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Intel Reimagines Data Center Storage with New 3D NAND SSDs

Today, Intel announced the Intel SSD DC P4510 Series for data center applications. The P4510 Series uses 64-layer TLC Intel 3D NAND to enable end users to do more per server, support broader workloads and deliver space-efficient capacity. The P4510 Series enables up to four times more terabytes per server and delivers up to 10 times better random read latency at 99.99 percent quality of service than previous generations. The drive can also deliver up to double the input-output operations per second (IOPS) per terabyte. The 1 and 2TB capacities have been shipping to cloud service providers (CSPs) in high volume since August 2017, and the 4 and 8TB capacities are now available to CSPs and channel customers. All capacities are in the 2.5-inch 15 mm U.2 form factor and utilize a PCIe NVMe 3.0 x4 connection.

To accelerate performance and simplify management of the P4510 Series PCIe SSDs and other PCIe SSDs, Intel is also delivering two new technologies that work together to replace legacy storage hardware. Intel Xeon Scalable processors include Intel Volume Management Device (VMD), enabling robust management such as surprise insertion/removal and LED management of PCIe SSDs directly connected to the CPU. Building on this functionality, Intel Virtual RAID on CPU (VROC) uses Intel VMD to provide RAID to PCIe SSDs. By replacing RAID cards with Intel VROC, customers are able to enjoy up to twice the IOPs performance and up to a 70 percent cost savings with PCIe SSDs directly attached to the CPU, improving customer's return on their investments in SSD-based storage.

ATP Announces Industrial M.2 NVMe SSDs with iTemp Support

ATP Electronics, a leading manufacturer of high-performance industrial memory and storage solutions, spearheads the implementation of industrial temperature (iTemp) support on its latest NVMe M.2 solid state drive modules. The new SSD modules support a wide operating temperature range of -40°C to 85°C to capably address the power and heat issues common in fanless embedded systems as well as extreme temperature variations in Industrial Internet of Things (IIoT) applications, enabling them to perform reliably in harsh environments.

When operating at high speeds in high-throughput scenarios, onboard thermal sensors can detect abnormal temperature elevation and automatically enable a mechanism that adjusts performance to cool the system. According to Peter Huang, ATP Head of Embedded Solid State Drive Business Unit, "ATP Dynamic Thermal Throttling intelligently regulates speed and power to reduce heat without aggressive declines in performance, unlike other thermal solutions that cause abrupt drops and thus compromise stability." Additionally, the low typical power consumption of 3.3V makes ATP's NVMe M.2 SSDs energy efficient, translating to longer drive usage and cost savings.

Intel Releases Its SSD 760p to the Wild With Competitive Pricing, Performance

Intel today released their mainstream answer to users' fast, NVMe-based storage needs, the SSD 760p. We've already covered this new consumer, mainstream SSD series in our news pieces; however, information and press decks have now come directly from Intel, allowing us a clearer picture of how Intel sees its products to fit into the consumer market - and hopefully, in consumer's choices.

Transcend Announces New Line of 3D TLC NAND SSDs for Embedded Applications

Transcend Information, Inc., a leading manufacturer of industrial-grade products, is proud to announce the release of 2.5-inch and M.2 form factor industrial solid-state drives featuring 3D TLC NAND flash memory. 3D TLC NAND flash memory has performance that can rival Planar (2D) MLC NAND flash, but at a very competitive price point. The new line of industrial SSDs also boast SLC caching, a RAID engine, low-density parity check (LDPC), and other features that make for a stable, long-lasting product ready for write-intensive industrial and embedded applications.

Built with high-quality 3D TLC NAND flash memory
This all-new series of SSDs uses high-quality 3D TLC NAND flash memory. 3D NAND flash breaks through physical limitations on Planar NAND by stacking layers of memory cells to allow for greater capacities and performance. Compared to Planar NAND, 3D NAND is faster, more reliable, and delivers greater performance. Devices manufactured with 3D NAND are price competitive, making them an excellent choice for embedded systems.

Intel Optane MEM M10 Cache Modules Surface on Retailers' Websites

The next step in Intel's Optane product launch could be right around the corner, as retailers have started listing the company's upcoming Optane MEM M10 cache drives up for pre-order. If you'll remember, these products were first leaked in some Intel product roadmap slides, where they appeared identified as "System Acce. Gen 1.0". Whether or not today's workloads and faster SSD-based storage require the introduction of a faster caching solution is up for debate; however, Intel seems to think there is room in the market for these caching solutions, even if the vast majority of users would be much better served by acquiring a higher capacity SSD as their primary drive (especially if they're coming from the HDD world).

These new Optane MEM M10 cache drives will come in capacities ranging from 16 GB to 64 GB. The M10 modules will take the M.2 2280 form-factor and deliver data through the PCIe 3.0 interface. Prices are being quoted at $47.58 for the 16 GB model, $82.03 for the 32 GB model, and $154.37 for the largest, 64 GB model. These should ensure lower latency and higher throughput than traditional SSDs do, due to their caching of users' more heavily requested data; however, due to the very nature of these caching solutions, and the memory footprint available for them, it's likely most users will hit severe performance bottlenecks, at the very least, on the 16 GB model.

ASRock Intros a Pair of Celeron "Gemini Lake" ITX Motherboards

ASRock introduced a pair of mini-ITX desktop motherboards implementing Intel's new Celeron "Gemini Lake" SoCs. The ASRock J4105-ITX and J4105B-ITX, as their names suggest, are powered by Celeron J4105 "Gemini Lake" SoCs, which combine a quad-core "Goldmont Plus" CPU ticking at 2.50 GHz, with new Intel UHD 600 Graphics. The integrated graphics features hardware-acceleration of 10bpc HEVC video encoding and decoding in addition to new DRM standards, which should enable Netflix 4K, and other on-demand video services at 4K UHD resolution. The J4105-ITX and J4105B-ITX are similar, but for the latter featuring legacy connectivity such as LPT and RS232 COM ports, replacing 8-channel HD audio with 6-channel, and a DVI port. While the former has a PCIe x1 slot, the latter has an x16 slot with x2 wiring.

The board draws power from a 24-pin ATX connector. The SoC is cooled by a fan-less heatsink, and is wired to DDR4 SO-DIMM slots, supporting up to 8 GB of dual-channel DDR4-2400 memory. The 22 mm M.2 slot that has x1 wiring, is recommended only for a WLAN card. Storage connectivity includes four SATA 6 Gbps ports on the J4105-ITX, and two ports on the J4105B-ITX. Both boards come with gigabit Ethernet. Display outputs include DVI, HDMI, and D-Sub on the J4105-ITX; while the J4105B-ITX features D-Sub and HDMI. Both boards are expected to be priced around $170, given that the SoC itself costs $107.

Samsung 860 EVO SSD Makes an Appearance

Hot on the heels of Samsung updating its website with its next performance-segment SSD 860 Pro series, with its range-topping 4 TB variant, a similar pre-launch website update revealed the company's next mainstream SATA SSD, the 860 EVO. The drive will be available in three form-factors, 7 mm-thick 2.5-inch, M.2-2280, and mSATA; all with SATA 6 Gbps interface. The 2.5-inch version comes in 250 GB, 500 GB, 1 TB, 2 TB, and 4 TB variants; while the M.2-2280 version comes in just 500 GB, 1 TB, and 2 TB variants; and the mSATA version in 250 GB, 500 GB, and 1 TB variants. The drives combine Samsung's latest generation 3D VNAND flash memory built in the 10 nm-class sliicon fabrication process, with an updated controller and refined firmware.

The 860 EVO offers sequential transfer rates of up to 550 MB/s, with up to 520 MB/s sequential writes, up to 97,000 IOPS 4K random reads, and up to 88,000 IOPS 4K random writes. The new-generation flash is rated for "8 times higher" endurance than the 850 EVO series; with up to 2,400 TBW. Samsung is reinforcing its faith in the drive by backing it with 5-year warranties. The company is introducing the new TurboWrite feature, which is a user-configurable SLC cache. You can set anywhere between 12 GB to 72 GB of the NAND flash to function as SLC, so the controller can juggle hot data in and out of it, for improved performance, using the Samsung Magician software.

Intel SSD 760p and 660p Specifications and Pricing Listed Online

Autobuy, a popular online shopping site in Taiwan, recently listed Intel's upcoming 760p and 660p M.2 NVMe SSDs on their store. The SSD 760p will be manufactured under Intel's 64-layer 3D NAND technology and feature TLC (triple-level-cell) NAND. It's obviously the faster of the two with a sequential read speed up to 3,200 MB/s and a write speed up to 1,600 MB/s. The drive offers random access reads up to 350,000 IOPS and writes up to 280,000 IOPS. Intel will offer this model in capacities of 128 GB, 256 GB, 512 GB, 1 TB, and 2 TB. TigerDirect listed the pricing for them at $96, $120, $240, $448, and $893, respectively.

The SSD 660p is Intel's budget-friendly this time around. Therefore, it will use QLC (quad-level-cell) NAND despite being manufactured with the same technology as its older brother. This SSD can reach up to 1,800 MB/s in sequential read and up to 1,200 MB/s in sequential write speeds with random access read and write performance in the range of 150,000 IOPS. Surprisingly, Intel won't be offering this model in the 128 GB and 256 GB capacities. Instead, the lowest capacity model will start from 512 GB and make its way up to 2 TB. Unfortunately, pricing wasn't available at the time of this article.

More Pictures of GIGABYTE Aorus X470 Gaming 7, Because Moar

We headed to the GIGABYTE Aorus booth at the 2018 International CES to check out the only motherboard based on AMD's upcoming 400-series chipset visible in the entire show, the Aorus X470 Gaming 7. We snapped a lot of pictures. The first thing that caught our attention is the board's updated styling, which resembles the one GIGABYTE introduced with its Intel Z370-series motherboards. The second thing of course, was two 32 Gb/s M.2 slots, confirming that AMD has indeed addressed 300-series chipset's greatest shortcoming - lack of PCIe gen 3.0 general purpose lanes. Since the AM4 SoC puts out 4 gen 3.0 general purpose lanes of its own, which wired to one 32 Gb/s M.2 slot on 300-series motherboards, the new 400-series boards will have at least two of these slots, one wired to the AM4 SoC, and another to the chipset.

The Aorus X470 Gaming 7 could become the company's flagship socket AM4 product based on AMD X470 chipset. It's been designed as such. Built in the ATX form-factor, the board draws power from a combination of 24-pin ATX, 8-pin EPS, and 4-pin ATX power connectors. A 12-phase VRM supplies power to the AM4 SoC. It's interesting to note that GIGABYTE chose some very high-current chokes for the chip's main voltage domains. The VRM heatsinks, too, are elaborate aluminium fin-stack types, with the two heatsinks spreading heat over a heat pipe. Is this a telltale sign that certain Ryzen 2 parts could have >95W TDP? The CPU socket is wired to four DDR4 DIMM slots, two PCI-Express 3.0 x16 slots (x8/x8 when both are populated), and one of the two M.2 slots (we're guessing the top M.2-22110 slot). Both it, and the bottom M.2-2280 slots have included heatsinks. Other expansion slots include an x16 (electrical x4) slot wired to the chipset, and two x1 slots, which are all gen 3.0.

Silverstone Also Showcases Storage Solutions at CES 2018

Silverstone at CES 2018 also showcased some number of cases and storage solutions that the company hopes to carve its way through the market with. There's an interesting 4x M.2 Drive bay, for instance, which occupies a traditional 3.5" bay but gives users the option to mount up to 4x M.2 SSD drives; there's a 2.5" SSD expansion bay (EXB01) that allows for hot-swapping of SSDs mounted on the rack; an M.2 to PCIe adapter with embedded heatsink and LEDs, as well as a PCIe Gen3 x16 to an NVMe drive adapter.

Crucial Shows Off Its MX500 M.2 SATA SSD

Crucial at CES 2018 has unveiled their M.2 version fo the prize-winning MX500 drive (you can read TPU's review of the MX500 2.5" drive here). The new M.2 SATA SSDs bring a much needed form-factor for Crucial's SSD line, with capacities ranging from 250 GB, passing through 500 GB, and ending in the 1 TB mark. All capacities have the same performance rating: 560 MB/s sequential read, 510 MB/s sequential writes, 90K random write and 95K random read IOPS.

EDGE Memory Also Announces Launch of NextGen M.2 PCIe SSD

EDGE Memory, a leading U.S.-based supplier of memory and storage upgrades, is announcing the NextGen M.2 PCIe 2280 SSD, adding a powerful PCIe NVMe based solid state drive solution to its product portfolio.

With transfers speeds up to 3.2GB/s and an IOPS rating of up to 370,000, the NextGen SSD is set to be one of the fastest drives available on the market. Powered by a Silicon Motion based SM2262 controller and a PCIe 3.0 x4 NVMe 1.3 interface, this drive delivers incredible performance. NextGen M.2 SSDs provide the advanced features and speeds to satisfy the needs of enthusiasts and power users everywhere.

ASRock Intros Ultra Quad M.2 Card

ASRock introduced the Ultra Quad M.2 Card, an add-on card that lets you easily set up an M.2 NVMe RAID array with up to four drives with 32 Gbps bandwidth for each drive. In principle, this product does exactly what ASUS Hyper M.2 x16 Riser card does, but better. The first benefit is shorter traces- while the ASUS card has M.2 slots arranged horizontally along the plane of the card, with the topmost slot being farthest away from the PCI-Express interface, the ASRock card has them arranged diagonally, in a way that ensures each slot is close to the PCIe bus. ASRock also claims better thermals with a larger 50 mm fan (vs. 40 mm of the ASUS card) and longer thermal pads (110 mm vs 80 mm), power stability with a 6-pin PCIe power input, and software control over the fan. The card supports NVMe RAID on both Intel X299 and AMD X399 platforms. The card is expected to be priced around USD $69.99.
ASRock presentation slides follow.

ADATA Shows Off XPG SX8200 and IM2P33F8 M.2 NVMe 1.3 SSDs

ADATA showed off its latest M.2 NVMe SSDs that support the latest NVMe 1.3 specification, and are based on some of the newer generation controllers, beginning with the XPG SX8200. This drive combines Silicon Motion SM2262 controller with 3D TLC NAND flash memory, and comes in capacities of 240 GB, 480 GB, and 960 GB. The drive offers sequential transfer rates of up to 3200 MB/s reads, with up to 1700 MB/s writes; and features SLC caching, an LPDC ECC engine, and an internal RAID engine.

The ADATA XPG SX8200 is designed to succeed the XPG SX8000, which is second-fiddle to the company's fastest XPG SX9000-series, and competes with the likes of Samsung 960 EVO series. The ADATA IM2P33F8 implements Silicon Motion SM2263XT controller, which is DRAM-less and has just four flash channels. The drive offers sequential speeds of up to 2400 MB/s reads, with up to 1700 MB/s writes; and comes in capacities of 128 GB, 256 GB, and 512 GB.

ADATA Shows off XPG Storm RGB M.2 SSD Heatsink

Thermal throttling is a big problem for M.2 NVMe SSDs, with drives losing up to 30 percent in sequential transfer rates when overheated. ADATA, with an M.2 SSD product spanning nearly all price-points, is taking the issue of throttling heat-on with its XPG Storm RGB M.2 SSD heatsink. The cooler consists of a chunky aluminium heatsink with coverage area for M.2-2280 drives, a tiny lateral-blower fan, and a cooler shroud with RGB LED lighting. ADATA claims the heatsink reduces temperatures by up to 25 percent.

Its RGB LED lighting supports standard headers, and can be controlled using standardized software such as ASUS Aura Sync RGB, GIGABYTE RGB Fusion, MSI Mystic Light RGB, etc. Unfortunately, the heatsink appears to add Z-height that makes it unfit for M.2 slots located between PCI-Express add-on card slots. At best they're suited for boards with M.2 slots above the topmost heatsink, or just south of the PCH heatsink. The heatsink relies on adhesive thermal-pads and its installation is tool-free

MSI Brings Award-Winning Innovations to CES 2018

MSI, a world leader in gaming hardware, launches three brand-new gaming products at CES 2018, and will display two other CES Innovation Award Honorees. The CES 2018 Innovation Award Honorees include the Trident 3 Arctic, the new Z370 GODLIKE GAMING motherboard, new GTX 1080TI Lightning Graphics Card, Infinite X gaming desktop and new Optix MPG27CQ gaming monitor. The Trident 3 Arctic was also awarded a "Best of Innovation at Gaming" award. With these products, MSI affirms its position at the head of the high-end gaming market, bringing gamers all over the world the latest and greatest technologies.

"MSI has been dedicated to the field of gaming and is highly acclaimed by gamers and eSports teams worldwide," said Eric Kuo, MSI Vice President of Global Sales & Marketing. "We are honored to receive award recognition for these products and are excited to share them with gamers everywhere."

ASRock Announces X399M Taichi Motherboard for Ryzen Threadripper

ASRock today unveiled the industry's first micro-ATX form-factor motherboard for AMD Ryzen Threadripper processors, the X399M Taichi. The board supports a full-featured Threadripper HEDT build. Drawing power from a combination of 24-pin ATX and 8-pin EPS power connectors, it uses an 8-phase VRM to power the CPU. MOSFETs of this VRM vent heat onto both a smaller primary heatsink, and a larger secondary heatsink, via a heat-pipe. The TR4 socket is wired to four DDR4 DIMM slots, supporting quad-channel DDR4 memory; and three PCI-Express 3.0 x16 slots (from which at least two run at full x16 bandwidth at all times).

Storage connectivity on the ASRock X399M Taichi includes three 32 Gb/s M.2 slots, one 32 Gb/s U.2 port, and eight SATA 6 Gb/s ports. Networking connectivity includes 802.11ac + Bluetooth 4.x WLAN, and two 1 GbE interfaces. USB connectivity includes eight USB 3.0 and two USB 3.1 (including a type-C) ports on the rear panel, and four USB 3.0 ports via headers. ASRock deployed its highest-grade onboard audio solution, which takes advantage of a 120 dBA SNR CODEC, audio-grade capacitors, and ground-layer isolation. The company will showcase this board at the 2018 International CES.

SilverStone Intros TP02-M2 Heatsink for M.2 SSDs

SilverStone rolled out the TP02-M2, a heatsink for 80 mm-long M.2 SSDs (M.2-2280). This chunky aluminium heatsink is 1 cm tall, and weighs a little over 16 g. In addition to a 3 g-ish adhesive thermal pad, it would have added close to 20 g of weight onto the various soldered components of your drive; but SilverStone is clever enough to include two silicone bands that strap the heatsink onto the drive, offloading some of that weight. The heatsink was tested by its designers to significantly lower temperatures of NAND flash chips and controllers, which pose performance penalties on faster NVMe SSDs. The company didn't reveal pricing.

AMD 400-series Chipset Surfaces on PCI-SIG, PCIe 3.0 General Purpose Confirmed

AMD's second-generation Ryzen processors, which debut some time in Q1-2018, will be accompanied by the company's new 400-series motherboard chipset, even though they are expected to work with existing socket AM4 motherboards based on 300-series chipsets (with BIOS updates). The 400-series Promontory chipset surfaced on the PCIe Integrators List of PCI-SIG, the standards governing body of the PCI bus (which also oversees PCIe specifications development).

The listing seems to confirm that 400-series chipset will feature PCI-Express gen 3.0 general purpose lanes. These are downstream PCIe lanes put out by the chipset, to run the various external onboard controllers on the motherboard, and usually wired to the x1 and x4 PCIe slots. The current 300-series chipset only features up to 8 PCIe gen 2.0 general purpose lanes, and that was seen as a drawback. AMD Ryzen socket AM4 processors put out additional gen 3.0 lanes besides the 16 lanes allocated to PEG (one x16 or two x8, physically x16 slots); and 4 lanes serving as chipset bus. These additional gen 3.0 lanes typically drive a 32 Gb/s M.2 slot. With 400-series chipset bringing gen 3.0 general purpose lanes, one can expect newer socket AM4 motherboards with more than one 32 Gb/s M.2 slot (one from the SoC, another from the chipset).

EVGA Announces the X299 DARK Motherboard

EVGA introduces you to the ultimate in raw performance for the next-gen Intel Extreme lineup, the EVGA X299 Dark. The Dark is crafted from the ground up to be the performance apex with everything you need to make a record-breaking benching run or a 24/7 number cruncher, and nothing you don't - a board that is as reliable as it is fast.

Kingston SSDs Featuring Phison Controllers Power Over 18 Million PCs and Systems

Kingston Digital Europe Co LLP, an affiliate of Kingston Technology Company Inc., the independent world leader in memory products, today announced it has shipped over 18 million SSDs worldwide utilizing Phison controllers symbolizing the strength of a longstanding relationship. Kingston and Phison Electronics Corp have been close collaborators for over a decade, first starting in USB Flash drives and then moving onto SSDs.

In 2010, both companies jointly invested in a new company to create embedded solutions to ease the design-in effort for handheld device makers expediting the overall product development cycle and bringing products to market faster. Both Phison and Kingston share and combine their expertise in engineering, production, sales and procurement. The company, Kingston Solutions, Inc., has grown exponentially from smart phones and tablets to a diverse portfolio including wearables, slot machines and consumer appliances such as smart beds and thermostats.

Apacer's Latest Z280 M.2 PCIe Gen 3 x4 SSD Hits Stores

Apacer knows it best when it comes to speed and uncompromised gaming performance. Z280, the latest answer to advanced SSDs, supports PCIe Gen 3 x4 and is compliant with NVMe 1.2 in a M.2 form factor. The blazing speed will boost the game status without getting too costly. With sustained read/write performance at 2750MB/s and 1500MB/s, the compact M.2-2280 keeps everything efficient at a massive capacity of 480GB. Want to be one step ahead of others? Look no further than Z280, the high-performing SSD that is compatible with mini PCs and laptops.

Rapidity & Jumbo Storage
Built with upscale SSD technologies that Apacer is synonymous for and excellent quality MLC, the cutting-edge Z280 is compliant with NVMe 1.2 standard and features the latest PCIe Gen 3 x4 interface to provide up to 4 times of bandwidth. The expert team at Apacer raised the bar of the industry by creating a blistering transmission at 2750/MB & 1500MB per second. Offering a massive memory capacity of 480GB, Z280 has a random write of 175,000 IOPs to ensure all actions in each gaming scene is smoothly processed, fluid and sharp, efficiently boosting a gamer's status.

Toshiba Memory Corporation Unveils 2TB XG5-P NVMe SSD

Toshiba Memory Corporation, the world leader in memory solutions, has enhanced its line-up of client SSDs with the launch of premium models in its XG5-P series. The new NVM Express (NVMe) client SSDs improve on the performance of the current XG5 series models and double the maximum capacity to 2 TB. Sample shipments to OEM customers start today in limited quantities, and Toshiba Memory Corporation will gradually increase shipments from the first calendar quarter of 2018.

The XG5-P series also utilizes a PCI Express (PCIe) Gen3 x4 lane and NVM Express Revision 1.2.1 interface, and delivers performance of up to 3000 MB/s sequential read and 2200 MB/s sequential write, and up to 320,000 IOPS random read and 265,000 IOPS random write. Its random read/write performance in full access range is approximately 55% better than that of standard XG5 series products. At the same time, low power consumption is maintained at less than 60 mW during operation.

EK is Releasing More Color Options for M.2 NVMe SSD Heatsinks

EK Water Blocks, the Slovenia-based premium computer liquid cooling gear manufacturer, is releasing new passive heatsinks for M.2 NVMe Next Generation Form Factor SSDs in multiple color options! The popularity of the existing Black and Nickel plated M.2 NVMe heatsinks clearly indicated the need for more color options, so here they are! It is not a secret that M.2 NVMe SSDs can overheat very easily and be affected by thermal throttling, thus losing performance. The EK-M.2 NVMe Heatsink can lower the SSDs operating temperature by 7 to 30°C.

The design of the heatsink ensures that it is easy to install, it is low profile, easily reusable and aesthetically non-intrusive. Simple clips ensure that the heatsink is very easy to install and to re-use if the SSD is upgraded. The ribbed surface of the heatsink acts as a very effective passive cooler, as well as aesthetic cover. Its simple design ensures a sleek, non-intrusive look that can be easily combined with any aesthetical requirement of the user. The compact design makes it highly compatible so that it does not interfere with other components. EK Water Blocks are offering the new EK-M.2 NVMe Heatsink in red, blue, green and purple variants. The gold variant will be available within two weeks of time.

LiteOn Intros MUX Series M.2 NVMe SSDs with Toshiba BiCS3 Flash

LiteOn today introduced the MUX line of "entry-level" M.2 PCI-Express SSDs in the M.2-2280 form-factor. Available in 128 GB and 256 GB capacities, the drives feature PCI-Express 3.0 x2 host interface, and take advantage of the NVMe protocol. They combine Phison PS5008-E8 controllers with Toshiba BiCS3 3D-TLC NAND flash memory.

The 128 GB variant offers sequential transfer rates of up to 1500 MB/s reads, with up to 450 MB/s writes; up to 91,000 IOPS 4K random reads, and up to 110,000 IOPS 4K random writes; while the 256 GB variant is slightly faster, offering up to 1600 MB/s sequential reads, up to 850 MB/s sequential writes, up to 145,000 IOPS 4K random reads, and up to 140,000 IOPS 4K random writes. Both variants are backed by 3-year warranties.
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