It appears that the microATX form factor is the way to go when it comes to AMD A620 chipset based motherboards and ASUS has no less than three new models, although one is technically with or without WiFi. The new models are the TUF Gaming A620M-Plus, the TUF Gaming A620M-Plus WiFi and the Prime A620M-A. All three boards sport six layer PCBs with what appears to be fairly basic power regulation, although ASUS doesn't mention how many phases either model has on its product pages. All boards feature a single PCIe 4.0 x16 slot and two PCIe 3.0 x1 slots, as well as two M.2 NVMe slots that support PCIe 4.0 x4 based drives. All models also have four DDR5 DIMM slots, four SATA 6 Gbps ports and front panel connectors for a 5 Gbps USB 3.2 Gen 1 Type-C port and two 5 Gbps USB 3.2 Gen 1 Type-A ports.

Around the back is where things differ a bit, as the TUF boards have two DisplayPort 1.4 and one HDMI port, as well as two 5 Gbps USB 3.2 Gen 1 ports, four USB 2.0 ports, a PS/2 port and a 2.5 Gbps Ethernet port courtesy of a Realtek chip, as well a BIOS FlashBack button. The Prime board on the other hand replaces one DisplayPort output with a VGA connector for some reason and gets to make do with Gigabit Ethernet. The connectivity options aren't what we'd call impressive, but appears to be par for course compared to ASUS' competitors' products. Pricing appear to be in the range of €139-169.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions today unveiled the latest AMD A620 series motherboards with optimal memory performance and all-round features. With the perfect support of the latest AMD Ryzen 7000 series processors, GIGABYTE A620 motherboards deliver the most competitive AM5 platform for users to enjoy performance flexibly and affordably.

Enhanced by GIGABYTE exclusive layout design and BIOS setting, the A620 lineup can achieve optimal memory performance of DDR5 EXPO/XMP overclocking up to DDR5-6400, which exerts the utmost value and performance of the AM5 platform. Boasted with comprehensive features, GIGABYTE A620 motherboards can best fit users' needs and budget, and become the best choice for users who plans on stepping up to the latest AM5 platform.Meanwhile, GIGABYTE's A620 motherboards boast the innovative PCIe EZ-Latch technology to simplify the upgrade of graphics cards, and to avoid accidental damage to the surrounding components. By GIGABYTE exclusive Q-Flash Plus feature, users can update the BIOS without installing any processor, memory, or even graphics card, making it possible for users to easily enjoy the benefits brought about by the new BIOS code and processors. Further with GIGABYTE GCC software platform, GIGABYTE delivers the competitive A620 platform with user-friendly features and multiple form factor options which covers Micro ATX to Mini ITX.

Chinese OEM ERYING designed a lineup of Micro-ATX and Mini-ITX desktop motherboards with 12th Gen Intel Core H-segment mobile processors. These are processors originally meant for the mobile platform, but which have been hardwired on these motherboards. Since the processor packages are bare-die BGAs, ERYING is using thick copper heatspreaders that protect the processor underneath, but most importantly, provide cooler compatibility for all aftermarket CPU coolers capable of handling Socket LGA1700 processors. This is a clever way of giving customers choice of aftermarket coolers by simply tossing in a slab of metal that serves as a heatspreader; than using a custom-design fan-heatsink with no upgradability.

Among the mobile processors these boards come with, are the Core i7-12700H (6P+8E), Core i5-12650H (4P+8E), i5-12500H (4P+8E), and i5-12450H (4P+4E). These boards come with conventional 24-pin ATX + 8-pin EPS power inputs, stock Intel clock speeds and power limits; and full-size memory slots, besides PCI-Express Gen 3 x16 and x1 slots, and a plethora of desktop-relevant I/O. Prices range between the equivalent of $286 to $356, depending on the processor used. An interesting feature with these boards is the ability to override the 45 W PL1 of the processors, and unlock PL1 and PL2 up to 95 W, to improve performance.

Cost-effective Socket AM5 motherboards are finally on the horizon, as the first marketing pictures emerged of an ASRock-branded motherboard based on the yet-unreleased AMD A620 chipset. A successor to the A520 and A320, the A620 provides the bare-minimum feature-set for the platform, and cuts out certain premium features such as CPU overclocking. The chipset limits the x16 PEG connection from the processor to Gen 4, although motherboard vendors are free to provide just Gen 3 x16. The CPU-attached M.2 NVMe interface, too, is limited to Gen 4. This ASRock motherboard appears to be offering a Gen 3-capped M.2 NVMe slot, going by the "Hyper M.2" branding that ASRock uses for Gen 3 M.2 slots. The board offers an additional M.2 NVMe slot that's wired to the A620 chipset, and interestingly, an M.2 E-key slot for WLAN modules.

The ASRock A620M-HDV/M.2 from the pictures below, is a Micro-ATX motherboard that draws power from a 24-pin ATX and a single 8-pin EPS. It offers the simplest possible 6-phase CPU VRM, with what look like 50 A DrMOS. Besides the two M.2 NVMe slots, the only storage connectivity on offer are two SATA 6 Gbps ports. Display connectivity include DisplayPort and HDMI. We count at least four type-A USB 3.x ports on the rear I/O, besides one USB type-C, and a USB 3.x internal header. 1 GbE wired networking, and 6-channel HD audio using the most basic CODEC, make for the rest of the connectivity. An interesting touch is USB BIOS Flashback, with a button on the rear I/O, which sets even the oldest inventories of this board up for future-generation Socket AM5 Ryzen processors. Motherboards based on the A620 are expected to be priced well under the $100-mark.

ADLINK Technology Inc., a global leader in edge computing, a global supplier of industrial PCs and motherboards, and a Titanium member of the Intel Partner Alliance, announces the launch of the new IMB-M47H industrial ATX motherboard for 12th/13th Gen Intel Core i9/i7/i5/i3, Pentium and Celeron processors. The IMB-M47H ATX motherboard delivers scalable, high-performance computing power and supports three simultaneous independent displays, external USB, 2.5GbE, and high-performance add-on cards for complex processing tasks in smart manufacturing, 5G manufacturing, semiconductor, and machine vision applications.

The IMB-M47H industrial ATX motherboard supports Gen 12 Intel processors and importantly the latest Intel Core processors that utilize a high-performance hybrid architecture with up to eight E-cores (Efficient-cores) for multi-threaded background task management and multitasking, and up to eight P-cores (Performance-cores) for demanding single-threaded work such as graphics and video rendering. The 12th/13th Gen Intel Core processors boost single-thread performance by 1.36x and multi-thread performance by 1.35x compared to 10th Gen Intel Core processors delivering more power-efficient general-purpose processing and offering powerful processing for intensive operations.

GIGABYTE AORUS invites gamers and fans to attend AORUSVERSE, a vast gaming universe packed with the latest AORUS gaming hardware and gears, at PAX EAST 2023. The triumphant return to Boston will also feature fun activities and exciting esports challenges throughout the booth, where visitors can get their hands on the latest tech and participate in various events to win prizes.

At AORUSVERSE, attendees can explore the 2023 gaming laptop lineup, featuring the flagship AORUS 17X and 15X. These laptops are powered by the latest Intel 13th gen CPU and NVIDIA GeForce RTX 40 laptop GPU, delivering a giant leap in gaming performance. They also come with QHD displays with up to 240 Hz refresh rates for a smooth and fluid gameplay. For those looking for a balance of performance and portability, the non-X variants, AORUS 17 and 15, will also be available onsite for attendees to test personally.

ASUS today announced that ASUS W790 workstation motherboards support ECC R-DIMM DDR5 RAM at up to 6800 MHz, unleashing class-leading overclocking capability to unlock even more performance potential. ASUS W790 workstation motherboards feature the memory capability of up to 2 TB RDIMM DDR5 memory to power the next generation of compute-intensive professional workloads. In addition, ASUS have been working with market-leading memory partners including G.SKILL, Kingston, and V-Color to establish multiple memory validations and to widely support 8-channel and quad-channel memory architectures. The Pro WS W790E-SAGE SE now supports up to 128 GB (8x16 GB) at 6800 MT/s, and the Pro WS W790-ACE supports up to 64 GB (4x16 GB) of DDR5 RAM at 6800 MT/s. This painstakingly cultivated collection of device validations helps ensure that an ASUS W790 workstation build supports a wide variety of scenarios.

Choosing the right CPU cooler for a workstation build can also be a challenge, because CPU sockets and form factors are different from those used in desktops. Therefore, ASUS has partnered with cooling experts including Enermax, EK and Noctua to offer air and liquid coolers for the LGA4677 socket used by the latest Intel Xeon workstation processors. These solutions are designed to offer optimal heat transfer and heat dissipation capacity through the cooler base and then to coolant tubes, heat pipes and radiator fins.

DFI, a global leader in embedded motherboards and industrial computers, today announced that they will be participating in Embedded World 2023 and joining Qualcomm Technologies, Inc. to showcase the world's first SBC equipped with the high-performance Qualcomm QRB5165 processor. With high integration capability and anti-vibration features, the product can be applied in fields such as industrial automation and AMR. It is expected to increase the overall AI edge computing efficiency and bring more capabilities to the industry.

For the first time during the three-day Embedded World 2023 exhibition, DFI will integrate the QRB551 industrial-grade motherboard built with the Qualcomm Robotics RB5 platform with 5G connectivity and AMR requirements. The solution will be applied to a smart factory environment while executing appearance recognition, defect detection, and human body posture recognition, which are commonly seen in industrial automation.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is thrilled to showcase the latest B760MZ-E PRO motherboard. The BIOSTAR B760MZ-E PRO motherboard is a versatile solution that meets diverse pro-user demands. Whether you are a professional creator seeking the hottest mid-range hardware on the market, a business professional requiring reliable and efficient computing power, or a casual user needing a seamless computing experience, the B760MZ-E PRO has you covered. Its cutting-edge technology, advanced DDR5 memory support, lightning-fast transfer speeds, and connectivity options make it the ultimate choice for those seeking a high-performance motherboard that can handle anything thrown its way.

Built on Intel's B760 single-chip architecture, The BIOSTAR B760MZ-E PRO motherboard supports the latest 12th/ 13th Generation Intel Core Processors, providing robust and stable performance for demanding applications. Its 4-DIMM DDR5 memory support and PCIe M.2 4.0 (64 Gb/s) lightning-fast transfer speeds offer unrivaled computing and file transfer efficiency. Ideal for content designers, business professionals, and casual users seeking the best-performance motherboard of this range.

Back in October of last year, pictures from an ASUS event in China appeared online, showing off a pair of mATX motherboards that had most of its peripheral and power connectors on the reverse side of the motherboard. Now it appears that ASUS has decided to launch such a product, in the shape of the unforgettably named TUF Gaming B760M-BTF WiFi D4. The BTF part in the model name stands Back To (the) Future, although ASUS is most likely not allowed to use that term due to copyright restrictions, so it had to make do with BTF. Regardless of naming, the interesting part here is that all of the power connectors, the four SATA ports, the USB-C and USB 3.0 headers, as well as multiple other headers and one of three M.2 slots, are on the reverse side of the motherboard. This is all done to allow for cleaner cable management.

Other noteworthy features on the board include a single PCIe 5.0 x16 slot, one PCIe 4.0 x4 and one x1 slot, three USB-C ports, of which one is capable of 20 Gbps speeds and 2.5 Gbps Ethernet. As this is a mid-range board, we presume ASUS wants to test the waters so to speak, to make sure there's a market for such a product. However, one major hurdle is the small fact that there aren't any suitable chassis in the market and the product page even mentions that "This motherboard is compatible with specific case models", without going into any details. Presumably, ASUS will offer a suitable chassis, or have some partner(s) lined up that will provide a suitable chassis. Gigabyte announced something similar in May last year, but decided to team up with system integrators, something ASUS might be planning on as well.

AAEON, a leading producer of industrial motherboards, has announced the release of the MIX-Q670A1, the most advanced Mini-ITX board it has ever produced. The first AAEON solution across any of its product ranges to support both 12th and 13th Generation Intel Core i9/i7/i5/i3/Pentium /Celeron processors (formerly Alder Lake-S and Raptor Lake-S respectively), the MIX-Q670A1 harnesses up to 24 cores, 32 threads, and a host of peripheral technologies including Intel vPro, Intel Thermal Velocity Boost, and Intel UHD Graphics 770.

AAEON believe the MIX-Q670A1 will become the gold-standard for applications requiring real-time, high-performance computing on the edge. Supporting 64 GB of dual-channel DDR5 4800 MHz system memory and a PCIe [x16] Gen 5 slot, the MIX-Q670A1 offers a 44% increase in memory speed over previous generations. Combining this speed with an I/O consisting of two LAN, two COM, and ten USB ports, the MIX-Q670A1 offers both a wealth of connectors for peripheral devices and real-time data transmittance on the edge for smart city applications.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is proud to announce the launch of four brand new motherboards - B760MZ-E PRO, B760MX2-E D4, B760MX2-E, and B760MX-E D4. These motherboards are tailored to meet the needs of a variety of target audiences, from content creators to home entertainment enthusiasts.

The B760MZ-E PRO motherboard is specifically designed for content creators who require a powerful and efficient system for photo and footage editing. This motherboard features the latest Intel B760 chipset and supports 12th/ 13th Generation Intel Core Processors. It supports DDR5 memory and PCIe 4.0, making it one of the advanced motherboards on the market. It also features 2.5 GbE LAN, Wi-Fi 6E module support for faster data transfer and connectivity. The B760MZ-E PRO also has a sleek design with LED ROCK ZONE and VIVID LED DJ RGB lighting, making it a stylish addition to any setup.

At the end of January, we reported on issues with Intel's i226-V 2.5 Gbps Ethernet controllers, which are used on a wide range of motherboards with both Intel and AMD CPUs, where users were having issues with stuttering and connections dropping. Intel has now released a workaround and a patch for the issue, not only for the i226, but also the i225 and the Killer E3100 2.5 Gbps network controller. What the workaround does, is disable the Energy-Efficient Ethernet mode, or EEE as it's also known as. EEE is only supposed to kick in when an Ethernet connection is idle and it's said to reduce power consumption by up to 50 percent.

However, in this case, it seems like EEE kicks in even when the Ethernet connection is active, which is causing the stuttering and connection dropouts. The patch disables EEE for all speeds above 100 Mbps, but it's also possible to disable EEE manually in the device settings in Windows. MSI is the first motherboard manufacturer to have released an updated driver on its site, but as this isn't a final solution to the problem, it's unlikely that this is the last we'll hear about the issue. Intel is apparently working on finding the root cause of the problem, but it's unclear if it's going to be possible to patch it in software or if a hardware revision is going to be required in the end.Update Mar 4th: User @lovingbenji reports that on his system this new driver version does not fix the disconnect issue.

The four major North American cloud service providers (CSPs) have made cuts to their server procurement quantities for this year because of economic headwinds and high inflation. Turning to server OEMs such as Dell and HPE, they are observed to have scaled back the production of server motherboards at their ODM partners. Given these developments, TrendForce now projects that global server shipments will grow by just 1.31% YoY to 14.43 million units for 2023. This latest figure is a downward correction from the earlier estimation. The revisions that server OEMs have made to their outlooks on shipments shows that the demand for end products has become much weaker than expected. They also highlight factors such as buyers of enterprise servers imposing a stricter control of their budgets and server OEMs' inventory corrections.

ASUS today announced availability of a BIOS update for its X670 and X670E motherboards that enables full compatibility with the latest AMD Ryzen 7000 Series X3D CPUs featuring AMD 3D V-Cache technology.

The proven gaming performance of the AMD Ryzen 7 5800X3D CPU made it a long-standing favorite for PC builders. ASUS motherboards gave those builders high-performance, feature-rich options for assembling a potent gaming machine built around one of these chips. Now, AMD is upping its game with two new Ryzen 7000 Series CPUs with AMD 3D V-Cache technology: the Ryzen 9 7950X3D and the Ryzen 9 7900X3D. Combining a 3D vertical cache and all the advantages of the cutting-edge X670 platform, these chips are poised to seize the gaming performance crown.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced today that GIGABYTE X670, B650 motherboard lineup with advanced configuration provides a perfect match for the latest AMD Raphael X3D processors with 3D V-Cache technology. This match delivers remarkable improvements on gaming performance for building ultimate gaming systems.

AMD first launched 3D V-Cache technology on Ryzen 7 5800X3D processors in 2022 and made it one of the best gaming CPUs. Now AMD brings 3D V-Cache technology to Zen 4 and introduces AMD Ryzen 9 7950X3D, Ryzen 9 7900X3D, and upcoming Ryzen 7 7800X3D processors with superior gaming performance. This new generation 3D V-Cache CPUs with more cores also raise L3 cache up to 128 MB, and boost gaming performance thanks to the extra 64 MB cache of 3D V-Cache.

MSI announced today a new lineup of AMD Ryzen 7000 Series processors with AMD 3D V-Cache Technology that will be compatible with all MSI's X670 and B650 motherboards. The new AMD Ryzen processors include the AMD Ryzen 9 7950X3D and Ryzen 9 7900X3D which will have a TDP of 120 W while increasing its L3 Cache by 50% compared to the regular Ryzen 7000 processors. Even with a slightly lower TDP of 120 W, these AMD Ryzen 7000 Series processors with AMD 3D V-Cache Technology processors have up to 16 cores and 32 threads while still being able to hit their theoretical max boost clock of up to 5.70 GHz.

With the latest AGESA COMBO PI-1.0.0.5c BIOS from MSI will be ready and have the most performance-optimized patch for the new AMD Ryzen 7000 Series processors with AMD 3D V-Cache Technology. However, previous BIOS versions are still compatible with any MSI's X670 and B650 motherboards as well. With the latest launch of AMD Ryzen 9 7950X3D and Ryzen 9 7900X3D processors, MSI is proud to announce the MAG X670E TOMAHAWK WIFI to our AMD Series lineup of the motherboard and will support all AMD Ryzen 7000 Series processors at launch. Inspired by military concept, the design MAG X670E TOMAHAWK WIFI is shown as a symbol of robust and durability that allow the users to have the optimal experience.

EK, the premium PC liquid cooling gear manufacturer, is launching the EK-Quantum Momentum² Strix X670E-I Gaming D-RGB - Plexi, the latest AMD AM5 socket-based monoblock. It is engineered specifically for the ASUS ROG STRIX X670E-I GAMING motherboard and features the latest EK Velocity² cooling engine for top-level CPU cooling. This Quantum line monoblock has addressable D-RGB LED compatible with ASUS Aura Sync RGB control, offering complete lighting customization for every diode at any time. It is also EK-Matrix7 compatible and doesn't require removing the factory-mounted heatsink before installation.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced today that GIGABYTE X670, B650 motherboard lineup with advanced configuration provides a perfect match for the latest AMD Raphael X3D processors with 3D V-Cache technology. This match delivers remarkable improvements on gaming performance for building ultimate gaming systems.

AMD first launched 3D V-Cache technology on Ryzen 7 5800X3D processors in 2022 and made it one of the best gaming CPUs. Now AMD brings 3D V-Cache technology to Zen4 and introduces AMD Ryzen 9 7950X3D, Ryzen 9 7900X3D, and upcoming Ryzen 7 7800X3D processors with superior gaming performance. This new generation 3D V-Cache CPUs with more cores also raise L3 cache up to 128 MB, and boost gaming performance up to 50% thanks to the extra 64 MB cache of 3D V-Cache.

ASRock is announcing the support of 48 GB and 24 GB DDR5 memory module across Intel 700 and 600 Series motherboards, boosting the maximum memory capacity from 128 GB to 192 GB on 4 DIMMs, providing performance and compatibility to enthusiasts.

For maximum performance, BIOS update is recommended to achieve a boost of system performance as well as memory capacity, increasing productivity for memory demanding multitasking applications.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, today introduces two of their latest commercial motherboards, the TZ590-PRO DUO and the TZ590-PRO. Designed on Intel's Z590 single chip architecture, both TZ590-PRO series motherboards are optimized to extract the highest performance out of 10th / 11th Generation Intel Core processors.

With DDR4 RAM base and Intel 11th generation CPU, the TZ590-PRO and TZ590-PRO DUO have superior stability to handle the most demanding tasks, ideal for businesses, 3D content creators, AI integration systems and more. As ATX-based boards, the TZ590-PRO and PRO DUO offer a variety of features and functionality including 8 PCIe 3.0 slots, one PCIe 4.0 x16 slot, and an excellent power delivery system that provides users with seemingly limitless expansion capability. Additionally, the TZ590-PRO DUO supports up to 4 M.2 slots and 10 SATA III connectors (6 Gb/s) for reliable storage capability as well as business NAS setup.

Kontron, a leading global provider of IoT/Embedded Computer Technology (ECT), announces that all ATX, µATX and Mini-ITX motherboards supporting the 12th generation Intel Core i processor series will soon receive a comprehensive BIOS update to 13th generation. Equipped with Intel's Performance Hybrid Architecture, they offer a significant increase in performance with lower energy consumption. All boards belong to a product family with synergetic BIOS, uniform drivers and comprehensive tool set for customer-specific settings (default settings, thermal management, boot logo, etc.) and are "designed and made in Germany". They are suitable for IoT applications in the fields of industry, medicine, kiosk, digital signage, POS/POI, video surveillance and casino gaming. They will be available from Q2/2023.

The compact Mini-ITX motherboards K3833-Q and K3832-Q are equipped with the powerful Intel Q670E chipset, which offers extensive features such as vPro Manageability, Stable Image (SIPP) or RAID. They have Dual Intel LAN interfaces incl. teaming as well as TSN and real-time support (TCC), a PCIe x16 Gen 5 expansion slot, USB 3.2 Gen 2 interfaces, an M.2 Key-M and Key-E slot as well as two DIMM sockets for DDR5 memory.

EK, the leading liquid cooling gear manufacturer, launches a workstation and a 1U rack-compatible high-performance liquid cooling solution for AMD Zen 4-based EPYC server processors. Code-named "Genoa," these AMD CPUs come with up to 96 cores and 192 threads and have a TDP of up to 360W. These specifications render these processors perfect for liquid cooling, especially in a dual-socket motherboard environment.

EK-Pro CPU WB SP5 Ni + Acetal
This is a dedicated enterprise-grade water block developed specifically for AMD processors. It features three standard G1/4" threaded ports located on the top of the water block and is intended for workstations and taller server racks.

Colorful Technology Company Limited, a professional manufacturer of graphics cards, motherboards, all-in-one gaming and multimedia solutions, and high-performance storage, proudly announces the launch of the EVOL X16 PRO gaming laptop. The new COLORFUL EVOL X16 PRO mainstream model is equipped an 13th Gen Intel Core i7-13700H processor and up to a NVIDIA GeForce RTX 4060 laptop graphics. The gaming laptop sports a 16-inch QHD 240 Hz IPS display with support for NVIDIA G-SYNC technology for smooth and stutter-free gaming visuals.

The EVOL X16 PRO also comes equipped with 16 GB of DDR5-4800 MHz memory, expandable up to 64 GB. For storage, the mainstream model comes with 512 GB of fast NVMe SSD storage with an empty M.2 slot for storage expansion. The laptop also features a USB-C Thunderbolt 4 port for high-speed data transmission and multi-device connectivity. For networking, the EVOL X16 PRO comes with a 2.5 GbE LAN port for gamers that prefer reliable and fast wired connection. For wireless networking, the gaming laptop also comes equipped with the latest Wi-Fi 6E + Bluetooth solution.

Antec Inc., a Californian supplier of high-performance computer components and accessories for the gaming, PC upgrade and Do-It-Yourself market, presents the AX90, a model oft he new budget-friendly AX series of Gaming cases. The mid-tower is equipped with three 120 mm ARGB fans in the front as well as one in the rear and is now available at a very affordable price of € 99.99 (recommended retail price including VAT).

The new AX series from Antec offers a large selection of gaming cases with LED lighting and eye-catching front panel designs - all at an affordable price. The new AX90 case has a side panel made of tempered glass and puts the built-in components in the limelight. Diamond-shaped frames in a mesh front panel create not only a visual highlight but also allow for excellent airflow.