News Posts matching "USB 3.1"

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VirtualLink: New Open Industry Standard for Next-Generation VR Headsets

(Editor's Note: Naturally, the adoption of such a standard does imply that graphics card manufacturers will have to start fitting USB 3.1 connectors on their graphics card outputs. This opens up a proverbial can of worms on backwards compatibility of this new data delivery protocol, however, in that even current top-of-the-line graphics cards lack such a port - meaning that this protocol will only be compatible with eventual, future GPU releases.)

A new industry consortium led by NVIDIA, Oculus, Valve, AMD, and Microsoft today introduced the VirtualLink specification - an open industry standard that enables next-generation VR headsets to connect with PCs and other devices using a single, high-bandwidth USB Type-C connector, instead of a range of cords and connectors.

Blackmagic Design Announces Blackmagic eGPU

Blackmagic Design today announced the Blackmagic eGPU, a high performance graphics processor for pro creative software such as DaVinci Resolve, 3D games and VR. Designed in collaboration with Apple, the Blackmagic eGPU features a built-in Radeon Pro 580, two Thunderbolt 3 ports, HDMI 2.0, 85W of charging power and four USB 3.1 connections. It comes in an integrated design that brings high-end desktop class graphics processing to MacBook Pro for professional video workflows, 3D games and immersive VR. And, the Blackmagic eGPU is the first to support Thunderbolt 3 displays. The Blackmagic eGPU is available now for only US $699 exclusively on Apple.com and in select Apple Retail stores worldwide.

Designed to address the needs of professional video editors, Hollywood colorists and visual effects artists who need to remain mobile, but want the power of a desktop class GPU added to their MacBook Pro, the Blackmagic eGPU is incredibly flexible and simply plugs in via Thunderbolt 3, so users can benefit from improved graphics performance and acceleration of computational tasks. It's perfect for speeding up professional creative application workflows including editing, color correction and visual effects with DaVinci Resolve. The Blackmagic eGPU adds the performance customers need to make the latest 3D games and VR look more realistic than ever. That means customers will get higher resolution images, higher frame rate gameplay, better lighting and more detailed textures for truly immersive experiences, even on a laptop computer.

ASUS Intros TUF B360M-Plus Gaming S Motherboard

ASUS expanded its mid-range TUF Gaming motherboard lineup with a new micro-ATX socket LGA1151 motherboard, the TUF B360M-Plus Gaming S. Built with the characteristic black+yellow color scheme and the polygonal shape, this board takes in 8th generation Core processors. It draws power from a combination of 24-pin ATX and 8-pin EPS power connectors, conditioning it for the CPU with a 4+3 phase VRM. The CPU is wired to four DDR4 DIMM slots, and a reinforced PCI-Express 3.0 x16 slot. Two other PCI-Express 3.0 x1 slots, and three M.2 PCIe slots make for the rest of the expansion.

Storage connectivity includes two M.2-2280 slots with PCIe gen 3.0 x4 wiring, one of which also has SATA 6 Gbps wiring; and six SATA 6 Gbps ports. The third M.2 slot is 30 mm long, has PCIe 3.0 x1 wiring, and is meant for CNVi WLAN cards. Networking is handled by an Intel i219-V controller driving a GbE interface. The onboard audio solution combines an entry-level Realtek ALC887 codec with 6-channel output, audio-grade capacitors, and ground-layer isolation. USB connectivity includes two USB 3.1 gen 2 (both type-A), four USB 3.1 gen 1 (three type-A, one type-C), two USB 3.1 gen 1 front-panel ports by header; and a number of USB 2.0 ports. The board features an RGB LED ornament at the top-right corner, and a 4-pin RGB LED header, controlled by Aura Sync RGB software. The board is expected to be priced around USD $120.

Thermaltake Announces Core P5 TG Ti Edition ATX Wall-Mount Chassis

Thermaltake, a leading premium gaming tower manufacturer, has launched its latest Thermaltake Core P5 Tempered Glass Ti Edition ATX Wall-Mount Chassis, an upgrade to the predecessor Core P5. Constructed with 5mm tempered glass panel plus stainless steel panels for secure mechanism, four USB 3.0 data transfer ports, a motherboard tray and fully modular design that allows flexibility for 3-way placement layouts (Wall mount, Horizontal and Vertical), dual GPU layout locations (Horizontal and Vertical) and placement locations for liquid cooling components. Uncover greatness with the Core P5 TG Ti's panoramic viewing angle with its full tempered glass window; designed to protect and display your stunning liquid cooling system.

By practicing and incorporating the idea of "maker movement" as well as 3D printing, Thermaltake designs the open frame panoramic viewing chassis for anyone to access and do his/her own mods as well as print out his/her own ideas using available liquid cooling components and manuals without boundaries.

QNAP Unveils the TS-1635AX 16-bay NAS

QNAP Systems, Inc. (QNAP) today announced the launch of the TS-1635AX NAS - the successor of the landmark TS-1635 NAS. With 16 drive bays (twelve 3.5-inch and four 2.5-inch) and dual 10GbE SFP+ ports, the TS-1635AX is further boosted with a high-performance Marvell ARMADA 8040 ARMv8 Cortex-A72 64-bit quad-core 1.6 GHz processor and two M.2 SATA SSD slots (2280 form factor) and supports Linux virtualization, SSD caching, and Qtier 2.0. The TS-1635AX sets a new standard for ARM-based NAS and marks a new milestone for high-capacity and affordable desktop NAS models.

The TS-1635AX supports QNAP's proprietary Qtier 2.0 for automatic tiered storage and provides a cache-like mechanism in volumes and LUNs to boost the performance of applications where high-efficiency data access is necessary (such as virtualization). The TS-1635AX also supports containerized virtualization (LXC and Docker ) and Linux command-line interface (CLI) virtual machines* for deploying virtualization applications to fully realize the potential of the Marvell ARMADA 8040 processor.

Intel Shelves Z390 Express As We Knew It, Could Re-brand Z370 as Z390

Intel is rumored to have shelved the iteration of its upcoming Z390 Express chipset as earlier publicized, the one which had certain new hardware features. It could now re-brand the existing Z370 Express as Z390 Express and probably bolster its reference design with heftier CPU VRM specifications, to cope better with its upcoming 8-core LGA1151 processors. The Z370 Express is similar in feature-set to the brink of being identical to its predecessor, the Z270 Express. This move could impact certain new hardware features that were on the anvil, such as significantly more USB 3.1 gen 2/gen1 ports directly from the PCH, integrated WiFi MAC, and Intel SmartSound technology, which borrowed certain concepts from edge-computing to implement native speech-to-text conversion directly on the chipset, for improved voice control latency and reduced CPU overhead.

The reasons behind this move could be a combination of last-minute cost-benefit analyses by Intel's bean-counters, and having to mass-produce Z390 Express on the busier-than-expected 14 nm silicon fabrication node, as opposed to current 300-series chipsets being built on the 22 nm node that's nearing the end of its life-cycle. Intel probably needed the switch to 14 nm for the significant increases in transistor-counts arising from the additional USB controllers, the WiFi MAC, and the SmartSound logic. Intel probably doesn't have the vacant 14 nm node capacity needed to mass-produce the Z390 yet, as its transition to future processes such as 10 nm and 7 nm are still saddled with setbacks and delays; and redesigning the Z390 (as we knew it) on 22 nm may have emerged unfeasible (i.e. the chip may have ended up too big and/or too hot). The Z390 Express chipset block-diagram, which we published in our older article has been quietly removed from Intel's website. It's also rumored that this move could force AMD to rethink its plans to launch its Z490 socket AM4 chipset.

ASUS Intros WS X299 SAGE 10G Motherboard with Dual 10GbE and Improved VRM

ASUS today introduced the WS X299 SAGE/10G, a step up variant of the WS X299 SAGE it launched back in Q4-2017. As you can tell from the model name, this board's star-attraction is 10 Gbps Ethernet. It features not one, but two 10 GbE interfaces, replacing the dual 1 GbE interfaces of the original. These interfaces aren't backed by low-cost controllers, but the Intel X550-AT2 "Sageville," which is an $80 chip by itself, and drives both interfaces.

ASUS also used the opportunity to improve the CPU VRM a bit. Although it's still the same combination of chokes and MOSFETs, pulling power from two 8-pin EPS connectors, ASUS improved the secondary VRM heatsink, which pulls heat from the main heatsink over a flattened heat-pipe. This heatsink is now made of a dense aluminium fin-stack like the main heatsink, a section of which protrudes all the way to the rear I/O shield. The rear I/O now consists of four USB 3.1 gen 1 ports, two USB 3.1 gen 2 ports (including a type-C port), and the 8-channel HD audio cluster, besides the two 10 GbE ports. The rest of the board's feature-set is unchanged from the original. We expect a $100 premium over the original's price.

In Win Z-Frame is the Crown Jewel of Computex 2018

We've been to many editions of Computex, and it would often be Lian Li with the year's most outrageously imaginative case design. Over the past few years, In Win picked up that mission, and succeeded even this year, with the Z-Frame. This case is a work of art, and anyone taking it to their local BYO eSports event is bound to get the most attention, or maybe even make it to the local daily's picture. Its design is more alien than Alienware ever came up with - twisted blocks of cast aluminium converging at the base, with an open-air E-ATX motherboard tray inside, and mounts for an ATX PSU, and two each of 3.5-inch and 2.5-inch drives.

The Z-Frame can take in E-ATX (or smaller) motherboards, graphics cards up to 34 cm in length, and CPU coolers up to 17 cm in height, and has 8 expansion slots. Like all "Frame" cases from In Win, the Z-Frame is open-air, and doesn't have too many fan mounts, but you get room for three 120 mm along the top panel, letting you mount a 360 mm x 120 mm radiator. Front-panel connectivity includes type-C USB 3.1, in addition to type-A USB 3.0, and HDA jacks. The Z-Frame comes in two color options, chrome-silver, and glossy black, both of which are made of the highest density cast aluminium. The case weighs a staggering 40 kg, not counting what you install inside it. In Win will do a limited production run for this case, and it could be yours for a little over USD $10,000.

Phanteks Evolv X High-end Chassis Detailed

Phanteks unveiled its next flagship chassis, the Evolv X. This dual-system chassis can simultaneously house an E-ATX motherboard, and a mini-ITX motherboard, and is ideally paired with the company's own Revolt X dual-system PSU. It retains the signature design of Phanteks' Enthoo Evolv series, but is darker, has a more premium sandblasted 3 mm-thick aluminium paneling, and a silicone RGB LED diffuser surrounding the front fascia, with addressable RGB LEDs. Storage options include either ten 3.5-inch drives over detachable drive-cages, and up to nine 2.5-inch drives mounted behind the motherboard tray.

Cooling options of the Phanteks Evolv X include three 140 mm front intakes, three 140 mm top exhausts, and a 140 mm rear exhaust. You can mount 420 mm x 140 mm radiators on the front, and 280/360 mm x 140/120 mm radiators along the top. Front panel connectivity includes a USB 3.1 type-C port, two USB 3.1 type-A, HDA jacks, and RGB LED control. The case is halfway between mid-tower and full-tower in terms of dimensions. The case is slated for release this August, priced at USD $199, or 199€.

PNY Elite-X Portable SSD Pictured

At Computex, PNY unveiled its Elite-X series portable SSDs. Built with an aluminium body, the drive comes in capacities of 240 GB, 480 GB, and 960 GB, and takes advantage of 10 Gbps USB 3.1 gen 2, with a single type-C cable handling both power and host connectivity. The drive uses that bandwidth to offer sequential transfer rates of up to 800 MB/s reads, with up to 660 MB/s writes, that's faster than any SATA SSD. Pricing of the drive will be revealed closer to its July 2018 launch.

QNAP Delivers Cost-efficient TS-832X Tiered NAS with Dual 10GbE SFP+ Ports

QNAP Systems, Inc. today released the new TS-832X 8-bay quad-core NAS with two built-in 10GbE SFP ports, providing users with a budget-friendly, high-speed network storage solution. It is also an ARM-based NAS that supports Qtier technology for auto-tiering, and its PCIe slots allow for the installation of peripheral cards like 10GbE NICs, QM2 cards, USB 3.1 10Gbps expansion cards, or wireless network cards to enhance the NAS with greater application potential.

"The TS-832X is a step up from the TS-831X, featuring an advanced 64-bit Cortex -A57 processor and DDR4 memory while also delivering computing power of 32K DMIPS to benefit performance upgrade by 40%," said Dan Lin, Product Manager of QNAP, continuing "Coupled with the 10GbE connectivity and PCIe expandability, it provides a highly cost-efficient private cloud NAS solution."

Intel Z390 Express Chipset Detailed

Intel released a product brief of its premium mainstream-desktop (MSDT) chipset, the Z390 Express. Positioned above the Z370 Express, the chipset has an exhaustive feature-set. It supports current 8th generation Core "Coffee Lake" processors, and is ready for the next-generation. Like all other 300-series chipsets, the Z390 interfaces with the LGA1151 processor over a DMI 3.0 chipset-bus. Much like the Z370, it features 24 downstream PCI-Express gen 3.0 lanes. Its storage setup remains unchanged from the Z370 - six SATA 6 Gbps ports with AHCI and RAID support; and up to three 32 Gbps M.2/U.2 connectors.

The differences begin with the chipset's integrated USB connectivity. The Z390 Express directly puts out six 10 Gbps USB 3.1 gen 2 ports, and ten 5 Gbps USB 3.1 gen 1 ports. If that's not a lot, it also puts out fourteen USB 2.0 ports (a total of 30 USB ports). Another major feature is Intel SmartSound technology, which the document specifies as an "audio/voice offload" DSP. This should, in theory, reduce the CPU's load in processing the audio stack. At the physical level it's still the company's "Azalia" HD audio bus wired to an audio CODEC with close to zero native signal processing. Perhaps some of that processing is done inside the chipset. The concept appears to be borrowed from edge-computing, and triggered by the rise in voice-command interface, so the chipset can natively process speech-to-text conversions.

ASUS Intros Prime H310T Motherboard

ASUS rolled out the Prime H310T, one of the rare few thin mini-ITX motherboards based on Intel 300-series chipset, a boon for certain SFF cases such as the Akasa Euler series, or DIY all-in-one PC upgrades. Based on Intel H310 chipset, the board supports 8th generation Intel "Coffee Lake" processors (including 95W TDP chips). It draws power from 2-pin (12V DC in), and conditions it for the LGA1151 processor using a simple 3+1 phase VRM. The CPU socket is wired to two DDR4 SO-DIMM slots, which support up to 32 GB of dual-channel DDR4-2666 memory.

Storage connectivity includes a 32 Gbps M.2-2280 slot, and two SATA 6 Gbps ports. The only other expansion slot is an M.2 slot for WLAN modules. Display outputs include LVDS (useful in AIOs), DisplayPort, and HDMI. USB connectivity includes four 5 Gbps USB 3.1 gen 1 ports. 2-channel HD audio and gigabit Ethernet make for the rest of it.

Corsair Launches Obsidian 1000D Super-Tower PC Case

CORSAIR , a world leader in PC gaming peripherals and enthusiast components, today announced the launch of its largest, most feature-rich PC case ever - the Obsidian Series 1000D. Building on the CORSAIR Concept Slate prototype that captured the imagination of PC enthusiasts, the Obsidian 1000D is the result of over two years of development and design to create the ultimate super-tower case. Clean exterior lines brushed aluminium details and four smoked tempered glass panels give the 1000D the iconic styling and superior build-quality enthusiasts have come to expect from the CORSAIR Obsidian Series.

Both a full E-ATX and Mini-ITX system can be installed simultaneously, cooled by 13 cooling fan mounts, powered by two PSUs (SFX and ATX) and equipped with 11 storage drives. Created to house the world's most epic PC builds, the 1000D is the ultimate super-tower PC case.

Cougar Announces Panzer EVO RGB Chassis

COUGAR is proud to announce the arrival of the last and most powerful iteration of its renowned Panzer Full Tower series: the Panzer EVO RGB. Combining four tempered glass covers, powerful RGB lighting and the industrial inspiration design that has characterized the series, this case offers massive amounts of space and unparalleled aesthetics.

As its name indicates, RGB lighting is one of the strengths of this case. This is not limited to the four powerful Vortex RGB fans but also includes the COUGAR Core Box, capable of supporting up to 8 COUGAR RGB fans and four COUGAR RGB LED strips, as well as a driver-free remote controller. This allows users to start enjoying and customizing the more than 100 RGB lighting effects right out of the box, without going through any software installation or encountering compatibility issues.

Sony Announces New SL-E Series External SSDs

Sony is expanding its External Solid-State Drive (SSD) range with a brand new top of the range SL-E series. This new model is a stylish, high-capacity external SSD that is small enough to put in your pocket but powerful enough for high-speed and safe data transfer. Designed with the needs of professionals such as architects, engineers and researchers in mind, the handy external solid-state drive is smaller than a credit card, so you can take it anywhere and with up to 960GB of storage you can keep all your important files with you all the time.

Compatible with wide range of devices
This SSD is equipped with compact and reversible USB Type-C ports for connection to all the latest mobile technology, as well as standard-A cables. Having both ports ensures usability with a wide range of devices including Mac and Windows PCs, Android smartphones and tablets.

QNAP Introduces New TVS-882BR-RDX NAS Models

QNAP Systems, Inc. today unveiled new TVS-882BR RDX models (including the TVS-882BR-RDX and TVS-882BRT3-RDX) that integrates the Tandberg RDX QuikStor internal SATA 5.25-inch docking station (8813-RDX) for installing removable and portable RDX hard disk cartridges. Compared to standard external hard drives, the Tandberg RDX cartridge features a rugged dust-proof design that protects data for a longer period of time and allows users to easily transfer data with the cartridges.

"QNAP constantly integrates partner backup solutions to our existing NAS solutions. By supporting RDX hard disk backup, the new TVS-882BR RDX models allows users to enjoy longer data protection and the portable cartridges can easily be shared for data exchanging. Coupled with Media Asset Management (MAM) software and a wide range of backup solutions, the TVS-882BR helps improve work efficiency while also providing highly-scalable storage space and powerful hardware that meets the requirements from modern businesses and organizations" said Dan Lin, Product Manager of QNAP.

StarTech Launches Two New Thunderbolt 3 Adapters

StarTech.com has announced the release of two new Thunderbolt 3 adapters that enable access to many different external peripherals and devices using various interfaces. The two new Thunderbolt 3 accessories allow users to extend the life of their external hard drives, USB devices and other specialized laptop peripherals.

The first new Thunderbolt 3 accessory, the Thunderbolt 3 to USB 3.1 Controller Adapter (SKU: TB33A1C), provides dedicated USB 3.0 bandwidth to three USB-A ports and one USB-C port (total of 20 Gbps). The adapter gives the user access to high performance USB peripherals such as storage controllers and 3D scanners from Thunderbolt 3 based laptops. The second new product, the Thunderbolt 3 eSATA Adapter with USB 3.1 (10 Gbps) Port (SKU: TB3ESATU31), offers connections to an external eSATA hard drive or SSD, and to a USB device simultaneously. Both products are beneficial for Windows and MacBook Pro users, where no USB-A ports are available.

ASUS Announces its AMD X470 Motherboard Lineup

Since its release last year, AMD's Ryzen platform reinvigorated the desktop with multithreaded horsepower plus accessible overclocking and gaming prowess. That first wave was a market revelation that touched everything from value-packed PCs to high-end gaming and content creation rigs. And now ASUS is ready for the second wave with a fresh family of motherboards based on the new AMD X470 chipset. The X470 chipset is designed to enhance the performance of the next generation AMD Ryzen 2000 series of processors code named Pinnacle Ridge and yet retains backward compatibility with current Ryzen processors.

The new X470 Series spans six motherboards, each with a unique spirit. The ROG Crosshair VII Hero and its WiFi twin lead the lineup with a stealthy design for serious overclockers, savvy enthusiasts and gamers. Its Strix X470-F Gaming sibling makes ROG enhancements like easy tuning and next-level customization more affordable, while the Strix X470-I Gaming shrinks everything down to mini-ITX proportions for powerhouse small-form-factor systems.

ASRock Fatal1ty X470 Gaming K4 and X470 Master SLI Pictured

ASRock is leading its AMD X470 chipset based motherboard lineup with the X470 Taichi Ultimate and the X470 Taichi. Here are pictures of its mid-range lineup based on the chipset, the Fatal1ty X470 Gaming K4 and the X470 Master SLI. Both models are based on the same exact PCB, with variations on product design and certain features that place the Fatal1ty X470 Gaming K4 a notch above the X470 Master SLI. Built in the ATX form-factor, the board draws power from a combination of 24-pin ATX, an 8-pin EPS, and interestingly, an additional 4-pin ATX power connector, which is usually found in high-end AM4 motherboards. A 12-phase VRM is used to condition power for the AM4 SoC.

The AM4 socket is wired to four DDR4 DIMM slots, supporting up to 64 GB of memory; two PCI-Express 3.0 x16 slots (x16/NC or x8/x8), and one of the two M.2 PCIe slots. Storage connectivity includes two M.2 PCIe slots, the topmost slot is 32 Gbps, and M.2-22110, while the bottom slot is 16 Gbps; and six SATA 6 Gbps ports. USB connectivity includes ten USB 3.0 ports (six on the rear panel, four by headers), and two USB 3.1 gen 2 ports (including one type-C port), on the rear panel. 8-channel onboard audio with a mid-range CODEC, and gigabit Ethernet with an Intel i219-V controller, make for the rest of the two. The Fatal1ty X470 Gaming K4 is slightly better endowed than the X470 Master SLI, in featuring a slightly more upscale onboard audio solution (probably ALC1220 vs. ALC892), Creative SoundBlaster Cinema DSP, RGB LEDs in even the rear I/O shroud, and Fatal1ty Mouse Port (specialized USB port with supposedly lower latency). The two could be priced under $150.

ProGrade Digital Announces SDXC UHS-II V90 Memory Cards

ProGrade Digital, founded with a mission to provide the highest quality professional grade digital memory cards and workflow solutions, announces its V90 premium line of digital memory cards-a step up in performance to sustained read speed of up to 250MB/second and sustained write speed of up to 200MB/second. ProGrade Digital SDXC UHS-II, U3, Class 10, V90 brings peak performance to upper-end DSLR, mirrorless, camcorder and digital cinema cameras-cameras that produce incredibly rich data streams and require more from a memory card. This elevated performance ensures faster capture during data-intensive processing, most notably for the Panasonic GH5S, Panasonic AU-EVA1, Canon Cinema EOS line and Canon EOS 5D Mark IV. ProGrade Digital SDXC UHS-II V90 memory cards in 64GB, 128GB and 256GB capacities will be available at the start of May.

BIOSTAR Presents Entry Level Intel 300 Series Motherboards

BIOSTAR presents two entry-level micro-ATX motherboards featuring the new Intel B360 and H310 chipsets - BIOSTAR B360MHD PRO and BIOSTAR H310MHD PRO; for office and home entertainment applications. The B360MHD PRO and H310MHD PRO have BIOSTAR's all new Nano Carbon Coating Heatsink for improved cooling over aluminium-extruded heatsinks, AudioArt Capacitors projecting artistic-like sound and Hi-Fi audio amplification effects and Tough Power Enhanced to ensure full energy output without additional energy loss.

The micro-ATX BIOSTAR B360MHD PRO uses the new entry-level B360 chipset that supports LGA 1151 8th generation Intel Core processors. It supports dual-channel memory of up to DDR4-2666MHz, a single PCI-E 3.0 x16 slot with reinforced iron protection design and USB3.1 Gen1. Other notable features include 6+ Experience and Charger Booster Technology for quicker mobile phone charges.

ASRock X470 Fatal1ty Gaming ITX/ac Motherboard Pictured

Here are some of the first pictures of ASRock X470 Fatal1ty Gaming ITX/ac, one of the first few upcoming AMD X470 chipset motherboards built in the mini-ITX form-factor. The board draws power from a 24-pin ATX, and an 8-pin EPS connector, and uses an 8-phase VRM to power the SoC. The AM4 socket is wired to two DDR4 DIMM slots, supporting up to 32 GB of dual-channel memory; a reinforced PCI-Express 3.0 x16 slot, and a 32 Gbps M.2-2280 slot (reverse side), besides two of the board's four SATA 6 Gbps ports, four of its USB 3.0 ports, and the onboard audio. The AMD X470 chipset puts out the remaining two SATA 6 Gbps ports and two USB 3.1 gen 2 ports, including a type-C port. High-grade 8-channel HD audio, gigabit Ethernet, and 802.11 ac WLAN with Bluetooth 4.1, make for the rest of it.

Intel Expands 8th Gen. Core Desktop Processor Family, Introduces New Chipsets

Intel today expanded its 8th generation Core desktop processor family, to include xx new models across its Core i7, Core i5, and Core i3 brand extensions. The company also introduced entry-level Pentium Gold and Celeron processors. The chips are based on the 14 nm "Coffee Lake" silicon, and are compatible with socket LGA1151 motherboards based on Intel 300-series chipset. Intel has relegated dual-core to the Celeron and Pentium Gold brands. The Celeron series includes 2-core/2-thread chips with 3 MB L3 cache; while the Pentium Gold series includes 2-core/4-thread chips with 4 MB L3 cache.

The company is launching the 8th generation Celeron series with two models, the G4900 and the G4920, clocked at 3.10 GHz, and 3.20 GHz, respectively. The Pentium Gold family has three parts, the G5400, the G5500, and the G5600, clocked at 3.70 GHz, 3.80 GHz, and 3.90 GHz, respectively. The 8th generation Core i3 family of 4-core/4-thread parts receives a new member, the i3-8300. Endowed with 8 MB of L3 cache, this chip is clocked at 3.70 GHz, and sits between the i3-8100 and the i3-8350K, but lacks the unlocked multiplier of the latter.

Shuttle Introduces DL10J, Fanless Gemini Lake PC with 4G LTE Support

As a global leader in small form factor computer technology, Shuttle always seems to be expanding their portfolio of products. Shuttle has unveiled an Intel Gemini Lake based fanless XPC slim DL10J, which is more geared towards for business use cases like digital signage and multi-display solutions. To meet the diverse applications of Internet of Things, the DL10J offers 4G/LTE network support via M.2 2230 expansion slot.

Powered by Intel Gemini lake Celeron J4005 processor, the DL10J is capable of supporting 4K/UHD content with Intel integrated graphics GPU engine, makes this model ideal for digital signage applications. At a body thickness of just 43mm, the new DL10J is equipped with a vast array of connectivity for a wide range of commercial uses; it features built-in Gigabit LAN, two COM ports, four native 2.0, two USB 3.1 Gen 1, and optional 4G/LTE SIM card adaptor. In terms of storage there is SATA 6G, M.2 interfaces. Triple displays are provided by HDMI, DisplayPort and D-sub outputs. Plus, the VESA mount complaint makes the DL10J fully integrate into diverse and space-critical environments.
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