Rapid evolution in AI technology is infusing IoT devices with new capabilities, leading to the new trend of AIoT. Simply speaking, IoT devices acquire data then transmit that data through the network to an integrated backend system. Typical applications include automation, remote control, and connection with other IoT devices. AIoT brings the power of AI to these IoT devices, so that machine equipment and factories can play a more active role in the process and learn intelligently. Accumulation of data, continuous learning, and data analysis can achieve failure prevention or autonomous operation to implement a fully-fledged "smart factory." The GP-3000 is Cincoze's highly-acclaimed flagship model for AI and machine vision applications, combining high-end computing performance, rich high-speed I/O, and harsh environment resilience to enable edge computing in the AIoT framework. It is the first choice for effectively implementing multiple applications on the field side, such as smart manufacturing and transportation.

The key to rapid smart manufacturing upgrades is introducing high-efficiency GPU computers as the on-site data processing center. To that end, the GP-3000 supports an Intel Xeon /Core (Coffee Lake-R & Coffee Lake) processor and sports the Intel C246 chipset, with up to two sets of DDR4-2666 ECC/non-ECC SO-DIMMs for a maximum of 64 GB of total memory. This setup provides the coveted combination of efficient processing and parallel processing. The GPU Expansion Box (GEB) supports up to two 250 W high-end full-length (≤328 mm) GPU cards to further enhance its processing capabilities. The high-speed I/O ports, with the simple addition of a camera, become the machine equipment's eyes, allowing for the quick and accurate inspection and categorization of high-definition image inputs.

ASRock Rack, a division of ASRock dedicated to server/enterprise products, has today quietly launched a 1U short depth server, equipped with AMD's X570 motherboards, able to accommodate AMD Ryzen 5000 series of processors. The 1U2-X570/2T, as ASRock calls it, features an X570D4I-2T motherboard that is capable of housing any AMD Ryzen and Ryzen Pro 5000 series processor with TDP up to 105 Watts, paired with up to four SO-DIMMs of DDR4 ECC memory. Being a remote desktop/server type of build, the 1U case is not designed to be equipped with any powerful discrete graphics card. There is room for the motherboard, the power supply, and the HDDs located next to the motherboard.

Equipped with an 80-Plus Bronze 265 Watt PSU, the system can handle almost any CPU it is equipped with, two 3.5" drives and two 2.5" 7 mm drives. The motherboard also supports M.2 2280 SSD with PCIe 4.0 protocol support. When it comes to basic graphics output, ASRock Rack has installed an ASPEED AST2500 graphics controller to handle basic video output and display the command line, so you can operate with your server with ease. When it comes to networking, it is equipped with dual RJ45 10 GbE connectors, coming from an Intel X550-AT2 Ethernet controller. For more details, head over to the ASRock Rack 1U2-X570/2T product page.

Axiomtek - a world-renowned leader relentlessly devoted in the research, development and manufacture of series of innovative and reliable industrial computer products of high efficiency - is proud to introduce its extremely compact fanless embedded system, the eBOX560-52R-FL. This palm-sized embedded system is powered by the onboard Intel Core i5-8365UE or Intel Celeron 4305UE processors (codename: Whisky Lake-U). It provides high-performance, power-efficient, and abundant I/O interfaces in a compact device. The eBOX560-52R-FL is highly suitable for space-constrained applications with strict performance requirements such as industrial equipment computers, in-cabinet equipment integration, collaborative robots, and more.

"Axiomtek's eBOX560-52R-FL is designed to provide customers with flexible, convenient, and simplified solutions for industrial and embedded applications. The fanless yet low-power embedded system can operate under wide temperatures ranging from -10°C to 50°C with 0.7 m/s airflows and endure up to 50G shock and 3Grms vibration. Moreover, it features two independent 4K Ultra HD displays through its DisplayPort++ and HDMI for multi-display applications," said Janney Lee, a product manager of Product PM Division at Axiomtek. "Its compact size, excellent computing power, and ability to function in harsh environments making it ideal for diverse industrial applications such as factory, machine, and logistics automation, station gate controls, and ticket vending machines."

TEAMGROUP's T-CREATE brand, which gives creators around the world the tools to express their creativity and inspiration, has updated its product lines again with today's launch of the EXPERT DDR4 OC10L desktop memory, CLASSIC PCIe 4.0 SSD, and CLASSIC DDR4 10L laptop memory. T-CREATE continues to launch diverse new products with improved specifications, producing powerful hardware to meet the needs of creators.

The T-CREATE EXPERT DESKTOP DDR4 OC10L not only has up to 32 GB of capacity per module but also an overclocking feature that automatically increases its frequency to 3600 MHz, providing worry-free overclocking with stable, high-frequency performance. It comes in a titanium grey finish that exudes the tasteful minimalism of the EXPERT product line. In addition, the memory uses a 10-layer PCB with a specialized anti-noise design for better processing capability, allowing creators to work on tasks simultaneously, whether it be producing animation, video editing, or converting large files. It substantially improves work efficiency and excels in multitasking during creative projects.

Leading global memory brand TEAMGROUP continues to make its mark on the next generation of DDR5 memory. At the end of last year, the company announced that it had entered the validation phase with the collaboration of major motherboard manufacturers. In early 2021, it has made another breakthrough. Paying attention to the needs of not only desktop but also notebook and mini PC users, TEAMGROUP has successfully created DDR5 SO-DIMM and is expected to be the first to take Intel and AMD's new platform validation tests.

Specifications of the DDR5 SO-DIMM at the early stage of development resemble those of the U-DIMM version. A single module has a capacity of 16 GB and a frequency of 4800 MHz, and both versions run at the lowered voltage of 1.1 V. For notebooks that need to stay mobile for a long period of time, this can noticeably reduce power consumption and extend standby time. DDR5 SO-DIMM also supports on-die ECC, a feature that self-corrects single-bit errors, greatly improving system stability. Users can look forward to the convenience and peace of mind that DDR5 will bring to notebooks, mini PCs, NAS, and more.

TEAMGROUP announced the T-FORCE ZEUS DDR4 U-DIMM Gaming Memory and SO-DIMM DDR4 Gaming Laptop Memory. Both possess a visually-striking design and are constructed with carefully selected, high-quality ICs. Each stick has up to 32 GB of memory and multiple frequency options, allowing you to maintain blazing speeds for your conquering foes.

The T-FORCE ZEUS DDR4 U-DIMM Gaming Memory features T-FORCE's iconic logo and a fierce thunderbolt design, symbolizing the awesome power of Zeus backing up the player. Built with a high-end integrated circuit, this memory module comes with up to 32 GB of RAM and frequency options ranging from DDR4 2666 to DDR4 3200. Say goodbye to complicated BIOS configuration as it supports overclock profiles, allowing you to switch speeds at a press of a button. You can also upgrade easily regardless of whether you use Intel or AMD processors.

GIGABYTE launched the BRIX S line of desktop mini PCs powered by AMD Ryzen 4000U "Renoir" 15 W mobile processors. These mini-PCs are almost NUC-sized, measuring 46.8 mm x 119.5 mm x 119.5 mm (HxWxD), and pack a 2.5-inch SATA drive-bay in addition to an M.2-2280 slot with both PCI-Express 3.0 x4 and SATA 6 Gbps wiring. Connectivity is highlighted by four display outputs—one each of HDMI 2.0a, DisplayPort, and two USB-C with DP passthroughs. Networking connectivity includes 2.5 GbE and 802.11ax + Bluetooth 5.1 WLAN.

As for the specific models, the GB-BRR7H-4700 is powered by a Ryzen 7 4700U, the GB-BRR5H-4500 by a Ryzen 5 4500U, and the GB-BRR3H-4300 by the Ryzen 3 4300U. All three feature two DDR4 SO-DIMM slots, and a vacant M.2-2280 slot, so you're expected to drop in your own memory and storage. All three include VESA mounting brackets, so you can tuck them behind your monitor, if it has VESA wall-mounts. The power bricks included with all three can put out 135 W of power. The company didn't reveal pricing.

With the SCHENKER VIA 15 Pro (M20), Schenker Technologies presents an ultra-mobile high-performance laptop, whose top of the range version uses the eight-core AMD Ryzen 7 4800H APU. The deliberate omission of an additional, dedicated graphics card, places the laptop in an exclusive position in the European market. In contrast to its little brother, the SCHENKER VIA 15 (E20), the Leipzig-based laptop manufacturer has equipped the Pro version with more flexible connectivity options and dual-channel memory support. Indespensible features such as the 91 Wh battery and the robust lightweight chassis remain untouched.

Schenker Technologies presents the SCHENKER VIA 15 Pro with AMD's current Renoir APUs - the Ryzen 5 4600H and Ryzen 7 4800H. The powerful, multithreaded and efficient six and eight-core models each operate in the maximum configurable 54 W TDP envelope. Compared to the regular SCHENKER VIA 15 (Non-Pro), whose AMD Ryzen 5 3550U is limited to a TDP of only 15 watts, the Pro offers a remarkable performance improvement. While the majority of competitors focus on coupling AMD's mobile H-APUs with an expensive, dedicated graphics solution, the SCHENKER VIA 15 Pro takes a more efficient approach. The integrated Vega 7 graphics unit is more than capable when powering everyday applications.

IBASE Technology Inc., a world leader in the manufacture of a wide range of digital solutions, has rolled out the SI-642-N 4K digital signage player that leverages the 8th Gen Intel Core U-series processors. The platform can be used in commercial establishments to increase brand awareness and customer engagement or deployed in transportation networks to provide real-time information and advertising relevant to the traveler.

The fanless SI-642-N offers high performance and high reliability for 24/7 operation in an industrial grade design. It is integrated with the IBASE iSMART and Observer technologies for remote monitoring, power on/off scheduling, power recovery and low temperature boot functions. With the Intel HD Graphics 620, the system can simultaneously support two independent displays (1x HDMI 2.0 & 1x Active DisplayPort 1.2) with 4K (4096 x 2160) @60Hz resolution as well as two independent audio outputs.

Axiomtek, a leading design and manufacturing company of innovative, high performance and reliable PC-based industrial computer products, is proud to introduce the MIRU130, a powerful embedded vision and AI motherboard for graphics-intensive applications such as machine vision and deep learning. It is powered by the onboard AMD RYZEN Embedded V1807B/V1605B processor with AMD Radeon RX Vega graphics. The embedded vision board features two PoE GbE LAN ports for camera interfaces and an integrated real-time vision I/O that includes 4-CH isolated DIO. The MIRU130 is feature-rich, highly expandable and easy-to-deploy with a compact design for space constraint enclosures. It is an ideal solution for systems integrators who are searching for a powerful, easy-to-integrate motherboard for vision-based AI applications.

The high performance MIRU130 measures 244 x 170 mm and has a vision-specific I/O with 2-CH trigger input, 2-CH LED lighting controller, 2-CH camera trigger output and an encoder input for conveyor tracking. It offers high graphical capabilities through the integrated AMD Radeon RX Vega graphics with support of DirectX 12 and allows dual display through one HDMI and one DisplayPort interfaces. The MIRU130 has two IEEE 802.3at PoE ports and two GbE LANs for connecting with industrial cameras.

XPG, a provider of high-performance products for gamers, e-sports pros, and tech enthusiasts, is pleased to announce that it has become the Official Gaming Notebook sponsor of the official Valve RMR CS:GO Online tournament series CS_SUMMIT 6.Organized by Beyond the Summit (BTS), the tournament will take place from June 22 to July 5. As a part of the sponsorship, the XPG XENIA will be the Official Gaming Notebook of the tournament.

CS_SUMMIT 6 will be broadcast internationally and is organized regionally with qualifying games in Europe and North America. XPG will be the major sponsor of the event in the Gaming Notebook category.This is the second time XPG has participated in a BTS-organized tournament as a sponsor. During CS_SUMMIT 5, XPG was the Official Keyboard sponsor.

ZOTAC got around to launching the third generation of its VR GO line of gaming backpack PCs, the VR GO 3.0. ZOTAC had unveiled it at the 2020 International CES. These devices are essentially desktop-replacement notebooks minus the display, with connectivity for a VR headset, which you wear like a backpack. This is the device's first update in over two years, with the VR GO 2.0 launching in the thick of the VR craze around 2018.

The new VR GO 3.0 comes with an improved wearable design, with better thermal insulation and ventilation for the wearer. It also gets updated hardware in the form of a Core i7-9700 processor, GeForce RTX 2070 graphics, 16 GB of DDR4-2667 SO-DIMM memory, and 240 GB NVMe SSD storage. The device comes with two hot-swappable battery packs. You can swap out a battery with at least one of them in the bay, in the middle of your game. The VR GO 3.0 supports a wide range of VR HMD standards, and is based on Windows 10. The company didn't reveal pricing.

ASRock Industrial Computer Corporation, the world's leader in Industrial PC motherboards, unveils a broad range of industrial motherboards powered by the Intel 10th Generation Core Processors (Comet Lake-S) with up to 10 Cores and supporting Intel 400-series Q470E, H420E, and W480E chipsets. Featuring improved multi-threaded computing performance and rich I/O functionality, ASRock Industrial's new series of product lineup covers comprehensive form factors, including industrial Mini-ITX, Micro-ATX, and ATX motherboards, are ideal for diverse applications, such as industrial automation, retail kiosks, digital signage, and AIoT solutions.

ASRock Industrial introduces the industry's first Intel 10th Gen Core Processors Industrial Motherboards with Q470E chipset, including the IMB-1220-L/IMB-1220-D and IMB-1222/IMB-1222-WV Mini-ITX motherboards, the IMB-1313 Micro-ATX motherboard and the IMB-1711 ATX motherboard. For value and cost-effective options, there are also new Mini-ITX motherboards with H420E chipset, the IMB-1221-L/IMB-1221-D comes with high-rise IO and the IMB-1223/IMB-1223-WV with thin IO.

Cincoze, a professional manufacturer of embedded systems, unveils the GM-1000 rugged GPU computer, which is powered by the 9th/8th generation Intel CPU and supports one MXM GPU module expansion. This GPU computer provides high-performance computing capability with a small footprint design, which is suitable for applications like edge computing, machine vision, image processing, and artificial intelligence.

GM-1000 can be configured with a range of 9th/8th generation Intel CPUs, including Xeon and Core i up to 8 cores. It supports dual channel DDR4 2666 MHz SO-DIMM up to 64 GB. It has abundant I/Os, including 4x COM, 2x GbE LAN, 8x USB, 1x HDMI, and 1x DVI-I. GM-1000 comes with an M.2 M key slot to support NVMe SSD, and M.2 E key slot to support CNVi for WiFi or Bluetooth connection which are commonly required in high speed data storage and communication. All these functions are integrated in a small footprint just 260 mm x 200 mm x 85 mm, making it easily installed in space-limited environments.

GeIL has today announced a new line of memory for Intel 10th Gen and AMD Ryzen 4000 series mobile processors. The new 64 GB kit offered as 2x 32 GB DDR4-3200 modules is simply called "SO-DIMM". This new kit features high-density chips and a standard operating voltage of 1.2 V which helps maximize system performance. The new series of modules will also feature lower speed kits in DDR4 2933 MHz 64 GB and DDR4 2666 MHz 64 GB. The 3200 MHz kit comes with a latency of 22-22-22-52 while the 2933 Mhz features 21-21-21-48 and the 2666 MHz 19-19-19-43 which are all similar to other vendors offerings. These new kits should offer gamers and content creators a robust memory upgrade path for mobile devices, pricing and availability were not announced.

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories is pleased to announce the launch of its industrial-grade 32 GB DDR4-3200 memory modules. With tested transfer rates of up to 3200 MT/s and 32 GB of capacity, the modules are ideal for segments and applications experiencing continuous growth of temporarily stored data as a result of 5G network and AIoT deployment, and thus require higher capacity and performance. These segments and applications include telecommunications, surveillance systems, autonomous vehicles, medical equipment, and industrial robots among others.

The modules come in U-DIMM, SO-DIMM, R-DIMM, ECC-DIMM, and ECC SO-DIMM variants and are compatible with the latest 3rd Gen AMD Ryzen and 10th Gen Intel Core processors. Made with the latest advancements in soldering and manufacturing. Utilizing a 288-pin design, operating voltage has been reduced from 1.5 V on DDR3 to 1.2 V, which not only helps save power by 20%, but also boosts transfer bandwidth speed.

GIGABYTE has updated its Brix lineup of Mini-PCs with Intel's latest and greatest 10th generation Comet Lake mobile CPUs. Measuring 46.8 x 119.5 x 119.5 mm, the Brix mini PC is a small form factor machine with its 0,6-liter size. If anyone thinks that power is proportional to the size of a PC, the GIGABYTE Brix is here to prove them wrong. Available in four variants that differ only in CPU that is soldered inside, you can get anything from a dual-core Intel Core i3-10110U, all the way up to six-core Core i7-10710U CPU powerhouse. These CPUs are 15 W TDP models, so even though the Brix is small, its cooling solution should be able to handle the heat.

The Brix Mini-PC comes with a mounting bracket for 75 x 75 mm and 100 x 100 mm VESA mounts, meaning that you can place it behind a monitor. Storage options are limited to one 2.5-inch drive that can be up to 9.5 mm thick. For RAM, the Brix is using two SO-DIMM slots that can support up to 64 GB of DDR4 2666 MHz RAM. When it comes to connectivity options, GIGABYTE has equipped the Brix with Intel Dual Band Wireless-AC 3168 wireless adapter providing Bluetooth 4.2 and WiFi 802.11ac connectivity. The IO options are somewhat decent as Brix has three USB 3.2 Gen 2 ports at the front, along with a USB Gen 2 Type-C connector and 3.5 mm headphone jack. On the back, there are two HDMI 2.0a ports for video output, two additional USC 3.2 Gen 2 ports, power input, and of course an RJ45 Ethernet connector.

Razer had an interesting outing at CES 2020. There were no new PC gaming peripherals, other than Star Wars "storm trooper" co-branded Kraken, Goliathus, and Atheris; but three interesting exhibits. To begin with, Razer Kishi is an adjustable, split game controller for smartphones. The controller's two ends (meant for your left and right hands, wrap around the two ends of your smartphone. You get two analog thumbsticks, a D-pad, four action buttons, and four triggers. The Razer Gamepad app lets you map the controller to your smartphone over Bluetooth, and provides custom button mapping. The company also showed off Arctech line of smartphone sleeves that are designed to dissipate heat.

Having made its mark as a leading gaming notebook vendor, Razer is turning its attention to pre-built gaming desktops, and we saw one of its first creations, the Tomahawk SFF. Much like Apple, Razer has a serious focus on form as much as function, and that's evident with the aluminium CNC precision-milled chassis with tempered glass side-panels, and a size that's fit both for desks and the living room.

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories today announces the launch of the XPG Hunter DDR4 memory module. Geared toward PC enthusiasts and gamers, the XPG Hunter delivers all the benefits of DDR4 with remarkable performance and efficiency. It supports XMP 2.0 for easy overclocking and offers great stability, making it ideal for performance seekers - gaming to competitive benchmarking. It comes in U-DIMM and SO-DIMM variants to meet the needs of desktop and notebook users alike.

The XPG Hunter modules are made with high-quality chips selected through a strict filtering process. They are equipped with the finest PCBs and pass rigid reliability and compatibility tests to ensure longevity and rugged durability, which are vital for overclocking, gaming, and extreme benchmarking. The modules deliver high-speed performance of up to 3200 MHz and comes with capacities of 4 GB, 8 GB, 16 GB, or 32 GB to meet the needs of diverse users and budgets.

The XPC slim model series has a new member. With the DS10 range, Shuttle now presents four slender, fanless barebones with a robust steel chassis and a variety of connection options. The available processors can handle different requirements from the energy-saving dual-core Intel Celeron through to the powerful i7 quad-core model.

All DS10 models are completely fanless and operate without any noise. At the same time, they are very low-maintenance, because the passive cooling means that less dust gets inside them. This is why the DS10 range is also particularly suitable for constant 24/7 operation in adverse ambient conditions. The robust steel chassis measuring 20 × 16.5 × 3.95 cm (LWH) provides space for one 2.5-inch drive in the form of a hard disk or SSD as well as two SO-DIMM slots which can accommodate a total of up to 32 GB of DDR4 memory. An M.2-2280 slot is available for fast NVMe drives. The second M.2 slot is equipped with a WLAN/Bluetooth module which transmits and receives data using two external antennas.

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories is pleased to announce new capacity 32 GB per DIMM of ADATA DDR4-2666 U-DIMM and DDR4-2666 SO-DIMM modules.

Made with the latest advancements in soldering and manufacturing, the ADATA DDR4-2666 U-DIMM and SO-DIMM 32GBwith a single slot has tested and provided excellent performance and support the latest Intel and AMD platforms.U-DIMM 32 GB will give discerning users, such as gamers and graphics professionals, the ability to break the memory limitations of two-slot platforms. For general laptop users, ADATA offers DDR4-2666 SO-DIMM 32 GB.

As with all ADATA memory modules, these modules and their components are produced and tested via a rigorous quality control process to ensure rapid performance and stable operation. Also, they meet strict JEDEC and RoHS standards to guarantee compatibility, stability, and environmentally friendliness and come backed by a lifetime warranty for maximum assurance.

ECS at its Computex 2019 booth showed off its next generation of LIVA branded mini PCs and a new AMD platform SFF desktop. We begin with the retro-looking SF110-A320, an SFF desktop measuring 205 mm x 176 mm x 33 mm (WxDxH), with an AM4 socket, and the ability to power 35W TDP APUs. Its mainboard is driven by an AMD A320 chipset. We know that the A320 supports 12 nm Ryzen 3000-series "Picasso" APUs. It's quite possible that these desktops could ship with them, particularly their low-TDP variants. The iGPU of these chips are wired out to two DisplayPorts, an HDMI, and a D-sub (VGA) output. You drop in your own DDR4 SO-DIMM modules, an M.2-2280 SSD, or 2.5-inch SATA drive. Networking options include 802.11ac WLAN, Bluetooth 4.2, and 1 GbE wired networking. ECS includes a 90W power-brick.

The company also showed off its latest LIVA Z3 Plus series mini PCs that appear to be ready for 10th generation Core "Ice Lake-U" SoCs, although the company won't mention it. There are two physical variants of the Z3 Plus, a shorter one that lacks a 2.5-inch drive bay, making you rely entirely on an M.2-2280 slot for internal storage (PCIe + SATA); and a taller variant with an additional 2.5-inch drive bay with SATA 6 Gbps. The shorter variant measures 117 mm x 128 mm x 37 mm (WxDxH), and the taller one about 47 mm in height. Both variants ship with 120W power bricks, take in two DDR4 SO-DIMM modules, one M.2-2280 SSD, and put out connectivity that includes HDMI and mDP display outputs, dual 1 GbE wired + 802.11ac + Bluetooth 4.2 networking, and four USB 3.1 gen 2 ports, from which one is a type-C.

ECS has introduced a new model into their Liva series of Mini PCs - this time, powered by AMD Ryzen APUs. The ECS LIVA A320 is a 1-liter Mini Pc (book-sized, according to the company, but I guess that depends on the books you prefer to read), and makes use of either an AMD Ryzen 3 or Ryzen 5 APU with up to 35 W TDP.

There's a lot to like about this little Mini PC that could, which ECS is marketing at light gaming workloads and all other content consumption and office-related shenanigans. There is a tooless design for easy upgradeability, 2x DDR4 support in the SO-DIMM form factor, internal support for an M.2 drive (which helps save space in such a small enclosure, even though a 2.5" HDD or SSD is still supported). A VESA mount means this can be installed in the back of a monitor or television for your content consumption needs.

The 1.3-litre PCs of the XPC slim model series are getting a facelift - the DH370 sports a new chassis design which accommodates Intel processors of the 8th generation for socket LGA1151v2, relies on the faster H370 chipset and offers a total of four USB 3.1 ports with up to 10 GBit/s. With the DH370, Intel's H370 chipset makes its debut in Shuttle's range of 1.3-litre PCs. These not only support Intel processors of the "Coffee Lake" generation with up to 65 Watt TDP and up to 32 GB of DDR4 SO-DIMM memory, it is also possible to control three monitors at once in 4K resolution. An HDMI 2.0b and two DisplayPort 1.2 ports are available to facilitate this. If required, one analog VGA port can be provided optionally. Three of the four monitor ports could then be used simultaneously.

"With these technical specs on paper, the DH370 now bears the title of the XPC model with the highest performance per cubic centimetre," says Tom Seiffert, Head of Marketing & PR at Shuttle Computer Handels GmbH. "The new chassis design sets the appropriate tone." Despite its compact dimensions of just 19 x 16.5 x 4.3 cm (DWH), there is space for a 2.5-inch drive (HDD/SSD) and an M.2 NVMe SSD. Another M.2 slot in 2230 format can be fitted with a WLAN module, for example. The Shuttle WLN-M is the appropriate accessory here. Two antennas guarantee optimum reception quality.

BASE Technology Inc., one of the world's leading manufacturers of innovative and high-performance digital signage systems, reveals its latest SI-614 digital signage player based on 7th Gen Intel Core desktop processors and supporting NVIDIA MXM GeForce GTX 10 Series graphics cards that feature amazing speed, power efficiency and with 3X the performance of previous-generation graphics cards.

The SI-614 digital signage player is designed for digital signage applications within hospitality, retail and education sectors to empower the establishments to connect and communicate with their guests, customers and audience, reliably delivering high-quality live video and digital signage content. The standard SI-614 signage player is powered by a 7th Gen Intel Core i5-7500 processor with a NVIDIA MXM NV1050 graphics card integrated with 4GB GDDR5 128bit memory, 16GB DDR4 memory and a 128GB 2.5-inch SSD storage device.