VIA Announces Trinity High-Def Platform
VIA Technologies, a leading innovator of power efficient x86 processor platforms, today announced a powerful new 3-chip silicon platform that brings HD performance to ultra compact systems for a far richer user experience.
While desktop PCs, notebooks and embedded devices are getting smaller and thinner, demands on system resources are growing by the day, with higher definition video content, richer Internet resources and increasingly complex image manipulation requiring more powerful processing, video and graphics capabilities. Codenamed "VIA Trinity", the new platform meets all these performance requirements using much less board real estate than traditional 4-chip platforms, yet still within a comparably low power envelope.
While desktop PCs, notebooks and embedded devices are getting smaller and thinner, demands on system resources are growing by the day, with higher definition video content, richer Internet resources and increasingly complex image manipulation requiring more powerful processing, video and graphics capabilities. Codenamed "VIA Trinity", the new platform meets all these performance requirements using much less board real estate than traditional 4-chip platforms, yet still within a comparably low power envelope.
