ASUS today announced the 15.6-inch Vivobook Go 15 OLED (E1504F) and 14-inch Vivobook Go 14 (E1404F), two exciting and affordable lifestyle laptops that help make users productive or keep them entertained, wherever they go. These light and compact laptops feature superior OLED (E1504F) or IPS (E1404F) displays and powerful ASUS SonicMaster sound systems with DTS Audio Processing for immersive entertainment. The design is stylish and practical, with thoughtful touches that make the user's life easier, such as a 180° lay-flat hinge. Built to survive any lifestyle, these tough laptops are US military-grade tested for durability using the world's strictest test regime.

Speedy performance for any task is assured by up to AMD Ryzen 5 7000-series processors, 16 GB of LPDDR5 RAM and a 512 GB PCIe SSD. Other user-friendly features include an ASUS ErgoSense keyboard; smart conferencing via the HD webcam with ASUS 3D Noise Reduction (3DNR), AI noise cancelation, and a physical privacy shield; and a useful suite of ASUS apps including MyASUS, GlideX and ScreenXpert 3.

SUS IoT, the global AIoT solution provider, today announced PE3000G—the industry's first edge AI system to support Mobile PCI Express Module (MXM) GPUs from both NVIDIA and Intel. Specifically, the all-new industrial PC works seamlessly with NVIDIA Ampere/Turing or Intel Arc A-series MXM GPUs. Powered by a 12th Gen Intel Core processor and up to 64 GB of DDR5 4800 MHz memory, and combining a proven power design, guaranteed and fanless thermal performance, and superior physical and mechanical ruggedness, PE3000G brings unprecedented longevity, computing power, flexibility and reliability to AI computing at the edge—making it an ideal option for scenarios where resilience, longevity and both CPU and GPU scalability are paramount.

"PE3000G is ASUS IoT's response to the burgeoning demand for accelerating AI inference and extreme deployment in industrial settings," commented KuoWei Chao, General Manager of the ASUS IoT business unit. "With robust power, thermal and mechanical design, it pushes versatile edge-AI-inference applications to business-critical applications. PE3000G is an ideal fit to accelerate edge AI inference in SWaP-constrained applications, such as machine vision in factory automation, outdoor surveillance system and AI-inference systems for autonomous vehicles."

AMD's entry-level A620 chipset for Socket AM5 motherboards is nearing launch, as manufacturers such as GIGABYTE and ASUS have started regulatory filing their upcoming products with the Eurasian Economic Commission (EEC). These would hopefully bring the starting prices of AM5 motherboards down to the USD $125 figure AMD promised. AMD will sufficiently differentiate A620 from the B650, using specs such as the lack of CPU overclocking capabilities, only a handful PCIe Gen 3 downstream lanes, and the lack of PCIe Gen 5 on both the PEG and CPU-attached M.2 slots (which could at least be limited to Gen 4 if not Gen 3).

While the motherboards themselves may be cheap, the overall platform costs may still end up higher than Intel's H610 or upcoming H710 chipsets; as Socket AM5 lacks DDR4 memory support, and even at the entry-level you'll be forced to buy DDR5. That said, what A620 promises is platform longevity, that the platform will support future processor generations that launch even beyond 2025. AMD dropped a major hint on A620 chipset motherboards availability in its 2023 CES Keynote address, when it pointed to "65 W CPUs and entry-level motherboards" alongside each other. The 65 W Ryzen 7000 series processors are already out, which means A620 should be just around the corner. February 2023 is when AMD looks to launch its high-end Ryzen 7000X3D processors.

Synology today announced the new 2-bay Synology DiskStation DS723+, the smallest expandable option in its lineup of all-in-one solutions for home offices and small businesses. Powered by the versatile Synology DiskStation Manager (DSM) operating system, the DS723+ offers comprehensive solutions to protect and manage business data, easily collaborate on documents, access files remotely, and monitor physical assets, all within a compact desktop format.

"This new unit delivers impressive performance and capability for its size," said Michael Wang, Product Manager at Synology. "With its extremely compact form factor, it will certainly appeal to those that have smaller storage requirements but don't want to give up on the convenience of centralized storage and the possibility to scale in the future."

QNAP Systems, Inc., a leading computing, networking, and storage solution innovator, today launched new high-performance TVS-h874 QuTS hero NAS models that incorporate 12th Gen Intel Core i9 sixteen-core, i7 twelve-core multi-thread processors with Intel Core Hybrid Technology for optimal computing performance and smooth multiple virtual machine (VM) operation. Integrating the reliable ZFS-based operating system, PCIe Gen 4 expandability, M.2 NVMe SSD caching, and 2.5GbE/10GbE connectivity, the TVS-h874 assists businesses in building high-performance storage environments for hosting multiple VM, application servers, and running business data backup/restore applications.

"The new TVS-h874 models adopt Intel Core Hybrid Technology, combining Performance-cores and Efficient-cores," said Andy Chuang, Product Manager of QNAP, adding "The Performance Hybrid Architecture intelligently allocates CPU cores to different tasks, thus increasing the performance of the new TVS-h874 models by 3.55 times compared with previous models."

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today introduced 4th Gen Intel Xeon Scalable processor-based server platforms highlighting built-in accelerators to improve performance across the fastest-growing workloads in AI, analytics, cloud, storage, and HPC.

"Greater availability of new technology like 4th Gen Intel Xeon Scalable processors continue to drive the changes in the business landscape", said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure Business Unit. "The advances in TYAN's new portfolio of server platforms with features such as DDR5, PCIe 5.0 and Compute Express Link 1.1 are bringing high levels of compute power within reach from smaller organizations to data centers."

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions today announced the evolutionary AORUS Gen4 7300 SSD, which is the upgraded PCIe 4.0 SSD with read speed up to 7300 MB/s. Enhanced by the select PCIe 4.0 controller with advanced 3D-TLC NAND Flash, it provides superior performance than the previous generation PCIe 4.0 NVMe SSD. AORUS Gen4 7300 SSD with M.2 2280 interface comes in two capacity variants of 2 TB and 1 TB, along with a unique packaging design of separated SSD and heatsink packing to offer more flexible thermal solutions. Meanwhile, the GIGABYTE exclusive GCC software management platform provides the instant overview and adjustment of SSD status for a cool storage operation with high performance.

AORUS Gen4 7300 SSD equips the select Phison E18 8-channel controller, which provides users with ultimate random access rate, as well as the high-speed 3D-TLC NAND Flash and SLC cache design that brings the PCIe 4.0 into full play. Under the real test, AORUS Gen4 7300 SSD can reach a read speed up to 7300 MB/s and a write speed up to 6850 MB/s, which is faster than the previous gen. PCIe 4.0 NVMe SSD, two times faster than PCIe 3.0 SSD, and up to 13 times faster than SATA SSD. Enhanced by the multi-core architecture of the E18 controller, AORUS Gen4 7300 SSD not only improves AI multitasking to lessen the bottleneck of system performance, but powers up content creators, gamers, and users eager for extreme performance.

During its CES 2023 keynote, AMD announced its latest Instinct MI300 APU, a first of its kind in the data center world. Combining the CPU, GPU, and memory elements into a single package eliminates latency imposed by long travel distances of data from CPU to memory and from CPU to GPU throughout the PCIe connector. In addition to solving some latency issues, less power is needed to move the data and provide greater efficiency. The Instinct MI300 features 24 Zen4 cores with simultaneous multi-threading enabled, CDNA3 GPU IP, and 128 GB of HBM3 memory on a single package. The memory bus is 8192-bit wide, providing unified memory access for CPU and GPU cores. CLX 3.0 is also supported, making cache-coherent interconnecting a reality.

The Instinct MI300 APU package is an engineering marvel of its own, with advanced chiplet techniques used. AMD managed to do 3D stacking and has nine 5 nm logic chiplets that are 3D stacked on top of four 6 nm chiplets with HBM surrounding it. All of this makes the transistor count go up to 146 billion, representing the sheer complexity of a such design. For performance figures, AMD provided a comparison to Instinct MI250X GPU. In raw AI performance, the MI300 features an 8x improvement over MI250X, while the performance-per-watt is "reduced" to a 5x increase. While we do not know what benchmark applications were used, there is a probability that some standard benchmarks like MLPerf were used. For availability, AMD targets the end of 2023, when the "El Capitan" exascale supercomputer will arrive using these Instinct MI300 APU accelerators. Pricing is unknown and will be unveiled to enterprise customers first around launch.

Ahead of CES 2023, MediaTek today announced the latest chipset in the Genio platform for IoT devices, the octa-core Genio 700 designed for smart home, smart retail, and industrial IoT products. The new chipset will be featured as part of a demo at MediaTek's booth at CES 2023. With a focus on power efficiency, the MediaTek Genio 700 is a N6 (6 nm) IoT chipset that boasts two ARM A78 cores running at 2.2 GHz and six ARM A55 cores at 2.0 GHz while providing 4.0 TOPs AI accelerator. It comes with support for FHD 60p + 4K 60p display, as well as an ISP for better images.

"When we launched the Genio family of IoT products last year, we designed the platform with the scalability and development support that brands need, paving the way for opportunities to continue expanding," said Richard Lu, Vice President of MediaTek IoT Business Unit. "With a focus on industrial and smart home products, the Genio 700 is a perfect natural addition to the lineup to ensure we can provide the widest range of support possible to our customers."

SK hynix Inc. announced today that it will showcase a number of its core and brand-new products at the CES 2023, the most influential tech event in the world taking place in Las Vegas from Jan. 5th through Jan. 8th. The products, introduced under the theme of the "Green Digital Solution," as part of the SK Group's "Carbon-Free Future" campaign, are expected to attract Big Tech customers and experts given the significant improvement in performance and energy efficiency compared with the previous generation as well as the effect of lessening the impact on the environment.

Attention on energy-efficient memory chips has been on the rise as global tech companies pursue products that process data faster, while consuming less energy. SK hynix is confident that its products to be displayed at the CES 2023 will meet customers' such needs with outstanding performance per watt and performance. The core product put forward at the show is PS1010 E3.S, an eSSD product composed of multiple 176-layer 4D NAND that supports the fifth generation of the PCIe interface.

EK, the leading computer cooling solutions provider, is now offering an enterprise-grade GPU water block for PNY NVIDIA A100 80 GB PCIe data center GPUs. The EK-Pro GPU WB A100 80 GB Rack - Nickel + Inox is a high-performance water block specifically engineered to make the entire GPU and water block assembly as thin as possible, effectively allowing it to consume only a single PCIe slot width-wise. The water block is equipped with a rack-style terminal, considerably reducing the assembly height and increasing the chassis compatibility.

By spanning the entire PCB, the water block directly cools the GPU, HBM VRAM, and the VRM (voltage regulation module) as the cooling liquid is channeled directly over these critical areas.

GIGABYTE, the world's leading computer brand, is known for its stylish and high-performing motherboards, graphics cards, gaming monitors, and more. The award-winning products are praised by worldwide consumers for their class-leading build quality and performance. What makes GIGABYTE products even more impressive is their friendly designs based on a thorough understanding of user needs and expectations. These ingenious designs are primed to make the products easier to assemble and upgrade for a much-enhanced user experience.

GIGABYTE's Intel-based Z790 series and AMD AM5-based X670, B650 gaming motherboards are equipped with tech that makes PC building and upgrades as easy as possible. The DIY-friendly PCIe EZ-Latch design allows users to easily detach the graphics card from the PCIe slot with a quick-release mechanism; the M.2 EZ-Latch makes installing M.2 SSDs effortless thanks to the screwless design. These latest-gen motherboards also support Intel XMP and AMD EXPO overclocking memory modules for maximum compatibility, and GIGABYTE BIOS comes packaged with pre-installed profiles to help users get greater performance with ease.

The long-awaited December 13th has finally arrived with the latest AMD Radeon RX 7000 Series GPUs being released. More good news is that EK, the premium water-cooling gear manufacturer, is ready with the EK-Quantum Vector² water blocks for the reference models of the new AMD Radeon RX 7900 XTX GPUs. The compatible water blocks can be found HERE.

But to celebrate the availability of these GPUs, EK Water Blocks is making a limited run of these special AMD Radeon Edition GPU water blocks. This water block fits reference PCB designs of the Radeon RX 7900 XTX GPUs, but we recommend you refer to the EK Cooling Configurator for a precise compatibility match.

YMTC today at the Flash Memory Summit (FMS) 2022 unveiled its X3-9070 TLC 3D NAND flash powered by Xtacking 3.0 architecture. Since its debut show at FMS 2018, YMTC's Xtacking technology has become a hallmark of the company's vision for innovation, and the approach to hybrid bonding has been widely recognized as one of the key enablers of the industry's future growth. Built out to be a common growth platform that drives value and innovation in the semiconductor ecosystem, YMTC's Xtacking 3.0 architecture opens up a world of opportunities for diversified applications in 5G, AloT, and beyond.

From 1.0 to 3.0, YMTC's Xtacking technology, a heterogeneous 3D integration architecture, has established a proven track record of success, as evidenced by a diverse portfolio of Xtacking NAND-based system solutions, including SATA III, PCIe Gen3 & Gen4 SSDs, as well as eMMC & UFS for mobile and embedded applications, garnering recognition from leading OEMs.

Lattice Semiconductor, the low power programmable leader, today unveiled Lattice Avant, a new FPGA platform purpose-built to bring the company's power efficient architecture, small size, and performance leadership to mid-range FPGAs. Lattice Avant offers best-in-class power efficiency, advanced connectivity, and optimized compute that enable Lattice to address an expanded set of customer applications across the Communications, Computing, Industrial, and Automotive markets.

"With Lattice Avant, we extend our low power leadership position in the FPGA industry and are poised to continue our rapid pace of innovation, while also doubling the addressable market for our product portfolio," said Jim Anderson, President and CEO, Lattice Semiconductor. "We created Avant to address our customers' need for compelling mid-range FPGA solutions, and we're excited to help them accelerate their designs with new levels of power efficiency and performance."

SMART Modular Technologies, Inc. ("SMART"), a division of SGH and a global leader in memory solutions, solid-state drives and hybrid storage products announces that it is now offering a new class of high performance, power efficient, data center solid state disk drives (SSDs) beginning with the DC4800 PCIe Gen 4 family.

SMART's DC4800 devices are designed with a specialized hardware-accelerated SSD controller that draws less power without compromising storage input/output (I/O) performance. Zero-induced throttling allows these SSDs to perform better under continued duress, even when they are pushed to their performance limit. This translates to significant power consumption improvement per server, as well as consistent latency performance of up to 7-nines or 99.99999% of the time.

Intel's Sapphire Rapids CPUs are designed to represent the company's finest work for the server/enterprise and high-end desktop processor (HEDT) sector. According to Wccftech, we have an idea of the launch date and availability of the HEDT Sapphire Rapids Workstation counterparts, codenamed Fishhawk Falls. The Intel Sapphire Rapids-WS CPU and W790 motherboard unveil should happen on the 7th week of 2023, which means the 12th Feb - 18th Feb launch window. For availability, April of 2023 is scheduled to meet the needs of the upcoming HEDT clients. With a declining HEDT market, Intel is in no rush to deliver the CPUs, with priority being the server Sapphire Rapids designs.

As a reminder, the HEDT models should come with up to 56 cores and 112 threads, 105 MB of L3 cache, 350 W TDP, and 112 PCIe Gen 5.0 lanes. For memory, the platform support 8-channel DDR5-4400 (1DPC) / DDR5-4800 (2DPC) configurations with a capacity of up to 4 TB.

Yesterday, AMD announced its latest addition to the data center family of processors called EPYC Genoa. Named the 4th generation EPYC processors, they feature a Zen 4 design and bring additional I/O connectivity like PCIe 5.0, DDR5, and CXL support. To disrupt the cloud, enterprise, and HPC offerings, AMD decided to manufacture SKUs with up to 96 cores and 192 threads, an increase from the previous generation's 64C/128T designs. Today, we are learning more about the performance and power aspects of the 4th generation AMD EPYC Genoa 9654, 9554, and 9374F SKUs from 3rd party sources, and not the official AMD presentation. Tom's Hardware published a heap of benchmarks consisting of rendering, compilation, encoding, parallel computing, molecular dynamics, and much more.

In the comparison tests, we have AMD EPYC Milan 7763, 75F3, and Intel Xeon Platinum 8380, a current top-end Intel offering until Sapphire Rapids arrives. Comparing 3rd-gen EPYC 64C/128T SKUs with 4th-gen 64C/128T EPYC SKUs, the new generation brings about a 30% increase in compression and parallel compute benchmarks performance. When scaling to the 96C/192T SKU, the gap is widened, and AMD has a clear performance leader in the server marketplace. For more details about the benchmark results, go here to explore. As far as comparison to Intel offerings, AMD leads the pack as it has a more performant single and multi-threaded design. Of course, beating the Sapphire Rapids to market is a significant win for team red, so we are still waiting to see how the 4th generation Xeon stacks up against Genoa.

The COVID-19 pandemic and the emergence of next-generation Intel and AMD motherboards have incited a wave of consumer PC replacement as well as growing demand for high-efficiency PCIe 4.0 SSDs. With additional consideration towards the PS5's SSD heat dissipation requirements, ADATA Technology Co., Ltd., a leading global memory products brand, has launched the LEGEND 960 MAX as of today. The LEGEND 960 MAX SSD has won Japan's GOOD DESIGN Award and features continuous read/write speeds of up to 7,400/6,800 MB per second. Its unique 3D radiator fin design can reduce temperatures of SSDs mounted in PS5 consoles by as much as 40%. The LEGEND 960 MAX and LEGEND 960 are part of the same series of SSD products and the prior LEGEND 960 model can be installed in Intel Evo certified lightweight notebooks. In the face of Web 3.0's unlimited creative universe, this new product is expected to become the most ideal storage solution for consumers.

The LEGEND 960 MAX employs a PCIe 4.0 transmission interface conforming to NVMe 1.4 standards. The SSD features exceptional 7,400/6,800 MB per second read/write capabiliies that are 4 times that of standard PCIe 3.0 SSDs and is backward compatible with the PCIe 3.0 platform. When handling a multitude of intensive creations, the LEGEND 960 MAX delivers 750K/630K IOPS random Read/Write speeds, improving multitasking efficiency and is suitable for driving exceptional performance in the latest Intel or AMD platforms. The professionally designed thermal convection effect produced by a 3D radiator fin profile enables an additional 40% cooling on motherboard installed SSDs and is an optimal solution for highly complex design tasks such as 3D animation, game development, and visual virtualization.

Cougar today rolled out the GEX Snow line of premium modular PSUs, characterized by their all-white body. Matte-white makes up the PSU's body, its modular connectors; the set of modular cables, and even the impeller of its fan. The GEX Snow comes in 650 W, 750 W, and 850 W capacities. Under the hood, these PSUs offer 80 Plus Gold efficiency, a single +12 V rail design, DC-to-DC switching, and most common electrical protections. The 120 mm hydro-dynamic bearing fan is designed to be fanless up to 40% load. The connector loadout of a 24-pin ATX, two 8-pin EPS, six 4-pin Molex, and eight SATA power connectors; is common to all three models. The 650 W and 750 W models offers four 6+2 pin PCIe power connectors, while the 850 W model offers six of these. The company didn't reveal pricing.

The innovative manufacturer of high-end multi-GPU workstations and professional liquid cooling solutions for individuals and workgroups requiring GPU computation, announces a slim waterblock of top-tier efficiency for GIGABYTE GeForce RTX 4090 GAMING OC 24 GB and AORUS RTX 4090 MASTER 24G GPUs.

Given the fact that the latest 4090 GPUs by Nvidia are extremely power hungry, the Comino team did its best to deliver the highest performance 4090 waterblock design, specifically adding:

Axiomtek - a world-renowned leader relentlessly devoted to the research, development, and manufacture of series of innovative and reliable industrial computer products of high efficiency - is pleased to announce the iNA200, a DIN-rail cybersecurity gateway for operational technology (OT) network security. The iNA200 is powered by the Intel Atom x6212RE or x6414RE processor (Elkhart Lake) and has one DDR4-3200 SO-DIMM for up to 32 GB of system memory. For demanding rugged environments, this fanless IIoT edge gateway comes with a wide operating temperature range of -40°C to 70°C and supports wide power input of 9 to 36 VDC with dual power input. The iNA200 also has two 2.5G LAN ports, sufficient storage, and high expandability for various industrial application needs.

"OT cybersecurity is essential for Industry 4.0. Axiomtek's iNA200 is designed to safeguard your OT assets and avoid network threats for critical infrastructure," said Kevin Hsiao, a product manager of Network Computing Platform Division at Axiomtek. "Additionally, our iNA200 features an M.2 Key B slot to enable 5G connectivity for next-generation industrial use cases. With the Trusted Platform Module 2.0 (TPM 2.0) support, this cybersecurity gateway increases security offering hardware-level protection against malware and sophisticated cyber-attacks."

Alphawave IP (LSE: AWE), a global leader in high-speed connectivity for the world's technology infrastructure, today announced the successful tapeout of its ZeusCORE100 1-112 Gbps NRZ/PAM4 Serialiser-Deserialiser ("SerDes"), Alphawave's first testchip on TSMC's most advanced N3E process. Alphawave IP will be exhibiting this new product alongside its complete portfolio of high-performance IP, chiplet, and custom silicon solutions at the TSMC OIP Forum on October 26 in Santa Clara, CA as the Platinum sponsor.

ZeusCORE100 is Alphawave's most advanced multi-standard-SerDes, supporting extra-long channels over 45dB and the most requested standards such as 800G Ethernet, OIF 112G-CEI, PCIe GEN6, and CXL 3.0. Attendees will be able to visit the Alphawave booth and meet the company's technology experts including members of the recently acquired OpenFive team. OpenFive is a longstanding partner of TSMC through the OIP Value Chain Aggregator (VCA) program. OpenFive is one of a select few companies with an idea-to-silicon methodology in TSMC's latest technologies, and advanced packaging capabilities, enabling access to the most advanced foundry solution available with the best Power-Performance-Area (PPA). With Alphawave's industry-leading IP portfolio and the addition of OpenFive's capabilities, designers can create systems on a chip (SoCs) that pack more compute power into smaller form factors for networking, AI, storage, and high-performance computing (HPC) applications.

IBM Research has published information about the company's latest development of processors for accelerating Artificial Intelligence (AI). The latest IBM processor, called the Artificial Intelligence Unit (AIU), embraces the problem of creating an enterprise solution for AI deployment that fits in a PCIe slot. The IBM AIU is a half-height PCIe card with a processor powered by 23 Billion transistors manufactured on a 5 nm node (assuming TSMC's). While IBM has not provided many details initially, we know that the AIU uses an AI processor found in the Telum chip, a core of the IBM Z16 mainframe. The AIU uses Telum's AI engine and scales it up to 32 cores and achieve high efficiency.

The company has highlighted two main paths for enterprise AI adoption. The first one is to embrace lower precision and use approximate computing to drop from 32-bit formats to some odd-bit structures that hold a quarter as much precision and still deliver similar result. The other one is, as IBM touts, that "AI chip should be laid out to streamline AI workflows. Because most AI calculations involve matrix and vector multiplication, our chip architecture features a simpler layout than a multi-purpose CPU. The IBM AIU has also been designed to send data directly from one compute engine to the next, creating enormous energy savings."

According to the latest TrendForce research, pandemic-induced materials shortages abated in the second half of this year and the supply and delivery of short-term materials has recovered significantly. However, assuming materials supply is secure and demand can be met, the annual growth rate of server shipments in 2023 is estimated to be only 3.7%, which is lower than 5.1% in 2022.

TrendForce indicates that this growth slowdown is due to three factors. First, once material mismatch issues had eased, buyers began adjusting previously placed purchase order overruns. Thus, ODM orders also decreased but this will not affect the 2022 shipment volume of whole servers for the time being. Second, due to the impact of rising inflation and weakness in the overall economy, corporate capital investment may trend more conservative and IT-related investment will emphasize flexibility, such as the replacement of certain server terminals with cloud services. Third, geopolitical changes will drive the continuing emergence of demand for small-scale data centers and previous construction of hyperscale data centers will slow. The recent ban on military/HPC servers issued by the U.S. Department of Commerce on October 7 has a very low market share in terms of its application category, so the impact on the overall server market is limited at present. However, if the scope of the ban is expanded further in the future, it will herald a more significant slowdown risk for China's server shipment momentum in 2023.