GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced that its Intel 700 and 600 series DDR5 motherboards can support 24 GB and 48 GB memory modules without BIOS update. This boosts the maximum RAM support from 128 GB to 192 GB on four DIMMs, and 64 GB to 96 GB on two DIMMs. The maximum speed runs up to XMP 7000 on 2 DIMMs 24 GB configuration.

Users can enjoy an effortless overall boost of memory capacity and system performance on both Intel XMP and AMD EXPO platforms, as well as a productivity uplift for multitasking gamers and RAM demanding users. Get your GIGABYTE motherboards now and enjoy the boost. To avail this, update to the latest BIOS on your compatible motherboard.

AMD's high-end X670E motherboard chipset combines two Promontory 21 chips working together to deliver a single solution. With regularly-sized ATX motherboards, having two chips to form a chipset is fine, as there is much room on the PCB. However, with Mini-ITX motherboards, packing two Promontory 21 chips is difficult as the PCB area is limited. To combat this, ASUS introduced an interesting solution to solve the problem and allowed the company to ship the high-end X670E chipset inside a Mini-ITX form factor. Thanks to UNIKO's Hardware's findings, we look at the exciting solution ASUS used to solve this problem.

Instead of two Promontory 21 chips side by side, one is placed on the motherboard directly, while the other stands vertically attached by M.2 PCIe slot. Below, the chipset's pictures and the highlight show how it looks disassembled.

Today MSI is announcing the support of 48 GB and 24 GB DDR5, non-binary memory across Intel 700 and 600 Series motherboards, including MEG, MPG, MAG, and PRO Series products. Namely, the maximum memory capacity support is increased to 192 GB for 4 DIMMs motherboards and 96 GB for 2 DIMMs motherboards. MSI has committed to providing performance and compatibility to DIY enthusiasts.

It is unnecessary to update motherboard BIOS for supporting 48 GB based memory modules. Just install the new memory module to enjoy a more efficient system with more productivity, especially for those multi-tasking gamers and users.

Although we haven't been able to confirm these specs, full specifications of AMD's upcoming A620 chipset was posted on Twitter by @g01d3nm4ng0, who has proven to have solid details in the past. This is supposedly the cut-down version of the B650 chipset, due to the rumored delays of the actual A620 chipset. The A620 chipset will be identical to the B650 chipset when it comes to PCIe lane counts, but rather than PCIe 4.0 lanes, the chipset will only offer PCIe 3.0 lanes. What is unclear is if the PCIe 3.0 of the B650 chipset will remain or not, as they're not included in the leaked specs.

If not, then the A620 chipset will only have a total of eight usable PCIe lanes, but four lanes that are connected to the CPU, which will apparently also be limited to PCIe 3.0 speeds. There's also no mention of SATA port configurations. AMD has trimmed the amount of USB 3.x ports significantly, with the A620 chipset only getting two 10 Gbps and two 5 Gbps ports. USB 2.0 ports remain the same at a total of six. A620 motherboards will apparently also be limited to PCIe 4.0 for the lanes from the CPU, but this should be less of an issue for most consumers. As rumored, CPU overclocking is also said to be missing, but RAM overclocking will still be present.

Colorful Technology Company Limited, a world-renowned manufacturer of desktop components, laptops, desktops, AIO PCs, and storage, launches the B760 Series motherboards for the 13th Gen and 12th Gen Intel Core processors. The Intel B760 Series motherboards are ideal gaming and content creation with DDR5 and DDR4 memory support depending on model.

COLORFUL introduces the CVN B760M FROZEN WIFI D5 and CVN B760I FROZEN WIFI motherboards for gamers and enthusiasts. Coming in a compact micro-ATX and Mini-ITX form factors, both motherboards feature PCIe 5.0 x16 slot to support the latest high-end graphics cards. The CVN B760 motherboards also come with Wi-Fi 6, three PCIe 4.0 M.2 slots for the CVN B760M FROZEN WIFI D5 and two PCIe 4.0 M.2 slots for the CVN B760I FROZEN WIFI Mini-ITX motherboard. COLORFUL also presents the BATTLE-AX B760M-F PRO motherboard with DDR4 memory support and two PCIe 4.0 M.2 slots.

According to HKEPC, AMD is set to introduce two versions of the A620 chipset for its lower-end motherboards, providing a lower barrier of AM5 entry for users on a smaller budget. As the new source notes, AMD is going to use its Promontory 21 (PROM21) module for A620 motherboards, the same one used on B650 and X670 models. However, for the first time, we are hearing about Promontory 22 (PROM22), a module that will allow A620-based motherboards to start at 125 US dollars—a promise made by AMD in its marketing slides (which you can see below). Two A620 chipsets will enable users to choose basic functionality or some additional features on a reasonable budget.

With PROM21 going inside all chipset SKUs, it carries silicon functionality disabled by AMD to create different categories. However, the PROM22 is a new silicon that doesn't need bells and whistles of the high-end boards inside a feature-deprived chipset like A620. This drives down AMD's costs, making it easier for vendors to adjust pricing. We have to wait for the launch and see how much of this will be fulfilled, so stay tuned for further updates.

For those that don't remember the early days of ASRock, the company started out making some rather unusual motherboards, often with some wild and wacky upgrade paths, such as both a slot and a socket for a CPU or both AGP and PCIe graphics card slots. Since then, ASRock has become a much more mainstream motherboard maker, but the company appears to have gone back to its roots with what the company calls the X670 Xpansion Kit. Right now, the expansion card appears to be working with the B650 LiveMixer motherboard and it's unknown if it's compatible with other models from ASRock. It seems to be limited to ASRock motherboards only, due to the fact that the add-in card requires not only a x4 PCIe slot with all lanes attached, on the motherboard, but also a custom cable that is most likely for "low-speed" I/O's such as I2C, SPI and so on.

As the name suggests, the X670 Xpansion Kit allows B650 motherboards to be turned into X670 motherboards, more or less. The card is home to a second chipset, which enables not only two additional M.2 slots for PCIe 4.0 NVMe SSDs, but it also features two SATA ports, a 10 Gbps USB-C port, three USB-A ports and—maybe most interestingly—a 10 Gbps Ethernet interface. It's unclear if this will be a retail product, but the card provided to Level1Techs doesn't appear to be an engineer unit, but a full retail ready product. It's definitely an interesting upgrade path for those that have invested in a B650 motherboard and there's no real reason why this shouldn't work as well as having the second chipset on the motherboard, especially as ASRock appears to have fitted a signal re-driver on the add-in card to make sure the PCIe signals are handled properly.

ASRock Industrial is pleased to introduce a range of upgrades in industrial motherboards powered by 13th Gen Intel Core Processors (Raptor Lake-S) with up to 24 cores and 32 threads, supporting Intel W680, Q670, and H610 chipsets. Featured as the first DDR5 ATX motherboards, the IMB-1714, IMB-X1714, and IMB-1713 are brand-new selections while encompassing upgraded support for the 12th Gen Intel CPU motherboards lineup through BIOS update. They guarantee computing power with performance hybrid architecture and enhanced AI capabilities, rich IOs and expansions for up to PCIe Gen 5 slots, quad displays 4K@60 Hz, USB 3.2 Gen2x2 (20 Gbit/s), triple Intel 2.5 G LANs, multi-M.2 Key M, ECC memory, TPM 2.0, and more. The 13th Gen Intel CPU motherboards cover comprehensive form factors, including Mini-ITX, Micro-ATX, and ATX for diverse Edge AIoT applications, such as factory automation, kiosks, digital signage, smart cities, medical, and more.

13th Gen Intel Core Motherboards for Upgraded Performance
The upgraded motherboards feature 13th Gen Intel Core i9/i7/i5/i3 processors (Raptor Lake-S) with performance hybrid architecture, plus up to 24 cores and 32 threads that boost compute-intensive edge performance. They leap up to 1.04x/1.34x/1.25x faster in single-thread/multi-thread/CPU image classification inference performance compared to 12th Gen Intel Core processors. Leveraging its engineered flexibility and power, the new 13th Gen Intel Core motherboards run up to DDR5-5600 memory module for higher bandwidth, and PCIe 5.0 for additional expansion while supporting engaging video and digital signage experiences with Intel UHD Graphics driven by Xe architecture.

GIGABYTE displayed their latest motherboards and graphics cards at the 2023 International CES, covering their Socket LGA1700 Intel 700-series chipset; and Socket AM5 AMD 600-series chipset. The Z790 AORUS Tachyon is the company's top-grade LGA1700 motherboard targeting the professional overclocking crowd. The board is designed to chase down CPU and memory overclocking world records, featuring the company's most powerful CPU VRM solution, and a 1 DIMM-per-channel DDR5 memory setup that preferred by overclockers for supporting the highest memory overclocks with the tightest timings. There are several overclocker-friendly features besides the onboard buttons—dual-BIOS ROMs, angled connectors for bench cases, consolidated voltage measurement points, and a feature-packed BIOS setup program.

Over in the AMD side, GIGABYTE's top Socket AM5 motherboard is the X670E AORUS Xtreme, which is a feature-packed motherboard with possibly the strongest CPU VRM solutions in the market for Ryzen 7000 processors, and with the best VRM cooling. In addition to the PCIe Gen 5 M.2 slot wired to the AM5 SoC, you get additional Gen 5 slots that subtract from the x16 PEG slot. The AORUS Xtreme also has the most feature-rich BIOS available among GIGABYTE's AM5 lineup. The B650I AORUS Ultra is a premium Mini-ITX Socket AM5 motherboard based on the AMD B650 chipset. Despite its compact size, it gives you a PCI-Express 4.0 x16 PEG slot, a Gen 5 M.2 slot, and two additional Gen 4 M.2 slots, besides the latest wired- and wireless connectivity. We also snapped the B650 AERO G motherboard targeting creators, and the mainstream B650 AORUS Elite AX.

GIGABYTE Technology, an industry leader in high-performance servers and workstations, today announced its enterprise solutions division has officially been spun off from GIGABYTE and acts as an independent, wholly-owned GIGABYTE subsidiary. The new standalone company, Giga Computing Technology, will leverage the GIGABYTE brand to drive server business growth and innovation. The GIGABYTE board of directors reached the decision, both the parent company and its new subsidiary agreed that the transaction would create long-term value for GIGABYTE customers that rely on enterprise solutions, as well as the consumer market.

In return for the split, GIGABYTE will receive 83,360,000 common shares of Giga Computing at NTD $10 per share, and this was determined by the estimated value of the subsidiary at NTD $833,600,000. This subsidiary creation is simply a group reorganization and will not have an impact on the daily and financial operations of the parent company. GIGABYTE and Giga Computing have an agreement in place to maintain the same development and support for all GIGABYTE enterprise products and solutions for customers. These systems and products sold by Giga Computing will, for the time being, continue to use the familiar GIGABYTE brand that is known and respected in the tech sector. At the same time, GIGABYTE will continue to drive its own growth in its consumer divisions for motherboards, GPUs, laptops, desktops, monitors, PC peripherals, and PC components.

Leading global motherboard manufacturer, ASRock, proudly announces its new series of Intel B760 motherboards, including B760M Steel Legend WiFi, B760M Pro RS, and special edition B760M PG SONIC WiFi. These feature-filled motherboards are designed to bring supreme performance and the latest technologies - including up to PCI-Express 5.0 & overclocked DDR5 - to benefit more PC enthusiasts, gamers, and office/workstation builds than ever before. The B760 chipset is designed for the latest 13th Generation Intel Core 'K' or 'non-K' series processors (socket LGA1700), while also supporting the previous 12th generation.

Followed by the success and critical acclaim of the ASRock Z790 PG SONIC, the company has released another officially licensed motherboard featuring SEGA's Sonic the Hedgehog: the B760M PG SONIC WiFi. Based on the mainstream Intel B760 chipset, this micro ATX motherboard features all the exciting SONIC elements in a small form factor and budget friendly design.

Intel introduced the Z790 platform to the market last year and impressed enthusiastic gamers. This year, we expect the introduction of the latest B760 platform. MSI's new B760 motherboards lineup will spring a surprise for mainstream users, attracting interest and sparking widespread discussion. Targeting the mainstream market, MSI B760 motherboards have unique designs and loaded specifications. Let's explore more about the B760 platform.

The B760 platform has lots of amazing features accompanied by MSI's MPG, MAG, and PRO Series. The mainstream users' choice - MAG Series includes black TOMAHAWK and white MORTAR motherboards. The MSI MAG Series motherboards adopted 12 Duet Rail Power System with 75 A DrMOS and 6 layer PCB with 2oz thickened copper, which provides stable currents delivered to the CPU. For expansion, the MSI MAG Series supports Lightning Gen 5 PCIe and owns up to 3 onboard M.2 Gen4 slots. To deal with the heat generated in high-loading operation, the MAG Series features premium thermal solutions including All Aluminium Design and Extended Heatsink. The M.2 slots are covered with M.2 Shield Frozr as well.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions today unveiled the latest Intel B760 series motherboards. With enhanced XMP and hardware design of memory, the full B760 DDR5 lineup can achieve superb Z790-like memory performance of DDR5-7600. Featuring up to 16+1+1 phases of 60 amps digital power VRM design with full-coverage heatsink, GIGABYTE's B760 lineup provides premium power and thermal design for the high-frequency operation of Intel 13th gen processors. Meanwhile, the innovative PCIe and M.2 EZ-Latch technology are implemented to simplify the upgrade of graphics cards and M.2 SSDs, and to avoid accidental damage to the surrounding components. Moreover, the features of 2.5 GbE LAN, Wi-Fi 6E, USB 3.2 Gen 2x2 Type C with 20 Gbps, and up to 3 sets of PCIe 4.0 x4 M.2 slots with armor on select models offer superb connectivity. Further with the latest GIGABYTE PerfDrive technology and GCC software platform, GIGABYTE delivers the outstanding B760 platform with the optimal hardware, software, and firmware which covers from DDR4 to DDR5 with full form factor options of ATX, Micro ATX, and Mini ITX.

In the Intel product plan, the "Z" chipset is the only platform to support CPU and memory overclocking. However, the B chipset with limited DDR frequency tuning offers more budget friendly options, especially those only require memory overclocking. In order to provide solid power for high-performance operation of CPU and XMP overclocking, GIGABYTE B760 AORUS motherboards are geared up to 16+1+1 power phases with 60 amps DrMOS design, while the well-received B760 AORUS ELITE features 12+1+1 power phases, and the leading power design of 14+1+1 phases on B760M AORUS PRO. These power designs allow GIGABYTE B760 AORUS motherboards of all configuration to deliver the most stable power, as well as to provide sufficient power when the CPU runs full loading. Meanwhile, enhanced by full-coverage heatsink, 5 W/mK thermal pad, and 2x copper PCB, B760 AORUS MASTER/ PRO/ ELITE/ GAMING X lineup covers from ATX to micro ATX models boast superb thermal design to improve the stability and keep the power supply area which is most likely to generate heat staying cool.

GIGABYTE, the world's leading computer brand, is known for its stylish and high-performing motherboards, graphics cards, gaming monitors, and more. The award-winning products are praised by worldwide consumers for their class-leading build quality and performance. What makes GIGABYTE products even more impressive is their friendly designs based on a thorough understanding of user needs and expectations. These ingenious designs are primed to make the products easier to assemble and upgrade for a much-enhanced user experience.

GIGABYTE's Intel-based Z790 series and AMD AM5-based X670, B650 gaming motherboards are equipped with tech that makes PC building and upgrades as easy as possible. The DIY-friendly PCIe EZ-Latch design allows users to easily detach the graphics card from the PCIe slot with a quick-release mechanism; the M.2 EZ-Latch makes installing M.2 SSDs effortless thanks to the screwless design. These latest-gen motherboards also support Intel XMP and AMD EXPO overclocking memory modules for maximum compatibility, and GIGABYTE BIOS comes packaged with pre-installed profiles to help users get greater performance with ease.

It would appear that motherboards based on the upcoming Intel B760 chipset aren't much of a secret, as even online price comparison sites are now starting to post details about the upcoming models. German Geizhals has posted details about Biostars B760A Silver motherboard and although the site doesn't have pictures of the board, it does provide a drawing from what appears to be the manual. As this is an entry level model, there isn't too much to get excited about, but it appears to be a decent enough board overall.

The B760A Silver sports four DDR5 DIMM slots, a PCIe 5.0 x16 slot, a PCIe 4.0 x4 slot and two PCIe 3.0 x1 slots, as well as three PCIe 4.0 M.2 slots for NVMe SSDs and an M.2 for an optional Wi-Fi/Bluetooth card. Other features include an HDMI 2.1 and DP 1.2 port around the back, as well as 2.5 Gbps Ethernet and a 10 Gbps USB-C port. The board has a front header for another 10 Gbps USB-C port, but there's no support for a 20 Gbps USB-C port. Biostar has at least not been stingy with fan headers, as a total of six are spread out around the board and for those that like RGB lights, there are also three ARGB headers. Geizhals isn't listing any retailers stocking the board as yet, so we don't get any indication on the cost of the board.

Intel is expected to launch the B760 chipset alongside a slew of more 13th gen Core CPUs at CES in January, but already details of upcoming motherboards are starting to appear. We've already seen some details about Gigabyte's B760 Aorus Elite and now some very detailed pictures of MSI's upcoming B760 MAG Tomahawk have made an appearance on VideoCardz. The board is a spitting image of its B660 predecessor in terms of layout, but there appear to be some minor changes in terms of header placement.

MSI has also changed the colour scheme for all black to black with some white highlights. The rear I/O cover appears to have changed marginally, but even the heatsinks appear to be nigh on identical to the previous model. The pictures are of the DDR4 version, but there will apparently be a DDR5 version as well of this SKU from MSI. According to the rumour mill, prices of B760 boards will be up about 10 percent over the current B660 models, but nothing has been confirmed as yet.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced the ultimate overclocking motherboard Z790 AORUS TACHYON with the latest 13th gen Intel Core processors has smashed 10 world O.C. records including PCMark 7, 3D Mark…etc, as well as 16 GFP (Global First Place) of individual category test by different core numbers, and obtained 9 HFP (Hardware First Place) highest record in specific CPU ID vs. core count. Designed by world-famous overclocker, GIGABYTE Z790 AORUS TACHYON packs overclocker-exclusive features with top-quality components to become the dream motherboard for overclockers, which delivers unparalleled O.C performance with a more friendly and thoughtful interface to set its leading role on Z790 O.C. motherboards.

"It's inspiring that Z790 AORUS TACHYON breaks 10 overclocking world records and more than 20 various overclocking scores, which not only proves GIGABYTE's strong R&D strength but also demonstrates that GIGABYTE's devotion to providing formidable O.C motherboard. We believe this is just the beginning and will continue to create superior overclocking performance and records by Z790 AORUS TACHYON. We look forward to seeing more overclockers around the world using this motherboard to break more world records!" said Jackson Hsu, Director of the GIGABYTE Channel Solutions Product Development Division.

January 3, 2023, on the sidelines of the International CES, Intel could launch dozens upon dozens of 13th Gen Core processor SKUs spanning every conceivable client PC platform. The event is expected to bring "Raptor Lake" to the mobile platform, with announcements spanning the ultra-portable "Raptor Lake-U," the thin-and-light performance "Raptor Lake-P," the mainstream mobile "Raptor Lake-H," and the enthusiast mobile "Raptor Lake-HX." This would cover almost every mobile device segment, including 7-9 W U-segment, to the 15-28 W P-segment, the 35-45 W H-segment, and the >55 W HX-segment, with several SKUs per segment across the four brand extensions (Core i3 thru Core i9).

For the desktop platform, Intel is expected to announce its new Core i9-13900KS "Raptor Lake-S" flagship, the world's first 6 GHz processor, besides a large number of 13th Gen Core "Raptor Lake-S" non-K SKUs in the 65 W TDP class, forming the bulk of the company's desktop processor lineup. Besides these, the company will also announce the more affordable Intel H770 and B760 desktop motherboard chipsets, bringing down platform costs (the 13th Gen Core processors are already supported on inexpensive motherboards based on the B660 and H670 chipsets via a BIOS update). Lastly, the company could announce "Raptor Lake" processors for the workstation segment, possibly compatible with the W780 chipset, and supporting ECC DDR5 memory, among other features relevant to the commercial desktop and workstation segments.

Not entirely unexpected, pictures of the first B760 motherboard, or at least its packaging and the board inside the packaging, has made an appearance online. We're around a month or so from the expected announcement of Intel's more cost effective 700-series chipset, which will likely follow the Z790 chipset by adding more PCIe 4.0 lanes, but otherwise differ very little from the current B660 chipset.

No actual details were provided when it comes to the specs of the Gigabyte B760 Aorus Elite AX DDR4, but it's likely that this will be the last generation of DDR4 motherboards. This is because it's unlikely that Intel will support DDR4 memory on future desktop PC platforms. What we can spot through the antistatic bag, is a board design that is very similar to Gigabyte's current B660 Aorus Elite AX DDR4, but with a new motif on the chipset and NVMe drive heatsinks. In fact, the board layout appears to be near identical from what little we can see, but there are some clearly visible component placement that can be seen and compared to the current model. Hopefully we'll get some better pictures of this board in the near future from the leaker.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is delighted to introduce its premier SILVER series, the Z790A-SILVER motherboard. Built around the Intel Z790 platform, the Z790A-SILVER is a masterful piece of tech designed to serve gamers, content creators, and casual users faithfully. With support for 12th/ 13th Generation Intel Core processors, a quad DIMM DDR5 ram interface, and a PCIe 5.0 x16 slot tailored for that beastly new graphics card, make it the ideal choice for a hardy gaming rig that turns average gamers into true champions.

As an expansion of BIOSTAR's RACING series motherboard range, the Z790A-SILVER carries a robust build and styling handed down by its predecessors, showcasing the classic RACING stripes on its PCB and the Silver colored cooling blocks. PCIe M.2 4.0 and SATA III (6 Gb/s) are the chosen storage technology for the Z790A-SILVER motherboard. They are highly stable and efficient for any given task, with superior USB 3.2 (Gen2) type-C and USB 3.2 (Gen2) type-A ports for blisteringly fast data transfers.

ASUS, a leading provider of server systems, server motherboards and workstations, today announced new best-in-class server solutions powered by the latest AMD EPYC 9004 Series processors. ASUS also launched superior liquid-cooling solutions that dramatically improve the data-center power-usage effectiveness (PUE).

The breakthrough thermal design in this new generation delivers superior power and thermal capabilities to support class-leading features, including up to 400-watt CPUs, up to 350-watt GPUs, and 400 Gbps networking. All ASUS liquid-cooling solutions will be demonstrated in the ASUS booth (number 3816) at SC22 from November 14-17, 2022, at Kay Bailey Hutchison Convention Center in Dallas, Texas.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today revealed the supreme performance of XMP DDR5-8000 on Z790 AORUS XTREME and Z790 AORUS MASTER motherboards with Team Group gaming modules T-FORCE DELTA RGB DDR5 memory. Enhanced with the exclusive Low Latency and High Bandwidth technology, this achievement proves again that GIGABYTE motherboard is the ultimate choice to unleash memory performance, as well as the leading role of memory performance by the teamwork of GIGABYTE vs. Team Group.

It's always been challenging to constantly exceed the high-frequency record of memory, and stable motherboards and high-performance memories make a perfect team to accomplish this difficult task. To provide superior performance and user experience, GIGABYTE has been working closely with Team Group on the record-breaking performance from DDR5-7600, DDR-7800, to XMP DDR5 8000. The detailed memory information is listed in the memory support list of the motherboard, users can check on the site for the best performance matrix on the Z790 platform.

A while back, some ASRock motherboards showed up with an eDP connector, which seemed odd, as outside of the embedded market or notebooks, eDP isn't commonly found. ASRock has now revealed what it's for, namely a 13.3-inch display, or side panel kit as the company calls it. In other words, this is a 13.3-inch display that mounts inside your case, assuming you have a tempered glass side panel. It's meant to be used as a secondary display, rather than just being some kind of diagnostics tool, which similar products on the market today end up being. The display uses an IPS panel and has a native resolution of 1920 x 1080 pixels, with a refresh rate of 60 Hz and a brightness of 300 cd/m², so nothing out of the ordinary there.

However, ASRock provides a custom eDP cable with a 40-pin connector, as well as four mounting brackets, some cable clips and even extra adhesive strips, in case you'd want to move the display to a new case in the future. The panel measures 300.26 x 193.01 mm (W x H), so it might not fit all cases. ASRock also points out that you need to have a clear, transparent tempered glass side panel for optimal usage of the display, as a tinted panel would for obvious reasons reduce the light that could be transmitted through the glass. The panel is compatible with the ASRock Z790 LiveMixer, Z790 Pro RS/D4, Z790M-ITX WiFi, Z790 Steel Legend WiFi, Z790 PG Lightning, Z790 Pro RS, Z790 PG Lightning/D4, H610M-ITX/eDP and B650E PG-ITX WiFi motherboards.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced that Z790 AORUS TACHYON pushes the envelope of memory performance to XMP DDR5-8333 and DDR5-9300 O.C. with air cooling. On top of that, the phenomenal performance of XMP DDR5-8000 on Z790 AORUS XTREME and Z790 AORUS MASTER motherboards proves the enhancements from hardware to firmware including top-quality components, new generation Shielded Memory Routing design, and High Bandwidth of BIOS setting greatly improve memory stability and performance.

Enhanced by the new generation Shielded Memory Routing and low signal-loss PCB design, GIGABYTE Z790 AORUS TACHYON, Z790 AORUS XTREME, and Z790 AORUS MASTER can effectively reduce the internal and external signal loss or interference, which ensures blasting-fast DDR5 memory speed. In addition, the abundant BIOS setting of DDR5 Memory Upgrade and XMP 3.0 User Profile lead to the breakthrough performance of memories.

ASUS today announced the availability of new Intel Z790 motherboards, including the ROG Maximus Z790 Apex, TUF Gaming Z790-PLUS WiFi and ProArt Z790-Creator WiFi - all of which provide DDR5 memory module support and PCIe 5.0 slots for video cards and storage.ASUS Z790 motherboards offer tremendous value to anyone assembling an Intel 13th Gen machine that includes AEMP II, AI Overclocking, AI Cooling II, PCIe 5.0 M.2 slots, Thunderbolt 4, WiFi 6E, Quick Charge 4+ technology and comprehensive connectivity. Overall, new ASUS Z790 motherboards are ideal solutions for any user who wants to build a next-gen machine or upgrade their existing system.

First up is the ROG Maximus Z790 Apex. The ultimate option for memory overclocking enthusiasts, this motherboard boasts a cutting-edge feature set. Then, for creative professionals of all kinds, ASUS offers the ProArt Z790-Creator WiFi. This motherboard offers premium connectivity and bespoke style, and it's fully ready for next-gen graphics cards and ultra-fast PCIe 5.0 storage. Finally, ASUS is bolstering its TUF Gaming lineup with the TUF Gaming Z790-Plus WiFi, which brings DDR5 support to the family.