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Intel Says Its Upcoming Gen12 GPUs Will Feature Biggest Architecture Change In A Decade

Intel is slowly realizing plans to "one up" its GPU game starting from first 10 nm Ice Lake CPUs that feature Gen11 graphics, equipping users of integrated GPUs with much more performance than they previously got. Fortunately, Intel doesn't plan to stop there. Thanks to the recent pull request found on GitLab Mesa repository, we can now expect to receive biggest GPU performance bump in over a decade with the arrival of Gen12 based GPUs, found on next generation Tiger Lake processors.

In this merge request, Francisco Jerez, member of Intel's open source Linux graphics team, stated the following: "Gen12 is planned to include one of the most in-depth reworks of the Intel EU ISA since the original i965. The encoding of almost every instruction field, hardware opcode and register type needs to be updated in this merge request. But probably the most invasive change is the removal of the register scoreboard logic from the hardware, which means that the EU will no longer guarantee data coherency between register reads and writes, and will require the compiler to synchronize dependent instructions anytime there is a potential data hazard..."

NETGEAR Debuts Orbi WiFi 6 Mesh System

NETGEAR, Inc., the leading provider of mesh WiFi systems that power smart homes, today announced the worldwide release of Orbi WiFi 6 Mesh System an innovative solution that delivers a new standard for wireless networks.

This next generation Orbi Mesh WiFi System is designed for the connected world of today and the future. Households now have a multitude of always-on and always-connected smart home devices many of which are running high-bandwidth applications like streaming 4K/8K Ultimate HD connections across multiple screens. The Orbi WiFi 6 mesh system has the capacity to support the traffic generated by the multitude of connected devices that are in the home today and for years to come. Similar to the difference experienced between driving on a congested four-lane highway compared to that of a sixteen-lane superhighway, WiFi 6 provides more streams so there is an increased capacity for more traffic ensuring that the fastest high-speed WiFi connected devices are not stalled by the slower ones.

LGA 4189 is the Latest Socket for Intel's Next Generation of Xeon CPUs

TE Connectivity, the maker of various kinds of connectivity solutions for computer systems, has released its latest iteration of the LGA socket for the next generation of Xeon Scalable CPUs. Being validated by Intel, the LGA 4189-4 and LGA 4189-5 are going to power the next generation of 10 nm Xeon CPUs, based on the Ice Lake architecture, and up to 56-core 2nd generation Xeon Scalable CPUs. While there are two models of the socket, TE Connectivity didn't reveal what the differences are between them. Socket P4 (LGA 4189-4) and P5 (LGA 4189-5) also feature exactly the same pin count, 0.9906 mm hex pitch and 2.7 mm SP height, so we can only speculate that the "4" or "5" in the revision is supposed to indicate details like higher power delivery capability or support for Ice Lake CPUs.

In addition to providing a new socket for Ice Lake, these sockets have support for PCI-Express Gen 4.0 and eight-channel memory (supported memory configurations are vendor dependent), meaning that we are getting two more memory channels than previous Xeon CPUs with a faster and newer PCIe standard.

GIGABYTE Smashes 11 World Records with New AMD EPYC 7002 Processors

GIGABYTE, a leading server systems builder which recently released a total of 17 new AMD EPYC 7002 Series "Rome" server platforms simultaneously with AMD's own official launch of their next generation CPU, is proud to announce that our new systems have already broken 11 different SPEC benchmark world records. These new world records have not only been achieved against results from all alternative processor based systems but even against competing vendor solutions using the same 2nd Generation AMD EPYC 7002 Series "Rome" processor platform, illustrating that GIGABYTE's system design and engineering is perfectly optimized to deliver the maximum performance possible from the 2nd Generation AMD EPYC.

Microsoft to Present First Halo Infinite Gameplay at E3 2019 - On the PC Platform

Tech Journalist Brad Sams, who first reported on Halo: The Master Chief Collection coming to the PC platform before its official announcement, has spilled the beans on another juicy detail regarding the Halo universe: that Microsoft will use this E3 2019 to showcase the first gameplay for the game. This isn't news, really - after last year's tease, it was expected that gameplay would be available this year to whet gamers' appetites. However, the fact that Halo Infinite will be running in the PC platform is newsworthy, since this is quite the departure from previously-known Microsoft, which seemed to relegate its PC gaming ambitions to other developers.

Now, with Microsoft vouching to treat the PC platform as the gaming juggernaut it is, and the already-known information that 343 Industries' (the current Halo developers) Slipspace engine would treat PC gamers with the latest technology in terms of graphics presentation, PC has become the defacto platform of choice to showcase Halo's next-gen visuals (whilst using an Xbox One controller, by the way). This likely only happens because Microsoft isn't ready to completely pull the wraps on the next-generation Xbox; or it could serve as a show of good faith from the company when it comes to PC gaming. Whatever the reason for Microsoft's decision, this seems like a great time to be a PC - and Halo - fan.

AMD Confirms Launch of Next-gen Ryzen, EPYC and Navi for Q3

During AMD's annual shareholder meeting today, AMD president and CEO Dr. Lisa Su confirmed the launch of next-generation AMD Ryzen, EPYC CPUs and Navi GPUs for the third quarter of this year. The expected products are going to be manufactured on TSMC's 7 nm process and will be using new and improved architectures.

Ryzen 3000 series CPUs are rumored to have up to as much as 16 cores in Ryzen 9 SKUs, 12 cores in Ryzen 7 SKUs and 8 cores in Ryzen 5 SKUs. EPYC server CPUs will be available in models up to 64 cores. All of the new CPUs will be using AMD "Zen 2" architecture that will offer better IPC performance and, as rumors suggest for consumer models, are OC beasts. Navi GPUs are the new 7 nm GPUs that are expected to be very competitive both price and performance wise to NVIDIA's Turing series, hopefully integrating new technologies such as dedicated Ray Tracing cores for higher frame rates in Ray Tracing enabled games. No next generation ThreadRipper launch date was mentioned, so we don't yet know when and if that will that land.

AMD President and CEO Dr. Lisa Su to Deliver COMPUTEX 2019 CEO Keynote

Taiwan External Trade Development Council (TAITRA) announced today that the 2019 COMPUTEX International Press Conference will be held with a Keynote by AMD President and CEO Dr. Lisa Su. The 2019 COMPUTEX International Press Conference & CEO Keynote is scheduled for Monday, May 27 at 10:00 AM in Room 201 of the Taipei International Convention Center (TICC) in Taipei, Taiwan with the keynote topic "The Next Generation of High-Performance Computing".

"COMPUTEX, as one of the global leading technology tradeshows, has continued to advance with the times for more than 30 years. This year, for the first time, a keynote speech will be held at the pre-show international press conference," said Mr. Walter Yeh, President & CEO, TAITRA, "Dr. Lisa Su received a special invitation to share insights about the next generation of high-performance computing. We look forward to her participation attracting more companies to participate in COMPUTEX, bringing the latest industry insights, and jointly sharing the infinite possibilities of the technology ecosystem on this global stage."

Google Announces Stadia Cloud Gaming Service at GDC 2019

We knew this was coming, especially after Google's teaser from earlier this month. Project Stream was a proof-of-concept in collaboration with Ubisoft, to see whether AAA gaming was possible over the internet. Things were smooth most of the time in our own experience, but there remained questions over how the concept would translate over to a finished product, especially with infrastructure challenges on the client side of things. Google's keynote at GDC just wrapped up, and the main focus was Stadia- the now named cloud gaming service borne out of Project Stream.

Stadia is built with instant access in mind. An example demo came in the form of Ubisoft's Assassin's Creed Odyssey, which was used in the public test before. It is integrated with partner YouTube channels such that a trailer for a supported game would have an option to play said game, which would then launch immediately. Stadia is built with support from a wide partner network including AMD, Unity, id Software, and more, with details seen past the break.

NVIDIA to Implement 7nm EUV Node for its 2020 GPUs

NVIDIA will implement the 7 nanometer EUV (extreme ultraviolet) lithography to build its future generation of GPUs slated for 2020, according to Japanese publication MyNavi.jp. The GPU giant could be among the first customers besides IBM, to contract Samsung for 7 nm EUV mass-production of GPUs. IBM will use the Korean semiconductor giant for manufacturing Z-series processors and FPGAs. Samsung announced in October 2018 that it will begin risk-production on its 7 nm EUV node in early-2019.

An earlier report from 2018 also forecast NVIDIA implementing 7 nm DUV (deep ultraviolet) node of TSMC for its 2019 GPU lineup. With news of the company now working with Samsung on 7 nm EUV for 2020, this seems less likely. It's possible that NVIDIA could somehow split its next generation GPU lineup between TSMC 7 nm DUV and Samsung 7 nm EUV, with the latter being used for chips with higher transistor-counts, taking advantage of the node's higher deliverable transistor densities.

Lenovo Confirms Mobile GeForce GTX 1160 GPU, Or Does It?

It was about 6 months ago that we posted a news story about how a Lenovo representative mentioned that the successor to NVIDIA's GeForce 10-series of GPUs would be named the 11-series. Fast forward in time, we know how that turned out with the recently announced RTX 20-series instead. The rumor mill has not taken a break over the holidays, however, with consistent postings and speculation online about how NVIDIA will announce not only the RTX 2060 at CES 2019, but also a whole new GTX 11-series accompanying it that is aimed to meet gaming needs without real-time ray tracing support and at a lower price point respective to the equivalent RTX SKU.

Perhaps it is fitting that Lenovo provides more fuel to this fire once again, with a listing of a mobile GeForce GTX 1160 (N18E) graphic solution on their upcoming Legion Y530 and Y7000P laptops. VideoCardz.com was quick to capture a screenshot of the specs listing, seen below, that describes it as a "next generation GPU", albeit with an asterisk hinting that the specification may not be final. Indeed, Lenovo has since changed the description on that product page to remove all signs of said 11-series mobile GPUs, and the LaptopMedia specs database for the Legion Y530 also now mentions a "GTX 2060" with 6 GB of VRAM instead. The only thing we know for sure is that we are not sure of anything, and it may well be that a GeForce 11-series, if it even exists, is a mobile-only platform. Hopefully CES will shed more light on this matter, and stay tuned for our coverage of the event accordingly.

Maxsun Teases Next-gen NVIDIA GeForce Product at ChinaJoy

Maxsun may not be much of a household name in territories outside China, as the western market penetration isn't the most relevant within NVIDIA's partners. That said, the company does enjoy the status of NVIDIA AIB, so they're privy to details on next-gen products - especially when they are, allegedly, so close to a reveal and launch.

Maxsun showcased their take on NVIDIA's next generation (you can find the ending of that very word in the photo of the presentation slide) products with a 3D render of what could very well be their finalized next-gen graphics card's looks - and part of their premium, iCraft segment. The ubiquitous RGB is there, as always, pandering to the majority of users' lighting requirements. The graphics card presents a dual-slot, triple-fan solution, and there doesn't seem to be a DVI connector, nor an SLI termination, for that matter. The card also seems to have a single 8-pin power connector, and the GeForce branding is clear. Sadly, the render doesn't specify the model it pertains to - it would be great to finally have some closure on the 1100, 2000 series' debates.

Micron Begins Volume Production of GDDR6 High Performance Memory

Micron Technology, Inc. today announced volume production on its 8 GB GDDR6 memory. Built on experience and execution for several generations of GDDR memory, GDDR6 - Micron's fastest and most powerful graphics memory designed in Micron's Munich Development Center - is optimized for a variety of applications that require high performance memory, including artificial intelligence (AI), networking, automotive and graphics processing units (GPUs). Additionally, Micron has worked with core ecosystem partners to ramp GDDR6 documentation and interoperability, enabling faster time to market for designs.

"Micron is a pioneer in developing advanced high bandwidth memory solutions and continues that leadership with GDDR6. Micron demonstrated this leadership by recently achieving throughput up to 20 GB/s on our GDDR6 solutions," said Andreas Schlapka, director, Compute Networking Business Unit, Micron. "In addition to performance increases, Micron has developed a deep partner ecosystem to enable rapid creation of GDDR6 designs, enabling faster time to market for customers looking to leverage this powerful new memory technology."

NVIDIA Introduces HGX-2, Fusing HPC and AI Computing into Unified Architecture

NVIDIA HGX-2 , the first unified computing platform for both artificial intelligence and high performance computing. The HGX-2 cloud server platform, with multi-precision computing capabilities, provides unique flexibility to support the future of computing. It allows high-precision calculations using FP64 and FP32 for scientific computing and simulations, while also enabling FP16 and Int8 for AI training and inference. This unprecedented versatility meets the requirements of the growing number of applications that combine HPC with AI.

A number of leading computer makers today shared plans to bring to market systems based on the NVIDIA HGX-2 platform. "The world of computing has changed," said Jensen Huang, founder and chief executive officer of NVIDIA, speaking at the GPU Technology Conference Taiwan, which kicked off today. "CPU scaling has slowed at a time when computing demand is skyrocketing. NVIDIA's HGX-2 with Tensor Core GPUs gives the industry a powerful, versatile computing platform that fuses HPC and AI to solve the world's grand challenges."

Intel "Ice Lake-U" Gen 11 iGPU Features 48 Execution Units

Intel's next generation "Ice Lake" processor could integrate a significantly faster integrated graphics solution (iGPU), if a SiSoft SANDRA online database entry is to be believed. A prototype "Ice Lake" chip was benchmarked, with its iGPU being described by the database as "Intel UHD Graphics" based on the company's Gen 11 graphics architecture, which succeeds the current Gen 9.5 architecture implemented on "Coffee Lake" and "Kaby Lake." This iGPU is endowed with 48 execution units (EUs), which work out to 384 unified shaders; against 24 EUs and 192 shaders on Intel UHD 620. SANDRA also describes the iGPU as being able to share up to 6 GB of memory from the system memory; and featuring 768 KB of dedicated cache. Its reference clock is 600 MHz, double that of the UHD 620, although its boost clock remains a mystery. "Ice Lake" is being built on Intel's new 10 nm+ silicon fabrication process, so it's understandable for the company to significantly enlarge its iGPU.

AMD to Build "Zen 2" and "Zen 3" Processors on 7 nm Process: CTO

AMD is in no mood to stick to the 14 nm process for as long as Intel has (building four performance x86 CPU micro-architectures on it). In an interview with EE Times, AMD CTO Mark Papermaster confirmed that the company's "Zen 2" and "Zen 3" CPU micro-architectures will be built on the next-generation 7 nm silicon fab process. Transition to the 7 nm process is not as straightforward as optically shrinking your chip designs and shipping them over to your foundry. Apparently it requires big technical changes for the chip design teams, which AMD feels are better executed while it's still riding on the success of its current "Zen" architecture.

"We had to literally double our efforts across foundry and design teams…It's the toughest lift I've seen in a number of generations," said Papermaster. He added that the 7 nm node requires new "CAD tools and [changes in] the way you architect the device [and] how you connect transistors-the implementation and tools change [as well as] the IT support you need to get through it." Papermaster predicts that 7 nm will be a "long node like 28 nm" in that chip designers will have to build several refinements to their designs on the node before the newer 4 nm node could be heralded. He urged semiconductor foundry companies to introduce EUV (extreme ultra-violet lithography), a technique used to etch transistors and circuits at the infinitesimally small 7 nm node, as soon as possible, so AMD could have more options at manufacturing its next generation processors.

Club 3D Announces 2 New Video Splitters With 2x 4K @ 60Hz Support

Club 3D is proud to announce the next generation of SenseVision video splitters today with the introduction of two brand new splitters, CSV-1474 (USB-A to HDMI 2.0 Dual Monitor 4K 60Hz) and CSV-1477 (USB-A to DP 1.2 Dual Monitor 4K 60Hz) with this press release.

Former generation video splitters or USB graphic adapters based on USB 3.0 or 3.1 suffered from a limitation of 30 Hz if you were aiming at using the highest resolutions like 3840 x 2160 (4K). The latest developments from DisplayLink make it possible now that with CSV-1474 and CSV-1477 the resolutions can be taken to a new level. Not only one time 4K60Hz is possible, both splitters offer Dual Monitor functionality and each of the outputs can offer 4K 60Hz. The only requirement is to have a free USB Type A 3.1 Gen 1 socket in your device. The two new SenseVision products are powered by DisplayLink 6950 SoC. Our new future-proof products will be ready for shipment on June 30th. Wide availability of the products in the market we expect in the first week of July.

AMD Ryzen 2000 Series Processors Based on Refined 14 nm Process

At its Analyst Day follow-up conference call, AMD confirmed that the company could build a new generation of Ryzen processors on 14 nm (albeit refined 14 nm) process, before transitioning to "Zen2," which will be built on the 7 nm process. As the first "Zen" based products built on the 14 nm process, the Ryzen "Summit Ridge" processors are based on the current-generation 14 nm FinFET process. AMD hopes to tap into a more refined version of this process before moving on to "Zen 2."

This could indicate that AMD's next generation of Ryzen processors, likely the Ryzen # 2xxx series, could be minor incremental updates to the current product stack, likely in the form of higher clock speeds or better energy-efficiency facilitated by the refined 14 nm process, but nothing major in the way of micro-architecture. Assuming the current Ryzen product stack, which will be augmented by Ryzen 3 series, Ryzen Pro series, and Ryzen APUs in the second half of 2017; last till mid-2018, one could expect a follow-up or refreshed Ryzen # 2xxx series run up to another year, before AMD makes a "leapfrog" upgrade to the 7 nm process with "Zen2," in all likelihood, by 2019.

LG Electronics Looks to Take a Share of the VR HMD Market

LG Electronics has just made one of the most cryptic, devoid-of-any-real-information announcements we've seen in recent years. The company will apparently enter the VR HMD field, and is looking to unveil its first prototype at this year's GDC in San Francisco, CA. LG will make use of Valve's GDC booth to showcase an HMD capable of delivering "a high fidelity, next generation VR experience".

That's about all the information we were given at face value. However, some other tidbits serve to paint a picture on how premature this announcement may have been: LG will purportedly be meeting with developers to "collect feedback and impressions as part of its effort to define the first commercial units". This means that the HMD is likely still in a proof of concept phase, early enough in development to cater to developers' expertise, needs and suggestions, which means it's probably still far removed from retail to be of any real import in the grand scheme of things. However, it Is a confirmed dip from another tech giant in the fully-fledged, high-performance VR HMD game. And judging by the proximity with Valve, we would expect LG's unit to borrow heavily from that company's input and vision for VR.

AMD's Upcoming Ryzen Line-up Could Feature 6-Core Chips After All

It's always a dance between rumours, expectations and "theorycrafting" when it comes to the launch of any particularly exciting product. And with AMD's Ryzen chips currently being the most hotly anticipated development (and product launch) in the hardware world, well, let's just say that anticipation is really building up to enormous levels, with any possible details surrounding AMD's line-up being the cause, in some cases, of heated debate.

Case in point: with AMD's CCX (CPU Complex) being indivisible, this would mean a blow not only to budget-conscious consumers, but also to AMD's ability to engender its product line. Flexibility has always been the name of the game with AMD (discounting their CMT-based Bulldozer and derived architectures), with the company offering triple-core processors in the past (and weren't those the good old days of processor unlocking). However, now reports have come in that Ryzen's CCX are actually divisible, which could open up possibilities for some theoretically value-breaking hexa-core Ryzen chips.

MSI Also Upgrades Nightblade Series Desktops with Kaby Lake Processors

MSI, the world's leading manufacturer of true gaming hardware, has fitted its Nightblade gaming desktop line with the recently introduced Intel Kaby Lake chipset. Built on the legacy of the first Nightblade gaming desktop series, the Nightblade 3 and Nightblade MI3 come with an updated exterior and interior design. With the updated exterior of the Nightblade 3 and Nightblade MI3, the Nightblade series gets a fresh upgrade for the next generation. Together with Nightblade MIB, the MSI Nightblade series PCs are ready to take any gaming challenge.

On the outside you will find an easy carry-handle situated at the front of the chassis, to make it convenient for gamers to bring their rig anywhere. Upgrading these systems is a piece of cake thanks to removable left, -right, and -topside chassis covers, giving access to its memory, graphics or storage bays. Applied to MSI's full gaming desktop family, MSI VR Link provides an HDMI port on the front side and 'One-Click to VR' software to optimize your VR experience.

Intel to Acquire 15 Percent Ownership of HERE

Intel has agreed to purchase a 15 percent ownership stake in HERE, a global provider of digital maps and location-based services, from HERE's current indirect shareholders: AUDI AG, BMW AG and Daimler AG. In conjunction with Intel's acquisition of a stake in HERE, the two companies also signed an agreement to collaborate on the research and development of a highly scalable proof-of-concept architecture that supports real-time updates of high definition (HD) maps for highly and fully automated driving. Additionally, the two companies plan to jointly explore strategic opportunities that result from enriching edge-computing devices with location data.

"Cars are rapidly becoming some of the world's most intelligent, connected devices," said Brian Krzanich, Intel CEO. "We look forward to working with HERE and its automotive partners to deliver an important technology foundation for smart and connected cars of the future." "A real-time, self-healing and high-definition representation of the physical world is critical for autonomous driving, and achieving this will require significantly more powerful and capable in-vehicle compute platforms," said Edzard Overbeek, HERE CEO. "As a premier silicon provider, Intel can help accelerate HERE's ambitions in this area by supporting the creation of a universal, always up-to-date digital location platform that spans the vehicle, the cloud and everything else connected."

Intel Unveils Strategy for State-of-the-Art Artificial Intelligence

Intel Corporation today announced a range of new products, technologies and investments from the edge to the data center to help expand and accelerate the growth of artificial intelligence (AI). Intel sees AI transforming the way businesses operate and how people engage with the world. Intel is assembling the broadest set of technology options to drive AI capabilities in everything from smart factories and drones to sports, fraud detection and autonomous cars.

At an industry gathering led by Intel CEO Brian Krzanich, Intel shared how both the promise and complexities of AI require an extensive set of leading technologies to choose from and an ecosystem that can scale beyond early adopters. As algorithms become complex and required data sets grow, Krzanich said Intel has the assets and know-how required to drive this computing transformation. In a blog Krzanich said: "Intel is uniquely capable of enabling and accelerating the promise of AI. Intel is committed to AI and is making major investments in technology and developer resources to advance AI for business and society."

ASRock Announces Next-Gen CPU Support for DeskMini 110

The globally-praised ASRock DeskMini 110 barebone series and the most compact mainboard H110M-STX are the world's first H110 chipset based products that support Intel next generation processors. Simply update BIOS after P1.40 version, users are able to enjoy the exciting performance of new CPUs.

The highly-recognized DeskMini 110 barebone series and H110M-STX motherboard are the very first models based on the Mini Socket Technology Extended (Mini-STX) form factor that add the flexibility to support Intel LGA 1151 socket-based Intel processors. Besides the comprehensive and valuable configurability options, ASRock Mini-STX series is also well focused on improving every possible computing features. Both two products are the pioneer that are compatible with the popular Samsung 950 Pro NVMe M.2 SSDs and Intel's latest 600p series SSDs with the fastest PCIe Gen3 x4 speed.

ASRock Unveils BIOS Updates for Next-Gen CPU Support to its LGA1151 Motherboards

ASRock's 100-series motherboards support Next Generation socket 1151 Intel Core Processors. Via a new BIOS update, ASRock Z170, H170, B150 and H110 series motherboards are resurrected. With only a few clicks, users are able to update the BIOS and enjoy the outstanding performance of next generation Intel processors.

Not only to those high-end and mainstream motherboards, ASRock also takes the latest BIOS to those entry level ones. From the Z170, H170, B150 series to the H110 series, users may expect more powerful processing speed yet enhanced capabilities by Intel's new processors. To download the latest BIOS updates, visit the ASRock website.

GLOBALFOUNDRIES Announces its 7 nm FinFET Technology

GLOBALFOUNDRIES today announced plans to deliver a new leading-edge 7nm FinFET semiconductor technology that will offer the ultimate in performance for the next era of computing applications. This technology provides more processing power for data centers, networking, premium mobile processors, and deep learning applications.

GLOBALFOUNDRIES' new 7nm FinFET technology is expected to deliver more than twice the logic density and a 30 percent performance boost compared to today's 16/14nm foundry FinFET offerings. The platform is based on an industry-standard FinFET transistor architecture and optical lithography, with EUV compatibility at key levels. This approach will accelerate the production ramp through significant re-use of tools and processes from the company's 14nm FinFET technology, which is currently in volume production at its Fab 8 campus in Saratoga County, N.Y. GLOBALFOUNDRIES plans to make an additional mutli-billion dollar investment in Fab 8 to enable development and production for 7nm FinFET.

"The industry is converging on 7nm FinFET as the next long-lived node, which represents a unique opportunity for GLOBALFOUNDRIES to compete at the leading edge," said GLOBALFOUNDRIES CEO Sanjay Jha. "We are well positioned to deliver a differentiated 7nm FinFET technology by tapping our years of experience manufacturing high-performance chips, the talent and know-how of our former IBM Microelectronics colleagues and the world-class R&D pipeline from our research alliance. No other foundry can match this legacy of manufacturing high-performance chips."
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