At the 2025 International CES, we went hands on with the new NVIDIA GeForce RTX 5090 Founders Edition "Blackwell" graphics card. This thing is huge—longer and taller than the RTX 4090 FE, and yet just 2 slots thick. This is because NVIDIA's designers have figured out that the heat dissipation area of the heatsink lost to thinning the card can be recovered by stretching it in other directions. The card retains the essential aesthetic of Founders Edition cards from the past two generations going back to the RTX 30-series, but changes the concept of the dual-axial flow-through.

While past generations used an intake fan on one side, blowing onto the PCB, and another fan at the tail end of the backplate pull air through the heatsink and out the back, the RTX 5090 FE has two large fans, both of which blow cold air through the heatsink, and out the back of the card. The PCB is located in the center of the card, and relies on a set of breakout PCBs for host interface and display outputs.

At CES 2025, we found the SSD controller that will spur high-end NVMe Gen 5 SSD adoption. Until now, high-end Gen 5 SSDs were driven by Phison's E26 series controller that the company built on TSMC's 12 nm process. The company on Monday launched the new E28 series controller (full name PS5028-E28). This chip is built on the much more advanced TSMC 6 nm process. The new process lets Phison to significantly lower the electrical cost of its NAND flash interface serializer-deserializer, and step up performance closer to the interface limits of PCI-Express 5.0 x4. The controller offers sequential speeds of up to 14.5 GB/s, which is an increase from last year's E26 Max14um variant.

The company showed us the bare E28 controller chip, and a reference-design SSD based on it. Not much to report, except that the drive lacked any cooling solution. Production SSDs powered by the E28 will still need heatsinks to achieve optimal performance, although they won't run as hot as drives powered by the E26. The company didn't have any performance demo stations set up with this drive.

Kioxia today introduced the Exceria Plus G4, a mid-range M.2 NVMe Gen 5 SSD. Built in the M.2-2280 form-factor, the drive takes advantage of the PCI-Express 5.0 x4 host interface, and comes in capacities of 1 TB and 2 TB. Both models offer sequential read speeds of up to 10,000 MB/s, but while the 1 TB model offers up to 7,900 MB/s sequential writes, the 2 TB model does up to 8,200 MB/s. 4K random access performance for both models are listed at up to 1.3 million IOPS reads, with up to 1.4 million IOPS writes. The 1 TB model endures up to 600 TBW of writes, while the 2 TB model is double that, at 1,200 TBW. Under the hood, the Kioxia Exceria Plus G4 appears to combine a Phison E31T series DRAMless NVMe Gen 5 controller, with Kioxia 218-layer BiCS flash memory. The company is backing the drive with 5-year product warranty. It didn't reveal pricing information.

ASRock has unveiled a full lineup of Z890 motherboards, led by the new Taichi series flagship models. This series offers a powerful mix of options for extreme enthusiasts, including the ASRock Z890 Taichi AQUA, Taichi OCF, Taichi, and Taichi Lite. Other ASRock Z890 motherboards include the gaming-focused Phantom Gaming series, featuring the Nova, Riptide, and Lightning models, as well as the popular Steel Legend, LiveMixer, and Pro series for mainstream users. The new Z890 motherboards support the latest Intel Core Ultra 200 series processors, offering more high-speed expansion such as PCI-Express 5.0 support for a graphics card, as well as M.2 SSD, and more importantly up to two Thunderbolt 4 ports for all Z890 motherboards.

The New Era of Taichi
The white-styled ASRock Z890 Taichi AQUA introduces a unique hybrid thermal design developed in collaboration with Alphacool, which combines air and water cooling for the VRM and M.2 block. The Z890 Taichi AQUA also features the first detachable M.2 water block for Gen-5 SSDs, simplifying and streamlining installation.

With PC motherboard manufacturers implementing 40 Gbps USB4, one wonders what's next for the [mostly] universal connectivity standard. Turns out, it is USB4 2.0, which yields the connector 80 Gbps of data bandwidth per direction, and 60 W of power-delivery (PD). Power delivery for USB4 2.0 can be as high as 240 W (48 V, 5 A). Japanese PC peripherals maker Elecom is the first with certified cables for both 80 Gbps + 60 W PD and 80 Gbps + 240 W PD. Besides power and data, both cables support DisplayPort passthrough for up to 8K @ 60 Hz (7680 x 4320 pixels). USB-IF, the governing body of the USB standard, is expected to formally launch USB4 2.0 in December 2024. A typical USB4 2.0 host controller will require at least a PCI-Express 5.0 x4 system bus connection to reach the standard's maximum bandwidth.

MSI today launched its first wave of Socket AM5 motherboards based on the new AMD X870E and AMD X870 chipsets, which come with drop-in support for the new Ryzen 9000 "Granite Ridge" processors, and new platform I/O. The company debuted products across its four key consumer motherboard brands—MEG, MPG, MAG, and PRO. Leading the pack is the flagship MEG X870E GODLIKE, followed by the performance segment MPG X870E Carbon WIFI, the mid-range MAG X870 Tomahawk WIFI, and the mainstream PRO X870-P WIFI.

The MEG X870E GODLIKE isn't just a flagship motherboard with no feature spared, but designed to be a piece of jewelry. It is shrouded almost entirely in heatsinks. Almost all its onboard I/O faces the front-end, including a 24-pin ATX, and two optional 8-pin PCIe power inputs. The two 8-pin EPS power inputs are exposed near the CPU socket area. A 27-phase VRM powers the CPU, with an active fan-heatsink solution that uses a series of aluminium fin-stack heatsinks with heat-pipes spreading heat among them. The CPU is wired to four DDR5 DIMM slots, supporting over DDR5-8000, with preparation for higher memory OC speeds that may come up in the future. Expansion slots include a PCI-Express 5.0 x16, a second x16 (electrical Gen 4), and a x4. There are four M.2 NVMe slots, three of these are Gen 5, and one Gen 4.

GIGABYTE just released its second AMD 800-series chipset motherboard following last week's debut of the X870E AORUS Master, the more affordable X870 AORUS Elite WIFI7. This board is based on the slightly more affordable AMD X870 (non-E) chipset, which offers connectivity nearly identical to that of the previous-generation AMD B650E, but with the addition of USB4. The board is built in the ATX form-factor, and features a 6-layer PCB. It draws power from a combination of 24-pin ATX and two 8-pin EPS power connectors. The CPU VRM solution consists of a 16+2+2 phase setup, with the vCore side of it being 8-phase with phase doubling. The Socket AM5 is wired to four DDR5 DIMM slots for up to 256 GB of memory.

Expansion slots include a PCI-Express 5.0 x16 wired to the CPU, a PCI-Express 4.0 x16 (electrical Gen 4 x4), and a third PCI-Express 3.0 x16 (electrical Gen 3 x2). The main Gen 5 x16 PEG slot gets a quick-release lever. You press a button, and it ejects the graphics card. Storage connectivity includes three M.2 Gen 5 x4 slots, two of these are wired to the CPU's dedicated Gen 5 x4 NVMe lanes, while the third slot subtracts 8 lanes from the Gen 5 x16 PEG slot. There is a fourth M.2 slot, which is Gen 4 x4, and wired to the X870 FCH. All four slots get heatsinks. Four SATA 6 Gbps ports make for the rest of the storage connectivity.

Leading global motherboard manufacturer, ASRock has announced that its W790 series workstation motherboards, including the W790 WS and W790 WS R2.0, now support the newly released Intel Xeon W-3500 series and Xeon W-2500 series processors. This enables consumers to experience the superior performance of the latest Intel Xeon series processors.

The ASRock W790 WS series workstation motherboards feature up to 2 TB DDR5 ECC RDIMM support, PCI-Express 5.0 expansion slots, USB4/Thunderbolt 4 and Dual 10 Gbps Ethernet. A flagship-class 14-layer PCB and 20+2 phase CPU VRM ensures ultimate performance and superb reliability, even when subjected to the most demanding sustained workloads.

GIGABYTE today debuted its AMD 800-series motherboards with the launch of the premium X870E AORUS Master. This will go on to be the company's second most premium product on this chipset, as the company is also planning the X870E AORUS Xtreme. The AORUS Master is still packed to the gills with everything this chipset has to offer, along with high-end onboard devices. The board is built in the ATX form-factor, and draws power from a combination of 24-pin ATX and two 8-pin EPS power connectors. It offers a 16+2+2 phase digital VRM featuring 110 A power stages. The board is laid out on a premium 8-layer PCB. You get tall extruded aluminium heatsinks for the CPU VRM, and the topmost M.2 NVMe Gen 5 slot.

The AMD Socket AM5 is wired to four DDR5 DIMM slots that support up to 192 GB of dual-channel DDR5, at speeds of over DDR5-8000. It also puts out no less than three M.2 NVMe Gen 5 slots. Two of these are wired to the dedicated x4 interfaces from the AMD "Raphael" or "Granite Ridge" processor, while one of them subtracts 4 lanes from the board's PCI-Express 5.0 x16 PEG slot. The board's fourth M.2 NVMe slot is Gen 4, and wired to the chipset. The only other expansion slots are a couple of PCI-Express 4.0 x16 (electrical Gen 4 x1). Besides the M.2 slots, you get four SATA 6 Gbps ports completing the board's storage connectivity.

AMD "Granite Ridge" is codename for the four new Ryzen 9000 series desktop processors the company plans to launch on July 31, 2024. The processor is built in the Socket AM5 package, and is meant to be backwards compatible with AMD 600-series chipset motherboards, besides the new 800-series chipset ones that will launch alongside. "Granite Ridge" is a chiplet-based processor, much like the Ryzen 7000 "Raphael," Ryzen 5000 "Vermeer," and Ryzen 3000 "Matisse." AMD is carrying over the 6 nm client I/O die over from "Raphael" in an effort to minimize development costs, much in the same way it carried over the 12 nm cIOD for "Vermeer" from "Matisse."

The SoC I/O features of "Granite Ridge" are contemporary, with its awesome 28-lane PCI-Express Gen 5 root complex that allows a PCI-Express 5.0 x16, two CPU-attached M.2 Gen 5 slots, and a Gen 5 x4 chipset bus. There's also a basic integrated graphics solution based on the older RDNA 2 graphics architecture; which should make these processors fit for all use-cases that don't need discrete graphics. The iGPU even has multimedia accelerators, an audio coprocessor, a display controller, and USB 3.2 interfaces from the processor.

A picture of a bare PCB of an upcoming GIGABYTE Z890 AORUS Pro Ice motherboard confirms that Intel will use the Core Ultra branding for its next-generation desktop processors based on the "Arrow Lake-S" microarchitecture. The picture reveals the CPU socket area, where the Socket LGA1851 will be installed, besides the CPU VRM component, the BIOS ROM, and the DDR5 DIMM slots, among other minor components. Although incompatible with LGA1700, the new LGA1851 socket has an identical cooler mount layout to it, and retains cooler compatibility, much like LGA1200 did with LGA1151. The AORUS Pro Ice comes with four DDR5 DIMM slots, as that's the only memory standard supported by "Arrow Lake" (no DDR4 support); and the CPU VRM solution uses DrMOS.

Our older article details the I/O aspects of "Arrow Lake-S." It is almost identical to the LGA1700, except it has four additional PCIe Gen 5 lanes from the CPU, for a total of 20 Gen 5 lanes, and 12 Gen 4 lanes. All Z890 motherboards will come with an M.2 Gen 5 NVMe slot that doesn't eat into the PCI-Express 5.0 x16 PEG slot's bandwidth; and an additional Gen 4 x4 that can either be wired out as an M.2 slot, or be used to drive bandwidth-hungry onboard devices, such as discrete Thunderbolt 4 or USB4 controllers. The chipset bus continues to be DMI 4.0 x8, or 128 Gbps per direction.

Intel introduced a line of 14th Gen Core "Raptor Lake Refresh" Socket LGA1700 processors for the embedded systems market. A highlight of these chips is that they come with their "Gracemont" E-core clusters disabled, and are pure P-core chips. It's interesting that Intel targets these chips for the embedded systems segment, but isn't building these in the non-socketed BGA packages carried over from its mobile platforms. Intel is addressing nearly all performance market-segments with these chips, including the very top. The Core i9-14901KE processor leading the pack is an 8-core/16-thread chip with eight "Raptor Cove" cores sharing the full 36 MB L3 cache available on the "Raptor Lake-S" die, a maximum boost frequency of 5.80 GHz, base frequency of 3.80 GHz, and processor base power of 125 W. The chip features an iGPU. The "K" in KE denotes that the chip supports overclocking.

Next up, is the Core i9-14901E, the 65 W sibling of this chip, which lacks an unlocked multiplier, and boosts up to 5.60 GHz, with a 2.80 GHz base frequency. Things get interesting with the Core i7-14701E, because the differentiator between the Core i9 and Core i7 SKUs is E-core count, and here we see the i7-14701 retaining the same 8-core/16-thread pure P-core configuration as the Core i9 chips, but with a touch lower frequencies of 5.40 GHz maximum boost, and 2.60 GHz base.

Phison is arguably the most popular brand for SSD controllers in the client segment, but is turning more of attention to the vast enterprise segment. The company had been making first-party enterprise SSDs under its main marquee, but decided that the lineup needed its own brand that enterprise customers could better discern from the controller ASIC main brand. We hence have Pascari and Imagin. Pascari is an entire product family of fully built enterprise SSDs from Phison. The company's existing first-party drives under the main brand will probably migrate to the Pascari catalog. Imagin, on the other hand, is a design service for large cloud and data-center customers, so they could develop bespoke tiered storage solutions at scale.

The Pascari line of enterprise SSDs are designed completely in-house by Phison, feature their latest controllers, firmware, PCB, PMIC, and on-device power-failure protection on select products. The third-party components here are the NAND flash and DRAM chips, which have both been thoroughly evaluated by Phison for the best performance, endurance, and reliability, at their enterprise SSD design facility in Broomfield, Colorado. Phison already had a constellation of industry partners and suppliers to go around with, and the company's drives even power space missions; but the Pascari brand better differentiates the fully-built SSD lineup from the ASIC make. Pascari makes its debut with the X200 series high-performance SSDs for high-access heat data. The drive leverages Phison's latest PCIe Gen 5 controller technology, the most optimized memory components, and availability in all contemporary server storage form-factors.

ASRock today introduced the W790 WS R2.0 motherboard for workstations powered by 4th Gen Intel Xeon W-3400 and W-2400 series processors in the Socket LGA4677 package. Although its model name suggests that it is a revision of the W790 WS, the new W790 WS R2.0 appears to be a lite version of the original, which removes several I/O features. To begin with, the fancy I/O shroud makes way for bare connectors, where you can see several of the connectors stripped away. While the CPU VRM appears unchanged, the VRM heatsinks used on the R2.0 are of a simpler design. The design effort behind both these changes appears to be to make the board friendly to certain kinds of rackmount chassis.

Besides the design changes, the ASRock W790 WS R2.0 loses out on Thunderbolt 4, Wi-Fi 6E, and only has a single 10 GbE interface instead of dual-10 GbE on the original W790 WS. These aside, the W790 WS R2.0 is still a very capable workstation motherboard for the platform it's based on. It draws power from a combination of 24-pin ATX, two 8-pin EPS, and a 6-pin PCIe power; and uses a 22-phase CPU VRM. The board features four PCI-Express 5.0 x16 slots (x16/NC/x16/NC or x16/NC/x8/x8 or x8/x8/x8/x8), and one PCI-Express 4.0 x16 (electrical x4). The CPU socket is wired to eight memory slots, supporting quad-channel DDR5 memory, with support for DDR5 RDIMM-3DS, a total memory capacity of 2 TB, and a maximum overclocked memory speed of DDR5-6800.

Colorful unveiled the iGame B760M Ultra Z, a Socket LGA1700 motherboard in the Micro-ATX form-factor, with a distinctive white PCB, but that's hardly the story—this is Colorful's first motherboard with backside connectors, for more discretely cabled PC builds. The board doesn't use any marketing buzzwords such as "BTF" or "Project Zero," but has its onboard connectors aligned to support PC cases with motherboard tray cutouts for either of the two standards. The board draws power from a combination of 24-pin ATX and 4-pin ATX connectors (sufficient for Intel Performance Power Delivery profile). The processor is wired to a PCI-Express 5.0 x16 slot, and an M.2-2280 Gen 4 slot. Colorful used the region of the PCB next to the four DDR5 memory slots—where you'd normally have 24-pin and other connectors—to position an additional M.2 slot hidden behind a heatsink. There is yet another M.2 slot between the two PCIe slots.

The backside of the PCB has the board's power connectors, four SATA 6 Gbps ports, the USB- and HD audio headers, fan headers, and the front-panel headers. Networking connectivity include Wi-Fi 6E and 2.5 GbE. USB connectivity includes two 5 Gbps type-A USB 3.2 Gen 1 ports, a 10 Gbps type-C USB 3.2 Gen 2 port, and four USB 2.0 ports. There are two additional 5 Gbps ports via an internal header. HDMI and DisplayPort make up the display connectivity. The motherboard offers the USB BIOS Flashback feature. Available now in the Chinese market, the Colorful iGame B760M Ultra Z is priced at RMB ¥1,199 or (converts to USD $167).

Intel is planning to launch its next-generation Arc "Battlemage" GPUs in 2024. When they come out, they could possibly be the first to implement a PCIe Gen 5 host interface, with the BCM-G10 silicon powering the top SKUs reportedly featuring PCI-Express 5.0 x16. Given how sensitive current generation Arc GPUs are to host interface features such as resizable BAR, the GPUs might possibly need not just the added bandwidth, but also features Gen 5 introduces, such as memory coherency. It might not just be a move aimed at sprucing up the specs sheet.

The Moore's Law is Dead report behind this leak also says that with the Arc Xe2 generation, Intel might not release mobile AIC cards like it does with the current generation. Now, this does not mean that there won't be mobile SKUs, it's just that they'll be sold to laptop OEMs to hardwired onto their laptop mainboards—as it's done on the majority of laptops with discrete GPUs. Besides laptop GPUs in trays, Intel will also develop desktop PCIe add-on graphics cards based on the new GPUs.

The current crop of PCIe Gen 5 based M.2 NVMe SSDs run scorching hot to deliver sequential transfer speeds of 10 GB/s, requiring some massive cooling solutions with tiny fans. All this might change, as Phison, a leading SSD controller manufacturer, unveiled three new controllers at the 2024 International CES. One of these that stands out, is the PS5031-E31T, which is built on the 7 nm node, and could power the first Gen 5 SSDs delivering 10 GB/s without elaborate cooling solutions. This is a big upgrade from the 12 nm node used by their first Gen 5 controllers. The PS5031-E31T is a DRAMless controller meant for mainstream Gen 5 SSDs. This controller has a 4-channel flash interface (16 CE), a PCI-Express 5.0 x4 host interface, supports capacities of up to 8 TB, and is claimed by Phison to offer sequential transfer rates of up to 10.8 GB/s, and up to 1500K IOPS random access; exceeding the fastest Gen 4 SSDs.

Phison also updated its high-end controller lineup with the new PS5026-E26 Max14um. This is a variant of the E26 that's designed for the upcoming Micron B58R NAND flash chip that offers 2400 MT/s per channel transfers. Over the 8-channel interface of the E26, this finally unlocks sequential transfer speeds exceeding 14 GB/s reads, and 12.7 GB/s sequential writes. This is merely a revision of the existing E26 with updated power-optimized firmware, the underlying silicon is identical. The E26 Max14um is the first controller to surpass 1000 MB/s in all three PCMark 10 storage tests. We have a sample of an SSD powered by the E26 Max14um in our labs, and will post our review soon.

MSI Spatium M580 Liquid Frozr is easily one of the most interesting SSDs we've come across in CES 2024. Picture this—an M.2-2280 SSD that has a self-contained liquid cooler, complete with a fan, radiator, a pump-block, and coolant channels. This is both cute and a little sad. M.2 SSDs were supposed to stay out of sight and be completely cable-free, like DIMMs. This isn't MSI's fault, they have to use the fastest controllers in the market, which are built on older 12 nm foundry nodes. PCI-Express 5.0 x4 is comparable bandwidth to PCI-Express 3.0 x16, and moving this kind of data is bound to generate heat for an SSD controller. Enough banter—the Spatium M580 uses the fastest Phison E26 Max14um controller, with Micron's fastest B58R 232-layer 3D NAND flash chips that deliver 2400 MT/s per flash channel.

The combination of Phison Max14um and B58R results in sequential transfer speeds beyond the 14 GB/s mark, which is where most PCIe Gen 5 x4 drives will end up accounting for the interface+protocol overhead. The theoretical max bandwidth of Gen 5 x4 is 16 GB/s. The drive comes in capacities of up to 4 TB. As for the cooler's design, the bare drive makes contact with a copper cold-plate, which has the block+reservoir, with a tiny pump. This sends coolant through a real aluminium heat-exchanger—this is probably the smallest radiator we've ever seen. The radiator is held up, a supporting structure has a tiny 20 mm lateral-flow fan, which blows air through the radiator. We can't wait to review this thing!

KIOXIA brought a handful of its latest data center SSDs to the 2024 International CES. The lineup begins with the CD8P series designed for a balance in data-heat (frequency of access) and capacity, with applications that include CDN, compute, read-intensive use-cases, and data streaming. The drive comes in the 2.5-inch 18 mm U.2 and EDSFF E3.8 form-factors. The CD8P features a PCI-Express 5.0 x4 host interface, and comes in capacities ranging between 1.92 TB, going all the way up to 15.36 TB. Write endurance recommended is between 1 DWPD to 3 DWPD, so this really isn't a major write-intensive drive, for that, you'll need to pay attention to our next drive, the KIOXIA FL6.

The FL6 from KIOXIA is a scribe par none. It's aimed at write heavy applications such as server caching, and the hottest tiers in tiered storage; and Big Iron database machines. The FL6 comes in capacities of up to 3.2 TB, but offers a mammoth 60 DWPD write endurance. It comes in the 2.5-inch 18 mm form factor with PCI-Express 3.0 x4 interface. Security features include SIE, SED, and FIPS 140-2.

Intel today announced the release of its 14th Gen Core HX series "Raptor Lake Refresh" mobile processors. Processor models from this series are supposed to cap off the upper end of Intel's mobile processor portfolio. Although Intel released the Core Ultra "Meteor Lake" mobile processors late last year, those chips cover the U-segment, and H-segment (ultraportable, thin-and-light, and mainstream); with the fastest model being the Core Ultra 165H, which caps out at 6P+8E+2LP. The HX segment, which started out as enthusiast-class, broadened in scope over the years to cover the bulky gaming notebooks and portable workstations. These chips typically have a power rating of 55 W. All chips have maximum turbo power rating of 157 W. Intel is tapping into its "Raptor Lake Refresh" silicon to carve out these processors. This is a monolithic chip built on the Intel 7 process, and its package is a multi-chip module with an on-package PCH.

The lineup begins with the Core i9-14900HX, which maxes out the "Raptor Lake Refresh" silicon, with an 8P+16E core-count, with 2 MB of L2 cache per P-core, 4 MB of L2 cache per E-core cluster, and a shared 36 MB L3 cache. The processor's full I/O is wired out, including support for dual-channel DDR5 (SO-DIMMs only), a PCI-Express 5.0 x16 connection for discrete GPUs, a PCI-Express 4.0 x4 connection for a CPU-attached M.2 NVMe SSD, and DMI 4.0 x8 link between the processor die and the PCH die. This PCH puts out up to 16 PCIe Gen 4 lanes, besides up to 12 Gen 3 lanes, which notebook designers can combine with discrete Thunderbolt 4 controllers, and the likes. You can expect Wi-Fi 7 to be prevalent in this crop of premium gaming notebooks. The i9-14900HX features a P-core maximum boost frequency of 5.80 GHz, and an E-core boost frequency of 4.10 GHz.

MINISFORUM released the AR900i, an MoDT (mobile on desktop) motherboard in the Mini-ITX form factor that comes with a hardwired Intel Core i9-13900HX mobile processor and a pre-installed cooling solution. The board is priced at $560 on Amazon, with a limited-period $70-off coupon. This is good value, considering that the i9-13900HX is a maxed-out "Raptor Lake" based mobile processor that features all 8 P-cores, all 16 E-cores, and all 36 MB of shared L3 cache physically present on the "Raptor Lake" silicon. The P-cores boost up to 5.40 GHz, and the E-cores up to 3.90 GHz. The only catch with this processor compared to something like a desktop i9-13900, is its power specs that were originally designed for the power constraints of notebooks, with 55 W base power, and 157 W of maximum turbo power, compared to 225 W of the socketed i9-13900.

Since the Core i9-13900HX is a mobile BGA1964 package that remains hardwired to the board, it is not upgradable. MINISFORUM has designed a cooling solution specific to the processor, which uses a large aluminium fin-stack heatsink that relies on an 80 mm case fan for ventilation. There's a secondary fan-heatsink that provides cooling to two M.2-2280 slots north of the processor. Each of these two M.2 slots has a PCI-Express 5.0 x4 wiring, and using either of them subtracts 8 PCIe lanes from the board's sole expansion slot, a PCI-Express 5.0 x16. The board features an M.2 E-key slot that you can pair with your own WLAN card, it comes with provision for dual-MIMO ready antennas. The processor is wired to two DDR5 SO-DIMM slots supporting up to 96 GB of memory. The board draws power from a 24-pin ATX and a single 8-pin EPS, which should prove sufficient for this processor.

Leading global motherboard manufacturer, ASRock, proudly announces its new WRX90 WS EVO & TRX50 WS motherboard for new AMD Ryzen Threadripper 7000 and AMD Ryzen Threadripper PRO 7000 WX-Series processors. The new motherboards support 4/8 channel memory up to 1 TB/2 TB DDR5 ECC RDIMM, PCI-Express 5.0 expansion slots, server grade storage expansion such as Slim-SAS & MCIO and 10 Gbps Ethernet, giving ultimate performance for almost every application such as content creating, video rendering, high-end workstation and even AI machine learning.

Ultimate Performance & Rock-Solid Stability
To ensure stability for AMD Ryzen Threadripper 7000 and AMD Ryzen Threadripper PRO 7000 WX-Series processors in all conditions and systems loads, the WRX90 WS EVO & TRX50 WS has been given a flagship-class server grade ultra-low loss PCB and 18+3+3 phase SPS Dr.MOS VRM design to ensure ultimate performance and superb reliability, even when subjected to the most demanding sustained workloads.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced the launch of the MP700, its first PCIe Gen 5 M.2 SSD. Available in capacities up to 2 TB, the MP700 sets a new standard for next-generation storage, with sequential read and write performance topping out an incredible 10,000 MB/sec and 10,000 MB/sec respectively—up to 40% faster than even the best PCIe 4.0 SSDs available today (see cooling requirements below).

On top of the impressive sequential throughput, the random read and write performance of up to 1.5 million read and 1.7 million write input/output operations per second (IOPS) put the MP700 way ahead of the best PCIe Gen 4 drives. The MP700 is backward compatible with PCIe 4.0 motherboards, making this an upgrade that will last you for years to come. Native support for Microsoft DirectStorage ensures that you'll get the most from the latest games, while copying files in Windows and loading applications has never felt so fast.

Don't forget to check out the TechPowerUp Review of the CORSAIR MP700 2 TB SSD

Crucial T700 marks the brand's return to the high-end SSD segment after years of catering to the mainstream segment with well-priced drives that the company can move in high volumes. The company had retired its Ballistix brand to mark its withdrawal from the high-end. The drive combines Micron's 232-layer 3D TLC NAND flash with a Phison E26-series controller and LPDDR4-based DRAM cache, and takes advantage of the PCI-Express 5.0 x4 host interface, with NVMe. A small section of the tech press was sampled with these drives and permitted to do performance previews.

Every SSD manufacturer's favorite benchmark, CrystalDiskMark (CDM), shows the drive clock 12.4 GB/s sequential reads (1 MB, QD8), along with 9.22 GB/s (1 MB QD1). Sequential writes are as high as 11.87 GB/s (1 MB QD8), and 9.66 GB/s (1 MB QD1). IOMeter testing revealed that the sustained write speeds are rather low, with the T700 holding onto top speeds only up to 25 GB, beyond which write performance falls off a cliff to 3.8 GB/s. Find more such interesting results in the source link below.

AMD is preparing a rather late counter to the Xeon W-2400 and W-3400 series "Sapphire Rapids" workstation platform with the Threadripper 7000 series and the Socket TR5 platform, in the second half of 2023, according to an ASUS product manager. While high core-count Threadripper Pro 5000WX processors still offer performance competitive to the latest Xeon W processors, the Intel platform offers the latest I/O, including support for faster DDR5 memory and PCIe Gen 5. The expectation with the Threadripper 7000 "Storm Peak" series is to increase CPU core IPC with the switch to "Zen 4," and introduce support for the latest DDR5 and PCIe Gen 5.

AMD's delay in releasing the Threadripper 7000 series has to do with the company wanting to push more high-margin EPYC "Genoa" processors to its large enterprise customers first; and possibly to take the time to redraw its platform to better counter the sub-classification Intel introduced within its Xeon W family, where the W-2400 series is targeted more toward the HEDT consumer, with its 4-channel memory and 64-lane PCIe interface; while the W-3400 series with its 8-channel memory interface, targets serious workstation use-cases; while both processors share a common socket and chipset. AMD could take a similar approach to the TR5 platform.