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Intel "Cascade Lake-X" HEDT CPU Lineup Starts at 10-core, Core i9-10900X Geekbenched

With its 10th generation Core X "Cascade Lake-X" HEDT processor series, Intel will not bother designing models with single-digit core-counts. The series is likely to start at 10 cores with the Core i9-10900X. This 10-core/20-thread processor features a quad-channel DDR4 memory interface, and comes with clock speeds of 3.70 GHz base, a 200 MHz speed-bump over the Core i9-9900X. The chip retains the mesh interconnect design and cache hierarchy of Intel's HEDT processors since "Skylake-X," with 1 MB of dedicated L2 cache per core, and 19.3 MB of shared L3 cache.

Geekbench tests run on the chip show it to perform roughly on par with the i9-9900X, with the 200 MHz speed-bump expected to marginally improve multi-threaded performance. Where the "Cascade Lake-X" silicon is expected to one-up "Skylake-X" is its support for DLBoost, an on-die fixed function hardware that multiplies matrices, improving AI DNN building and training; and pricing. Intel is expected to price its next-generation HEDT processors aggressively, to nearly double cores-per-Dollar.

Intel to Increase Cores-to-the-Dollar Across the Board with Cascade Lake-X?

Intel is preparing to increase core-counts across the board with its upcoming Core X "Cascade Lake-X" HEDT processor family, launching next month. The first indication of this comes from an Intel slide that claims a 1.74 to 2.09x increase in performance-per-Dollar over "Skylake-X." The "Cascade Lake" microarchitecture already made its debut in the enterprise market as Intel's 2nd generation Xeon Scalable processors, and its IPC is similar clock-to-clock, to its predecessor (Skylake).

If Intel is claiming such performance-per-Dollar increases, it only points to a significant increase in core counts to the Dollar (think 16-core at $999, 28-core at $1999, etc.). Adding value to these chips are certain new AI accelerating instruction sets, such as DLBoost, support for Optane DC Persistent Memory, increased memory clock-speeds, and higher CPU clocks across the board compared to the Core X 9000-series. The Core X "Cascade Lake-X" processor family debuts this October.

X499 or X299G? Intel's Fall 2019 HEDT Update Heralds a New Chipset?

Our readers spotted an interesting visual detail that missed us during our coverage of GIGABYTE's three new socket LGA2066 motherboards unveiled at Computex 2019. One of the three boards, the X299S Designare 10G, has the hard-marking "X499" on its CPU VRM heatsink. Another detail that strikes us is that none of the three new boards we pictured has "X299" printed on the PCB anywhere. The Designare 10G has a sticker below the printed GIGABYTE logo that reads "X299G Designare 10G." The purported X299G Aorus Master has another interesting detail: right above the "Aorus Master" print, there's a tiny sticker marked "X299G," positioned as if it's covering up a printed marking on the PCB itself.

All these details lead us to wonder if GIGABYTE tried to cover up that these boards are in fact based on the unannounced X499 Express chipset, and made to appear like they are X299. We only have paper stickers and the booth placards that indicate "X299," while a metal embossing on the Designare 10G's VRM heatsink reads X499. Intel in its Computex 2019 keynote announced that it will introduce new Core X HEDT processors. It's been over 2 years since the first Core X "Skylake-X" processors launched in Q2-2017. Intel refreshed the lineup in 2018 with 9th generation branding and soldered TIM, with a few specification improvements across the product-stack, but a largely unchanged silicon. It's likely that the Fall 2019 release could see new chips with increased core counts, perhaps even the fabled 22-core die, and some hardware mitigation against recent security vulnerabilities.

GIGABYTE Unveils Three New X299 Motherboards at Computex 2019

At Computex 2019, we spotted three new socket LGA2066 motherboards from GIGABYTE, and several other manufacturers. At its Computex 2019 keynote, Intel announced that in Q3 2019, the company is launching new Core X series HEDT processor models "for creators." When combined with the handful new LGA2066 motherboard models we've spotted, it becomes highly likely that the processors Intel is launching this Fall could be LGA2066-compatible. Without further ado, the X299G Aorus Master, the X299G Aorus Xtreme Waterforce, and the X299G Designare 10G.

The X299G Aorus Master is different from the X299 Aorus Master launched last November, and the X299G Designare 10G is different from the X299 Designare EX launched way back in 2017. The X299G Aorus Xtreme Waterforce is the first "Xtreme" sub-branded LGA2066 product. What's common to these three boards is out-of-the-box support for the upcoming HEDT processor models, besides 9th generation "Skylake-X" Refresh processors, and the original "Skylake-X" chips.

New Intel Core i9-9990XE Sheds Cores in Favor of High Clock Speeds, Benchmarked

Intel is giving final touches to a new socket LGA2066 high-end desktop processor with an interesting model number for its specifications. The new Core i9-9990XE is positioned above the current flagship i9-9980XE. Normally you'd expect it to be the same 18-core "Skylake-X" chip with a speed-bump, however, the i9-9990XE is a unique proposition. It sheds cores in favor of significantly higher clock-speeds than the i9-9980XE.

The i9-9990XE is a 14-core/28-thread processor, based on a binned "Skylake-X" HCC (high core count) die, and uses STIM (soldered thermal interface material) between the die and integrated heatspreader (IHS). It features some aggressive clock-speeds, with 4.00 GHz nominal clock-speeds, and a massive 5.10 GHz maximum Turbo Boost frequency that beats even the Core i9-9900K. Besides 14 cores, the i9-9990XE is configured with 19.25 MB of shared L3 cache, and 1 MB of L2 cache per core. The four disabled cores alone don't help Intel's efforts to dial up clock-speeds. Intel has increased the chip's rated TDP all the way up to 255 Watts!

Intel "Glacier Falls" Platform Likely Gets a Computex Unveil, Also B365 Chipset

Intel's 9th generation re-branding of its "Skylake-X Refresh" HEDT processors could have a rather short lifespan in the company's product-stack of just three quarters. Intel is planning to launch its next HEDT platform, codenamed "Glacier Falls," which succeeds the current "Basin Falls Refresh." "Glacier Falls" could launch around late-Q2/early-Q3, with unveils slated for Computex 2019 (June). These details are part of a slide leak from an internal presentation from motherboard manufacturer GIGABYTE.

The slide revealing "Glacier Falls" also mentions two new mainstream-desktop platform chipsets, the B365 Express and the H310C Express. There is no information on what sets these apart from the current B360 and H310, respectively. We predict their entry is necessitated by stronger CPU VRM requirements to support 9th generation Core 6-core and 8-core processor SKUs that are known to pull up to 140 Watts of power (unrelated to TDP, which is calculated on the basis of nominal clock speed and not Turbo Boost). There's also a faint possibility of Intel giving the B365 CPU overclocking support to compete with the value proposition of AMD's B450.

AMD Expands 2nd Generation Ryzen Threadripper Desktop Processor Line-up, Powering Ultimate Computing Experiences, Available Today From $649

[Editor's Note: Our review of the Ryzen Threadripper 2920X is out already, and that of the Ryzen Threadripper 2970WX will follow soon after.]

Today, AMD announced availability of two additional 2nd Gen AMD Ryzen Threadripper processor models, 2970WX with 24 cores and 48 threads and the Ryzen Threadripper 2920X with 12 cores and 24 threads. The Ryzen Threadripper WX series commands class-leading core counts, purpose-built for prosumers focused on raw computational power for the heaviest workloads. In turn, Ryzen Threadripper X series provides enthusiasts, gamers, and streamers high performance with a beautiful and smooth gaming experience based on higher base and boost processor clock speeds than the previous generation.

"The dramatic transformation in the HEDT and overall PC market is driven by AMD leadership and innovation, and the AMD Ryzen Threadripper family is central to this global excitement," said Saeid Moshkelani, senior vice president and general manager, Client Compute, AMD. "We are expanding this excitement while also ensuring the HEDT market remains accessible to a broader range of creators and gamers with two new Threadripper processors that start at $649."

MSI Intros X299 MEG Creation Motherboard

MSI drew more than a few eyeballs at Computex 2018 when it showcased the X399 MEG Creation motherboard for AMD Ryzen Threadripper processors. With the advent of "new" Skylake-X Refresh processors by Intel, the company has a new high-end motherboard with the X299 MEG Creation. MSI appears to have toned down on the design from its X399-based product, although you still see the metal waveform design along the chipset heatsink that's contiguous with M.2 SSD heatsinks, the VRM heatsink, and the rear I/O shroud. The board draws power from a combination of 24-pin ATX, and two 8-pin EPS power connectors, conditioning it for the LGA2066 processor with a 14-phase VRM.

Expansion slots on the MSI X299 MEG Creation include four PCI-Express 3.0 x16, from which three are wired to the CPU, and the fourth one to the PCH. Between them are three M.2-2280 slots with PCI-Express 3.0 x4 wiring, each. You can add up to four more M.2-2280 SSDs with the included M.2-Xpander Aero accessory, which is a 4-slot M.2 riser with air-cooling, which made its debut with the X399 MEG Creation. Another star attraction with this board is Realtek 2.5 Gbps Ethernet, alongside an Intel i219-V powered 1 GbE interface, and an 802.11 ac + BT 5.0 WLAN. Another interesting accessory is the ThunderboltM3, a Thunderbolt 3.0 card with two type-C ports, and two DisplayPort connectors, for daisy chaining your displays. Storage connectivity, besides the seven M.2 slots, includes eight SATA 6 Gbps ports, and a U.2 port. This board could be priced around the $500-mark.

Intel Fixes Spectre & Meltdown on New Desktop Processors, Core-X Will Have to Wait

The new 9th generation Intel Core processors arrived yesterday with a series of improvements made to entice gamers and content creators. These improvements, however, join others that go beyond pure performance. Intel has introduced several architectural changes to fix the infamous Spectre & Meltdown vulnerabilities, and the new processors mitigate most of the variants of these attacks through a combination of hardware, firmware and OS fixes.

The big changes come to two of the six variants of those vulnerabilities. In both "Rogue Data Cache Load" (Meltdown, variant 3) and "L1 Terminal Fault" (Meltdown, Variant 5) vulnerabilities these new processors have hardware fixes that are new and not present on the rest of the current portfolio of Intel chips. This includes the new Xeon W-3175X (Core-X Skylake-X Refresh), which still depend on firmware fixes to mitigate those problems.

ASUS Introduces new Prime X299-Deluxe II and ROG Dominus Extreme

Intel's high-end desktop platform raises the stakes with updated Intel Core X-Series processors that boast a lot more of everything, including cores, cache, bandwidth, and more. The additional processing power plows through CPU-intensive tasks, while the extra bandwidth lets you add more GPUs and NVMe SSDs to accelerate a wider range of workloads.

Anchored by the X299 platform, this upper echelon scales up to 18 cores with the new Core i9-9980XE. It's now joined by an even more exclusive chip with 28 cores and an entirely separate platform that redefines extreme desktop PCs. We have new motherboards designed to exploit the strengths of each CPU. The Prime X299-Deluxe II gives professionals and power users a flexible foundation for serious work and it is not alone, ROG engineers are also working on a new Rampage motherboard geared toward hardcore gamers and overclockers, while the ROG Dominus Extreme shows what's possible when our engineers have the freedom to go beyond traditional boundaries

Intel Xeon W-3175X is a new Beast for Workstation Lovers: 28 Cores and Up to 512 GB of Memory

Although the big stars of today's Intel event have been the new desktop processors, the company also wanted to take this opportunity to launch its new beasts for the workstation field. These are the Intel Xeon W-3175X, which are destined to conquer ambitious users in that professional segment. These unlocked microprocessors, similar (but not equal) to what we saw at Computex in June, have 28 cores, 56 threads and base frequencies of 3.1 GHz, although they can reach 4.3 GHz.

These chips support 68 PCIe 3.0 lanes (44 on the CPU, 24 on the chipset), and there is another important feature on the memory front: the 6-channel DDR4 support allows the user to configure these systems with up to 512 GB at 2666 MHz (ECC and standard). This processor's TDP is 255 W and is based on Intel's Skylake-X architecture.

Intel HEDT Platform to be Forked into Z399 and X599

Intel could very soon fork its high-end desktop platform into two, with the introduction of the new Z399 socket LGA2066 chipset later this quarter; and the fabled X599 chipset powering LGA3647 processors. The move is probably triggered by AMD's introduction of new 24-core and 32-core Ryzen Threadripper processors that wipe out competitiveness of its existing "Basin Falls" X299 platform. The X599 could essentially be a C629 with the addition of some client-segment features (and the subtraction of some enterprise-segment ones), whereas the Z399 is a whole different beast.

With the introduction X599 and LGA3647, Intel could restore competitiveness at the >$1,500 market segment with new 24-core, 26-core, and 28-core "Skylake-X" XCC (extended/extreme core count) processors; whereas the introduction of Z399 could be necessitated with a that of a new 22-core chip for the LGA2066 socket, from which Intel can carve out new 20-core and 22-core SKUs. Existing Skylake-X LCC and HCC chips could be forwards-compatible with Z399, and X299 motherboards could still be eligible for supporting new 20-core and 22-core processors via BIOS updates. The Z399 could introduce a handful of new client-segment features Intel is introducing with the Z390.

EVGA Announces Availability of the X299 Micro ATX 2 Motherboard

The X299 MICRO ATX 2 is a reimagined mATX board designed to support the power, performance, and cooling necessary to power Intel's i5/i7/i9 CPU's for the X299 Chipset. With a 14 Phase power design, a thick VRM heatsink/fan, two 8 pin EPS power connectors, an additional 6 pin PCIe power connector, and external BCLK, this motherboard was born for the enthusiast desiring maximum power in a small form factor. The X299 MICRO ATX 2 supports current storage standards, including M.2 NVMe, Intel Optane, Intel VROC and SATA 6Gb/s to give you a blazing fast access to your data, while Intel Dual-Band WIFI/BT and an Intel i219V Gigabit NIC Keeps you connected.

Intel X599 Chipset to Drive 28-core HEDT+ Platform

The introduction of 32-core AMD Ryzen Threadripper 2990WX at $1,799 has demolished the competitiveness of the similarly priced Core i9-7980XE, forcing Intel to "productize" its Skylake-X XCC (extreme core-count) silicon for the client-segment. We've already seen one or two motherboards for this platform at Computex, notably the ASUS ROG Dominus (pictured below). Intel's demo platform is reportedly powered by a GIGABYTE-made motherboard. Both these boards may have been prototypes based on Intel C629 "Lewisburg" chipset, as Intel was still mulling on whether to even launch the product.

With the 2990WX out, the fate of the client-segment cousin of the Xeon Platinum 8180 is sealed, and so is that of the C629. In its client-segment avatar, the chipset will be branded "Intel X599 Express." This chipset will support new SKUs derived from the "Skylake-X" XCC silicon (probably 24-core, 26-core, and 28-core), in the LGA3647 package. The platform features not just up to 28 cores, but also a 6-channel DDR4 memory interface, which will probably support up to 192 GB of memory on the client-platform. There's also a rumor that Intel could launch new 20-core and 22-core LGA2066 processors. Those, coupled with the 8-core LGA1151 processor, will be Intel's fig-leaf until late-2019.

Intel Unveils 28-core/56-thread HEDT Processor

It was only a matter of time before Intel maxed out the "Skylake-X" silicon on the client segment, by bringing its "Skylake XCC" (extreme core count) 700 mm² die on a client-segment package, and here we are. Without taking model names, Intel made it clear that it's launching a new client-segment 28-core/56-thread processor. The company didn't specify the processor's package, and we're doubtful if it's LGA2066 for the simple reason that the Skylake XCC die has 6-channel memory interface. Nevertheless, this processor is clocked at 2.70 GHz (nominal), and without revealing Turbo speeds, Intel managed to overclock it bench-stable to 5.00 GHz, at which it scored 7,334 nT Cinebench points. This product will launch in Q4-2018.

FinalWire Announces AIDA64 v5.97 Update

FinalWire Ltd. today announced the immediate availability of AIDA64 Extreme 5.97 software, a streamlined diagnostic and benchmarking tool for home users; the immediate availability of AIDA64 Engineer 5.97 software, a professional diagnostic and benchmarking solution for corporate IT technicians and engineers; the immediate availability of AIDA64 Business 5.97 software, an essential network management solution for small and medium scale enterprises; and the immediate availability of AIDA64 Network Audit 5.97 software, a dedicated network audit toolset to collect and manage corporate network inventories.

The latest AIDA64 update implements 64-bit AVX-512 accelerated benchmarks, adds monitoring of sensor values on Asus ROG RGB LED motherboards and video cards, and supports the latest AMD and Intel CPU platforms as well as the new graphics and GPGPU computing technologies by both AMD and nVIDIA.
DOWNLOAD: FinalWire AIDA64 v5.97

Caseking Starts Selling Skylake-X Direct Die Cooling Frame

Caseking, in partnership with overclocking prowess Der8auer, have introduced a new overclocking product for users that want to extract every little percentage of additional overclocking from their chips (they had already introduced 99.9% purity silver-based heatspreaders, too). The Skylake-X Direct-Die Cooling Frame is a solution that aims to replace Intel's Integrated Loading Mechanism (ILM), attaching itself to the CPU cooler mount holes, and enabling users to use direct-to-die cooling mechanisms (sans heatspreader). The idea is that users can "cut the middleman" and make do without both Intel's terrible TIM and their stock heatspreaders, achieving a much higher heat transfer form the CPU die to the CPU cooler and, therefore, higher heat dissipation, lower temperatures, and higher overclocking.

G.Skill Intros Quad-channel DDR4-4000 MHz SO-DIMM Kit

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is announcing the world's highest performance DDR4 SO-DIMM memory running at DDR4-4000 MHz CL18-18-18-38 32 GB (4x8 GB) at 1.35V. Combining high frequency and ultra-low timing, this Ripjaws DDR4 SO-DIMM memory kit is capable of achieving the new high level of performance through rigorously hand-binned Samsung B-die DDR4 IC components.

Just two months ago, G.SKILL announced the high performance DDR4-3800MHz CL18-18-18-38 Ripjaws DDR4 SO-DIMM kit. Aiming to push memory limits to yet another level, G.SKILL strives to deliver the best memory performance possible on current systems, and this time for small form factor (SFF) PCs. With this new SO-DIMM memory kit, SFF PCs can now unlock the full potential of memory performance, as shown in the following screenshot, where this new memory kit is tested for over 6 hours on the ASRock X299E-ITX/ac mini-ITX motherboard with the Intel Core i9-7900X processor.

EVGA Announces the X299 DARK Motherboard

EVGA introduces you to the ultimate in raw performance for the next-gen Intel Extreme lineup, the EVGA X299 Dark. The Dark is crafted from the ground up to be the performance apex with everything you need to make a record-breaking benching run or a 24/7 number cruncher, and nothing you don't - a board that is as reliable as it is fast.

Latest Intel Roadmap Slide Leaked, Next Core X is "Cascade Lake-X"

The latest version of Intel's desktop client-platform roadmap has been leaked to the web, which reveals timelines and names of the company's upcoming product lines. To begin with, it states that Intel will upgrade its Core X high-end desktop (HEDT) product line only in Q4-2018. The new Core X HEDT processors will be based on the "Cascade Lake-X" silicon. This is the first appearance of the "Cascade Lake" micro-architecture. Intel is probably looking to differentiate its Ringbus-based multi-core processors (eg: "Coffee Lake," "Kaby Lake") from ones that use Mesh Interconnect (eg: "Skylake-X"), so people don't compare the single-threaded / less-parallized application performance between the two blindly.

Next up, Intel is poised to launch its second wave of 6-core, 4-core, and 2-core "Coffee Lake" processors in Q1-2018, with no mentions of an 8-core mainstream-desktop processor joining the lineup any time in 2018. These processors will be accompanied by more 300-series chipsets, namely the H370 Express, B360 Express, and H310 Express. Q1-2018 also sees Intel update its low-power processor lineup, with the introduction of the new "Gemini Lake" silicon, with 4-core and 2-core SoCs under the Pentium Silver and Celeron brands.

ASUS Intros WS C422 PRO SE Motherboard

ASUS expanded its socket LGA2066 workstation-class motherboard lineup with the WS C422 Pro SE. The board is physically identical to the WS X299 Pro SE, but is based on the Intel C422 chipset. Designed for single-socket Intel Xeon W ("Skylake-W") processors, this board is targeted at workstation builders who require ECC memory support.

"Skylake-W" is an enterprise variant of the "Skylake-X" silicon, with support for up to 512 GB of ECC quad-channel DDR4 memory. It features up to 18 CPU cores, and is different from the Xeon Scalable "Skylake-SP" silicon. The board supports up to 512 GB of quad-channel DDR4 memory with support for ECC, over its eight memory slots. The rest of its feature-set is identical to that of the WS X299 Pro SE.

Intel Extends the Core i9 Brand to the Mobile Platform

Intel created the Core i9 brand to differentiate two key groups of Core X series HEDT (high-end desktop) processors, with the Core i7 X-series parts featuring 28-lane or 16-lane PCIe interfaces, while the Core i9 X-series parts featuring the full 44-lane interfaces present on the "Skylake-X" silicon. The Core i9 brand also earned a degree of exclusivity as it allows Intel to ask upwards of $999 for these client-segment parts, with the top-end i9-7980XE scraping the $2,000-mark. Intel sees the potential for a similar segmentation for its mobile processor lineup, even if not on grounds of PCIe lane budget or core-counts.

The Core i9 mobile processor family could bring the highest-levels of 6-core "Coffee Lake" desktop processor performance to the notebook platform. Intel is giving final touches to the Core i9-8000 series "Coffee Lake-H" processor lineup, which could feature the full 6-core/12-thread configuration of the "Coffee Lake" silicon, alongside 12 MB L3 cache. The first SKU in the lineup could be the Core i9-8950HK, sniffed out from the change-log of the latest FinalWire AIDA64. These chips could enable large (>17-inch) gaming notebooks with one or more high-end graphics cards, the latest advancements in cooling, 4K UHD or curved displays, etc.

GIGABYTE Unveils Their Latest X299 AORUS Gaming 7 Pro Motherboard

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards and graphics cards, has unveiled the new X299 AORUS Gaming 7 Pro motherboard. With support for the new Intel 18-Core i9 7980XE processor, the new motherboard is ready to elevate performance to the next level. Featuring an updated VRM design paired with Smart Fan 5 technology to satiate the power demands of the new 18-core processor while keeping the system icy cool, the new X299 AORUS Gaming 7 Pro is the definitive motherboard of choice for users who value performance first and foremost.

"The X299 AORUS Gaming 7 Pro motherboard is designed to fully support Intel's newest Core i9 7980XE processor." said Vincent Liu, Senior Associate Vice President of GIGABYTE's Motherboard Business Unit. "With our tried-and-true approach and seasoned experience, we have designed a motherboard that truly fulfills enthusiasts' highest expectations."

ASUS Intros the WS X299 SAGE Motherboard

ASUS today introduced the WS X299 SAGE motherboard, a socket LGA2066 motherboard designed for Intel Core X "Skylake-X" processors, in the SSI-CEB form-factor. This board is targeted at the same quasi-workstation crowd that the company's WS X299 Pro and WS X299 Pro SE are designed for, but unlike the latter, it lacks an iKVM remote-management chip. Those looking for more serious workstation builds involving something from Intel's Xeon stable or even 2P setups, should consider the larger WS C621E SAGE. The WS X299 SAGE is targeted at those who need the massive PCIe loadout of the C621E SAGE, but can make do with 1P Core X processors.

The ASUS WS X299 SAGE draws power from a combination of 24-pin ATX, two 8-pin EPS, and a 6-pin PCIe power. An 8-phase VRM powers the CPU, and is rated to power 16-core and 18-core CPU models. The CPU socket is wired to eight DDR4 DIMM slots supporting up to 128 GB of quad-channel DDR4 memory; and seven PCI-Express 3.0 x16 slots. Storage connectivity includes eight SATA 6 Gb/s ports, and two each of 32 Gb/s M.2 slots and 32 Gb/s U.2 ports. Four USB 3.1 gen 2 ports, two 1 GbE interfaces, and a dozen USB 3.0 ports make for the rest of it. The company didn't reveal pricing.

ASUS Intros WS X299 Pro Socket LGA2066 Motherboard

ASUS today rolled out the WS X299 Pro, a feature-rich socket LGA2066 motherboard designed for machines built in the gray-area between high-end desktops (HEDTs) and "real" workstations (based on the Xeon/EPYC platforms). The board is still based on the Intel X299 Express chipset, and will only support Intel Core X "Skylake-X" processors. It features the company's highest-grade electrical components. Built in the ATX form-factor, the board draws power from a combination of 24-pin ATX, a 6-pin PCIe power, and two 8-pin EPS connectors. It conditions power for the CPU using a 9-phase high-current VRM, which puts out heat on not just a primary heatsink making direct contact with the MOSFETs, but also a secondary heatsink over a heat-pipe. This heatsink occupies an area not just behind the rear I/O area, but also extends downwards, to just behind the expansion slots (while not intruding).

The LGA2066 socket is wired to eight reinforced DDR4 DIMM slots, supporting up to 128 GB of quad-channel memory, and four PCI-Express 3.0 x16 slots (x16/x16/NC/x4 or x16/x8/x8/x4 on 44-lane CPUs), and a fifth open-ended x4 slot. Storage connectivity includes two 32 Gbps M.2 slots (both of which feature heatsinks), a 32 Gbps U.2 port, and six SATA 6 Gbps ports. USB connectivity includes four 10 Gbps USB 3.1 ports, and six 5 Gbps USB 3.0 ports. Networking is care of two 1 GbE interfaces, driven by Intel i210-AT controllers. The onboard audio is based around a Realtek ALC1220A CODEC, fronted by a headphones amp, and backed by audio-grade capacitors, and ground-layer isolation. The company didn't reveal pricing or availability.
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