Today an overclocking utility for AMD Ryzen CPUs called "Work Tool" has been updated with new features. The tool enables per-CCX overclocking, which is said to enable additional overclocking performance if one CCX is more capable than the other, so the whole CPU doesn't have to run at the speed of a slower CCX to be stable. The tool has been released by user shamino1978 on Overclock.net forums.

The reason for overclocking Ryzen CPUs on per CCX basis is because if you want to overclock a single core inside a CCX, the second core must run at a 1 GHz difference, meaning that if one core is OC'd to 4.5 GHz, the second core must run at 3.5 GHz. Such design is to be blamed on CPU's internal clock divider. However, you can use the Work Tool to do individual CCX overclocking and gain additional performance. Additionally, the tool has been updated to support tweaking of voltage aka VID. There are two versions of the tool, one which is smaller and has less features and one which can tweak the voltages. The smaller version is available here, while the bigger, more capable version is available here.

BIOSTAR formally (officially) enabled PCI-Express gen 4.0 support for four of its socket AM4 motherboard models based on the AMD X470 and B450 chipsets, through BIOS updates. The updated BIOS lets you use PCI-Express gen 4.0 graphics cards on the topmost PCI-Express x16 slot, and the M.2 NVMe slot that's directly wired to the AM4 SoC. The expansion slots that are wired to the chipset are still restricted to PCIe gen 2.0. You will need a 3rd generation Ryzen "Matisse" processor for PCI-Express gen 4.0. Among the motherboards that receive PCIe gen 4.0 support through BIOS updates are the AB45C-M4S (B450MH), the AB35G-M4S (B45M2), the AX47A-A4T (X470GT8), and the AX47A-I4S (X470GTN). The links lead to the BIOS image files on BIOSTAR website, which you use at your own risk.

The latest version of AGESA ComboAM4 microcode that enables 3rd generation Ryzen support on AMD 400-series chipset motherboards has been deemed buggy and pulled from motherboard vendors. AGESA ComboAM4 1.0.0.3ABA (not to be confused with 1.0.0.3AB that's being widely distributed), was originally released to fix an application crash noticed with "Destiny 2." The microcode inadvertantly destabilizes PCI-Express on motherboards, with users of ASUS motherboards complaining of stability issues with the latest BIOS updates that include 1.0.0.3ABA.

Peter "Shamino" Tan from ASUS commented that the company was under a tight schedule to push 1.0.0.3ABA out as BIOS updates, and didn't have the time to properly validate it. "We just got told to pull (was undergoing validation prior) 1003 ABA version," he said, adding the root cause of the problem being "that PCIE speed of BXB-C downgraded from gen4 to gen2,..." He comments "so its not surprising that bugs emerge since the source has hidden bugs that only gets unraveled with thorough testing. combine that with trying to get firmwares out in a tight time frame, kinda damn if you do (release firmware quickly) and damn if you dont (dont release firmware quickly) situation." It's interesting to note that in their BIOS update change-logs, quite a few motherboard vendors omit the full version string of AGESA. You may encounter ComboAM4 1.0.0.3AB being referred to simply as "AGESA ComboAM4 1.0.0.3."

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear and Enthusiast Memory solutions announced that their liquid and air cooling solutions are able to help gaming enthusiasts, streamers, overclockers, and content creators break their processing limits by achieving maximum heat transfer and thermal dissipation with the all-new Ryzen 3000 series processors. All coolers are 3rd Gen Ryzen series processor ready. Choose from Thermaltake's strong lineup of liquid and air coolers.

PATRIOT and Viper Gaming, a global leader in performance memory, SSDs, gaming peripherals, and flash storage solutions, announced the release of a new addition to their Viper 4 series line today. The Viper 4 DDR4 Blackout series is designed to be a PC-Build-friendly with a potential for overclocking and more extensive compatibility across various Intel and AMD platforms. The whole new matte-black heat spreader design covers a high-quality black PCB and offers a stylishly understated memory kit designed for PC enthusiasts, modders, and system builders. The Viper 4 Blackout series is available in frequencies of 3000 MHz up to 4000 MHz and is fully compatible with the latest 3rd Gen AMD Ryzen Desktop Processors and AMD X570 motherboards.

The all-black color theme matches any high-end system component from motherboards and graphics cards down to gaming cases and system coolers. The Viper Gaming team was inspired to create this highly tweakable memory kit in a sleek and stylish matte black aluminum heat spreader, and 100% compatible with current JEDEC memory standards.

Today, AMD announced the global availability of its new leadership PC gaming platform based on AMD Radeon RX 5700 series graphics cards and 3rd Gen AMD Ryzen Desktop Processors, as well as AMD Ryzen 3000 Series Processors with Radeon Graphics (APUs). Together, these offerings take gaming performance, immersive experiences, and visual fidelity to new heights.

AMD Radeon RX 5700 series graphics cards redefine what is possible in 1440p gaming. Built on the ground-breaking all-new AMD RDNA gaming architecture and 7nm process technology, the new graphics cards deliver superior visual fidelity, lightning-fast performance and advanced features to power the latest AAA and eSports titles. Starting today, AMD Radeon RX 5700 XT and RX 5700 graphics cards are available on AMD.com and from leading etailers and retailers for $399 and $349 USD SEP, respectively, and the 50th Anniversary Edition Radeon RX 5700 XT graphics card is available while supplies last for $449 USD SEP from AMD.com and JD.com.

The leading global motherboard manufacturer, ASRock, is pleased to officially announce the launch of the new AMD X570 motherboard series, previewed during Computex 2019. The series offers ten motherboard models for every role from affordable performance to gaming to content creation to power users. ASRock's X570 boards get the most from the next generation PCIe 4.0 interface and from the newest, most powerful AM4 processors, including the AMD Ryzen 2000 and 3000 Series. These new boards continue the tradition of trusted ASRock names such as Taichi and Phantom Gaming.

The new design for ASRock's X570 motherboards is a huge step forward. ASRock has combined both aesthetics and functionality to create a board that not only looks fascinating, with its bold angular lines, but performs as good as it looks. The stunning full coverage aluminum heatsink cools and protects the PCIe 4.0 NVMe M.2 SSDs as well as the chipset. The neatly designed color LED system is eye-catching but also classy. If you need even more enhanced RGB effects, you can customize your PC with Polychrome SYNC full-color RGB LED lighting, which provides both 3-pin addressable RGB headers and traditional 4-pin RGB LED headers which allow users to connect RGB strips directly to the motherboard and sync their lighting system using the app provided.

Today an article was posted on Intel's internal employee-only portal called "Circuit News". The post, titled "AMD competitive profile: Where we go toe-to-toe, why they are resurgent, which chips of ours beat theirs" goes into detail about the recent history of AMD and how the company achieved its tremendous growth in recent years. Further, Intel talks about where they see the biggest challenges with AMD's new products, and what the company's "secret sauce" is to fight against these improvements.The full article follows:

El Chapuzas Informático has posted an early review of the AMD Ryzen 5 3600 which was tested on a Gigabyte Aorus Gaming 7 WiFi motherboard, G.Skill FlareX DDR4 @ 3200 MHz and an NVIDIA GeForce RTX 2080 Ti FE graphics card. Looking at the data presented, it becomes clear the performance on offer if real looks to be quite impressive. The site compared AMD's latest offering to the Intel Core i9-9900K and the AMD Ryzen 7 2700X with the Ryzen 5 3600 typically slotting in between the two and in some cases beating both. This is interesting to note as the Ryzen 7 2700X offers similar clock speeds to the Ryzen 5 3600 but the former has a 2C/4T advantage. Even so, the newer AMD CPU tends to outpace the Zen+ based Ryzen 7 2700X in multiple tests. In Cinebench R15, for example, the Ryzen 5 3600 had the lead in single-core performance while multi-core was held by the Ryzen 7 2700X. Cinebench R20 roughly mimics these results as well.

While memory latency was quite high 80.5 ns, it didn't seem to impact performance to any serious degree. In fact, in wPrime 2.10 32M running on a single core showed the Ryzen 5 3600 coming in just behind the Intel Core i9-9900K while being faster than the previous generation Intel Core i7-8700K, i7-8600K, and AMD Ryzen 7 2700X and 1700X. That said, the previous generation Ryzen processors were far slower here were as the Intel chips were still competitive. In the multi-core test, the Ryzen 7 2700X took a slight lead while the Ryzen 7 1700X was a bit slower than the Ryzen 5 3600. One interesting quirk of note was the lack of write speed on the memory with the Ryzen 5 3600 only hitting 25.6 GB/s which is quite a drop from the 47 GB/s seen on the Ryzen 7 1700X and Ryzen 7 2700X. However this could be due to the X470 motherboard being used or maybe an issue with sub timings on the memory, something that will need to be verified in future reviews.

GIGABYTE today officially launched its latest addition to the Aorus series of motherboards, made for the new generation of Ryzen 3000 series processors. The "Master" as it is called, is an impressive feat of engineering designed to handle even the most power-hungry Ryzen CPUs like the 16 core Ryzen 9 AMD recently showcased.

For starters, the board is featuring twice the amount of copper wires usually needed to implement a PCIe connection, which means less information loss on PCB. It has a 14 direct phases of Infineon digital IR 3556 PowIRstage MOSFETs VRMs that are capable of delivering 50A each, which means that the VRM is capable of delivering up to 700A of current, providing additional headroom for CPU overclock. To handle the large amount of VRMs effectively, the board is equipped with beefy heatsinks and a heat pipe that has direct contact with VRMs. Sandwiches between the heatsink and the board is a new generation of thermal pads designed by LAIRD, with 1.5 mm thickness and 5 W/mK thermal conductivity.

ASUS today rolled out an entry-level mini-ITX motherboard for the AMD socket AM4 platform, the Prime A320I-K. Based on the AMD A320 chipset, the board supports 1st and 2nd generation Ryzen processors out of the box, including the 8-core models. The tiny A320 chipset is tucked away behind a metal heatspreader underneath the M.2-2280 slot. The board draws power from a combination of 24-pin ATX and 8-pin EPS connectors, conditioning it with a 6-phase VRM that makes do without a heatsink.

Storage connectivity on the A320I-K includes four SATA 6 Gbps ports, and an M.2-2280 slot with PCI-Express 2.0 x4 and SATA 6 Gbps wiring from the SoC. The board's lone expansion slot is a PCI-Express 3.0 x16. USB connectivity includes six USB 3.1 gen 1 ports, four on the rear-panel and two via headers; and four USB 2.0 ports, of which two are via headers. Display connectivity includes one each of DisplayPort and HDMI. Networking is care of a single 1 GbE interface driven by a Realtek RTL8111H controller, and the onboard audio solution is an entry-level Realtek ALC887. We expect the Prime A320I-K to be priced around $60.

AMD Ryzen 3000 "Matisse" processors are multi-chip modules of two kinds of dies - one or two 7 nm 8-core "Zen 2" CPU chiplets, and an I/O controller die that packs the processor's dual-channel DDR4 memory controller, PCI-Express gen 4.0 root-complex, and an integrated southbridge that puts out some SoC I/O, such as two SATA 6 Gbps ports, four USB 3.1 Gen 2 ports, LPCIO (ISA), and SPI (for the UEFI BIOS ROM chip). It was earlier reported that while the Zen 2 CPU core chiplets are built on 7 nm process, the I/O controller is 14 nm. We have confirmation now that the I/O controller die is built on the more advanced 12 nm process, likely GlobalFoundries 12LP. This is the same process on which AMD builds its "Pinnacle Ridge" and "Polaris 30" chips. The 7 nm "Zen 2" CPU chiplets are made at TSMC.

AMD also provided a fascinating technical insight to the making of the "Matisse" MCM, particularly getting three highly complex dies under the IHS of a mainstream-desktop processor package, and perfectly aligning the three for pin-compatibility with older generations of Ryzen AM4 processors that use monolithic dies, such as "Pinnacle Ridge" and "Raven Ridge." AMD innovated new copper-pillar 50µ bumps for the 8-core CPU chiplets, while leaving the I/O controller die with normal 75µ solder bumps. Unlike with its GPUs that need high-density wiring between the GPU die and HBM stacks, AMD could make do without a silicon interposer or TSVs (through-silicon-vias) to connect the three dies on "Matisse." The fiberglass substrate is now "fattened" up to 12 layers, to facilitate the inter-die wiring, as well as making sure every connection reaches the correct pin on the µPGA.

AMD X570 is the company's first in-house design desktop motherboard chipset for the AM4 platform. The company sourced earlier generations of chipset from ASMedia. A chipset in context of the AM4 platform only serves to expand I/O connectivity, since an AM4 processor is a full-fledged SoC, with an integrated southbridge that puts out SATA and USB ports directly from the CPU socket, in addition to LPCIO (ISA), HD audio bus, and SPI to interface with the firmware ROM chip. The X470 "Promontory Low Power" chipset runs really cool, with a maximum TDP of 5 Watts, and the ability to lower power to get its TDP down to 3W. The X570, on the other hand, has a TDP of "at least 15 Watts." A majority of the X570 motherboards we've seen at Computex 2019 had active fan-heatsinks over the chipset. We may now have a possible explanation for this - there are just too many things on the chipset.

According to AMD, the X570 chipset by itself can be made to put out a staggering twelve SATA 6 Gbps ports (not counting the two ports put out by the AM4 SoC). A possible rationale behind this may have been to enable motherboard designers to equip every M.2 slot on the motherboard with SATA wiring in addition to PCIe, without needing switches that reroute SATA connection from one of the physical ports. It's also possible that AMD encouraged motherboard designers to not wire out SATA ports from the AM4 SoC as physical ports to save costs on switches, and dedicate one of them to the M.2 slot wired to the SoC. With the two SATA ports from the SoC out of the equation, and every other M.2 slot getting a direct SATA connection from the chipset, motherboard designers can wire out the remaining SATA ports as physical ports, without spending money on switches, or worrying about customer complaints on one of their drives not working due to automatic switching. This is an extreme solution to a rather simple problem.

AMD senior technical marketing manager Robert Hallock, responding to a specific question on Twitter, confirmed that the 3rd generation Ryzen processors do feature soldered integrated heatspreaders (IHS). Soldering as an interface material is preferred as it offers better heat transfer between the processor die and the IHS, as opposed to using a fluid TIM such as pastes. "Matisse" will be one of the rare few examples of a multi-chip module with a soldered IHS. The package has two kinds of dies, one or two 7 nm "Zen 2" 8-core CPU chiplets, and one 14 nm I/O Controller die.

The most similar example of such a processor would be Intel's "Clarkdale" (pictured below), which has its CPU cores sitting on a 32 nm die, while the I/O, including memory controller and iGPU, are on a separate 45 nm die. On-package QPI connects the two. Interestingly, Intel used two different sub-IHS interface materials for "Clarkdale." While the CPU die was soldered, a fluid TIM was used for the I/O controller die. It would hence be very interesting to see if AMD solders both kinds of dies under the "Matisse" IHS, or just the CPU chiplets. Going by Hallock's strong affirmative "Like a boss," we lean toward the possibility of all dies being soldered.Image Credit: TheLAWNOOB (OCN Forums)

Motherboard vendors are betting big on the success of AMD's "Valhalla" desktop platform that combines a Ryzen 3000-series Zen 2 processor with an AMD X570 chipset motherboard, and have responded with some mighty premium board designs. GIGABYTE deployed its full spectrum of Aorus branding, including Ultra, Elite, ITX Pro, Master, and Xtreme. The X570 I Aorus Pro WiFi mini-ITX motherboard is an impressive feat of engineering despite its designers having to wrestle with the feisty new PCIe gen 4 chipset. It draws power from a combination of 24-pin and 8-pin connectors, and conditions power for the SoC with an impressive 8-phase VRM that uses high-grade PowIRstage components. A rather tall fan-heatsink cools the X570 chipset, with a 30 mm fan.

Connectivity options on the X570 I Aorus Pro WiFi are surprisingly aplenty. The sole expansion slot is a PCI-Express 4.0 x16, but the storage connectivity includes not one, but two M.2-2280 slots (reverse side of the PCB), each with PCI-Express 4.0 x4 and SATA 6 Gbps wiring. Four SATA 6 Gbps ports make for the rest of the storage connectivity. Networking options include 2.4 Gbps 802.11ax WLAN, Bluetooth 5.0 (Intel , and 1 GbE, all pulled by Intel-made controllers. USB connectivity includes six 5 Gbps USB 3.2 gen 1, and two 10 Gbps USB 3.2 gen 2 ports (of which one is type-C), and two 5 Gbps ports by headers. The onboard audio solution has 6-channel analog output, but is backed by a premium Realtek ALC1220VB Enhance CODEC (114 dBA SNR).

KLEVV at its Computex 2019 booth unveiled a new line of high-performance USB flash drives. It also brought along its latest variants of CRAS series M.2 NVMe SSDs and DDR4 memory, which come with a dazzling/blinding (take your pick) amount of RGB LED embellishment. We begin with the Portable Ghost, branded as a "portable SSD" and not a flash-drive. This is because the USB 3.1 gen 2 type-C connection pulls a PCIe/NVMe internal SSD. When plugged into a PC or a USB charger, the drive can also work as a wireless drive to your other devices over Bluetooth 4.2. The drive comes in two variants based on capacity, which significantly differ in hardware. The 240 GB variant is pulled by a JMicron JM5583 controller, while the 480 GB variant has a Silicon Motion SM2263EN. Both models use 72-layer 3D TLC NAND flash, and have the same on-paper performance figures, with up to 1,250 MB/s reads/writes. The drive isn't without two RGB LED diffusers.

The Blu RC30 is another fascinating, albeit slower drive, that's properly marketed as a flash drive. Built in the conventional 2-piece capped form-factor, the drive features a USB 3.1 gen 1 (5 Gbps) type-A connection. An internal battery which soaks up power when plugged in, lets the drive function wireless over Bluetooth 4.2, and also be used as a wireless presentation tool (a clicker), with capacitive touch surface and a couple of buttons, which imitate a mouse. Built in capacities of 32 GB, 64 GB, and 128 GB, the Blu RC30 offers sequential transfer-rates of up to 250 MB/s reads on all three models, and write-speeds rated at 40 MB/s for the 32 GB model, 50 MB/s for 64 GB, and 90 MB/s for the 128 GB model. Transfer rates are severely throttled in wireless mode. We then moved on to its SSD and memory products.

ZADAK may have dropped the "511" from its name, but remains a sought-after boutique hardware brand for case-modders. At its Computex 2019 booth, the company showed off its latest memory modules, cooling products, and a few case-mods that put the two together. The centerpiece at the booth was the Spark line of premium DDR4 memory modules. Silver accents of brushed aluminium top a darker shade, crowned by a silicone addressable-RGB LED diffuser. Each module has five lighting zones - top, top sides, and corners, which the maker calls "Dynamic multi-zone RGB." Each module cycles between 8 lighting presets, although with a 3-pin ARGB connection, you can play with the lighting via software.

ZADAK Spark memory comes in single-module, dual-channel, and quad-channel kits of 8 GB and 16 GB modules, which are further differentiated in four speeds, DDR4-3000, DDR4-3200, DDR4-3600, and DDR4-4133. Up to 3200 MHz, these modules offer timings of 16-18-18-38@1.35V, which loosen to 17-19-19-39@1.35V for DDR4-3600, and 19-21-21-42@1.4V for DDR4-4133. ZADAK claims it tested each memory kit for advertised settings on both Intel Core and AMD Ryzen platforms. Prices start at USD $159.99 for a 2x 8 GB DDR4-3200 memory kit. Next up, is the ZADAK Spark AIO closed-loop liquid CPU cooler.

With AMD chipset based motherboards like X570 and next-generation Ryzen 3000 series CPUs delivering the 4.0 version of the PCIe protocol for consumers, products based on the faster protocol are bound to take advantage of its improvements - especially in terms of better bandwidth.

At their Computex booth, Gigabyte showed off some pretty impressive results of their PCIe 4.0 based SSD card. The so-called "Auros AIC Gen4 SSD" is a performance monster. It is able to pack up to four PCIe 4.0 M.2 SSDs that can go up to 2 TB of density each, for a maximum 8 TB total storage. Put them in RAID 0 configuration, though, and you will get some amazing performance numbers. Gigabyte demonstrated speeds exceeding 15 GB/s in sequential reads and writes, providing much more bandwidth than what has ever seen before ina consumer-geared product. The SSD comes with an aluminum shroud with pre-applied thermal pads to facilitate heat dissipation. Additionally, there is a blower fan attached to the card to keep a constant flow of fresh air, which seems like a must if you're packing four M.2 drives inside a tiny aluminum case.

While its honestly staggering see how many products ASUS had on display at Computex this year, I think the number of laptops might take the cake. They had just about everyone imaginable on hand except a kitchen sink. The ROG lineup was represented by the Zephyrus M GU502, Zephyrus S GX502, Zephyrus G GA502, Strix Hero III, Strix SCAR III, and last but not least the Mothership. Meanwhile, the TUF Gaming brand demoed the FX705DU and FX505DU. More surprising is the fact AMD's Ryzen 3750H makes an appearance not only in the TUF Gaming laptops but in the Zephyrus series as well bringing a bit more selection to the once Intel dominated mobile market.

Taking a closer look at the Republic of Gamers lineup and our attention is immediately drawn to the ROG Mothership which due to its design is the most unique laptop on display here. Featuring a detachable keyboard with RGB lighting, eight heat pipes, liquid metal cooling, 4K G-SYNC display, Intel i9-8950H CPU overclocked, NVIDIA GeForce RTX 2080, and NVMe SSDs, it stands out from the crowd. Gone is the traditional clamshell if you so choose without sacrificing performance. It definitely proves to be an eye-catching product.

An AMD-based system's most important performance pairing lies in the CPU and system RAM, as a million articles written ever since the introduction of AMD's first generation Ryzen CPUs have shown (remember the races for Samsung B-die based memory?). There are even tools that allow you to eke out the most performance out of your AMD system via fine memory overclocking and timings adjustment, which just goes to show the importance the enthusiast community derives from such tiny details that maximize your AMD Zen-based CPU performance. Now, notorious leaker @momomo_us has seemingly confirmed that AMD has worked wonders on its memory controller, achieving a base JEDEC 3200 MHz specification - up from the previously officially supported DDR4-2666 speeds in the first-gen Ryzen (updated to DDR4-2933 speeds on the 12 nm update).

ECS has introduced a new model into their Liva series of Mini PCs - this time, powered by AMD Ryzen APUs. The ECS LIVA A320 is a 1-liter Mini Pc (book-sized, according to the company, but I guess that depends on the books you prefer to read), and makes use of either an AMD Ryzen 3 or Ryzen 5 APU with up to 35 W TDP.

There's a lot to like about this little Mini PC that could, which ECS is marketing at light gaming workloads and all other content consumption and office-related shenanigans. There is a tooless design for easy upgradeability, 2x DDR4 support in the SO-DIMM form factor, internal support for an M.2 drive (which helps save space in such a small enclosure, even though a 2.5" HDD or SSD is still supported). A VESA mount means this can be installed in the back of a monitor or television for your content consumption needs.

AMD today posted its latest version of the Radeon Software Adrenalin 2019 Edition. Version 19.5.2, signifying the second release for the month of May 2019, comes with release-date optimization for "Total War : Three Kingdoms." Among the issues fixed are multi-display screen flickering problems noticed on Radeon VII, incorrect maximum temperature values reported by Radeon WattMan for certain GPUs, GPU Utilization showing up for unsupported products on Radeon Performance Metrics Overlay; and HDR video freezing or experiencing corruption on certain Ryzen APUs. Grab the drivers from the link below.

DOWNLOAD: AMD Radeon Software Adrenalin 19.5.2 betaThe change-log follows.

AMD X570 is the company's first in-house design socket AM4 motherboard chipset, with the X370 and X470 chipsets being originally designed by ASMedia. With the X570, AMD hopes to leverage new PCI-Express gen 4.0 connectivity of its Ryzen 3000 Zen2 "Matisse" processors. The desktop platform that combines a Ryzen 3000 series processor with X570 chipset is codenamed "Valhalla." A rough platform diagram like what you'd find in motherboard manuals surfaced on ChipHell, confirming several features. To maintain pin-compatibility with older generations of Ryzen processors, Ryzen 3000 has the same exact connectivity from the SoC except two key differences.

On the AM4 "Valhalla" platform, the SoC puts out a total of 28 PCI-Express gen 4.0 lanes. 16 of these are allocated to PEG (PCI-Express graphics), configurable through external switches and redrivers either as single x16, or two x8 slots. Besides 16 PEG lanes, 4 lanes are allocated to one M.2 NVMe slot. The remaining 4 lanes serve as the chipset bus. With X570 being rumored to support gen 4.0 at least upstream, the chipset bus bandwidth is expected to double to 64 Gbps. Since it's an SoC, the socket is also wired to LPCIO (SuperIO controller). The processor's integrated southbridge puts out two SATA 6 Gbps ports, one of which is switchable to the first M.2 slot; and four 5 Gbps USB 3.x ports. It also has an "Azalia" HD audio bus, so the motherboard's audio solution is directly wired to the SoC. Things get very interesting with the connectivity put out by the X570 chipset.Update May 21st: There is also information on the X570 chipset's TDP.
Update May 23rd: HKEPC posted what looks like an official AMD slide with a nicer-looking platform map. It confirms that AMD is going full-tilt with PCIe gen 4, both as chipset bus, and as downstream PCIe connectivity.

ZADAK announced today the immediate worldwide release of their latest ultra-high-performance RGB gaming memory module, the SPARK RGB DDR4. Firmly aimed at the high-end PC enthusiasts and gamers market, the SPARK RGB DDR4 brings together powerful memory module, overclocking capability and top-notch design elements to form a valuable addition to the ZADAK DDR4 family that is compatible with high-end motherboards.

SPARK RGB DDR4 modules are available in kits ranging from 16GB (2x8GB) up to 64GB (4x16GB) with the top-end models running at 4133 MHz. Overclocking is made simple with XMP 2.0 support allowing users to select their preferred profile for stable and reliable overclocking.

The folks over at Videocardz have treated us to a leak on MSI's upcoming X570 motherboards. The company's mid-tier MPG motherboards usually include the likes of the Gaming Carbon and Gaming Plus motherboards, and this round of motherboard development is no different. Both motherboards join leaked designs from other brands that showed active cooling being mounted on top of the chipset, a throwback to another era.

The leaked Gaming Plus is the lower-tier of the two leaked solutions of today, cutting on reinforcements on some expansion ports (such as the PCIe 16x slot). The Gaming Pro Carbon features a fancier design (with RGB lighting); the chipset hroud also serves as cooling for M.2 slots you can populate underneath (or so it seems). The Gaming Pro Carbon has more attention to detail on the placement of connectors such as SATA, and seems to have a slight advantage on the overall motherboard power delivery circuits, but these are just being eyeballed. One thing we can see is that while the Gaming Pro Carbon features MSI's Audio Boost feature, the Gaming Plus doesn't. Expect more details to be available closer to launch.