During the International Supercomputing Conference on May 31, 2022, in Hamburg, Germany, Jeff McVeigh, vice president and general manager of the Super Compute Group at Intel Corporation, announced Rialto Bridge, Intel's data center graphics processing unit (GPU). Using the same architecture as the Intel data center GPU Ponte Vecchio and combining enhanced tiles with Intel's next process node, Rialto Bridge will offer up to 160 Xe cores, more FLOPs, more I/O bandwidth and higher TDP limits for significantly increased density, performance and efficiency.

"As we embark on the exascale era and sprint towards zettascale, the technology industry's contribution to global carbon emissions is also growing. It has been estimated that by 2030, between 3% and 7% of global energy production will be consumed by data centers, with computing infrastructure being a top driver of new electricity use," said Jeff McVeigh, vice president and general manager of the Super Compute Group at Intel Corporation.

Hot Chips 34, the upcoming semiconductor conference from Sunday, August 21 to Tuesday, August 23, 2022, will feature many significant contributions from folks like Intel, AMD, Tesla, and NVIDIA. Today, thanks to Intel's registration at the event, we discovered that the company would present its work on Meteor Lake and Arrow Lake processors with the novel Foveros 3D packaging. The all-virtual presentation from Intel will include talks about Ponte Vecchio GPU and its architecture, system, and software; Meteorlake and Arrowlake 3D Client Architecture Platform with Foveros; and some Xeon D and FPGA presentations. You can see the official website here for a complete list of upcoming talks.

As a little reminder, Meteor Lake is supposed to arrive next year, replacing the upcoming Raptor Lake design, and it has already ahs been pictured, which you can see below. The presentation will be recorded and all content posted on Hot Chips's website for non-attendees to catch up on.

GIGABYTE Technology, an industry leader in high-performance servers and workstations, today announced a new supercharged, scalable server, G492-PD0, that supports an Ampere Altra Max or Altra processor with NVIDIA HGX A100 Tensor Core GPUs for the highest performance in cloud infrastructure, HPC, AI, and more. Leveraging Ampere's Altra Max CPU with a high core count, up to 128 Armv8.2 cores per socket with Arm's M1 core, the G492-PD0 delivers high performance efficiently and with minimized total cost of ownership.

GIGABYTE developed the G492-PD0 in response to a demand for high-performing platform choices beyond x86, namely the Arm-based processor from Ampere. This new G492 server was tailored to handle the performance of NVIDIA's baseboard accelerator without compromising or throttling CPU or GPU performance. This server joins the existing line of GIGABYTE G492 servers that support the NVIDIA HGX A100 8-GPU baseboard on the AMD EPYC platform (G492-ZL2, G492-ZD2, G492-ZD0) and Intel Xeon Scalable (G492-ID0).

With its desktop graphics card lineup still elusive, the company is planning a new entry-level SKU positioned below the Arc A380 and A350M. Called A310, this chip will be based on a heavily cut-down version of the DG2-128 (ACM-G11) silicon, and offer performance levels somewhere between the Iris Xe MAX (DG1) desktop discrete GPU, and the A350M, with the design goal being to compete with AMD's Radeon RX 6400 and NVIDIA's GTX 1650 in the entry-level space.

At this point the core configuration of the A310 is not known. It is speculated to feature 64 to 96 execution units (EU) out of the 128 present on the ACM-G11 silicon. 4 GB of GDDR6 memory across a 64-bit wide memory bus, could remain standard fare for this card. All of the media-acceleration features of "Alchemist" could be featured, including AV1 decode and encode. The A310 could make for a good combo with future Intel workstation or HEDT platforms with non-gaming visual requirements. The ACM-G11 is built on the 6 nm silicon fabrication process, and so the A310 could come with a low power footprint that doesn't need additional power connectors.

Intel's recently announced Arc "Alchemist" line of discrete gaming graphics processors consists of at least five mobile SKUs across the Arc 3, Arc 5, and Arc 7 lines; with desktop SKUs expected later this year. These are based on one of two ASICs—the DG2-128 (ACM-G11) and the DG2-512 (ACM-G10), both built on the TSMC N6 (6 nm) silicon fabrication process. Coelacanth's Dream discovered a third ASIC when digging through Intel Graphics Compiler code on GitHub, referred to as the "ACM-G12."

This silicon has exactly half the amount of number-crunching machinery as the DG2-512, and features 256 execution units (EU), or 16 Xe cores, working out to 2,048 unified shaders—double that of the DG2-128, but half that of the DG2-512. Interestingly, the Arc 5 A550M mobile GPU announced last week has specifications corresponding to this silicon, even though it was announced to be a heavily cut-down DG2-512. Intel probably figures that at some point making A550M GPUs using DG2-512 could mean cutting down perfectly functional silicon, and so it makes sense to manufacture physically smaller dies (more dies per wafer). There are no other known specs of the ACM-G12. It's quite likely given the rest of its alignment with the A550M's specs that it could feature a 128-bit wide GDDR6 memory interface.

The Intel Arc A370M was put through the "Ashes of the Singularity" benchmark. In two separate runs, the GPU ended up with a score of 3500 and 3600 points in the "Min_1080p" configuration, with an average framerate of 67 FPS in the normal batch. The notebook test-platform this chip ran on consisted of a Core i7-12700H processor, and 32 GB of memory.

3500 points is a rather vague score for this benchmark, given that GPUs from a wide range of market segments attained the similar scores (albeit on very different CPU and memory configurations). The A370M is expected to be SKU that maxes out the smaller DG2 ASIC that physically features 128 execution units (1,024 unified shaders), and a 64-bit wide GDDR6 memory bus holding 4 GB of memory. This A370M should offer roughly twice the performance as the Iris Xe iGPU with 96 EUs found in quad-core "Tiger Lake" mobile processors.

GIGABYTE Technology, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced the all-new 2022 BRIX Extreme mini-PC series, which adopts the latest 12th Gen Intel Core Mobile Processors with Intel's most scalable client architecture that delivers superior computing performance. Benefiting from a new Intel Core design for leadership performance, these processors boost the performance significantly in the all-new performance hybrid design for superior single-threaded & multi-threaded performance. Enhanced by GIGABYTE's exclusive design, the new 2022 BRIX Extreme design integrates four display outputs, including HDMI 2.1, USB4, 2.5G Ethernet, plus the latest WiFi 6E configuration, creating the most powerful multitasking mini-PC with astounding performance and responsiveness for either gaming or content creation.

The latest 12th Gen Intel Core Mobile Processors highlight 10 nm technology, and when compared to the previous generation, these new processors feature a 10% increase in GPU performance, 24% increase in multi-threaded performance, and do so with higher clock frequencies up to 4.70 GHz. The powerful performance in these new processors sets a milestone for the mobile platform. When it comes to benchmark testing, it is inspiring to see that SYSMark 25 Performance scores improve by 14% compared to 11th Gen processors and by 28% on CrossMark too. No more needing to compromise between productivity, performance, and gaming/video performance.

"Join us on March 30th at 8 A.M. Pacific Time to see Intel Arc graphics take center stage and get a first look at our new discrete graphics for laptops." - is the statement that Intel posted on its website regarding the launch of its upcoming Arc Alchemist GPUs for laptops. While we await the final reveal of the desktop Arc Alchemist graphics cards, it looks like team blue will give us a very first look at Arc discrete graphics cards for laptops. Regarding the performance numbers, Intel's Lisa Pearce, Vice President and General Manager for the Visual Compute Group, posted a quick performance claim stating that the Intel Arc A370M mobile GPU will feature two-fold performance improvement over integrated GPU designs found in Intel Core i7-12700H processor.

Lisa PearceWhat performance can we expect from the first product to make it to market, the Intel Arc A370M?
The first Intel Arc discrete graphics products to enter the mobile market will enable up to a 2X improvement in graphics performance vs. integrated graphics alone while maintaining similar form factors.
2x performance claim based on average FPS at 1080p Medium with Metro Exodus (DX12) as of March 3, 2022 as the beginning of the disclosure. Intel Arc system: Intel Core i7-12700H processor 14C/20T, 32 GB 4800Mhz system memory, Intel Arc A370M graphics, Windows 11 Pro v10.0.22000, Preproduction driver as of March 2022, total system TDP 40 W. Intel Core system: Intel Core i71280P 14C/20T, 32 GB 4800 MHz system memory, Iris Xe integrated graphics, Windows 11 Pro 21H2 22000.493, Driver version 30.0.101.1029, total system TDP 28 W.

Axiomtek—a world-renowned leader relentlessly devoted in the research, development and manufacture of series of innovative and reliable industrial computer products of high efficiency - is pleased to introduce the DSP511, a 4K Ultra HD digital signage player with four HDMI 2.0 ports and a 2.5G Ethernet port, which enhance multiple view and real-time displays. The outstanding signage player is powered by the 11th generation Intel Core i5/i3 (codename: Tiger Lake-UP3) which makes it much more versatile in smart retail applications such as interactive advertisement or AI precision marketing.

In addition to the standard GbE LAN port, it adds a 2.5G LAN port to support faster internet transmission to upload videos and advertisements in higher resolutions for real-time display. It has four HDMI 2.0 ports for multiple displays and the resolution can reach 4K 60 Hz. The DSP511 utilizes the Intel Tiger Lake-UP3 processor; with Iris Xe Graphics, the computing performance is boosted. While the computing capability is powerful enough, even for Artificial Intelligence (AI) processing, the digital signage player doesn't need a discrete graphics card. Measuring 260 x 160 x 26 mm, the DSP511 is perfectly suited for menu board and video wall solutions in airports, shopping malls, and other commercial premises that require reliable 24/7 operation.

Today, Intel expands the 12th Gen Intel Core mobile processor lineup with the official launch of 12th Gen Intel Core P-series and U-series processors. Engineered for blazing performance and superior productivity, these 20 new mobile processors will power the next generation of thin-and-light laptops. The first devices will be available in March 2022, with more than 250 coming this year from Acer, Asus, Dell, Fujitsu, HP, Lenovo, LG, MSI, NEC, Samsung and others.

"Following our launch of the fastest mobile processor for gaming, we're now expanding our 12th Gen Intel Core processor family to deliver a massive leap forward in performance for thin-and-light laptops. From the ultra-thin form factors to enthusiast-grade performance in a sleek design, we're providing consumers and businesses with leadership performance and cutting-edge technologies."

SiSoftware put out the mother lode of information on Intel's upcoming Arc "Alchemist" gaming graphics card series, along with OpenCL compute performance of the entry-level Arc A380. The Arc series model numbering is "A" (Alchemist) followed by a number series. The A300 series makes up the entry-mainstream; the A500 series makes up the mid-performance segment; and the A700 series leads the pack with high-end SKUs. The "Alchemist" GPUs are built on the 7 nm silicon fabrication node at TSMC, the N7.

The A300 series is based on the smaller "Alchemist" series dies, with 128 EUs (execution units), which work out to 1,024 programmable shaders. The A500 series and A700 series appear to be carved out from the larger silicon. The A500 series has roughly 384 EU or 3,072 shaders. The top-dog A700 series has all 512 EU or 4,096 shaders enabled. Intel is tapping into industry-standard GDDR6 for dedicated graphics memory. The A300-series SKUs typically have 6 GB of 14 Gbps-rated memory across a 96-bit wide memory bus, for 192 GB/s of bandwidth. The A500 series parts have 12 GB of 16 Gbps-rated memory across a 192-bit bus, for 384 GB/s of bandwidth. The top A700 series maxes out the 256-bit memory bus with 16 GB of memory at 16 Gbps data-rate, for 512 GB/s bandwidth.

During the International Solid-State Circuits Conference (ISSCC) 2022, Intel gave us a more significant look at its upcoming Ponte Vecchio HPC accelerator and how it operates. So far, Intel convinced us that the company created Ponte Vecchio out of 47 tiles glued together in one package. However, the ISSCC presentation shows that the accelerator is structured rather interestingly. There are 63 tiles in total, where 16 are reserved for compute, eight are used for RAMBO cache, two are Foveros base tiles, two represent Xe-Link tiles, eight are HBM2E tiles, and EMIB connection takes up 11 tiles. This totals for about 47 tiles. However, an additional 16 thermal tiles used in Ponte Vecchio regulate the massive TDP output of this accelerator.

What is interesting is that Intel gave away details of the RAMBO cache. This novel SRAM technology uses four banks of 3.75 MB groups total of 15 MB per tile. They are connected to the fabric at 1.3 TB/s connection per chip. In contrast, compute tiles are connected at 2.6 TB/s speeds to the chip fabric. With eight RAMBO cache tiles, we get an additional 120 MB SRAM present. The base tile is a 646 mm² die manufactured in Intel 7 semiconductor process and contains 17 layers. It includes a memory controller, the Fully Integrated Voltage Regulators (FIVR), power management, 16-lane PCIe 5.0 connection, and CXL interface. The entire area of Ponte Vecchio is rather impressive, as 47 active tiles take up 2,330 mm², whereas when we include thermal dies, the total area jumps to 3,100 mm². And, of course, the entire package is much larger at 4,844 mm², connected to the system with 4,468 pins.

Intel's upcoming "Meteor Lake" and "Arrow Lake" client mobile processors introduce an interesting twist to the chiplet concept. Earlier represented in vague-looking IP blocks, new artistic impressions of the chip put out by Intel shed light on a 3-die approach not unlike the Ryzen "Vermeer" MCM that has up to two CPU core dies (CCDs) talking to a cIOD (client IO die), which handles all the SoC connectivity; Intel's design has one major difference, and that's integrated graphics. Apparently, Intel's MCM uses a GPU die sitting next to the CPU core die, and the I/O (SoC) die. Intel likes to call its chiplets "tiles," and so we'll go with that.

The Graphics tile, CPU tile, and the SoC or I/O tile, are built on three different silicon fabrication process nodes based on the degree of need for the newer process node. The nodes used are Intel 4 (optically 7 nm EUV, but with characteristics of a 5 nm-class node); Intel 20A (characteristics of 2 nm), and external TSMC N3 (3 nm) node. At this point we don't know which tile gets what. From the looks of it, the CPU tile has a hybrid CPU core architecture made up of "Redwood Cove" P-cores, and "Crestmont" E-core clusters.

At Intel's 2022 Investor Meeting, Chief Executive Officer Pat Gelsinger and Intel's business leaders outlined key elements of the company's strategy and path for long-term growth. Intel's long-term plans will capitalize on transformative growth during an era of unprecedented demand for semiconductors. Among the presentations, Intel announced product roadmaps across its major business units and key execution milestones, including: Accelerated Computing Systems and Graphics, Intel Foundry Services, Software and Advanced Technology, Network and Edge, Technology Development, More: For more from Intel's Investor Meeting 2022, including the presentations and news, please visit the Intel Newsroom and Intel.com's Investor Meeting site.

Adobe's Premiere Pro, one of the most common video editing tools in the industry, has received a February update today with version 22.2. The new version brings a wide array of features like Adobe Remix, an advanced audio retiming tool. Alongside that, the latest update accelerates offline text-to-speech capabilities by as much as three times. However, this is not the most significant feature, as we are about to see. Adobe also enabled 10-bit 420 HDR HEVC H/W encoding on Window with Intel and NVIDIA graphics. This feature allows the software to use advanced hardware built-in the NVIDIA Quadro RTX and Intel Iris Xe graphics cards.

The company managed to run some preliminary tests, and you can see the charts below. They significantly improve export times with the latest 22.2 software version that enables HEVC 10-Bit hardware encoding. For Intel GPUs, no special drivers need to be installed. However, for NVIDIA GPUs, Adobe is advising official Studio drivers in combination with Quadro RTX GPUs.

The most popular cryptocurrency by market-cap, Bitcoin, has dropped in value to below the USD $40,000-mark, to $38,429 as of this writing. This amounts to a whopping 43% drop in value from its November 2021 peak of roughly $67,600. Ethereum has also seen an 8% fall over the past 24 hours, as has the value of several other cryptocurrencies. While we won't get into the nuts and bolts of Bitcoin volatility or hand out any financial advice, this could have an impact on graphics card availability owing to a multitude of reasons.

As of this writing, we see the GeForce RTX 3080 commanding a scalper price of roughly $1,500 (brand new), for the LHR variant (lower crypto-mining performance), while non-LHR cards that are used, start around $1,900. If the fall in cryptocurrencies continues, we could see increased availability of used graphics cards from crypto miners, as gamers would be willing to buy a used RTX 30-series or RX 6000 series graphics card that's still within its warranty period (of 2 years).

congatec - a leading vendor of embedded and edge computing technology - introduces the 12th Generation Intel Core mobile and desktop processors (formerly code named Alder Lake) on 10 new COM-HPC and COM Express Computer-on-Modules. Featuring the latest high performance cores from Intel, the new modules in COM-HPC Size A and C as well as COM Express Type 6 form factors offer major performance gains and improvements for the world of embedded and edge computing systems. Most impressive is the fact that engineers can now leverage Intel's innovative performance hybrid architecture. Offering of up to 14 cores/20 threads on BGA and 16 cores/24 threads on desktop variants (LGA mounted), 12th Gen Intel Core processors provide a quantum leap [1] in multitasking and scalability levels. Next-gen IoT and edge applications benefit from up to 6 or 8 (BGA/LGA) optimized Performance-cores (P-cores) plus up to 8 low power Efficient-cores (E-cores) and DDR5 memory support to accelerate multithreaded applications and execute background tasks more efficiently.

Today at CES 2022, Intel announced the world's fastest mobile processor, bringing its performance hybrid architecture to mobile platforms for the first time with new 12th Gen Intel Core mobile processors that are up to 40 percent faster than the previous generation mobile processor. Intel introduced 28 new 12th Gen Intel Core mobile processors that deliver a feature-rich suite of capabilities to create laptops for people to compute whenever and wherever they need - without compromise.

With the introduction of the full 12th Gen Intel Core desktop processor lineup, the 12th Gen Intel Core processor family also represents the company's most scalable lineup to date, powering designs across consumer, enterprise, the Internet of Things (IoT) and other applications. "Intel's new performance hybrid architecture is helping to accelerate the pace of innovation and the future of compute," said Gregory Bryant, executive vice president and general manager of Intel's Client Computing Group. "And, with the introduction of 12th Gen Intel Core mobile processors, we are unlocking new experiences and setting the standard of performance with the fastest processor for a laptop—ever."

Intel today released oneAPI 2022 toolkits. Newly enhanced toolkits expand cross-architecture features to provide developers greater utility and architectural choice to accelerate computing. "I am impressed by the breadth of more than 900 technical improvements that the oneAPI software engineering team has done to accelerate development time and performance for critical application workloads across Intel's client and server CPUs and GPUs. The rich set of oneAPI technologies conforms to key industry standards, with deep technical innovations that enable applications developers to obtain the best possible run-time performance from the cloud to the edge. Multi-language support and cross-architecture performance acceleration are ready today in our oneAPI 2022 release to further enable programmer productivity on Intel platforms," said Greg Lavender, Intel chief technology officer, senior vice president and general manager of the Software and Advanced Technology Group.

New capabilities include the world's first unified compiler implementing C++, SYCL and Fortran, data parallel Python for CPUs and GPUs, advanced accelerator performance modeling and tuning, and performance acceleration for AI and ray tracing visualization workloads. The oneAPI cross-architecture programming model provides developers with tools that aim to improve the productivity and velocity of code development when building cross-architecture applications.

MinisForum is a small mini PC manufacturer, known for their Ryzen series of mini PCs. Earlier this month they released information about their upcoming Ryzen 5000X series mini PC which will come with a dedicated graphics card. Finally today they have unveiled this Intel chip mini PC: TH50. MinisForum's previous Intel chip mini PC was the TL50, which came with an Intel Core i5-1135G7 processor and was launched in May this year. The new model, called the TH50, is more powerful than the TL50, comes with Windows 10 Pro and is compatible with Windows 11.

The EliteMini TH50 is powered by the 11th generation Intel Core i5 processor "Intel Core i5-11320H" and is compliant with Intel Iris Xe Graphics with built-in graphics for high performance to handle everyday slightly higher load task use; the Intel Core i5-11320H processor with built-in Intel Torch Xe graphics allows you to toy with light games with lots of high quality images, and by lowering the image quality setting, even slightly heavier games can be played comfortably. It performs well in content editing software such as Photoshop and Premiere as well as popular games such as APEX and GTA5.

The National Renewable Energy Laboratory (NREL) has selected Hewlett Packard Enterprise (HPE) to build its third-generation, high performance computing (HPC) system, called Kestrel. Named for a falcon with keen eyesight and intelligence, Kestrel's moniker is apropos for its mission—to rapidly advance the U.S. Department of Energy's (DOE's) energy research and development (R&D) efforts to deliver transformative energy solutions to the entire United States.

Installation of the new system will begin in the fall of 2022 in NREL's Energy Systems Integration Facility (ESIF) data center. Kestrel will complement the laboratory's current supercomputer, Eagle, during the transition. When completed—in early 2023—Kestrel will accelerate energy efficiency and renewable energy research at a pace and scale more than five times greater than Eagle, with approximately 44 petaflops of computing power.

Intel's next entry-level processor for the Socket LGA1700 platform is the Core i3-12100. Carved out of the "Alder Lake-S" H0 silicon, this processor features 4 "Golden Cove" performance cores with HyperThreading enabling 8 logical processors, and no E-cores. The processor ticks at 3.30 GHz, with 4.30 GHz Turbo Boost 2.0 frequency. Each of the four cores has 1.25 MB of L2 cache, and they share 12 MB of L3 cache. The i3-12100 gets a Gen12 Xe LP-based iGPU, while a variant of the processor, the i3-12100F, lacks integrated graphics. Intel is rating the processor base power value at 60 W, with 77 W maximum turbo power.

XFastest scored an i3-12100 engineering sample, and wasted no time in comparing it with the Ryzen 3 3300X. The i3-12100 was tested on an ASRock Z690 Steel Legend motherboard that has DDR4 memory slots. 16 GB of dual-channel DDR4-3600 memory and RTX 3060 Ti were used on both the Intel and AMD test-beds. A Ryzen 3 3100 was also used on the AMD side. Right off the bat, we see the i3-12100 take a significant lead over the AMD chips at PCMark, posting a roughly 15% performance lead. Cinebench R23 is another test where the little "Alder Lake" scores big, posting a roughly 26% performance lead in the multi-threaded test, and 27% in the single-threaded test. This is mainly because the 3300X is based on "Zen 2" while the i3-12100 uses the cutting-edge "Golden Cove" cores. AMD hasn't bothered with "Zen 3" based Ryzen 3 desktop processors in the retail market.

Intel debuted its 12th Gen Core "Alder Lake-S" desktop processor family late last month with only the unlocked "K" and "KF" SKUs targeting gamers and PC enthusiasts, alongside only the top Z690 chipset motherboards. The company is preparing to expand the lineup early next year with the addition of at least seven more SKUs (excluding additional "F" variants that lack integrated graphics). These processors could also introduce more value-conscious motherboard chipsets, such as the B660 and H670. momomo_us on Twitter, a reliable source with hardware leaks, predicts specs and a possible mid-January launch date for these chips.

The lineup possibly includes the Core i9-12900 and i9-12900F at the top, followed by the i7-12700 and i7-12700F, and the meaty Core i5 lineup that includes the i5-12600 and i5-12600F; the i5-12500, and the i5-12400/F. At least two Core i3 series SKUs could also be launched. The possible clock-speeds, and L3 cache sizes for the SKUs are tabulated below. What stands out from these SKUs is the specs of the Core i5-12600. We earlier thought it would be based on the larger "C0" silicon, with 6 P-cores and 4 E-cores, but it turns out, that the SKU is based on the smaller "H0" silicon with just 6 P-cores and no E-cores. Read more about the two silicon variants of "Alder Lake-S" in our older article. The i5-12600 will have significantly different performance and energy efficiency numbers than the i5-12600K.

With its 12th Gen Core "Alder Lake-P" mobile processors still on the horizon, Intel is already building test batches of the 14th Gen "Meteor Lake" mobile processors, at its Fab 42 facility in Chandler, Arizona. "Meteor Lake" is a multi-chip module that leverages Intel's Foveros packaging technology to combine "tiles" (purpose built dies) based on different silicon fabrication processes depending on their function and transistor-density/power requirements. It combines four distinct tiles across a single package—the compute tile, with the CPU cores; the graphics tile with the iGPU: the SoC I/O tile, which handles the processor's platform I/O; and a fourth tile, which is currently unknown. This could be a memory stack with similar functions as the HBM stacks on "Sapphire Rapids," or something entirely different.

The compute tile contains the processor's various CPU core types. The P cores are "Redwood Cove," which are two generations ahead of the current "Golden Cove." If Intel's 12-20% generational IPC uplift cadence holds, we're looking at cores with up to 30% higher IPC than "Golden Cove" (50-60% higher than "Skylake."). "Meteor Lake" also debuts Intel's next-generation E-core, codenamed "Crestmont." The compute tile is rumored to be fabricated on the Intel 4 node (optically a 7 nm-class node, but with characteristics similar to TSMC N5).

The 58th annual edition of the TOP500 saw little change in the Top10. The Microsoft Azure system called Voyager-EUS2 was the only machine to shake up the top spots, claiming No. 10. Based on an AMD EPYC processor with 48 cores and 2.45GHz working together with an NVIDIA A100 GPU and 80 GB of memory, Voyager-EUS2 also utilizes a Mellanox HDR Infiniband for data transfer.

While there were no other changes to the positions of the systems in the Top10, Perlmutter at NERSC improved its performance to 70.9 Pflop/s. Housed at the Lawrence Berkeley National Laboratory, Perlmutter's increased performance couldn't move it from its previously held No. 5 spot.