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Arm Delivers New Edge Processor IPs for IoT

Today, Arm announced significant additions to its artificial intelligence (AI) platform, including new machine learning (ML) IP, the Arm Cortex -M55 processor and Arm Ethos -U55 NPU, the industry's first microNPU (Neural Processing Unit) for Cortex-M, designed to deliver a combined 480x leap in ML performance to microcontrollers. The new IP and supporting unified toolchain enable AI hardware and software developers with more ways to innovate as a result of unprecedented levels of on-device ML processing for billions of small, power-constrained IoT and embedded devices.

Zhaoxin KaiXian x86 Processor Now Commercially Available to the DIY Channel

Zhaoxin is a brand that makes multi-core 64-bit x86 processors primarily for use in Chinese state IT infrastructure. It's part of the Chinese Government's ambitious plan to make its IT hardware completely indigenous. Zhaoxin's x86-64 CPU cores are co-developed by licensee VIA, specifically its CenTaur subsidiary that's making NCORE AI-enabled x86 processors. The company's KaiXian KX-6780A processor is now commercially available in China to the DIY market in the form of motherboards with embedded processors.

The KaiXian KX-6780A features an 8-core/8-thread x86-64 CPU clocked up to 2.70 GHz, 8 MB of last-level cache, a dual-channel DDR4-3200 integrated memory controller, a PCI-Express gen 3.0 root-complex, and an iGPU possibly designed by VIA's S3 Graphics division, which supports basic display and DirectX 11.1 readiness. The CPU features modern ISA, with instruction sets that include AVX, AES-NI, SHA-NI, and VT-x comparable virtualization extensions. The chip has been fabricated on TSMC 16 nm FinFET process.

Europe Readies its First Prototype of Custom HPC Processor

European Processor Initiative (EPI) is a Europe's project to kickstart a homegrown development of custom processors tailored towards different usage models that the European Union might need. The first task of EPI is to create a custom processor for high-performance computing applications like machine learning, and the chip prototypes are already on their way. The EPI chairman of the board Jean-Marc Denis recently spoke to the Next Platform and confirmed some information regarding the processor design goals and the timeframe of launch.

Supposed to be manufactured on TSMC's 6 nm EUV (TSMC N6 EUV) technology, the EPI processor will tape-out at the end of 2020 or the beginning of 2021, and it is going to be heterogeneous. That means that on its 2.5D die, many different IPs will be present. The processor will use a custom ARM CPU, based on a "Zeus" iteration of Neoverese server core, meant for general-purpose computation tasks like running the OS. When it comes to the special-purpose chips, EPI will incorporate a chip named Titan - a RISC-V based processor that uses vector and tensor processing units to compute AI tasks. The Titan will use every new standard for AI processing, including FP32, FP64, INT8, and bfloat16. The system will use HBM memory allocated to the Titan processor, have DDR5 links for the CPU, and feature PCIe 5.0 for the inner connection.

CacheOut is the Latest Speculative Execution Attack for Intel Processors

Another day, another speculative execution vulnerability found inside Intel processors. This time we are getting a new vulnerability called "CacheOut", named after the exploitation's ability to leak data stored inside CPU's cache memory. Dubbed CVE-2020-0549: "L1D Eviction Sampling (L1Des) Leakage" in the CVE identifier system, it is rated with a CVSS score of 6.5. Despite Intel patching a lot of similar exploits present on their CPUs, the CacheOut attack still managed to happen.

The CacheOut steals the data from the CPU's L1 cache, and it is doing it selectively. Instead of waiting for the data to become available, the exploit can choose which data it wants to leak. The "benefit" of this exploit is that it can violate almost every hardware-based security domain meaning that the kernel, co-resident VMs, and SGX (Software Guard Extensions) enclaves are in trouble. To mitigate this issue, Intel provided a microcode update to address the shortcomings of the architecture and they recommended possible mitigations to all OS providers, so you will be protected once your OS maker releases a new update. For a full list of processors affected, you can see this list. Additionally, it is worth pointing out that AMD CPUs are not affected by this exploit.

Intel Launches Data Streaming Accelerator

Intel has today launched a new product called Data Streaming Accelerator known as Intel DSA shortly. The new device is going to be present inside every future Intel processor with a goal of "optimizing streaming data movement and transformation operations common with applications for high-performance storage, networking, persistent memory, and various data processing applications."

The DSA processor will replace an existing solution that is Intel QuickData Technology, which was previously used for data movement. This new dedicated processor has a much-needed purpose to free up CPU cycles from doing IO work like moving data to/from volatile memory, persistent memory, memory-mapped I/O, and through a Non-Transparent Bridge (NTB) device to/from remote volatile and persistent memory inside a chip. In addition to the usual data movement operations, the DSA processor can create and test CRC checksums for any errors in storage and networking applications.

Benchmarks Surface on Intel's Next-Gen Comet Lake-S 10-Core, 6-Core CPUs

Benchmarks have been uploaded to popular benchmarking utility Geekbench's servers, and they seemingly allow us to look into Intel's next-gen Comet Lake-S processors. The results, which have likely been taken from pre-release hardware (which means benchmarks and even proper identification of features on the CPUs shouldn't be taken as guarantees), help paint a picture on Intel's next release all the same.

Processor information for the 10-core, 20-thread CPU gives us a 1.51 GHz base clock and 3.19 GHz boost, with the chip featuring 32 Kb each for L1 instruction and L1 data caches (x10 cores, 640 KB total) 256 KB L2 cache (x10 cores, for a total of 2.5 MB) and 20 MB L3 cache. The six-core part, on the other hand, is reported as featuring a 1.99 GHz base clock and 2.89 GHz boost clock, 384 KB total L1 instruction and data caches (32 KB x 6 cores), 256 KB L2 cache (x6 cores, for a total of 1.5 MB) and 12 MB L3 cache. This means each core is in Comet Lake-S is paired with 2 MB of L3 cache, which is being cut-down alongside cores. Like almost all other Intel desktop CPU releases, these CPU cores will be paired with an IGP in the form of Intel UHD Graphics 630, which features up to 24 Execution Units (EUs). With Intel's 10-core CPU being expected to be the cream of the crop on the company's mainstream CPU lineup come Comet Lake-S, comparisons to AMD's own core density are moot, in that there is no real competition available, should that top core count actually materialize.

Cerebras Introduces the CS-1 System, Home to World's First Trillion Transistor Processor

Cerebras has introduced the world to its CS-1 system, which will house the company's (and simultaneously, the industry's) most powerful monolithic accelerator. The CS-1 is an integrated solution the size of 15 industry-standard rack units, and packs everything from the Wafer Scale Engine to cooling systems. The CS-1 consumes 20 kW of power, with a full 4 kW dedicated solely to the cooling subsystem, like fans, pumps, and the heat exchanger, 15 kW dedicated to the chip, and 1 kW is totally lost to power supply inefficiencies. Obviously, power supply modules and other cooling subsystems are redundant, and hot-swappable if need be - you can imagine the computational value lost with each millisecond of downtime that were to occur in such a system.

AMD Announces Integration With Microsoft's Secured-Core PC Initiative

In today's world, computer security is becoming very important due the exponential increase in malware and ransomware attacks. Various studies have shown that a single malicious attack can cost companies millions of dollars and can require significant recovery time. With the growth of employees working remotely and connected to a network considered less secure than traditional corporate network, employee's computer systems can be perceived as a weak security link and a risk to overall security of the company. Operating System (OS) and independent hardware vendors (IHV) are investing in security technologies which will make computers more resilient to cyberattacks.

Intel Discontinues Omni-Path Enabled Xeon Processors

Intel's Omni-Path technology has been used primarily in high performance computing market, in order to provide high speed interconnect between Intel Xeon CPUs, with speeds reaching around 100 Gbps. Accompanied by different design and system integration that Omni-Path uses, it was a bit difficult to integrate into server system, while not adding much value that other technologies couldn't match or beat.

Because of these reasons, Intel is now discontinuing its last product capable of utilizing Omni-Path - the first generation Xeon Scalable CPUs. Carrying the suffix "F", these CPUs had an extra connector sticking out of CPU's PCB to enable the Omni-Path functionality (see images bellow). There were eight CPUs manufactured in total that had this extra feature, consisting out of two Xeon Platinum and six Xeon Gold CPUs, which have now reached end of life. Intel states that focus from these CPUs has shifted to other technologies like silicon photonics, which provides much greater speed reaching 100s of gigabits per second. Intel already demonstrated transceivers capable of reaching 400 Gb/s speeds with the magic of light, which will become available in 1H 2020.

New Information on Intel's Upcoming i9-9900KS Processor Outed - 127 W TDP

Intel's upcoming 5 GHz-on-all-cores Core i9-9900KS will certainly be a beast of a processor for the company - in more ways than one. The 8-core, 16-thread 5 5 GHz all-core turbo CPU will be Intel's best-performing consumer CPU for a while. The steps taken to ensure that have been the only ones Intel could do with their current CPU design and fabrication process - increase the TDP and improve all-core boost frequency, which should allow the CPU to perform incredibly well in peak performance.

The question that remains, of course, is how long the CPU will actually be able to keep its 5.0 GHz all-core frequency when it's engaged. The 127 W TDP as outed by an ASUS BIOS is a monstrous amount for an 8-core CPU, and I don't envy the heatsinks that will have to keep it in check. All in all, this seems to be nothing more than a CPU binned for Intel's purposes of becoming the best CPU for gaming and "home user relevant applications".

AMD Confirms: Ryzen 9 3950X and Threadripper 3rd Generation Coming in November

AMD just released an update on their upcoming processor launches this year. First revealed at E3, just a few months ago, the Ryzen 9 3950X is the world's first processor to bring 16-cores and 32-threads to the consumer desktop space. The processor's boost clock is rated at "up to 4.7 GHz", which we might now actually see, thanks to an updated AGESA software that AMD released earlier this month. Base clock for this $749 processor is set at 3.5 GHz, and TDP is 105 W, with 72 MB cache. While AMD said "September" for Ryzen 9 3950X back at E3, it looks like the date got pushed back a little bit, to November, which really makes no difference, in the grand scheme of things.

The second big part of today's announcement is that AMD is indeed working on "Rome"-based third generation Threadripper processors (probably the industry's worst-kept secret), and that these CPUs will also be launching in November, right in time to preempt Intel from having any success with their upcoming Cascade Lake-X processors. Official information on AMD's new HEDT lineup is extremely sparse so far, but if we go by recent leaks, then we should expect new chipsets and up to 32-cores/64-threads.
AMD's full statement is quoted below.

AORUS Announces the All-New AORUS 17 Flagship Laptop

Top-of-the-line gaming brand AORUS, reveals itself at the 2019 GAMESCOM trade show in Germany Cologne, in which the spotlight shines at the all-new 17 inch flagship gaming laptop, the AORUS 17. AORUS takes the lead yet again through the co-op with world renowned switch manufacture OMRON to innovate and develop a set of unique mechanical switches that is tailored for the AORUS 17, not only does the keys offer exceptional durability, it also offers one of the best feeling keys that gamers can find on a laptop. The AORUS greatness continues through the combination of the brand new Intel 8-core CPU, NVIDIA RTX graphics chip with Ray Tracing technology and an exclusive WINDFORCE INFINITY cooling system, the AORUS 17 steadily sits on the high-end gaming thrown with these specs.

AORUS leads the industry again by working with world renowned mechanical switch manufacture, OMRON in order to create a unique set of mechanical keys for the AORUS laptop, with gamer oriented design details, including an optimal 2.5 mm key travel and an actuation point of 1.6 mm, giving gamers both the sensational touch and sound of a crisp blue switch, which gamers can now enjoy the qualities of a full mechanical keyboard right on their AORUS laptop. AORUS pursues further by redesigning the key caps to produce stunning backlit keys with unique "concentric" keycaps, letting the LED underneath the keycap shine though evenly, increasing the overall lighting intensity by 27%, in addition to the AORUS exclusive FUSION 2.0 keyboard customization software, gamers can truly create a unique personal style.

GIGABYTE Smashes 11 World Records with New AMD EPYC 7002 Processors

GIGABYTE, a leading server systems builder which recently released a total of 17 new AMD EPYC 7002 Series "Rome" server platforms simultaneously with AMD's own official launch of their next generation CPU, is proud to announce that our new systems have already broken 11 different SPEC benchmark world records. These new world records have not only been achieved against results from all alternative processor based systems but even against competing vendor solutions using the same 2nd Generation AMD EPYC 7002 Series "Rome" processor platform, illustrating that GIGABYTE's system design and engineering is perfectly optimized to deliver the maximum performance possible from the 2nd Generation AMD EPYC.

Next-generation Intel Xeon Scalable Processors to Deliver Breakthrough Platform Performance with up to 56 Processor Cores

Intel today announced its future Intel Xeon Scalable processor family (codename Cooper Lake) will offer customers up to 56 processor cores per socket and built-in AI training acceleration in a standard, socketed CPU as part of its mainline Intel Xeon Scalable platforms, with availability in the first half of 2020. The breakthrough platform performance delivered within the high-core-count Cooper Lake processors will leverage the capabilities built into the Intel Xeon Platinum 9200 series, which today is gaining momentum among the world's most demanding HPC customers, including HLRN, Advania, 4Paradigm, and others.

"The Intel Xeon Platinum 9200 series that we introduced as part of our 2nd Generation Intel Xeon Scalable processor family generated a lot of excitement among our customers who are deploying the technology to run their high-performance computing (HPC), advanced analytics, artificial intelligence and high-density infrastructure. Extended 56-core processor offerings into our mainline Intel Xeon Scalable platforms enables us to serve a much broader range of customers who hunger for more processor performance and memory bandwidth."
-Lisa Spelman, vice president and general manager of Data Center Marketing, Intel Corporation

Intel Launches First 10th Gen Core Processors: Redefining the Next Era of Laptop Experiences

Today, Intel officially launched 11 new, highly integrated 10th Gen Intel Core processors designed for remarkably sleek 2 in 1s and laptops. The processors bring high-performance artificial intelligence (AI) to the PC at scale, feature new Intel Iris Plus graphics for stunning entertainment and enable the best connectivity with Intel Wi-Fi 6 (Gig+) and Thunderbolt 3. Systems are expected from PC manufacturers for the holiday season.

"These 10th Gen Intel Core processors shift the paradigm for what it means to deliver leadership in mobile PC platforms. With broad-scale AI for the first time on PCs, an all-new graphics architecture, best-in-class Wi-Fi 6 (Gig+) and Thunderbolt 3 - all integrated onto the SoC, thanks to Intel's 10nm process technology and architecture design - we're opening the door to an entirely new range of experiences and innovations for the laptop."
-Chris Walker, Intel corporate vice president and general manager of Mobility Client Platforms in the Client Computing Group

GIGABYTE Launches X570 Aorus Master Motherboard

GIGABYTE today officially launched its latest addition to the Aorus series of motherboards, made for the new generation of Ryzen 3000 series processors. The "Master" as it is called, is an impressive feat of engineering designed to handle even the most power-hungry Ryzen CPUs like the 16 core Ryzen 9 AMD recently showcased.

For starters, the board is featuring twice the amount of copper wires usually needed to implement a PCIe connection, which means less information loss on PCB. It has a 14 direct phases of Infineon digital IR 3556 PowIRstage MOSFETs VRMs that are capable of delivering 50A each, which means that the VRM is capable of delivering up to 700A of current, providing additional headroom for CPU overclock. To handle the large amount of VRMs effectively, the board is equipped with beefy heatsinks and a heat pipe that has direct contact with VRMs. Sandwiches between the heatsink and the board is a new generation of thermal pads designed by LAIRD, with 1.5 mm thickness and 5 W/mK thermal conductivity.

AMD Announces 3rd Generation Ryzen Desktop Processors

AMD CEO Dr. Lisa Su at her 2019 Computex keynote address announced the 3rd generation Ryzen desktop processor family, which leverages the company's Zen 2 microarchitecture, and are built on the 7 nm silicon fabrication process at TSMC. Designed for the AM4 CPU socket, with backwards compatibility for older AMD 300-series and 400-series chipset motherboards, these processors are multi-chip modules of up to two 8-core "Zen 2" CPU chiplets, and a 14 nm I/O controller die that packs the dual-channel DDR4 memory controller and PCI-Express gen 4.0 root complex, along with some SoC connectivity. AMD claims an IPC increase of 15 percent over Zen 1, and higher clock speeds leveraging 7 nm, which add up to significantly higher performance over the current generation. AMD bolstered the core's FPU (floating-point unit), and doubled the cache sizes.

AMD unveiled three high-end SKUs for now, the $329 Ryzen 7 3700X, the $399 Ryzen 7 3800X, and the $499 Ryzen 9 3900X. The 3700X and 3800X are 8-core/16-thread parts with a single CPU chiplet. The 3700X is clocked at 3.60 GHz with 4.40 GHz maximum boost frequency, just 65 Watts TDP and will be beat Intel's Core i7-9700K both at gaming and productivity. The 3800X tops that with 3.90 GHz nominal, 4.50 GHz boost, 105W TDP, and beat the Core i9-9900K at gaming and productivity. AMD went a step further at launched the new Ryzen 9 brand with the 3900X, which is a 12-core/24-thread processor clocked at 3.80 GHz, which 4.60 boost, 72 MB of total cache, 105W TDP, and performance that not only beats the i9-9900K, but also the i9-9920X 12-core/24-thread HEDT processor despite two fewer memory channels. AMD focused on gaming performance with Zen 2, with wider FPU, improved branch prediction, and several micro-architectural improvements contributing to a per-core performance that's higher than Intel's. The processors go on sale on 7/7/2019.

Some AMD Processors Have a Hardware RNG Bug, Losing Randomness After Suspend Resume

Red Hat Systemd (system and service manager) lead developer Lennart Poettering discovered that AMD A6-6310 "Beema" SoC that's popular among low-cost notebooks, has a faulty implementation of the RdRand random-number generation instruction. The processor's hardware random number generator (RNG) loses "randomness" after the machine resumes from a suspended state (i.e. waking up the notebook from sleep by opening its lid while it's powered on). Modern computers rely on RNGs for "entropy," critical to generation of unpredictable keys on the fly for SSL. However, the entropy source needn't be hardware, and isn't so by default. Software RNGs exist, and by default the Linux kernel does not use RdRand to generate entropy. Windows is not known to use RdRand for basic ACPI functions such as suspend/resume; however a faulty hardware RNG is not without implications for the platform, and applications that run on it.

Users on GitHub and Bugzilla report that with this bug, you cannot make a machine suspend a second time after waking it up from a suspended state, if your kernel uses RdRand. Commit cc83d51 to Systemd introduced optional randomness generation based on RdRand instruction. So, if RdRand instruction is present, it is used to generate UUIDs for invocation IDs. Michael Larabel of Phoronix comments that the RdRand bug is only found on older generations of AMD processors, "Excavator" and older; and does not affect the latest "Zen" processors. This bug report chronicles what's wrong with RdRand on the affected processors, as does this Linux kernel bugzilla thread. By avoiding RdRand usage on the system as part of generating a UUID, the reported systemd issue no longer happens. Red Hat is working on a solution to this bug.

Intel, AMD, and HTC Partner to Resolve Vive Wireless Adapter Compatibility Issue with Ryzen Processors

The headline of this post makes it seem a touch more innocuous than the story may lead to, at least if you believe the rumor mills abound. There has been an ongoing issue with AMD systems using Ryzen CPUs and the HTC Vive wireless adapter (powered by Intel WiGig) to where the systems have frozen or even had a BSOD. HTC acknowledged this as early as Nov, 2018, noting that they have seen this with a subset of Ryzen-based motherboards when the PCIe wireless adapter is installed and running. It took until last week to get a solution of sorts, and unfortunately reports from users indicate this is not a true fix for everyone.

The hotfix update 1.20190410.0 was made available April 25 to attempt to combat this issue, which was garnering a lot of attention in the VR-community on whether there was more Intel could be doing to help AMD customers. This hotfix update is available automatically once an end user with the Vive wireless adapter checks for an update, and HTC acknowledge that they continue to test this, as well as partner with Intel and AMD to help resolve this once and for all. In the meantime, users report mixed success to date, including some we know personally as well, and it remains a thorn in the side of wireless VR to get to the PC successfully.

AMD Announces the Ryzen Embedded R1000 SoC Series

At the Taiwan Embedded Forum, AMD announced the Ryzen embedded product family is growing with the new AMD Ryzen Embedded R1000 SoC. Building upon the success of the Ryzen Embedded V1000 SoC, the AMD Ryzen Embedded R1000 SoC provides embedded customers with dual core, quad-threaded performance, as well as the ability to run fanless, low power solutions for 4K displays; while providing leading-edge security features. The AMD Ryzen Embedded R1000 is perfect for applications in digital displays, high-performance edge computing, networking, thin clients and more.

Customers like Advantech, ASRock Industrial, IBASE, Netronome, Quixant and others are already working on Ryzen Embedded R1000-based products. As well, Atari© is using the high-performance Vega 3 graphics and 'Zen' CPU architecture in the AMD Ryzen Embedded R1000 SoC to power the upcoming Atari VCS game system.

BIOSTAR Intel 300 Series Motherboards Ready for the New Stepping of 9th Generation Intel Core Processors

BIOSTAR today announced that their entire 300 series motherboards have a BIOS update available that brings immediate, drop-in compatibility with Intel's new 9th generation processors. What kind of update this new stepping (which updates the old P0 stepping to the new R0) brings is unclear - Intel hasn't officially said what this change introduces at the silicon level. TDP fixes, clock increases, fixing mere errata in the CPU ID, or even some other silicon-level changes - these are all fair game for such a nebulous release. Look after the break for the entire list of updated BIOSTAR motherboards.

Intel Unleashes 56-core Xeon "Cascade Lake" Processor to Preempt 64-core EPYC

Intel late Tuesday made a boat-load of enterprise-relevant product announcements, including the all important update to its Xeon Scalable enterprise processor product-stack, with the addition of the new 56-core Xeon Scalable "Cascade Lake" processor. This chip is believed to be Intel's first response to the upcoming AMD 7 nm EPYC "Rome" processor with 64 cores and a monolithic memory interface. The 56-core "Cascade Lake" is a multi-chip module (MCM) of two 28-core dies, each with a 6-channel DDR4 memory interface, totaling 12-channel for the package. Each of the two 28-core dies are built on the existing 14 nm++ silicon fabrication process, and the IPC of each of the 56 cores are largely unchanged since "Skylake." Intel however, has added several HPC and AI-relevant instruction-sets.

To begin with, Intel introduced DL Boost, which could be a fixed-function hardware matrix multiplier that accelerates building and training of AI deep-learning neural networks. Next up, are hardware mitigation against several speculative execution CPU security vulnerabilities that haunted the computing world since early-2018, including certain variants of "Spectre" and "Meltdown." A hardware fix presents lesser performance impact compared to a software fix in the form of a firmware patch. Intel has added support for Optane Persistent Memory, which is the company's grand vision for what succeeds volatile primary memory such as DRAM. Currently slower than DRAM but faster than SSDs, Optane Persistent Memory is non-volatile, and its contents can be made to survive power-outages. This allows sysadmins to power-down entire servers to scale down with workloads, without worrying about long wait times to restore uptime when waking up those servers. Among the CPU instruction-sets added include AVX-512 and AES-NI.

ASRock DeskMini 310 supports Intel 9th Gen Processors

The world leading motherboard and mini PC manufacturer - ASRock, announces DeskMini 310 supports Intel the latest 9th Generation Core series 65-watt LGA1151 processors. ASRock DeskMini 310 adopts with Intel H310 chipset, supports up to 32GB DDR4-2666MHz memory, dual 2.5-inch hard drive and one M.2 (2280) PCIe Gen3 x4 NVMe SSD. ASRock provides various optional accessories of DeskMini 310, includes USB 2.0 cable, VESA mount kit, and Wi-Fi ac kit. With comprehensive accessories, DeskMini 310 can satisfy diverse demands from all users.

AMD Kicks-Off 2019 Offering Complete Mobile Portfolio with Ryzen, Athlon, and A-Series Processors for Notebooks and Chromebooks

Today, AMD announced the first members of its 2019 mobility line-up encompassing all notebook segments: 2nd Gen AMD Ryzen 3000 Series Mobile Processors powering ultrathin and gaming notebooks; AMD Athlon 300 Series Mobile Processors powering mainstream notebooks with the fast and efficient "Zen"3 core; and optimized 7th Gen AMD A-Series processors, elevating performance for mainstream Chromebooks. In addition, AMD announced that starting this quarter, gamers, creators and enthusiasts will be able to install Radeon Software Adrenalin software to bring the latest GPU features and game optimizations to all systems powered by AMD Ryzen Processors with Radeon Graphics.

"Users expect mobile PCs that excel at both everyday tasks and compute-heavy experiences, and with our latest mobile processor portfolio AMD offers exactly that across all levels of the market," said Saeid Moshkelani, senior vice president and general manager, Client Compute, AMD. "Notebook users want to experience the latest modern features while streaming, gaming, or finishing work faster. Enabling breakthrough entertainment experiences, AMD is pleased to enable a wide range of AMD powered notebooks than ever that deliver on those expectations with blazing fast performance, rich graphics, and long battery life."

Stuttgart-based HLRS to Build a Supercomputer with 10,000 64-core Zen 2 Processors

Höchstleistungsrechenzentrum (HLRS, or High-Performance Computing Center), based in Stuttgart Germany, is building a new cluster supercomputer powered by 10,000 AMD Zen 2 "Rome" 64-core processors, making up 640,000 cores. Called "Hawk," the supercomputer will be HLRS' flagship product, and will open its doors to business in 2019. The slide-deck for Hawk makes a fascinating disclosure about the processors it's based on.

Apparently, each of the 64-core "Rome" EPYC processors has a guaranteed clock-speed of 2.35 GHz. This would mean at maximum load (with all cores loaded 100%), the processor can manage to run at 2.35 GHz. This is important, because the supercomputer's advertised throughput is calculated on this basis, and clients draw up SLAs on throughput. The advertised peak throughput for the whole system is 24.06 petaFLOP/s, although the company is yet to put out nominal/guaranteed performance numbers (which it will only after first-hand testing). The system features 665 TB of RAM, and 26,000 TB of storage.
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