News Posts matching #USB 3.2

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MSI Announces the Creator X299 and X299 Pro 10G Motherboards

In recent years, MSI aims at motherboards in content creation market for the ever-increasing number of creators and the popularity. Together with the new launch of Intel Core X-Series processors, we are proud to introduce three new motherboards to anticipate every creator's need from high loading operation to general graphic design. For the high-end processors and X299 platform, MSI all aluminium design ensures CPU to run at full speed for the best performance. Larger heatsinks contains more surface for heat dissipation to cool down CPU while high-loading operation.

USB 3.2 Gen 2x2: Super Speed USB 20G: For all types of designers, large data and files transfer is always troublesome as it takes plenty of waiting time. All new MSI X299 motherboards support the latest USB 3.2 Gen 2x2 Super Speed USB 20G solution powered by ASMedia to meet creators' requirement. Transfer speed enhances to incredibly 4 times faster than USB 3.2 Gen1 solution so that designers can save time on backup and other essential data transfer processes. "We are pleased to have a strong and close relationship with MSI. ASMedia Technology Inc. offers the latest USB 3.2 Gen 2x2 Super Speed USB 20G solution to the market and continues working closely with top motherboard vendor MSI," said Chewei Lin, President of ASMedia.

ASUS Republic of Gamers Announces Strix Arion Portable SSD

ASUS Republic of Gamers (ROG) today announced Strix Arion, an external solid-state drive (SSD) enclosure that lets gamers create their own high-speed mobile storage solution. Compatible with M.2 NVM Express (NVMe) SSDs with 2230, 2242, 2260 and 2280 form factors and featuring USB-C 3.2 Gen 2 connectivity, ROG Strix Arion enables transfer speeds of up to 10 Gbps for ultrafast performance when working with media and other large files. To ensure sustained performance with no throttling, the enclosure is made from aluminium alloy and features integrated thermal pads for effective heat dissipation.

ROG Strix Arion features an innovative design that lets gamers quickly and easily install an SSD without a screwdriver. Sporting futuristic looks with ASUS Aura Sync lighting effects, the enclosure blends perfectly with any gaming setup. ROG Strix Arion comes with a protective holder with a detachable hook for hanging as well as both USB-C and USB-C to USB-A cables to ensure out-of-the-box connectivity with a wide range of PCs and devices.

Reported Specifications on AMD B550 Chipset Surface

We've known for some time that AMD's mainstream-segment B550 chipset wouldn't bring all the bangs and whistles of its bigger, enthusiast-class cousin X570. For one, it wouldn't make sense to increase development and implementation costs of both the chipset and motherboards built for mainstream enthusiasts by adding PCIe 4.0 support and the more stringent signaling and power requirements the new standard entails. As such, B550 reportedly cuts down fully on PCIe 4.0 support, as well as on the latest USB standards, to offer a product that's sufficiently rounded up on I/O while offering overclocking support for users that demand it.

Reportedly, AMD's B550 will only support up to 2x USB 3.2 Gen2 devices, 6x USB 2.0, 4 + 4 SATA3 connections, and the interlink between the chipset and the CPU occurs via a 4x PCIe 3.0 interface, which means there's less bandwidth for communication between the CPU and the chipset than on X570 - not that that was a real problem on AMD's previous-gen Ryzen products, though, so that's more of a technicality at this point. Ryzen 3000 CPUs still offer 4x PCIe 4.0 ports, though, so these could be used for speeding up a PCIe 4.0 NVMe SSD, for instance. The launch of B550-bound products is expected towards October.

ADATA Also Launches SC680 External Solid State Drive

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories today announces the launch of the ADATA SC680 external solid state drive (SSD). The SSDs features a stylish and compact form factor for easy portability and implements the USB 3.2 Gen 2 interface for excellent read and write performance.

Lightweight (35 g), and only 10 mm thick, the SC680 is very portable, slipping into pockets and bags with ease. Utilizing the USB 3.2 Gen 2 interface it's also fast too, sporting read/write speeds of up to 530/460 MB/s, making it over 6.6 times faster than external hard drives. This performance not only benefits users when transferring stored data, but also when loading game titles. What is more, it is shockproof, operates quietly, and consumes less power than many other external SSDs.

Western Digital Unveils WD_BLACK Gaming Storage Lineup

Western Digital unveiled a full fledged lineup of WD_BLACK series gaming storage devices. With it, the company is branching out WD_BLACK as its new brand targeted at the gaming crowd, both PC and console. The WD_BLACK brand is a divergence from the company's classic Western Digital Caviar Black line of premium internal hard drives. The brand had a rebirth of sorts with the WD_BLACK SN750 M.2 NVMe SSDs. Its designers are launching several new products, including the WD_BLACK P10 portable hard drive, the WD_BLACK D10 external desktop hard drive, the WD_BLACK P50 portable SSD, and Xbox One variants of the P10 and D10.

The WD_BLACK P10 is a pocket-size portable hard drive with a single USB 3.1 cable needed for both power and connectivity. It comes in 2 TB, 4 TB, and 5 TB capacities. Its Xbox One variant has the Xbox One decal on its body, and includes a 2-month Xbox Game Pass Ultimate subscription. The WD_BLACK D10 is meant to sit on your desk with its separate power and host-connectivity cables. It also puts out USB type-A high current ports to recharge your wireless gaming peripherals. The base variant of the WD_BLACK D10 comes in 8 TB capacity, while the D10 Xbox One edition comes with 12 TB capacity and a 3-month Xbox Game Pass Ultimate. Lastly, there's the WD_BLACK P50. This portable SSD encloses an NVMe drive that serves up sequential transfer rates of up to 2000 MB/s by utilizing USB 3.2 Gen 2x2 (20 Gbps) interface. A single cable handles power and host connectivity. It comes in capacities of 500 GB, 1 TB, and 2 TB.

ADATA Releases New MLC IESU317 External SSD and IUFU33B Flash Drive

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories is pleased to announce the ADATA IESU317 external solid state drive (SSD) and the IUFU33B flash drive. Both products are equipped with MLC NAND flash and support the high-speed USB 3.2 interface, which combines excellent durability with next-gen performance. The products are compatible with a wide range of operating systems for plug-and-play usability and provide users a practical, convenient, and reliable mobile storage solution.

The IESU317 external SSD sports a slim form factor of just 9.6 mm (0.38in) and a sandblasted metal casing with a matte finish that is not only highly durable but also resistant to scratching and fingerprints. With the next-generation USB 3.2 Gen 1 interface, the SSD delivers read and write speeds of up to 435/400 MB per second, for speedy data transfers and back up. Equipped with MLC NAND flash, the IESU317 provides a higher P/E Cycle (Program/Erase Cycle) than its TLC counterparts of up to 3K. This significantly extends data retention and reduces the risk of data corruption or loss. What's more, the SSD features AES 256-bit encryption for robust data protection and comes with up to 1 TB capacity, making it especially suitable for users working in animation, photography, graphic design, or any users that need to encrypt, back up, and store data only a daily basis.

GIGABYTE Gives AMD X570 the Full Aorus Treatment: ITX to Xtreme

Motherboard vendors are betting big on the success of AMD's "Valhalla" desktop platform that combines a Ryzen 3000-series Zen 2 processor with an AMD X570 chipset motherboard, and have responded with some mighty premium board designs. GIGABYTE deployed its full spectrum of Aorus branding, including Ultra, Elite, ITX Pro, Master, and Xtreme. The X570 I Aorus Pro WiFi mini-ITX motherboard is an impressive feat of engineering despite its designers having to wrestle with the feisty new PCIe gen 4 chipset. It draws power from a combination of 24-pin and 8-pin connectors, and conditions power for the SoC with an impressive 8-phase VRM that uses high-grade PowIRstage components. A rather tall fan-heatsink cools the X570 chipset, with a 30 mm fan.

Connectivity options on the X570 I Aorus Pro WiFi are surprisingly aplenty. The sole expansion slot is a PCI-Express 4.0 x16, but the storage connectivity includes not one, but two M.2-2280 slots (reverse side of the PCB), each with PCI-Express 4.0 x4 and SATA 6 Gbps wiring. Four SATA 6 Gbps ports make for the rest of the storage connectivity. Networking options include 2.4 Gbps 802.11ax WLAN, Bluetooth 5.0 (Intel , and 1 GbE, all pulled by Intel-made controllers. USB connectivity includes six 5 Gbps USB 3.2 gen 1, and two 10 Gbps USB 3.2 gen 2 ports (of which one is type-C), and two 5 Gbps ports by headers. The onboard audio solution has 6-channel analog output, but is backed by a premium Realtek ALC1220VB Enhance CODEC (114 dBA SNR).

ASRock Unveils X570 Phantom Gaming-ITX TB3 Motherboard

ASRock is ready with its own mini-ITX motherboard based on the AMD X570 chipset, the X570 Phantom Gaming-ITX TB3. This tiny powerhouse one-ups other mini-ITX motherboards in its category by offering 40 Gbps Thunderbolt 3 connectivity over USB type-C, in addition to USB 3.2. This Thunderbolt port also includes a DP pass-through from your discrete graphics card.

Expansion includes one PCI-Express 4.0 x16. Storage connectivity includes one M.2-2280 with PCI-Express 4.0 x4 and SATA 6 Gbps connectivity; and four SATA 6 Gbps ports. Networking options include 2.4 Gbps 802.11ax WLAN, Bluetooth 5.0, and 1 GbE driven by Intel i211-AT. The board pulls power from a combination of 24-pin ATX and 8-pin EPS connectors, conditioning it for the SoC with a 6+2 phase VRM. A chunky fan-heatsink cools the chipset, shedding some of its heat to the enlarged VRM heatsink cloaked under the I/O shroud.

ASRock X570 Motherboards Zoomed Into: Taichi, Phantom Gaming, Steel Legend

ASRock came to Computex 2019 with a fairly big selection of socket AM4 motherboards based on the AMD X570 chipset. The lineup is led by the X570 Taichi, launched as a single SKU and not differentiated into an "Ultimate" variant. ASRock retains the characteristic gearwheel style along the board's styling. Almost the entire bottom half of the board is covered by a metal shroud that spreads heat from the chipset heatsink, and three M.2 SSDs. The chipset heatsink's fan is concealed behind a grille to not look like an eyesore. New generation connectivity options from this board include 2.5 GbE wired + 2.4 Gbps 802.11ax WLAN, and USB 3.2 ports. The Taichi looks a little less understated than its predecessors, with more RGB LED embellishments.

We also spied the X570 Steel Legend, with its polarizing "urban camo" print, and bright metal meatsinks and I/O shrouds. The Steel Legend series motherboards command interesting sub-$200 price-points, and it will be interesting to see where this one lands. You get two M.2 NVMe slots, both with metal heatsinks, an M.2 E-key slot, open-ended x1 slots, and a reasonably powerful ALC1220-based onboard audio solution. We also spotted two Phantom Gaming products, the X570 Phantom Gaming X, and the X570 Phantom Gaming 4, with the Gaming X being the company's flagship X570 offering. This board maxes out the platform's connectivity with three M.2 NVMe slots, 802.11ax WLAN, 2.5 GbE wired networking, an additional 1 GbE interface driven by an Intel controller, USB 3.2, and a strong 16-phase VRM powering the AM4 socket. Like most other ASRock boards, the fan ventilating the chipset heatsink is concealed behind a grille.

AMD Showcases Several Premium X570 Motherboards for Ryzen 3000 Zen2

AMD at its 2019 Computex private showcase for the media following its CEO's keynote address, unveiled several premium motherboards based on the new AMD X570 chipset. The X570 is an in-house design effort by AMD, and unlike the X470, isn't sourced from ASMedia. The chipset supports PCI-Express gen 4.0 end-to-end, which means not only is the chipset-bus gen 4.0, but also the downstream PCIe lanes it puts out. The chipset connects to the AM4 socket over a PCI-Express 4.0 x4 link (64 Gbps).

It has a downstream PCIe lane budget of 16 lanes, which the motherboard designers can spread out as up up to two M.2 NVMe slots, an x4 (physical x16) slot, a bunch of x1 slots, and newer generation connectivity such as 802.11ax WLAN, 2.5/5.0/10 GbE wired networking, and a larger number of USB 3.2 ports, including newer 20 Gbps portsn over external controllers. This chipset runs hotter than the X470, with a TDP rumored to be around 15W, probably because of the PCIe gen 4.0 implementation. Many of the motherboards we spotted had active fan-heatsinks over the chipset.

ASRock Outs Z390 Phantom Gaming 4S Motherboard

ASRock today rolled out the Z390 Phantom Gaming 4S motherboard. Clearly built to a cost, the board ships with a narrow ATX PCB, and is positioned below both the Z390 Phantom Gaming 4 and the Z390 Pro4. It draws power from a 24-pin ATX and an 8-pin EPS, conditioning it for the CPU with a 6+2 phase VRM. The LGA1151 socket is wired to four DDR4 DIMM slots, and a single PCI-Express 3.0 x16. The second x16 slot is electrically x4 and wired to the PCH. An M.2 PCIe E-key slot (for WLAN cards) and three open-ended PCIe 3.0 x1 slots make for the rest of the expansion area. Storage connectivity includes just the one M.2-22110 slot (PCI-Express 3.0 x4 and SATA 6 Gbps wiring), and six SATA 6 Gbps ports.

Display outputs include just the one HDMI port. USB connectivity includes eight USB 3.2 gen 1 ports, four on the rear panel, four by headers. The board's sole 1 GbE network interface is driven by an Intel i219-V controller. The onboard audio solution combines a rather premium Realtek ALC1220 CODEC with 6-channel analog output, audio-grade capacitors, and ground-layer isolation. Separate PS/2 ports, one 3-pin addressable-RGB, two 4-pin RGB, and five 4-pin PWM fan headers make for the rest of this board. We expect this to be ASRock's cheapest Z390 offering, priced between USD $110-120.

USB Promoter Group Announces USB4 Specification

While we just recently covered the USB 3.2 specification. The USB Promoter Group has today announced the pending release of the USB4 specification, a major update to deliver the next generation USB architecture that compliments and builds on the existing USB 3.2 and USB 2.0 architectures. The USB4 architecture is based on the Thunderbolt protocol specification recently contributed by Intel Corporation. It doubles the bandwidth of USB and enables multiple simultaneous data and display protocols.

The new USB4 architecture defines a method to share a single high-speed link with multiple end device types dynamically that best serves the transfer of data by type and application. As the USB Type-C connector has evolved into the role as the external display port of many host products, the USB4 specification provides the host the ability to optimally scale allocations for display data flow. Even as the USB4 specification introduces a new underlying protocol, compatibility with existing USB 3.2, USB 2.0 and Thunderbolt 3 hosts and devices is supported; the resulting connection scales to the best mutual capability of the devices being connected. "The primary goal of USB is to deliver the best user experience combining data, display and power delivery over a user-friendly and robust cable and connector solution," said Brad Saunders, USB Promoter Group Chairman. "The USB4 solution specifically tailors bus operation to further enhance this experience by optimizing the blend of data and display over a single connection and enabling the further doubling of performance."

USB-IF Rebrands USB 3.0 and 3.1 With New USB 3.2 20Gbps Standard

You would have thought that the USB Implementers Forum (USB-IF) would have learned their lesson the first time around with the rebranding of USB standards; however, that doesn't seem to be the case. At MWC 2019, they announced that the USB 3.2 standard would include the previous USB 3.0 and 3.1 specifications, but with a twist. USB 3.0, which has a data rate of 5Gbps, had already been rebranded as USB 3.1 Gen 1, will now once again be rebranded as USB 3.2 Gen 1. Meanwhile, USB 3.1 Gen 2 with a data rate of 10Gbps will be renamed USB 3.2 Gen 2. Finally, the new kid on the block which has a data rate of 20Gbps will be officially named USB 3.2 Gen 2x2.

While there is a reason for these names, the fact remains that it doesn't do consumers any favors. USB 3.2 Gen 2x2 gets its name from the two high-speed 10Gbps channels it uses to achieve the new data rate. Keep in mind that previous USB standards only allowed for one channel, and only USB Type-C connectors allow for dual channels. This, as you may have guessed by now, means USB 3.2 Gen 2x2 is only usable via USB Type-C connectors. To try and reduce confusion, USB-IF has suggested that vendors use marketing terms on top of the current naming scheme to help consumers understand what is what in the world of USB. USB 3.0 USB 3.1 Gen 1 USB 3.2 Gen 1 will be marketed as SuperSpeed USB, and USB 3.2 Gen 2 will be marketed as SuperSpeed USB 10Gbps as per our sources. Finally, the newest standard will use SuperSpeed USB 20Gbps as its marketing term, not that it will do much if implementation of the new standard will take as long as it took for USB 3.2 Gen 2 and the Type-C connector.

Synopsys Demonstrates USB 3.2 with Throughput Speeds Up to 20 Gbps

Synopsys has successfully carried out the world's first USB 3.2 demonstration. The host system was running on a Windows 10 operating system with the standard USB drivers without any modifications whatsoever. The USB 3.2 host controller was implemented on a HAPS-80 FPGA platform connected to the PHY board through a Type-C connector. The target system, which ran on Linux, used an identical hardware setup as the host system with the exception that it was configured as a Mass Storage device. The PHY employed in the demonstration was manufactured on the FinFET process and capable of operating at speeds up to 10 Gbps per lane. Therefore, Synopsys's solution consisted of pairing both lanes to achieve a combined throughput of 20 Gbps. The company also emphasized the fact that USB 3.2 doesn't require the use of special cables. For the demonstration, they utilized a pair of conventional Belkin USB 3.1 Type-C cables that you can find at your local Target store.

ASMedia Remains AMD Chipset & USB Partner, Increases Revenues By 44.7%

ASMedia Technology, a tech company that's best known for designing high speed controllers (most recently, USB 3.1 Gen2, and AMD's X370 chipset), has posted tremendous increases in revenue and profits. The Taiwanese company distributed cash dividends per share in the order of $0.21 in late 2017, after achieving revenues of roughly $102 million, up 44.7% YoY (Year over Year).

While ASMedia is one of the implied companies in the latest AMD nightmare (the suspiciously timed and apparently interest-driven CTS flaw disclosure), AMD is keeping with ASMedia for its X470 chipset design and production. Which was to be expected - even if AMD wanted to change partners or develop the chipset in-house, AMD's Ryzen 2000 series and the accompanying motherboards' release is impending. The company is expected to continue its strong growth on continued shipment of USB 3.1 controllers, adding USB 3.2 controllers to its portfolio, and increased profits derived from the development of AMD's X470 chipset.

USB 3.0 Promoter Group Announces USB 3.2 Specification

The USB 3.0 Promoter Group today announced the pending release of the USB 3.2 specification, an incremental update that defines multi-lane operation for new USB 3.2 hosts and devices. USB Developer Days 2017 will include detailed technical training covering USB 3.2, fast charging advancements in USB Power Delivery, and other exciting topics.

While USB hosts and devices were originally designed as single-lane solutions, USB Type-C cables were designed to support multi-lane operation to ensure a path for scalable performance. New USB 3.2 hosts and devices can now be designed as multi-lane solutions, allowing for up to two lanes of 5 Gbps or two lanes of 10 Gbps operation. This enables platform developers to continue advancing USB products to fit their customers' needs by effectively doubling the performance across existing cables. For example, a USB 3.2 host connected to a USB 3.2 storage device will now be capable of realizing over 2 GB/s data transfer performance over an existing USB Type-C cable that is certified for SuperSpeed USB 10 Gbps.

"When we introduced USB Type-C to the market, we intended to assure that USB Type-C cables and connectors certified for SuperSpeed USB or SuperSpeed USB 10 Gbps would, as produced, support higher performance USB as newer generations of USB 3.0 were developed," said Brad Saunders, USB 3.0 Promoter Group Chairman. "The USB 3.2 update delivers the next level of performance."
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