Microsoft launched its Majorana 1 chip—the world's first quantum processor powered by a Topological Core architecture—last month. The company's debuting of its Majorana design was celebrated as a significant milestone—in 2023, an ambitious roadmap was published by Microsoft's research department. At the time, a tall Majorana particle-based task was set: the building of a proprietary quantum supercomputer within a decade. Returning to the present day; outside parties have criticized Microsoft's February announcements. The Register published an investigative piece earlier today, based on quotes from key players specializing in the field of Quantum studies. Many propose a theoretical existence of Majorana particles, while Microsoft R&D employees have claimed detection and utilization. The Register referred back to recent history: "(Microsoft) made big claims about Majorana particles before, but it didn't end well: in 2021 Redmond's researchers retracted a 2018 paper in which they claimed to have detected the particles."

As pointed out by Microsoft researcher Chetan Nayak; their latest paper was actually authored last March 2024, but only made public in recent weeks. Further details of progress are expected next week, at the American Physical Society (APS) 2025 Joint March Meeting. The Register has compiled quotes from vocal critics; starting with Henry Legg—a lecturer in theoretical physics at the University of St Andrews, Scotland. The noted scholar believes—as divulged in a scientific online comment—that Microsoft's claimed Quantum breakthrough: "is not reliable and must be revisited." Similarly, collaborators from Germany's Forschungszentrum Jülich institute and the University of Pittsburgh, USA released a joint video statement. (Respectively) Experimental physicist Vincent Mourik and by Professor Sergey Frolov outlined: "distractions caused by unreliable scientific claims from Microsoft Quantum."

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China's domestic extreme ultraviolet (EUV) lithography development is far from a distant dream. The newest system, now undergoing testing at Huawei's Dongguan facility, leverages laser-induced discharge plasma (LDP) technology, representing a potentially disruptive approach to EUV light generation. The system is scheduled for trial production in Q3 2025, with mass manufacturing targeted for 2026, potentially positioning China to break ASML's technical monopoly in advanced lithography. The LDP approach employed in the Chinese system generates 13.5 nm EUV radiation by vaporizing tin between electrodes and converting it to plasma via high-voltage discharge, where electron-ion collisions produce the required wavelength. This methodology offers several technical advantages over ASML's laser-produced plasma (LPP) technique, including simplified architecture, reduced footprint, improved energy efficiency, and potentially lower production costs.

The LPP method relies on high-energy lasers and complex FPGA-based real-time control electronics to achieve the same result. While ASML has refined its LPP-based systems over decades, the inherent efficiency advantages of the LDP approach could accelerate China's catch-up timeline in this critical semiconductor manufacturing technology. When the US imposed sanctions on EUV shipments to Chinese companies, the Chinese semiconductor development was basically limited as standard deep ultraviolet (DUV) wave lithography systems utilize 248 nm (KrF) and 193 nm (ArF) wavelengths for semiconductor patterning, with 193 nm immersion technology representing the most advanced pre-EUV production technique. These longer wavelengths contrast with EUV's 13.5 nm radiation, requiring multiple patterning techniques to achieve advanced nodes.

Giga Computing, a subsidiary of GIGABYTE Technology, has signed a Memorandum of Understanding (MoU) with SK Telecom and SK Enmove to collaborate on advancing AI Data Center (AIDC) and high-performance computing (HPC) while accelerating the adoption of liquid cooling technology in next-generation data centers.
This strategic partnership sets the stage to nurture and develop high-performance, energy-efficient, and sustainable data center solutions.

Driving AI and Cooling Technology Innovation Together
Performance AI servers, liquid cooling technologies, and modular AI clusters to support SK's various business units, including:

• SK Telecom: Strengthening AIDC infrastructure to support next-generation data centers
• SK Enmove: Advancing liquid cooling technologies to improve energy efficiency and sustainability in data centers

Damo Academy—a research and development wing of Alibaba—launched its debut "server-grade processor" design late last week, in Beijing. According to a South China Morning Post (SCMP) news article, the C930 model is a brand-new addition to the e-commerce platform's XuanTie RISC-V CPU series. Company representatives stated that their latest product is designed as a server-level and high-performance computing (HPC) solution. Going back to March 2024, TechPowerUp and other Western hardware news outlets picked up on Alibaba's teasing of the Xuantie C930 SoC, and a related Xuantie 907 matrix processing unit. Fast-forward to the present day; Damo Academy has disclosed that initial shipments—of finalized C930 units—will be sent out to customers this month.

The newly released open-source RISC-V architecture-based HPC chip is an unknown quantity in terms of technical specifications. Damo Academy reps did not provide any detailed information during last Friday's conference (February 28). SCMP's report noted the R&D division's emphasizing of "its role in advancing RISC-V adoption" within various high-end fields. Apparently, the XuanTie engineering team has: "supported the implementation of more than thirty percent of RISC-V high-performance processors." Upcoming additions will arrive in the form of the C908X for AI acceleration, R908A for automotive processing solutions, and an XL200 model for high-speed interconnection. These XuanTie projects are reportedly still deep in development.

Chinese manufacturers have seized significant market share in legacy chip production, driving prices down and creating intense competitive pressure that Western competitors cannot match. The so-called "China shock" in the semiconductor sector appears as mature node production shifts East at accelerating rates. Legacy process nodes, which are usually 16/20/22/24 nm and larger, form the backbone of consumer electronics and automotive applications while providing established manufacturers with stable revenue streams for R&D investment. However, this economic framework now faces structural disruption as Chinese fabs leverage domestic demand and government support to expand capacity. By Q4 2025, Chinese facilities will control 28% of global mature chip production, with projections indicating further expansion to 39% by 2027.

This rapid capacity growth directly results from Beijing's strategic pivot following US export controls on advanced semiconductor equipment, which redirected investment toward mature nodes where technological barriers remain lower. This is happening in parallel with companies like SMIC, although isolated, which are developing lithography solutions for cutting-edge 5 nm and 3 nm wafer production. For older nodes, The market impact appears most pronounced in specialized materials like silicon carbide (SiC). Industry benchmark 6-inch SiC wafers from Wolfspeed were previously $1,500, compared to current $500 pricing from Guangzhou Summit Crystal Semiconductor—representing a 67% price compression that Western manufacturers cannot profitably match. Multiple semiconductor firms report significant financial strain from this pricing pressure. Wolfspeed has implemented 20% workforce reductions following a 96% market capitalization decline, while Onsemi recently announced 9% staff cuts. With more Chinese expansion into the mature node category, Western companies can't keep up with the lowered costs of what is now becoming a commodity.

Investment bank Morgan Stanley has estimated that an astonishing 77% of all globally produced silicon wafers dedicated to AI accelerators will be consumed by none other than NVIDIA. Often, investment research by large investment banks like Morgan Stanley includes information from the semiconductor supply chain, which is constantly expanding to meet NVIDIA's demands. When looking at wafer volume for AI accelerators, it is estimated that in 2024, NVIDIA captured nearly 51% of wafer consumption for its chips, more than half of all demand. With NVIDIA's volume projected to grow to 77%, this represents more than a 50% year-over-year increase, which is incredible for a company of NVIDIA's size. Right now, NVIDIA is phasing out its H100 accelerators in favor of Blackwell 100/200 and the upcoming 300 series of GPUs paired with Grace CPUs.

NVIDIA is accelerating its product deployment timeline and investing a lot in its internal research and development. Morgan Stanley also projects that NVIDIA will invest almost $16 billion in its R&D budget, enough to endure four to five years of development cycles running three design teams sequentially and still delivering new products on an 18-24 month cadence. The scale of this efficiency and development rivals everyone else in the industry. With all this praise, NVIDIA's Q4 revenue report is coming in exactly a week on February 26, so we have to see what its CEO, Jensen Huang, will deliver and show some estimates for the coming months.

The AI Pin - Humane's first, and last product - received an overwhelmingly negative reception at launch, and that's putting it mildly. The device was hindered by poor usability and an extremely laggy operating system that made even the simplest of tasks an absolute chore. The product, unsurprisingly, was criticized by almost every reviewer who touched it, and rumors regarding a potential acquisition of Humane soon began to circulate. Now, HP has seemingly finalized a $116-million acquisition offer for the startup that once raised over $230 million, and valued itself at $1 billion. It appears that HP wants almost all of Humane's assets - with the notable exception of one key product, the AI Pin.

As such, once the calendar reaches the 28th of February, the AI Pin will cease to function. The servers that the AI Pin utilized for communications will be shut down, rendering the AI Pin unable to access customer's cloud data, make phone calls, send AI queries, or text messages. Customers who bought the Pin in the last 90 days will be eligible for a full refund, whereas those who bought the ill-fated gadget before that will soon have an arguably good-looking fashion accessory that will probably still be able to tell them the time. After all, the product's build quality and design was the lone aspect of the AI Pin that received praise. It remains to be seen how HP puts Humane's R&D to use, although considering the AI hype that is engulfing the consumer tech industry, it wouldn't be surprising to see HP leverage Humane's tech to carve out its own niche in the AI-assisted personal computing space. Of course, that is contingent on HP's implementation being better than what Humane pulled off the last time around.

3M is expanding its commitment to the semiconductor industry by joining the US-JOINT Consortium, a strategic partnership of 12 leading semiconductor suppliers. The consortium drives research and development in next-generation semiconductor advanced packaging and back-end processing technologies anchored by a new cutting-edge facility in Silicon Valley.

"As the demands of AI and other high performance computing technologies increase, suppliers must work together to provide comprehensive solutions to tough challenges on increasingly shorter timelines." said Steven Vander Louw, 3M's president of display and electronics product platforms. "The companies in the US-JOINT Consortium represent US and Japanese innovation leaders in a range of advanced packaging technologies. 3M is pleased to join the consortium in order to bring our decades of materials science expertise, across more than 50 technology platforms, to help address these challenges."

Samsung Electronics today reported financial results for the fourth quarter and the fiscal year 2024. The Company posted KRW 75.8 trillion in consolidated revenue and KRW 6.5 trillion in operating profit in the quarter ended December 31, 2024. For the full year, it reported KRW 300.9 trillion in annual revenue and KRW 32.7 trillion in operating profit.

Although fourth quarter revenue and operating profit decreased on a quarter-on-quarter (QoQ) basis, annual revenue reached the second-highest on record, surpassed only in 2022. Meanwhile, operating profit was down KRW 2.7 trillion QoQ, due to soft market conditions especially for IT products, and an increase in expenditures including R&D. In the first quarter of 2025, while overall earnings improvement may be limited due to weakness in the semiconductors business, the Company aims to pursue growth through increased sales of smartphones with differentiated AI experiences, as well as premium products in the Device eXperience (DX) Division.

Today, the U.S. Department of Commerce has announced that CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has finalized $1.4 billion in award funding to bolster U.S. leadership in advanced packaging and enable new technologies to be validated and transitioned at scale to U.S. manufacturing. These awards will help establish a self-sustaining, high-volume, domestic, advanced packaging industry where advanced node chips are both manufactured and packaged in the United States.

These awards include:

• A total of $300 million under the CHIPS NAPMP's first Notice of Funding Opportunity (NOFO) for advanced substrates and material research to Absolics Inc., Applied Materials Inc., and Arizona State University. This follows the previously announced intent to enter negotiations on November 21, 2024
• $1.1 billion to Natcast to operate the advanced packaging capabilities of the CHIPS for America NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility (PPF). This follows the previously announced CHIPS R&D Facilities Model on July 12, 2024, and planned site selection for the PPF on January 6, 2025

At yesterday's J.P. Morgan Healthcare Conference NVIDIA announced new partnerships to transform the $10 trillion healthcare and life sciences industry by accelerating drug discovery, enhancing genomic research and pioneering advanced healthcare services with agentic and generative AI. The convergence of AI, accelerated computing and biological data is turning healthcare into the largest technology industry. Healthcare leaders IQVIA, Illumina and Mayo Clinic, as well as Arc Institute, are using the latest NVIDIA technologies to develop solutions that will help advance human health.

These solutions include AI agents that can speed clinical trials by reducing administrative burden, AI models that learn from biology instruments to advance drug discovery and digital pathology, and physical AI robots for surgery, patient monitoring and operations. AI agents, AI instruments and AI robots will help address the $3 trillion of operations dedicated to supporting industry growth and create an AI factory opportunity in the hundreds of billions of dollars.

Quobly, a leading French quantum computing startup, has reported that FD-SOI technology can serve as a scalable platform for commercial quantum computing, leveraging traditional semiconductor manufacturing fabs and CEA-Leti's R&D pilot line.

The semiconductor industry has played a pivotal role in enabling classical computers to scale at cost; it has the same transformative potential for quantum computers, making them commercially scalable and cost competitive. Silicon spin qubits are excellent for achieving fault-tolerant, large-scale quantum computing, registering clock speeds in the µsec range, fidelity above 99% for one and two-qubit gate operations and incomparably small unit cell sizes (in the hundredths of 100 nm²).

Lenovo Group Limited (HKSE: 992) (ADR: LNVGY), together with its subsidiaries ('the Group'), today announced Q2 results for fiscal year 2024/25, reporting significant increases and growth in net income, year-on-year revenue growth for the 4th consecutive quarter, and strong double-digit year-on-year revenue increases from all its business groups. Group revenue increased 24% year-on-year to US$17.9 billion. Net income was up 48% year-on-year to US$404 million on a non-Hong Kong Financial Reporting Standards (non-HKFRS)[1] basis, and non-PC revenue mix was up five points year-to-year to 46%. The Group's results reflect its clear strategy, operational excellence, investment in R&D, innovations in hybrid AI, and global footprint.

The Group's hybrid AI strategy and years of continuous investment in R&D and innovations are paying off, with its first phase of AI PCs, launched in China in May 2024, already reaching double digit share of its total notebook shipments in the China market. Recent launches of AI PCs for the global market with Lenovo AI Now have also been received positively. For enterprise AI, the Group is leveraging its full-stack hybrid infrastructure as well as Lenovo Hybrid AI Advantage to capture growth opportunities. This relentless focus on AI innovation as well as investment in R&D (up 10% year-on-year to US$548 million) is firmly establishing the Group's market differentiation and industry leadership.

LG Display, the world's leading innovator of display technologies, announced today its unveiling of the world's first Stretchable display capable of expanding up to 50%, the highest rate of elongation in the industry. At LG Science Park in Seoul on Nov. 8, the company demonstrated the panel at a meeting of more than 100 South Korean industry, academia, and research stakeholders involved in a Stretchable display national project.

Stretchable displays are seen as the ultimate free-form screen technology because they can be freely transformed into any shape, including by stretching, folding, and twisting.

Today, the Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced the expected location for the first CHIPS for America research and development (R&D) flagship facility. The CHIPS for America Extreme Ultraviolet (EUV) Accelerator, an NSTC facility (EUV Accelerator), is expected to operate within NY CREATES' Albany NanoTech Complex in Albany, New York, supported by a proposed federal investment of an estimated $825 million. The EUV Accelerator will focus on advancing state of the art EUV technology and the R&D that relies on it.

As a key part of President Biden's Investing in America agenda, CHIPS for America is driven by the growing need to bolster the U.S. semiconductor supply chain, accelerate U.S. leading-edge R&D, and create good quality jobs around the country. This proposed facility will bring together NSTC members from across the ecosystem to accelerate semiconductor R&D and innovation by providing NSTC members access to technologies, capabilities, and critical resources.

Today, ASML Holding NV (ASML) has published its 2024 third-quarter results.

• Q3 total net sales of €7.5 billion, gross margin of 50.8%, net income of €2.1 billion
• Quarterly net bookings in Q3 of €2.6 billion of which €1.4 billion is EUV
• ASML expects Q4 2024 total net sales between €8.8 billion and €9.2 billion, and a gross margin between 49% and 50%
• ASML expects 2024 total net sales of around €28 billion
• ASML expects 2025 total net sales to be between €30 billion and €35 billion, with a gross margin between 51% and 53%

CEO statement and outlook
"Our third-quarter total net sales came in at €7.5 billion, above our guidance, driven by more DUV and Installed Base Management sales. The gross margin came in at 50.8%, within guidance. While there continue to be strong developments and upside potential in AI, other market segments are taking longer to recover. It now appears the recovery is more gradual than previously expected. This is expected to continue in 2025, which is leading to customer cautiousness. Regarding Logic, the competitive foundry dynamics have resulted in a slower ramp of new nodes at certain customers, leading to several fab push outs and resulting changes in litho demand timing, in particular EUV. In Memory, we see limited capacity additions, with the focus still on technology transitions supporting the HBM and DDR5 AI-related demand."

At an industry event in Austin today, Thundercomm announces RUBIK Pi, the first Pi built on Qualcomm SoC platforms for developers. RUBIK Pi is an innovative tool that aims to lower the barriers application development with AI inference, allowing developers to access high-performance, easy-to-deploy AI R&D tools.

The Pi product is a must-have for electronics enthusiasts and developers. It can be seen as a microcomputer, integrating a processor, memory, storage, and various interfaces on a credit card-sized board. Thundercomm, a world-leading IoT product and solution provider, building on its expertise in ICT technologies and developer workflows, launched RUBIK Pi, aiming to create the most user-friendly AI R&D tools.

The Biden-Harris Administration announced today that Intel Corporation has been awarded up to $3 billion in direct funding under the CHIPS and Science Act for the Secure Enclave program. The program is designed to expand the trusted manufacturing of leading-edge semiconductors for the U.S. government.

The Secure Enclave program builds on previous projects between Intel and the Department of Defense (DoD) such as Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) and State-of-the-Art Heterogeneous Integration Prototype (SHIP). As the only American company that both designs and manufactures leading-edge logic chips, Intel will help secure the domestic chip supply chain and collaborate with the DoD to help enhance the resilience of U.S. technological systems by advancing secure, cutting-edge solutions.

Today, AMD (NASDAQ: AMD) opened a new engineering design center in Serbia, with offices in Belgrade and Nis, strengthening its presence in the Balkans region. The new design center will employ highly skilled software engineers focused on the development of software technologies optimized for AMD leadership compute platforms, including the AMD ROCm software stack for AMD Instinct data center accelerators and AMD Radeon graphics cards. The center was established through an agreement with HTEC, a global technology services company.

"Software plays a critical role in unlocking the capabilities of our leadership AMD hardware. Our new design center will be instrumental in enabling both the design and deployment of future generations of AMD Instinct and Radeon accelerators to help make end-to-end AI solutions more accessible to customers around the world," said Andrej Zdravkovic, senior vice president and chief software officer at AMD. "Our investments in Serbia are a testament to the Balkan region's strong engineering talent, and we are excited to collaborate with HTEC, local universities and the vibrant ecosystem in Belgrade and Nis as we deepen our presence in the region over the coming years."

AMD today announced the signing of a definitive agreement to acquire ZT Systems, a leading provider of AI infrastructure for the world's largest hyperscale computing companies. The strategic transaction marks the next major step in AMD's AI strategy to deliver leadership AI training and inferencing solutions based on innovating across silicon, software and systems. ZT Systems' extensive experience designing and optimizing cloud computing solutions will also help cloud and enterprise customers significantly accelerate the deployment of AMD-powered AI infrastructure at scale. AMD has agreed to acquire ZT Systems in a cash and stock transaction valued at $4.9 billion, inclusive of a contingent payment of up to $400 million based on certain post-closing milestones. AMD expects the transaction to be accretive on a non-GAAP basis by the end of 2025.

"Our acquisition of ZT Systems is the next major step in our long-term AI strategy to deliver leadership training and inferencing solutions that can be rapidly deployed at scale across cloud and enterprise customers," said AMD Chair and CEO Dr. Lisa Su. "ZT adds world-class systems design and rack-scale solutions expertise that will significantly strengthen our data center AI systems and customer enablement capabilities. This acquisition also builds on the investments we have made to accelerate our AI hardware and software roadmaps. Combining our high-performance Instinct AI accelerator, EPYC CPU, and networking product portfolios with ZT Systems' industry-leading data center systems expertise will enable AMD to deliver end-to-end data center AI infrastructure at scale with our ecosystem of OEM and ODM partners."

According to the Taiwan Central News Agency AMD is considering opening up an R&D center in Taiwan. AMD is said to have applied with the Ministry of Economic Affairs (MOEA) as part of Taiwan's "A+ global R&D and innovation partnership program" to set up a new R&D facility. The government partnership program covers three types of fields, namely AI, new-generation semiconductors including high-power and high-frequency ICs, and new 5G network structures and it's aiming for both local and international businesses to set up new R&D centers. AMD has yet to announce any plans about the potential R&D center and the MOEA has declined to share any details with local media in Taiwan.

However, an unnamed source with inside knowledge in the matter has revealed that AMD is looking at investing around NT$5 billion (~US$155 million), based on the application. The same source also mentioned that the MOEA has stipulated conditions that AMD has to meet, which among other things involves working with local IC design companies to help further develop Taiwan's IC design industry, working with local companies to produce servers with AI chips and working with local universities to cultivate talent. Furthermore, the MOEA is said to have asked AMD to recruit at least 20 percent of its R&D centre workforce from outside of Taiwan, to avoid competing with local companies for staff. AMD could be making an announcement about the R&D center at Computex, but it's worth keeping in mind that these things take time. Back in 2021, NVIDIA announced that it would set up an R&D center in Taiwan, but with a much bigger budget of NT$24.3 billion plus a government subsidy of a further NT$6.7 billion. NVIDIA has as yet to announce the opening of its Taiwan R&D center.

SK hynix Inc., the world's leading producer of High-Bandwidth Memory (HBM) chips, announced today that it will invest an estimated $3.87 billion in West Lafayette, Indiana to build an advanced packaging fabrication and R&D facility for AI products. The project, the first of its kind in the United States, is expected to drive innovation in the nation's AI supply chain, while bringing more than a thousand new jobs to the region.

The company held an investment agreement ceremony with officials from Indiana State, Purdue University, and the U.S. government at Purdue University in West Lafayette on the 3rd and officially announced the plan. At the event, officials from each party including Governor of Indiana Eric Holcomb, Senator Todd Young, Director of the White House Office of Science and Technology Policy Arati Prabhakar, Assistant Secretary of Commerce Arun Venkataraman, Secretary of Commerce State of Indiana David Rosenberg, Purdue University President Mung Chiang, Chairman of Purdue Research Foundation Mitch Daniels, Mayor of city of West Lafayette Erin Easter, Ambassador of the Republic of Korea to the United States Hyundong Cho, Consul General of the Republic of Korea in Chicago Junghan Kim, SK vice chairman Jeong Joon Yu, SK hynix CEO Kwak Noh-Jung and SK hynix Head of Package & Test Choi Woojin, participated.

Have you ever dreamed of having a real conversation with an NPC in a video game? Not just one gated within a dialogue tree of pre-determined answers, but an actual conversation, conducted through spontaneous action and reaction? Lately, a small R&D team at Ubisoft's Paris studio, in collaboration with Nvidia's Audio2Face application and Inworld's Large Language Model (LLM), have been experimenting with generative AI in an attempt to turn this dream into a reality. Their project, NEO NPC, uses GenAI to prod at the limits of how a player can interact with an NPC without breaking the authenticity of the situation they are in, or the character of the NPC itself.

Considering that word—authenticity—the project has had to be a hugely collaborative effort across artistic and scientific disciplines. Generative AI is a hot topic of conversation in the videogame industry, and Senior Vice President of Production Technology Guillemette Picard is keen to stress that the goal behind all genAI projects at Ubisoft is to bring value to the player; and that means continuing to focus on human creativity behind the scenes. "The way we worked on this project, is always with our players and our developers in mind," says Picard. "With the player in mind, we know that developers and their creativity must still drive our projects. Generative AI is only of value if it has value for them."

Arizona State University (ASU) and Deca Technologies (Deca), a premier provider of advanced wafer- and panel-level packaging technology, today announced a groundbreaking collaboration to create North America's first fan-out wafer-level packaging (FOWLP) research and development center.

The new Center for Advanced Wafer-Level Packaging Applications and Development is set to catalyze innovation in the United States, expanding domestic semiconductor manufacturing capabilities and driving advancements in cutting-edge fields such as artificial intelligence, machine learning, automotive electronics and high-performance computing.