News Posts matching "LGA1151"

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GIGABYTE Intros the B250M-Gaming 5 Motherboard

GIGABYTE today introduced the B250M-Gaming 5 motherboard. This micro-ATX socket LGA1151 board is targeted at performance-segment gaming PC builds, and features full RGB lighting over two multi-color LED elements near the CPU socket, and a multi-color LED lighting strip near the ATX power connector. There are also LEDs under the PCH heatsink and the audio ground layer isolation strip. The board is based on the Intel B250 Express chipset, and lacks support for CPU overclocking, or NVIDIA SLI. The CPU socket is wired to four DDR4 DIMM slots (reinforced), and one PCI-Express 3.0 x16 slot. The second x16 slot is gen 3.0 x4 and wired to the PCH. Two other gen 3.0 x1 slots make for the rest of the expansion area.

Storage connectivity on the B250M-Gaming 5 includes six SATA 6 Gb/s ports, and a 32 Gb/s M.2 slot. Display outputs include DVI and HDMI. Networking is care of a single gigabit Ethernet interface, driven by an Intel-made controller. GIGABYTE deployed its AMP-UP onboard audio solution, with an 8-channel HD audio CODEC that boasts of 120 dBA SNR, a headphones amp, audio-grade electrolytic capacitors, and ground-layer isolation. USB ports include four USB 3.1 ports (two on the rear panel, including a type-C port, and two ports through headers); and six USB 3.0 ports. Other features include GIGABYTE's dual-UEFI BIOS. The company didn't reveal pricing, although one could expect this one to be priced around the $100 mark.

ASUS Intros the B150M Expedition Motherboard

ASUS' new line of PC hardware targeted at gaming iCafes under the Expedition brand grows, with its first motherboard, the B150M Expedition (model: EX-B150M-V5 D3). These products are designed to be durable enough for the rigors of gaming iCafes, at affordable prices, though not as apocalypse-survivalist as the company's coveted TUF series. The B150M Expedition is a socket LGA1151 motherboard with DDR3 memory support. It features two memory slots that support up to 16 GB of dual-channel DDR3-1866 memory. The memory slots have an anti-theft feature that lets you screw-in the modules to the slots.

The narrow micro-ATX board draws power from a combination of 24-pin ATX and 8-pin EPS power connectors, and conditions it for the CPU with a 7-phase VRM. Expansion slots include one PCI-Express 3.0 x16, and two PCI-Express 3.0 x1. Storage connectivity includes four SATA 6 Gbps ports. USB connectivity includes eight USB 3.0 ports (six on the rear panel, two via headers). Networking is care of a single gigabit Ethernet interface driven by a Realtek RTL8111GR controller. ASUS deployed the gaming-grade Crystal Audio 2 onboard audio solution, with a Realtek ALC887 6-channel HD audio CODEC, ground-layer isolation, audio-grade capacitors, and a headphones amp. The board also features a PS/2 port for legacy input devices. ASUS didn't disclose pricing.

Light Up Your Gaming with Biostar B250 Motherboard Series

BIOSTAR is proud to announce its line-up of new motherboards based on the Intel B250 chipset as part of the 2nd-generation RACING series family of products with the announcement of the BIOSTAR RACING B250GT5 and B250GT3. Both motherboards support Intel's 7th-generation Core processors as well as native support for Intel Optane Memory technology for next-generation high-speed storage.

BIOSTAR Announces Line-up of Z270 Motherboards

BIOSTAR is proud to announce the full line-up for the new 2nd-generation RACING series motherboards featuring support for Intel's 7th-generation Core processors. Following the announcement last week of the flagship RACING Z270GT9, today BIOSTAR proudly announces the different level products of the new RACING series family with the introduction of the RACING Z270GT8, RACING Z270GT6 and RACING Z270GT4 motherboards featuring the latest technology from BIOSTAR inspired by the quest for the best in gaming features. The 2nd-gen RACING series Z270 motherboard lineup brings a new level of gaming experience and performance-oriented motherboards to gamers and enthusiasts.

Eurocom Launches the 15.6" Tornado F5 - 4K, GTX 1080, i7 7700K, 64 GB DDR4 RAM

Eurocom launches the fully upgradeable, high performance 15.6" Tornado F5 with NVIDIA GeForce GTX 1080 graphics, Intel Core i7 7700K processor, 64 GB DDR4 memory via four slots, dual M.2 SSD slots and a 4K 15.6" display.

EUROCOM Tornado F5 users who own an Intel Core i7-6700K SKU can upgrade to the i7-7700K since the two processors share the same LGA 1151 socket. The EUROCOM Tornado F5 is one of the few laptops with a Z170 chipset, LGA 1151 CPU socket and MXM 3.0 graphics slot for a wide range of customization options. Two M.2 SSD PCIe x2/x4 or SATA SSD and one 9.5mm SATA3 6Gb/s storage drive is also supported to offer a great combination of capacity and speed. Four memory slots are available to support up to 64 GB of DDR4 SODIMM. Customers have a 15.6" FHD matte display and a 4K matte display to choose from as well.

Colorful Unveils its iGame Z270 Gamer Customization Motherboard

Colorful Technology Company Limited, professional manufacturer of graphics cards and motherboards, is proud to announce its latest motherboard for enthusiasts and gamers featuring the latest Intel Z270 chipset to support LGA1151 processors including the newly announced 7th generation Core processors from Intel with their new iGame Z270 Gamer. Customization motherboard. This latest products joins the family of iGame enthusiast and performance series of motherboards and graphics cards which focuses on not just the needs of gamers for a faster and robust system but serves as a canvas to promote their creativity and idea with great customization options.

BIOSTAR Announces the Racing Z270GT9 Motherboard

BIOSTAR is proud to announce its latest motherboard supporting the 7th-generation of Intel Core series processors with the announcement of the BIOSTAR RACING Z270GT9. Featuring the latest Intel Z270 chipset, this motherboard supports LGA1151 processors for the latest in performance and power as well as the best features including support for DDR4-3600+ high-speed memory, six PCI-E x16 3.0 slots, and two USB 3.1 (TYPE A+C) ports amongst others.

Built upon reliability, the new BIOSTAR RACING Z270GT9 features enhanced endurance and stability under intense conditions which is a great advantage for gamers thanks to its improved power design named Digital Power+ which features IR digital PWM controller and PowIRstage IC which offer excellent stability and voltage delivery whilst operating cooler and more reliable under load than competing designs. The BIOSTAR RACING Z270GT9 features 14-phase power design complimented with all solid capacitors for a stable overclocking experience.

Colorful Unveils Feature Preview of its iGame200 Motherboards

Colorful Technology Company Limited, professional manufacturer of graphics cards and motherboards, is thrilled to reveal its preview of features for its upcoming iGame200 motherboard product line. The new motherboards from Colorful will support both existing and upcoming processors for the LGA1151 socket including the 7th-gen Core series processors from Intel. The new processors will bring several improvements over its predecessor including performance and efficiency enhancements and Colorful is ready to bring the best that these CPUs can offer and deliver the needs of gamers with outstanding features.

ASRock Z270 Extreme4 Motherboard Pictured

Here are some of the first pictures of ASRock Z270 Extreme4, the company's mid-range socket LGA1151 motherboard based on Intel's upcoming Z270 Express chipset, with out of the box support for 7th generation Core "Kaby Lake" processors, and support for Intel Optane 3D X-point solid-state storage. Built in the ATX form-factor, the Z270 Extreme4 draws power from a combination of 24-pin ATX and 8-pin EPS connectors, and conditions it for the CPU with a 12-phase VRM.

The CPU socket is wired to four DDR4 DIMM slots, supporting up to 64 GB of dual-channel DDR4 memory; and two PCI-Express 3.0 x16 slots (electrical x8/x8 when both are populated). The third PCIe 3.0 x16 slot is electrical x4 and wired to the PCH. Three open-ended PCIe 3.0 x1 slots make for the rest of the expansion area. Storage connectivity includes eight SATA 6 Gb/s ports, and two 32 Gb/s M.2 slots. Display connectivity includes one each of D-Sub, DVI, and HDMI. You get a total of eight USB 3.0 ports (four on the rear panel four by headers), and two USB 3.1 ports (one each of type-A and type-C, both on the rear panel). Eight channel HD audio and gigabit Ethernet make for the rest of the connectivity.

MSI Z270 "Tomahawk" Motherboard Teased

Tis the season of 'leaks.' A marketing image of an upcoming socket LGA1151 Z270 chipset based motherboard by MSI bearing its Gaming Series Tomahawk branding was teased on Facebook. It appears to be feature-rich given that MSI positions its "Tomahawk" branded motherboards in the mid-tier of its lineup. One of the features that caught our attention is MSI's claim to have achieved true 1000 MB/s bandwidth for USB 3.1 (gen 2.0) using a custom software feature. MSI is calling this the X-Boost. The company is also guaranteeing full 8 Gb/s bandwidth per port, since it's using ASMedia AS2142 controllers to drive its USB 3.1 ports.

Many Thanks to TheLostSwede for the tip.

Scythe Announces the Mugen 5 CPU Cooler with Kaze Flex 120 Fan

Japanese cooling expert Scythe presents the fifth version of the Mugen CPU Cooler, which has been fitted with significant improvements. The Mugen has been one of the most popular CPU coolers on the market for a long time. Scythe was able to ramp up the performance even further with Mugen 5 and at the same time equip the heatsink with a unique new fan. Supplied Kaze Flex 120 PWM fan features noise reduction rubber-insulators in the corners, dynamic fan speed range from 300 to 1.200 rpm as well as a brand-new Sealed Precision FDB bearing, allowing smooth and silent operation at all times.

Scythe's engineering team took the user feedback and applied it on the revamped design of Mugen 5! The heatsink of the Mugen 5 is based on 6 high-quality all-copper heatpipes and a solid aluminum fin stack. Great compatibility to tall memory modules is achieved thanks to the new asymmetrical design of Mugen 5. The solid copper base-plate has been placed slightly shifted for this purpose, instead of centered. In addition to that, several layers of the fin stack on the back of Mugen 5 have been shortened, to further increase RAM compatibility. Mugen 5 can easily fit into most PC chassis on the market, thanks to the total height of only 154.5 mm. In order to avoid corrosion and to improve the quality, all copper-heatpipes and the copper-baseplate are nickel-plated.

Intel Z270 and H270 Chipsets Detailed: More PCIe Lanes

Early 2017, a new wave of socket LGA1151 motherboards based on Intel 200-series chipset will launch, alongside the company's 7th generation Core "Kaby Lake" processors. The lineup will be led by the Z270 Express, targeting performance desktops, and H270 Express, targeting premium commercial desktops. The question on your mind probably is what sets these chipsets apart from the current 100-series Z170 and H170 chipsets. Here are some pointers.

To begin with, motherboards based on Z270 and H270 chipsets are assured to support Core "Kaby Lake" processors, out of the box. The 100-series chipset motherboards inventory with retailers may require BIOS updates, although some of the newer production batches could ship with the latest BIOS that support "Kaby Lake." Secondly, the Z270 and H270 support Intel Optane technology, a new breed of bleeding-edge performance SSDs based on the company's 3D X-point non-volatile memory, which is the very latest in sold-state storage, and purported to be the fastest. The chipets also support Rapid Storage Technology v15.

Intel "Coffee Lake" Company's First 6-core Mainstream SKU

Intel's upcoming "Coffee Lake" micro-architecture, or the 9th generation Core processor family by Intel, is scheduled for launch in the second half of 2018. It succeeds the 8th generation "Cannon Lake" family of notebook processors (which likely doesn't see a desktop launch), and the 7th Gen Core "Kaby Lake" socket LGA1151 processors slated for January 2017. While it's not known if mainstream desktop "Coffee Lake" chips will continue to be based on the LGA1151 socket, the possibility is diminishing, looking at a platform layout diagram leaked to the web by, supported by new connectivity interfaces coming out of the CPU package. The biggest selling-point of "Coffee Lake," is its core-count.

The 9th generation Core "Coffee Lake" family could introduce Intel's first 6-core processor to the mainstream desktop platform. The company's first 6-core client part was launched in its LGA1366 HEDT (high-end desktop) platform with the Core i7 "Gulftown" processor, way back in 2010. An increase in core-count from 4 has eluded the mainstream-desktop lineup. The 6-core "Coffee Lake" silicon will be built on a highly-refined 14 nm node by Intel, with a die-size of 149 mm². Quad-core parts won't be carved out of this silicon by disabling two cores, but rather be built on a smaller 126 mm² die. For reference, the quad-core "Kaby Lake" die is expected to be 123 mm², and the current quad-core "Skylake-D" die measures 122.6 mm².

Intel Core i5-7600K Tested, Negligible IPC Gains

Ahead of its launch, a Core i5-7600K processor (not ES) made its way to Chinese tech publication PCOnline, who wasted no time in putting it through their test-bench, taking advantage of the next-gen CPU support BIOS updates put out by several socket LGA1151 motherboard manufacturers. Based on the 14 nm "Kaby Lake" silicon, the i5-7600K succeeds the current i5-6600K, and could be positioned around the $250 price-point in Intel's product-stack. The quad-core chip features clock speeds of 3.80 GHz, with 4.20 GHz max Turbo Boost frequency, and 6 MB of L3 cache. Like all its predecessors, it lacks HyperThreading.

In its review of the Core i5-7600K, PCOnline found that the chip is about 9-10% faster than the i5-6600K, but that's mostly only due to its higher clock speeds out of the box (3.80/4.20 GHz vs. 3.50/3.90 GHz of the i5-6600K). Clock-for-clock, the i5-7600K is just about 1% faster, indicating that the "Kaby Lake" architecture offers only negligible IPC (instructions per clock) performance gains over the "Skylake" architecture. The power-draw of the CPU appears to be about the same as the i5-6600K, so there appear to be certain fab process-level improvements, given the higher clock speeds the chip is having to sustain, without a proportionate increase in power-draw. Most of the innovation appears to be centered on the integrated graphics, which is slightly faster, and has certain new features. Find more performance figures in the review link to PCOnline below.

SilentiumPC announces Fortis 3 HE1425 v2 CPU-Cooler

SilentiumPC has announced the Fortis 3 HE1425 v2 CPU-cooler which is a much cheaper version of the award winning Fortis 3 HE1425 Malik Customs Edition. Despite a much more attactive price the Fortis 3 HE1425 v2 is still offering the same cooling performance. Engineered to achieve optimal balance between heat dissipation and airflow it uses five high performance heatpipes transferring heat efficiently to 38 aluminum fins. In terms of styling the Fortis 3 v2 has a black top with black caps sealing the heatpipes.

The former properties of the cooler remain otherwise unchanged. The asymmetric high performance cooling body consists of aluminum fins and heat pipes, which have a direct contact to the processor and form the basic framework. For the corresponding heat dissipation there is a quiet Sigma Pro 140mm-PWM-fan included. The in-house Pactum PT-2-thermal paste also comes in the package.

ASUS Rolls Out BIOS Updates for Next-Generation LGA1151 Processors

ASUS today announced that all 100-series motherboards will now support next-generation Intel Core processors. A quick and easy UEFI BIOS update unleashes the full potential of the next-generation high-performance CPUs for socket LGA 1151, reaffirming ASUS as the BEST leading motherboard brand - Best Selling, Easy to Use, Stable and Trusted. Owners of ASUS Republic of Gamers (ROG), Pro Gaming, Signature and TUF Z170, H170, B150 and H110 motherboards are able to take advantage of the easy upgrade to the award-winning ASUS UEFI BIOS, which is available today via the relevant ASUS Support web page.

All ASUS 100-series motherboards that include the ASUS USB BIOS Flashback feature allow users to apply UEFI BIOS updates with ease. For other ASUS 100-series motherboards the necessary UEFI BIOS update takes just one click in an easy-to-use Windows-based BIOS updater application, ASUS EZ Update, which is available to download from the ASUS website.

Two ASRock Z270 Motherboard Packages Smile for the Camera

Ahead of their Q1-2017 launch alongside the 7th generation Core "Kaby Lake" processors, the boxes of two premium ASRock motherboards based on the upcoming Z270 Express chipset smiled for the camera. These are the ASRock Z270 Gaming K6, and the Z270 Pro4, or at least that's the best we could read through the blur. The Z270 Gaming K6 could be a premium offering, while the Z270 Pro4 could be an entry-mainstream one.

Just as Intel launched both the 6-series and 7-series chipset for the LGA1155 socket, and the 8-series and 9-series chipset for the LGA1150 socket; the Z270 could be Intel's second platform for the LGA1151 socket, in being compatible with both the upcoming 7th generation Core "Kaby Lake" processors, and the existing 6th generation Core "Skylake" ones. Existing 100-series chipset motherboards will support "Kaby Lake" chips with BIOS updates.

-- images removed at request of AsRock --

ASRock Unveils the Z170M-PIO2 Motherboard with Parallel Expansion Slot

ASRock unveiled the Z170M-PIO2, a micro-ATX socket LGA1151 motherboard with a unique angled PCI-Express gen 3.0 x16 slot that lets you install a graphics card parallel to the plane of the motherboard. It takes away the need for PCIe riser cables in certain PIO form-factor compliant SFF chassis. The PIO form-factor is an emerging standard of compact SFF cases that you mount along the VESA wall-mount bolts of your display. Technically, the board conforms to the uDTX form-factor, but is compatible with micro-ATX and PIO form-factors.

Its star-attraction aside, the Z170-PIO2, as its name suggests, is based on the overclocking-ready Z170 Express chipset. It supports up to 32 GB of dual-channel DDR4 memory with its two memory slots. The board draws power from a combination of 24-pin ATX and 4-pin CPU power connectors. Besides the angled PCIe x16, you get an mPCIe slot (for WLAN cards), and one 32 Gb/s M.2 slot. Four SATA 6 Gb/s ports, 6-channel HD audio, four USB 3.0 ports, and gigabit Ethernet make for the rest of its connectivity.

Scythe Announces the Byakko CPU Cooler

Japanese cooling expert Scythe announces a new addition to the tower-design CPU cooler line-up. Scythe Byakko is a compact cooling solution with a total height of mere 130 millimeters, which fits in virtually every PC case. Great compatibility is assured thanks to the asymmetric alignment of the base-plate and the heatsink. Byakko is equipped with Scythes Slip Stream 92 PWM fan, offering a wide speed range for different purposes. User friendly and fast mounting of Byakko on both Intel and AMD Sockets is accomplished thanks to the supplied mounting clips.

Scythe Byakko was designed with the aim to fit into most PC cases on the market and to offer maximum compatibility to tall memory modules as well as VRM heatsinks. All this is possible thanks to the compact dimensions of 102 x 130 x 84 mm (W x H x D) and the new asymmetric design of the heatsink. Three high-quality copper heatpipes with 6 millimeter diameter are connecting the solid copper base-plate and the aluminum fins-stack heatsink. Both the copper-heatpipes and the copper-baseplate are nickel-plated in the final process, in order to avoid corrosion and to improve the quality.

Intel Core i7-7700K "Kaby Lake" SANDRA Scores Surface

Someone with access to a Core i7-7700K "Kaby Lake" processor and an ASRock Z270-Extreme4 motherboard put the chip through SiSoft SANDRA 2015 CPU tests. Engineering sample or not, the clock speeds of the chip appear to check out with those of the lineup as we know it. The core ticks at 4.20 GHz, with a maximum Turbo Boost frequency of 4.50 GHz. You also get 8 MB of L3 cache, and HyperThreading. The benchmark confirms that Intel is working on a new platform refresh chipset, with the Z270 chipset succeeding the existing Z170. Existing LGA1151 could support the new chips, with BIOS updates.

At its stock speeds, the i7-7700K churns out a SANDRA 2015 "Processor Arithmetic" score of 151.94 GOPS. Its "Processor Multimedia" score yielded is 379.8 Mpix/s. To put things in perspective, a Core i7-6700K "Skylake" processor running at its stock speed of 4.00 GHz core with 4.20 GHz Turbo Boost typically yields 140.88 GOPS in "Processor Arithmetic" and 353.8 Mpix/s in "Processor Multimedia" tests, according to LegitReviews. Intel is expected to launch the 7th generation Core processor family, alongside the 200 series chipset, later this year. Kaby Lake is Intel's third CPU micro-architecture for the 14 nm process, after "Skylake" and "Broadwell."

Intel Xeon E3-1200 V6 "Kaby Lake" Series Detailed

Intel is preparing a broad lineup of enterprise CPUs based on the upcoming 14 nm "Kaby Lake" silicon, besides the first wave of its desktop lineup, with no less than 8 quad-core SKUs. What makes the lineup of the Xeon E3-1200 V6 family more comprehensive than previous generations is the fact that some of the SKUs feature integrated graphics. Predecessors of the E3-1200 V6 series generally lack integrated graphics. Intel denoted parts that feature integrated graphics with Xeon E3-###5 V6, and endowed them with the GT2 graphics available on the "Kaby Lake" common silicon shared between the Xeon E3-1200 V6 and 7th generation Core series.

All eight SKUs launched by Intel are quad-core and feature 8 MB of L3 cache, six of them feature HyperThreading. Three of the SKUs feature integrated graphics. The SKUs without integrated graphics have 74W TDP rating, the ones with it have 78W TDP rating. Some of the notable SKUs include the E3-1280 V6, with 3.90 GHz nominal clocks, E3-1275 V6 with 3.70 GHz clocks and GT2 integrated graphics; and E3-1225 V6, featuring 3.30 GHz clocks, and integrated graphics. The Xeon E3-1200 V6 series processors will be built in the LGA1151 package, and will be compatible with the C232 and C236 chipset motherboards. The company could launch these chips by the end of 2016.

Intel Core "Kaby Lake" Desktop Processors First Wave Detailed

Intel is reportedly planning launch its 7th generation Core "Kaby Lake" processors by Q4-2016. Its desktop variants, built in the existing LGA1151 package, will be the third Intel micro-architecture built on the 14 nm process (after "Skylake" and "Broadwell" architectures). With this generation, Intel is planning to sub-classify LGA1151 into three categories, to ensure people don't try to install higher-powered CPUs on low-power machines.

These are LGA1151-Standard Power; LGA1151-Low Power; and LGA1151-Ultra Low Power. These are defined by the TDP of the packages. Standard Power chips run at 95W TDP, Low Power at 65W TDP, and Ultra Low Power at 35W TDP. There could be motherboards and machines that, depending on their VRM setup, completely shut out Standard Power or even Low Power chips.

Colorful Announces the iGame Z170 YMIR-G Motherboard

Colorful Technology Company Limited, professional manufacturer of graphics cards and motherboards, proudly announces its feature-packed gaming motherboard: the iGame Z170 Ymir-G for the latest 6th-generation Intel Core processors. The latest part of the iGame family of high-performance products intended for gamers and enthusiasts, the iGAME Z170 Ymir-G motherboard boasts features for any and all kinds of gamers from modders to streamers.

The COLORFUL iGAME Z170 Ymir-G motherboard loads everything a gamer needs and more into a single motherboard. Supporting 6th-generation Intel processors for the LGA1151 socket, this motherboard supports processors up to 125w and delivers solid power to the CPU thanks to its 14-phase power delivery design which also helps in stable overclocking. The motherboard features rich connectivity options including a wide range of internal expansion and external I/O: high-speed storage via 32 Gb/s M.2 port, 16 Gb/s SATA Express ports, 10 Gb/s USB3.1 as well as USB Type-C, quick charge USB ports and dual-LAN support with both Intel i211 and Killer E2201 chips onboard.

ECS Shows off the No-frills H110S-2P

ECS showed off its the H110S-2P, a no-frills motherboard built in a form-factor that's smaller than mini-ITX, although compatible with mini-ITX cases. The board lacks add-on card expansion slots. The only expansion you can give this board is an mPCIe, and an M.2 2230, which closely passes over the PCH. You can tell from the M.2 placeholder marking on the PCB running over the PCH that even the production board could lack a PCH heatsink.

The H110S-2P supports 6th generation Core processors in the LGA1151 package, and up to 32 GB of dual-channel DDR4-2400 memory though SODIMMs. Storage connectivity, besides the M.2 slot, includes one SATA 6 Gb/s port. Display outputs (you'll need them), include one each of DisplayPort 1.2 and HDMI 1.4a. Four USB 3.0 ports, and two USB 2.0 ports complete the package.

ECS Partners with Silverstone to Develop LIVA Pro

ECS partnered with Silverstone to co-develop the LIVA Pro, a NUC-rivaling product by ECS. It consists of a custom-design all-aluminium case by Silverstone, and innards by ECS, which include an LGA1151 socket to support Intel Core "Skylake" processors with TDP of up to 65W (some Core i5/i7 low-power quad-core parts should work); Intel H110 core-logic, two DDR4 SODIMM slots, one each of M.2 and 2.5-inch SATA 6 Gb/s drive bays, gigabit Ethernet, 802.11 b/g/n WLAN, USB 3.0 type-A and type-C front-panel ports, and more.
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