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Tachyum Delivers the Highest AI and HPC Performance with the Launch of the World's First Universal Processor

Tachyum today launched the world's first universal processor, Prodigy, which unifies the functionality of a CPU, GPU and TPU in a single processor, creating a homogeneous architecture, while delivering massive performance improvements at a cost many times less than competing products.

After the company undertook its mission to conquer the processor performance plateau in nanometer-class chips and the systems they power, Tachyum has succeeded by launching its first commercial product. The Prodigy Cloud/AI/HPC supercomputer processor chip offers 4x the performance of the fastest Xeon, has 3x more raw performance than NVIDIA's H100 on HPC and has 6x more raw performance on AI training and inference workloads, and up to 10x performance at the same power. Prodigy is poised to overcome the challenges of increasing data center power consumption, low server utilization and stalled performance scaling.

Samsung Electronics Introduces Industry's First 512GB CXL Memory Module

Samsung Electronics, the world leader in advanced memory technology, today announced its development of the industry's first 512-gigabyte (GB) Compute Express Link (CXL) DRAM, taking an important step toward the commercialization of CXL which will enable extremely high memory capacity with low latency in IT systems. Since introducing the industry's first CXL DRAM prototype with a field-programmable gate array (FPGA) controller in May 2021, Samsung has been working closely with data center, enterprise server and chipset companies to develop an improved, customizable CXL device.

The new CXL DRAM is built with an application-specific integrated circuit (ASIC) CXL controller and is the first to pack 512 GB of DDR5 DRAM, featuring four times the memory capacity and one-fifth the system latency over the previous Samsung CXL offering. "CXL DRAM will become a critical turning point for future computing structures by substantially advancing artificial intelligence (AI) and big data services, as we aggressively expand its usage in next-generation memory architectures including software-defined memory (SDM)," said Cheolmin Park, Vice President of Memory Global Sales & Marketing at Samsung Electronics, and Director of the CXL Consortium. "Samsung will continue to collaborate across the industry to develop and standardize CXL memory solutions, while fostering an increasingly solid ecosystem."

Intel Said to be Launching 55 W Alder Lake-HX Mobile CPUs Next Week

On Tuesday and Wednesday next week, Intel will host its Intel Vision event which will take a look at what the company will bring in the near future. Although not specified in the program, VideoCardz have managed to secure a slide listing no less than seven new Alder Lake-HX mobile CPUs that Intel are expected to reveal during the event. The new chips will be fully loaded out with eight performance and eight efficient cores and with a total of 24 threads at the top-end, i.e. the same as Intel's current desktop parts. In fact, according to VideoCardz, these CPUs are the same physical size as the desktop CPUs, just in a different packaging that reduces the Z-height.

Alder Lake-HX comes with a base power TDP of 55 W and is said to be a new enthusiast CPU range from Intel in the mobile space. As such, overclocking is said to be allowed, which can push the turbo TDP to at least 157 W and this applies to all the CPUs in the Alder Lake-HX family. The platform is also said to feature a full set of PCIe lanes, which means 16 PCIe 5.0 lanes, 20 PCIe 4.0 lanes and 12 PCIe 3.0 lanes. DDR5 memory with XMP 3.0 profiles is also supported, alongside something called Dynamic Memory Boost. Oddly enough, Intel has even made several vPro SKU's that support overclocking, albeit with some kind of limit compared to the non vPro SKUs. It'll be interesting to see what kind of notebooks these CPUs will be going into and what kind of cooling systems will be required, but it's pretty obvious we're talking desktop replacement machines.

Montage Technology Delivers the World's First CXL Memory eXpander Controller

Montage Technology, a leading data processing and interconnect IC design company, today announced that it has delivered the world's first Compute Express Link (CXL ) Memory eXpander Controller (MXC). The device is designed to be used in Add-in Cards (AIC), Backplanes or EDSFF memory modules to enable significant scaling of memory capacity and bandwidth for data-intensive applications such as high-performance computing (HPC) and artificial intelligence (AI). The MXC is a Type 3 CXL DRAM memory controller. The MXC supports and is compliant with both DDR4 & DDR5 JEDEC standards. It is also designed to the CXL 2.0 specification and supports PCIe 5.0 specification speeds. The MXC provides high-bandwidth and low-latency interconnect between the CPU and the CXL-based devices, allowing them to share memory for higher performance, reduced software stack complexity, and lower data center TCO.

Montage Technology's President, Stephen Tai said, "CXL is a key technology that enables innovative ways to do memory expansion and pooling which will play an important role in next-generation server platforms. I'm very excited that Montage is the first company in the industry to successfully deliver the MXC chip, which signals we are making a critical step towards advancing the CXL interconnect technology to the memory market." CXL Consortium's President, Siamak Tavallaei said, "The CXL Consortium is excited to see continued CXL specification adoption to enable technologies and solutions such as the CXL DRAM Memory eXpander Controller." Montage Technology is working closely with industry-leading memory manufacturers to deliver advanced memory products based on the CXL MXC and help develop a robust memory ecosystem around CXL.

KIOXIA America Showcases Breakthrough Flash Storage Solutions at Dell Technologies World

Next week at Dell Technologies World, KIOXIA America, Inc. will be on hand to demonstrate how its innovative solid state drives (SSDs) are accelerating customer application performance and enabling product breakthroughs. From SSDs designed with PCIe 5.0 technology that boost power and performance to the industry's first lineup of Enterprise and Datacenter Standard Form Factor (EDSFF) E3.S SSDs, best in class drives from KIOXIA are used in a number of Dell product lines.

KIOXIA, the inventor of NAND flash, sits at the forefront of flash storage and SSD innovation. Achievements such as the introduction of 3D flash memory, XL-FLASH storage class memory, and new form factors and interfaces underscore the contributions the company has made toward enabling next-gen applications - and transforming the digital world.

AMD AM5 Socket to Launch with DDR5-Only Memory Option, Feature Dual-Chipset Designs

AMD is preparing to launch its highly-anticipated AM5 socket for the next generation of motherboards. And today, thanks to the sources over at Tom's Hardware, we have information regarding memory support for B650 and X670 motherboards. According to the report, both B650 and X670 chipsets will limit the user's memory option to the latest DDR5 memory standard, making it impossible for users with already existing DDR4 memory to perform a seamless upgrade to a new platform. So far, we don't have a lot of details about Zen4's integrated memory controller, and we can't be certain if it supports DDR5 only or carries legacy DDR4 support. However, it seems like B650 and X670 motherboards will have no plans to enable the DDR4 standard memory usage.

Additionally, the report confirms that the B650 chipset is connected to the AM5 socket via PCIe 4.0 x4 connection and has eight lanes of PCIe 4.0 (four of which are for M.2 SSD), four SATA, and lots of USB ports. Documents suggest that the chipset-socket connection is available using PCIe 5.0 for some AM5 processors, so we have to wait and see how it works. As far as high-end X670 is concerned, this chipset is a combination of two chipset dies, presumably a combination of two B650 modules. This doesn't work as the older north/southbridge type of a solution but rather doubled connectivity of a single B650 chipset. We have to wait for the official launch to confirm this information.

BIOSTAR Launches Z690A-SILVER Motherboard

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, unveils the brand-new Z690A-SILVER motherboard. Designed to unleash the maximum potential of Intel Alder Lake Z690 chipset, the Z690A-SILVER motherboard brings shiny new features to your desktop, packed with raw unhindered potential.

PCIe 5.0 takes center stage on the Z690A-SILVER motherboard, with data transfer rates reaching 128 Gb/s. Extract maximum performance from the latest graphics cards with PCIe 5.0 backed by Intel's all-powerful 12th gen processors. Take your gaming to the next level with BIOSTAR's all new Z690A-SILVER motherboard. The Z690A-SILVER motherboard supports up to 4 DIMMs of high-speed DDR4 RAMs capable of overclocking numbers exceeding 5000+MHz (O.C). Furthermore, features like PCIe M.2 4.0, USB 3.2 GEN2 TYPE-A, and C bring excellent utility for users.

Alibaba Previews Home-Grown CPUs with 128 Armv9 Cores, DDR5, and PCIe 5.0 Technology

One of the largest cloud providers in China, Alibaba, has today announced a preview for a new instance powered by Yitian 710 processor. The new processor is a collection of Alibaba's efforts to develop a home-grown design capable of powering cloud instances and the infrastructure needed for it and its clients. Without much further ado, the Yitian 710 is based on Armv9 ISA and features 128 cores. Ramping up to 3.2 GHz, these cores are paired with eight-channel DDR5 memory to enable sufficient data transfer. In addition, the CPU supports 96 PCIe 5.0 lanes for IO with storage and accelerators. These are most likely custom designs, and we don't know if they are using a blueprint based on Arm's Neoverse. The CPU is manufactured at TSMC's facilities on 5 nm node and features 60 billion transistors.

Alibaba offers these processors as a part of their Elastic Compute Service (ECS) instance called g8m, where users can select 1/2/4/8/16/32/64/128 vCPUs, where each vCPU is equal to one CPU core physically. Alibaba is running this as a trial option and notes that users should not run production code on these instances, as they will disappear after two months. Only 100 instances are available for now, and they are based in Alibaba's Hangzhou zone in China. The company notes that instances based on Yitian 710 processors offer 100 percent higher efficiency than existing AMD/Intel solutions; however, they don't have any useful data to back it up. The Chinese cloud giant is likely trying to test and see if the home-grown hardware can satisfy the needs of its clients so that they can continue the path to self-sustainability.

AMD Ryzen 7000 Series Processor Spotted Running on MSI MAG B650 Motherboard at 1.5 Volts

AMD is slowly gearing up to launch the latest 7000 series Ryzen processors codenamed "Raphael." Thanks to the famous hardware leaker @9550pro on Twitter, we have evidence of B650 motherboards for the next-generation hardware. According to the image posted by the leaker, it appears like AMD's Ryzen 7000 series Raphael processor is running on MSI's MAG B650 motherboard at a very high voltage of 1.5 Volts VCore. While we don't know the exact SKU running here, we see a note referring to it as an Engineering Sample, meaning that this is not a final product. It is expected to see the new AM5 platform make a debut alongside DDR5 and PCIe 5.0 technology, so we have to wonder what the B650 chipset can support.

Keysight Delivers Single Vendor Validation Solution for Seamless Support of PCIe 5.0 and 6.0

Keysight Technologies, Inc., a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, announced an end-to-end PCIe test solution for digital development and senior engineers that enable the simulation, pathfinding, characterization, validation and compliance testing of PCIe designs. The rapid increase of AI (artificial intelligence) related workloads in data centers and edge computing demand new compute designs. Data center system designers are challenged to provide new higher speed devices within reduced design cycles. New PCIe devices will need to keep up with Ethernet network interfaces in data centers and the emergence of CXL (compute express link).

To maintain performance goals and prepare for the PCIe 6.0 move to pulse amplitude modulation 4-level (PAM4), customers need a smooth transition from PCIe 5.0 to 6.0, where the integrity of PCIe measurements are backed by leading-edge tools and comply with PCIe specifications. With shrinking design cycles, end-to-end solutions from simulation to validation through the layers of the stack are required. Keysight provides a comprehensive physical layer test solution, approved by the Peripheral Component Interconnect Special Interest Group (PCI-SIG) to test transmitters and receivers for all generations of the PCIe specification, which is currently supported by the PCI-SIG integrators list. To reflect the increasing time to market pressure for design engineers, Keysight extends the portfolio to cover PCIe protocol, making it the first end-to-end solution from simulation to full stack validation.

AMD's Upcoming Zen 4 Based Genoa CPUs Confirmed to Have 1 MB L2 Cache per Core

As unreliable as Geekbench can be as a comparative benchmark, it's also an excellent source for upcoming hardware leaks and in this case more details about AMD's upcoming Zen 4 based Genoa server and workstation processors has leaked. Someone with access to a 32-core engineering sample thought it was a good idea to run geekbench on it and upload the results. As the engineering sample CPU is locked at 1.2 GHz, the actual benchmark numbers aren't particularly interesting, but the one interesting titbit we get is that AMD has increased the L2 cache to 1 MB per core, or twice as much as its predecessor.

What seems to be missing from this engineering sample is any kind of 3D V-Cache, as it only has a total of 128 MB L3 cache. Despite the gimped clock speed, the Genoa CPU is close to an EPYC 7513 in the single core tests and that CPU has a 2.6 GHz base clock and a 3.65 GHz boost clock, both system running Ubuntu 20.04 LTS. It manages to beat it in a couple of the sub-tests, such as Navigation, SQLite, HTML5, gaussian blur and face detection and it's within a few points in things like speech recognition and rigid body physics. This is quite impressive considering the Genoa engineering sample is operating at less than half the clock speed, or possibly even at a third of the clock speed of the EPYC 7513. AMD is said to be launching its Zen 4 based Genoa CPUs later this year and models with up to 96 core and 192 threads, with 12-channel DDR5 memory and PCIe 5.0 support are expected.

NVIDIA Unveils Grace CPU Superchip with 144 Cores and 1 TB/s Bandwidth

NVIDIA has today announced its Grace CPU Superchip, a monstrous design focused on heavy HPC and AI processing workloads. Previously, team green has teased an in-house developed CPU that is supposed to go into servers and create an entirely new segment for the company. Today, we got a more detailed look at the plan with the Grace CPU Superchip. The Superchip package represents a package of two Grace processors, each containing 72 cores. These cores are based on Arm v9 in structure set architecture iteration and two CPUs total for 144 cores in the Superchip module. These cores are surrounded by a now unknown amount of LPDDR5x with ECC memory, running at 1 TB/s total bandwidth.

NVIDIA Grace CPU Superchip uses the NVLink-C2C cache coherent interconnect, which delivers 900 GB/s bandwidth, seven times more than the PCIe 5.0 protocol. The company targets two-fold performance per Watt improvement over today's CPUs and wants to bring efficiency and performance together. We have some preliminary benchmark information provided by NVIDIA. In the SPECrate2017_int_base integer benchmark, the Grace CPU Superchip scores over 740 points, which is just the simulation for now. This means that the performance target is not finalized yet, teasing a higher number in the future. The company expects to ship the Grace CPU Superchip in the first half of 2023, with an already supported ecosystem of software, including NVIDIA RTX, HPC, NVIDIA AI, and NVIDIA Omniverse software stacks and platforms.
NVIDIA Grace CPU Superchip

KIOXIA Introduces 2nd Generation SSDs for Enterprise and Hyperscale Data Centers Designed with PCIe 5.0 Technology

KIOXIA America, Inc., today announced that it is sampling its 2nd generation PCIe 5.0 SSD for enterprise and data center customers. After being the first vendor to offer a drive using the PCIe 5.0 interface, KIOXIA has now introduced the new CD8 Series data center NVMe SSD family. CD8 SSDs double the bandwidth per lane over PCIe 4.0 SSDs from 16 gigatransfers per second (GT/s) to 32GT/s and are optimized for hyperscale data center and enterprise server-attached workloads.

"Today, PCIe 4.0 SSDs are considered at the forefront in terms of delivering the highest levels of drive performance," commented Greg Wong, founder and principal analyst, Forward Insights. "Next generation PCIe 5.0 SSDs provide twice the level of performance, and will continue to propel the PCIe/NVMe SSD market - which is expected to grow at a CAGR of over 20% out to 2026."

FSP Announces Power Supplies Compliant with Intel PSDG ATX 3.0 and PCIe 5.0

FSP Group, the leading manufacturer of high-performance power supplies today, announces product compliance with INTEL PSDG ATX 3.0 and PCIe 5.0 for the ultimate performance enhancement.

The retail models of FSP's consumer-based power supply range are getting a major overhaul with the addition of INTEL Power design guide ATX 3.0 and PCIe 5.0 specification compliance, packing more power and stability that is tailor-made for high demand systems. Traditional power supplies need three 8-pin to 16-pin adapters to support the latest PCIe Gen 5.0 graphics cards. FSP looks to address this drawback with their latest iteration of PSUs, unlocking seamless integration with all the latest hardware in the market.

PCI-SIG Approves Teledyne LeCroy PCI Express 5.0 Compliance Solution

Teledyne LeCroy, the worldwide leader in serial data test solutions is pleased to announce that the Peripheral Component Interconnect Special Interest Group (PCI-SIG), responsible for the definition of serial expansion buses and related components required to drive fast, efficient transfers between processors and peripheral devices, has approved Teledyne LeCroy as a solution vendor for official PCI Express (PCIe ) 5.0 link and transaction layer compliance testing at the PCI-SIG compliance workshops.

Compliance testing allows design and test engineers to ensure product interoperability as well as adherence to the PCIe standard, enabling technology adoption among integrators. The Summit Z58 Protocol Exerciser/Analyzer which was previously approved for PCIe 3.0 and 4.0 compliance testing has now also been approved for official PCIe 5.0 compliance and certification testing, making it the only piece of test equipment currently certified for link and transaction layer testing of all three PCIe generations. Passing the PCI-SIG's compliance tests are also a necessary step for equipment to be included in the PCI-SIG's Integrators List.

Microchip Introduces Industry's Highest-Performance 16-Channel PCIe Gen 5 Enterprise NVMe SSD Controller

As data processing requirements continue to evolve, cloud-scale infrastructure requires solutions that maximize bandwidth, minimize latency and are optimized for efficient resource utilization. Microchip Technology Inc. today announced the newest member of the Flashtec controller family, the NVMe 4016 SSD controller. As the industry's highest-performing PCIe Gen 5 NVMe SSD controller, the Flashtec NVMe 4016 controller addresses the market demand for high-reliability, high-performance Solid-State Drives (SSDs) delivering greater than 14 GB per second throughput and over 3 million IOPS. With advanced Credit Management technology, this next-generation controller offers the stringent Quality of Service (QoS) required by today's cloud-focused data center applications.

"Microchip is proud to announce the next generation of our Flashtec NVMe controller product line. Its market-leading performance, coupled with our proven and flexible architecture, means the NVMe 4016 can provide our cloud and OEM customers with a cutting-edge platform for their PCIe Gen 5 NVMe SSD solutions," said Pete Hazen, vice president of Microchip's data center solutions business unit.

Intel Details Ponte Vecchio Accelerator: 63 Tiles, 600 Watt TDP, and Lots of Bandwidth

During the International Solid-State Circuits Conference (ISSCC) 2022, Intel gave us a more significant look at its upcoming Ponte Vecchio HPC accelerator and how it operates. So far, Intel convinced us that the company created Ponte Vecchio out of 47 tiles glued together in one package. However, the ISSCC presentation shows that the accelerator is structured rather interestingly. There are 63 tiles in total, where 16 are reserved for compute, eight are used for RAMBO cache, two are Foveros base tiles, two represent Xe-Link tiles, eight are HBM2E tiles, and EMIB connection takes up 11 tiles. This totals for about 47 tiles. However, an additional 16 thermal tiles used in Ponte Vecchio regulate the massive TDP output of this accelerator.

What is interesting is that Intel gave away details of the RAMBO cache. This novel SRAM technology uses four banks of 3.75 MB groups total of 15 MB per tile. They are connected to the fabric at 1.3 TB/s connection per chip. In contrast, compute tiles are connected at 2.6 TB/s speeds to the chip fabric. With eight RAMBO cache tiles, we get an additional 120 MB SRAM present. The base tile is a 646 mm² die manufactured in Intel 7 semiconductor process and contains 17 layers. It includes a memory controller, the Fully Integrated Voltage Regulators (FIVR), power management, 16-lane PCIe 5.0 connection, and CXL interface. The entire area of Ponte Vecchio is rather impressive, as 47 active tiles take up 2,330 mm², whereas when we include thermal dies, the total area jumps to 3,100 mm². And, of course, the entire package is much larger at 4,844 mm², connected to the system with 4,468 pins.

Intel's Upcoming NUC 12 Extreme Specs Leak

The NUC Extreme might not share much in terms of design with either the original NUC or its earlier Extreme siblings these days, as it's grown into a rather hefty SFF system. Now the 12th gen NUC Extreme has leaked and it comes with a few unexpected surprises, in both a good and a bad sense. Initially it looks like there will be two main barebones SKU's, the NUC12EDBi9 and the NUC12EDBi7, with a 65 W Core i9-12900 and a Core i7-12700 CPU respectively. In other words, it appears we're not looking at any dedicated CPU SKU's this time around.

The first thing that sticks out in the spec is the fact that Intel has gone for a pair of DDR4 SO-DIMM slots, rather than DDR5. In all fairness, this could be due to a lack of DDR5 SO-DIMMs in the market, but feels odd in a product with Extreme in the product name. Memory speeds of up to 3200 MHz are supported and up to 64 GB can be fitted. On the storage side, there's support for no less than three PCIe 4.0 M.2 NVMe drives using the 2280 form factor. Two of the slots can also accept 2242 drives and SATA drives. A full PCIe 5.0 x16 slot is also present for an optional graphics card, but more on that a little bit later.

Mainstream PCIe 5.0 SSDs Only Expected in 2024

Although we've already seen some companies both tease and announce PCIe 5.0 consumer SSDs, it seems like we shouldn't expect mainstream PCIe 5.0 SSDs until 2024, at least if Silicon Motion's earnings call is anything to go by. Wallace Kou, Silicon Motion's CEO was quoted as saying ""It is likely that PCIe Gen4 will last a few years since Intel, AMD both continue to bring new upgrade variant of CPU with PCIe Gen4 to the market," continuing "Similarly, we are preparing for the launch of our third-generation PCIe Gen4 controller next year before transitioning to PCIe Gen5 in the following year."

This obviously has something to do not only with development time, but also with recuperating the costs of developing the previous generation of PCIe 4.0 SSD controllers before introducing new products that would have limited market share due to at least initially high prices. Silicon Motion is said to be working on multiple PCIe 5.0 SSD controllers with the enthusiast grade SM2508 expected towards the end of this year and it's set to compete with Phison's PS5026-E26 and InnoGrit's IG5666 controllers, plus unannounced inhouse controllers from the likes of Samsung and WD. Silicon Motion's mainstream PCIe 5.0 controller is said to be the SM2507, which is also said to be more suitable for mobile applications, most likely due to lower power consumption. However, the first PCIe 5.0 controller from Silicon Motion should be the SM8366 enterprise grade controller that was announced last year and which should be shipping in the second half of this year. For most users, PCIe 5.0 SSDs are unlikely to make a huge difference, unless we see some major improvements when it comes to random read and write performance, as this is currently the real bottleneck with SSDs.

TEAMGROUP T-FORCE Debuts the Latest PCIe Gen5 SSD

To meet the demand for high-speed storage driven by big data, TEAMGROUP is utilizing its years of experience in computer storage solutions to launch the newest PCIe Gen5 SSD this year. In light of the generational advancements of PCIe 5.0, the company is actively committed to developing products using cutting-edge technologies. With its expertise in R&D and dedication to product excellence, the company is excited to enter the next era of SSD storage solutions and to deliver spectacular new products to the world.

TEAMGROUP is releasing its first PCIe Gen5 SSD under its gaming sub-brand T-FORCE as part of the CARDEA series. It is capable of maximum sequential read speeds of over 13,000 MB/s and write speeds exceeding 12,000 MB/s, and together with a maximum storage capacity of 4 TB, it will be the highest performance PCIe Gen5 flagship SSD on the market when launched. The T-FORCE PCIe Gen5 SSD will support the latest NVMe 2.0 and will be enhanced using proprietary technology to improve durability and product lifespan. The new hardware and support will enable its Gen5 SSDs to fully meet the needs of the gaming computing market, video streaming, augmented reality (AR), virtual reality (VR), and other next-gen digital domains. TEAMGROUP plans to mass-produce T-FORCE CARDEA series' PCIe Gen5 SSD in 2022 Q3, and will also launch a variety of efficient cooling solutions for the PCIe Gen5 SSD. Together with its global motherboard manufacturing partners, TEAMGROUP will continue to refine specifications and technologies of the latest generation of SSDs to meet market demands and provide consumers around the world with a stable and rapid storage experience.

ASRock Announces Two Z690 Aqua Motherboards, One with Extra OC Creds

At the launch of the Z690 chipset, ASRock didn't reveal its flagship Aqua model, but now the company has finally announced not just one, but two Z690 Aqua models, one "regular" SKU and one OC SKU. The main difference between the two is that the OC SKU only has two DIMM slots, since as we know, DDR5 is extra finicky when it comes to running at high clock speeds and two DIMM boards allow for higher DRAM clock speeds, This also means that all the major board makers have now launched a two DIMM product geared towards overclockers.

The two boards are mostly identical in terms of features otherwise, but there are some minor differences that we'll point out later. As expected, both boards feature a large, nicely integrated liquid cooling plate for the CPU and the 20 phase 105 A SPS VRM setup. ASRock has gone for a 12 layer PCB, not something you see in a lot of consumer motherboards and it's unclear if it'll bring any real benefits, but as this is a premium motherboard, it's a nice touch. The heatsink of the top-most M.2 drive is home to a small OLED display, but ASRock hasn't listed the size on its website.

congatec launches 10 new COM-HPC and COM Express Computer-on-Modules with 12th Gen Intel Core processors

congatec - a leading vendor of embedded and edge computing technology - introduces the 12th Generation Intel Core mobile and desktop processors (formerly code named Alder Lake) on 10 new COM-HPC and COM Express Computer-on-Modules. Featuring the latest high performance cores from Intel, the new modules in COM-HPC Size A and C as well as COM Express Type 6 form factors offer major performance gains and improvements for the world of embedded and edge computing systems. Most impressive is the fact that engineers can now leverage Intel's innovative performance hybrid architecture. Offering of up to 14 cores/20 threads on BGA and 16 cores/24 threads on desktop variants (LGA mounted), 12th Gen Intel Core processors provide a quantum leap [1] in multitasking and scalability levels. Next-gen IoT and edge applications benefit from up to 6 or 8 (BGA/LGA) optimized Performance-cores (P-cores) plus up to 8 low power Efficient-cores (E-cores) and DDR5 memory support to accelerate multithreaded applications and execute background tasks more efficiently.

BIOSTAR Announces its B660 Chipset Motherboards

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, introduces the brand new B660 series motherboards geared to run the latest Intel 12th generation processors. Available in 3 distinct models, B660GTA, B660GTQ, and the B660GTN, BIOSTAR's new B660 series motherboards carry the legacy of their predecessors as the best performance motherboards available in the market. The B660 Series motherboards are the best mid-range motherboard series in the market for business users, content creators and casual gamers alike that works the best with Intel 12th generation processors.

Featuring PCIe 5.0, the latest leap in data transmission technology, and PCIe M.2 4.0 storage technology, BIOSTAR's B660 series motherboards are robust and functional, designed to suit any use case scenario. The B660GTA, the B660GTQ, and the B660GTN motherboards come in 3 distinct form factors ATX, uATX, and Mini-ITX respectively. For users to select between their favorite build sizes.

ASUS Announces New ROG Loki SFX-L PSUs at CES 2022

ASUS has today announced the ROG Loki SFX-L power supply lineup during their ROG CES 2022 livestream with models ranging from 750 W to 1200 W with 80 Plus Platinum ratings. These new power supplies are designed for small-form-factor gaming builds featuring high-core processors and power-hungry graphics cards. The units include a 16-pin power cable for PCIe 5.0 GPU support and feature a 120 mm dual-ball bearing axial-tech fan with PWM control to manage noise and keep temperatures low. The Loki power supplies will feature integrated ASUS Aura ARGB lighting with Aura Sync compatibility and custom ROG heatsinks cover critical components. The ASUS ROG Loki SFX-L power supply lineup will be available to purchase worldwide in Q1/Q2 2022.

XPG to Showcase Latest Breadth and Depth of Products at CES 2022

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today announces it will be on location in Las Vegas during the 2022 CES show (Jan. 5-8). Under the theme of 'Dawn of a New Xtreme,' it will be showing off the latest products from XPG and ADATA including gaming systems, peripherals, accessories, and components, such as the newest DDR5 memory, PCIe 5.0 solid state drives (SSD) and the latest state-of-the-art Platinum PSU.

XPG's and ADATA are gearing up to bring next-generation performance to gamers and other users with its latest PCIe Gen5x 4 SSDs and DDR5 DRAM. At the booth, visitors will get a first look at the XPG LANCER RGB DDR5 and CASTER RGB DDR5 that deliver next-level performance of up to 6000 MT/s and 7000 MT/s, respectively. ADATA's industrial-grade DDR5-4800 U/SO/R-DIMM memory with on-die ECC & PMIC will also be on display.
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