom take the biggest hit in absolute revenue terms at RMB 3.5 billion ($508 million), even if their exposure isn't the highest. The duo export SoCs and cellular modems to Huawei, both as bare-metal and licenses. Storage hardware makers aren't far behind, with the likes of Micron, Seagate, and Western Digital taking big hits. Micron exports DRAM and SSDs, while Seagate and WDC export hard drives.

Intel was the historic leader in silicon manufacturing and sales from 1993 through 2016, the year it lost its lead to Samsung. The issue wasn't so much to do with Intel, but more to do with market demands at the time - if you'll remember, it was the time of booming DRAM pricing alongside the smartphone demand increase that propagated stiff competition and manufacturers trying to outgun one another in the form of specs. The DRAM demand - and its ridiculous prices, at the time - propelled Samsung towards the top spot in terms of revenue, leaving Intel in the dust.

However, with the decrease in DRAM pricing following the reduce in smartphone demand and increased manufacturing capabilities of semiconductor manufacturers, which flooded the market with product that is being more slowly digested, has led to the drop of the previously-inflated Dram pricing, thus hitting Samsung's revenues enough for Intel to again become "top dog" in the silicon manufacturing world - even as the company struggles with its 10 nm rollout and faced supply issues of their own. As IC Insights puts it, "Intel replaced Samsung as the number one quarterly semiconductor supplier in 4Q18 after losing the lead spot to Samsung in 2Q17. (...) With the collapse of the DRAM and NAND flash markets over the past year, a complete switch has occurred, with Samsung having 23% more total semiconductor sales than Intel in 1Q18 but Intel having 23% more semiconductor sales than Samsung just one year later in 1Q19!".

The United States tech industry has overnight dealt a potentially fatal blow to Chinese electronics giant Huawei, by boycotting the company. The companies are establishing compliance with a recent Executive Order passed by President Donald Trump designed to "stop the import, sale, and use of equipment and services by foreign companies based in countries that are potential adversaries to U.S. interests," particularly information technology security. Google has announced that it will no longer allow Huawei to license Android, and will stop updates and Google Play access to Huawei smartphones. Huawei can still equip its phones with open-source Android, but it cannot use Google's proprietary software, including Google Play Store, Chrome, and all the other Google apps. Intel decided to no longer supply processors and other hardware to Huawei, for use in its laptops and server products. Sales of AMD processors will stop, too. Qualcomm-Broadcom have decided to stop supply of mobile SoCs and network PHYs, respectively. Microsoft decided to stop licensing Huawei to use Windows and Office products.

The ban is a consequence of the U.S. Government placing Huawei on a list of banned entities, forcing all U.S. companies to abandon all trade with it, without prior approval from the Department of Commerce. Trade cuts both ways, and not only are U.S. firms banned from buying from Huawei, they're also banned from selling to it. Huawei "buys from" over 30 U.S. companies, (for example, Windows licenses from Microsoft). CNN reports that U.S. firms could lose up to $11 billion in revenues.

ZOTAC Technology, a global manufacturer of innovation, today introduced the more capable ZBOX Q Series Mini Creator PC featuring the advanced NVIDIA Quadro GPU and powerful workstation focused Intel Xeon processor. The new addition to the ZBOX Q Series leverages the ZBOX Mini PC's sleek and minimal design without compromising the powerful hardware components inside. From stunning industrial design and advanced special effects, to complex scientific visualization and sophisticated data modeling, to creating and editing images and videos, the ZBOX Q Series enables limitless creations.

The new ZBOX Q Series features the industry certified NVIDIA Quadro with up to 16GB GDDR5 memory. It's a tested and certified fully compatible hardware on many major professional design applications. The new Q Series models come equipped with an Intel Xeon processor to deliver fast and responsive performance.

Cybersecurity researchers at the Vrije Universiteit Amsterdam, also known as VU Amsterdam, allege that Intel tried to bribe them to suppress knowledge of the latest processor security vulnerability RIDL (rogue in-flight data load), which the company made public on May 14. Dutch publication Nieuwe Rotterdamsche Courant reports that Intel offered to pay the researchers a USD $40,000 "reward" to allegedly get them to downplay the severity of the vulnerability, and backed their offer with an additional $80,000. The team politely refused both offers.

Intel's security vulnerability bounty program is shrouded in CYA agreements designed to minimize Intel's losses from the discovery of a new vulnerability. Under its terms, once a discoverer accepts the bounty reward, they enter into a NDA (non-disclosure agreement) with Intel, to not disclose their findings or communicate in the regard with any other person or entity than with certain authorized people at Intel. With public knowledge withheld, Intel can work on mitigation and patches against the vulnerability. Intel argues that information of vulnerabilities becoming public before it's had a chance to address them would give the bad guys time to design and spread malware that exploits the vulnerability. This is an argument the people at VU weren't willing to buy, and thus Intel is forced to disclose RIDL even as microcode updates, software updates, and patched hardware are only beginning to come out.Update: (17/05): An Intel spokesperson commented on this story.

Apple has advised users that they should disable Intel's Hyper-Threading feature on the company's computers due to the recently exposed MDS vulnerabilities. Citing internal testing, Apple said that users can expect an up to 40% performance loss in such a scenario (depending on system and workload, naturally) in various benchmarks and multithreaded workloads. The performance loss is understandable - you're essentially halving the number of threads available for your CPU to process data.

Like Intel said, it becomes an issue of how much users value their performance compared to the security risks involved: a classic risk/benefit scenario, which shouldn't ever be in the equation, after all. If users buy a system with a CPU that has known performance levels, they will obviously expect those to be valid for the longevity of the product, unless otherwise stated and considering operational variances that fall within a margin of error/product obsolescence. Halving your performance because of a design flaw that resulted from an effort to achieve higher and higher IPC increases doesn't strike as a way to inspire confidence in your products.

ASRock today rolled out the Z390 Phantom Gaming 4S motherboard. Clearly built to a cost, the board ships with a narrow ATX PCB, and is positioned below both the Z390 Phantom Gaming 4 and the Z390 Pro4. It draws power from a 24-pin ATX and an 8-pin EPS, conditioning it for the CPU with a 6+2 phase VRM. The LGA1151 socket is wired to four DDR4 DIMM slots, and a single PCI-Express 3.0 x16. The second x16 slot is electrically x4 and wired to the PCH. An M.2 PCIe E-key slot (for WLAN cards) and three open-ended PCIe 3.0 x1 slots make for the rest of the expansion area. Storage connectivity includes just the one M.2-22110 slot (PCI-Express 3.0 x4 and SATA 6 Gbps wiring), and six SATA 6 Gbps ports.

Display outputs include just the one HDMI port. USB connectivity includes eight USB 3.2 gen 1 ports, four on the rear panel, four by headers. The board's sole 1 GbE network interface is driven by an Intel i219-V controller. The onboard audio solution combines a rather premium Realtek ALC1220 CODEC with 6-channel analog output, audio-grade capacitors, and ground-layer isolation. Separate PS/2 ports, one 3-pin addressable-RGB, two 4-pin RGB, and five 4-pin PWM fan headers make for the rest of this board. We expect this to be ASRock's cheapest Z390 offering, priced between USD $110-120.

Intel released CPU microcode updates to address four new security vulnerabilities disclosed by the company on May 14, 2019. These microcode updates can be encapsulated as motherboard UEFI firmware updates, and for some processors even distributed through Windows Update. In its Microcode Revision Guidance document put out on Tuesday, Intel revealed that all Core and Xeon processors going as far as the 2nd generation Core "Sandy Bridge" architecture are eligible for microcode updates.

2nd generation Core is roughly the time when motherboard vendors were forced to adopt UEFI (unrelated to these vulnerabilities). A number of low-power microarchitectures, such as "Gemini Lake," "Cherry View," "Apollo Lake," and "Amber Lake," which are basically all low-power processors released after 2012-13, also receive these updates. Until you wait for your motherboard vendor or PC/notebook OEM to pass on these microcode updates, Intel advises you to disable HyperThreading if your processor is older than 8th gen "Coffee Lake," and seek out the latest software updates.Additional slides follow.

Today Intel announced ModernFW - an experimental approach to building a minimum viable platform firmware for machines such as cloud server platforms. The reason for this software is that, while traditional PC Firmware has evolved over time and retained its backward compatibility, it has become very big and often inefficient.

So to meet the requirements of new platforms that need to be built quickly and adapted easily, Intel decided to offer a new software package that will help with that. The new firmware package targets x86_64 from ISA standpoint and Linux kernel based OSes.

AMD in a statement confirmed that its processors are unaffected by the RIDL (Rogue In-Flight Data Load) and Fallout vulnerabilities. The company however worded its statement in CYA language, just to be safe. "...we believe our products are not susceptible to 'Fallout' or 'RIDL' because of the hardware protection checks in our architecture. We have not been able to demonstrate these exploits on AMD products and are unaware of others having done so," reads the AMD statement put out late Tuesday (14th May).

AMD came to these conclusions on the basis of its own testing and discussions with the researchers who discovered RIDL. It's important to note here, that the "Fallout" vulnerability AMD is referring to in this statement is the one which is part of four MDS vulnerabilities Intel disclosed yesterday, and not the identically named "Fallout" vulnerability discovered by CTS Labs in 2018, allegedly affecting secure memory management of AMD "Zen" processors.

Intel Tuesday once again shook the IT world by disclosing severe microarchitecture-level security vulnerabilities affecting its processors. The Microarchitectural Data Sampling (MDS) class of vulnerabilities affect Intel CPU architectures older than "Coffee Lake" to a greater extent. Among other forms of mitigation software patches, Intel is recommending that users disable HyperThreading technology (HTT), Intel's simultaneous multithreading (SMT) implementation. This would significantly deplete multi-threaded performance on older processors with lower core-counts, particularly Core i3 2-core/4-thread chips.

On "safer" microarchitectures such as "Coffee Lake," though, Intel is expecting a minimal impact of software patches, and doesn't see any negative impact of disabling HTT. This may have something to do with the 50-100 percent increased core-counts with the 8th and 9th generations. The company put out a selection of benchmarks relevant to client and enterprise (data-center) use-cases. On the client use-case that's we're more interested in, a Core i9-9900K machine with software mitigation and HTT disabled is negligibly slower (within 2 percent) of a machine without mitigation and HTT enabled. Intel's selection of benchmarks include SYSMark 2014 SE, WebXprt 3, SPECInt rate base (1 copy and n copies), and 3DMark "Skydiver" with the chip's integrated UHD 630 graphics. Comparing machines with mitigations applied but toggling HTT presents a slightly different story.

Ouch doesn't even begin to describe how much that headline hurt. As far as speculative execution goes, it's been well covered by now, but here's a refresher. Speculative execution essentially means that your CPU tries to think ahead of time on what data may or may not be needed, and processes it before it knows it's needed. The objective is to take advantage of concurrency in the CPU design, keeping processing units that would otherwise be left idle to process and deliver results on the off-chance that they are indeed required by the system: and when they are called for, the CPU saves time by not having to process them on the fly and already having them available.

The flaws have been announced by Intel in coordination with Austrian university TU Graz, Vrije Universiteit Amsterdam, the University of Michigan, the University of Adelaide, KU Leuven in Belgium, Worcester Polytechnic Institute, Saarland University in Germany and security firms Cyberus, BitDefender, Qihoo360 and Oracle. While some of the parties involved have named the four identified flaws with names such as "ZombieLoad", "Fallout", and RIDL, or "Rogue In-Flight Data Load", Intel is using the PEGI-13 "Microarchitectural Data Sampling (MDS)" name.