Noctua has, as of this month, refreshed its product roadmap for the rest of 2023, and even provides a couple of scant details about far-off hardware scheduled for launch in early 2024 and beyond. The Austrian computer cooling hardware specialist is probably updating their release forecast in preparation for Computex 2023 - set to start at the end of the month - where brand new goodies could be debuted to industry-types and public attendees.

Noctua's 8-way fan hub seems to be delayed - the previous version of the roadmap had it down for a Q1 2023 launch, but the update now indicates a second quarter window. A bunch of next-gen AMD Threadripper coolers are marked down for an estimated third-quarter release, and Noctua has a slim 60 mm fan
as well as a 24 V 40 mm fan lined up for the final quarter. All-black versions of existing NH-D12L, NH-D9L and NH-L9x65 CPU coolers are due by the end of this year - a number of coolers are already available in the company's "chromax.black" finish - for those who do not enjoy the signature beige and brown aesthetic. A single next-generation 140 mm fan is teased for a Q1 2024 launch, with a chromax.black version coming later in the year. Finally, a re-designed NH-D15 CPU cooler gets a loose 2024 window.

Intel has appointed Deepak Patil as the new corporate vice president and general manager of its Accelerated Computing Systems and Graphics (AXG) group. Patil is set to succeed Raja Koduri in this leadership role - company CEO Pat Gelsinger was the first person to announce news (last month) of Koduri's departure from Intel. At the time of his leaving Team Blue, Koduri's official job title was "Executive Vice President and Chief Architect" so the wording of his successor's executive ranking is slightly different. Patil is the current chief technology and strategy officer at the Intel Data Center and AI Group, and was previously senior vice president at Dell APEX USA. He will be taking over directly from interim AXG division leader Jeff McVeigh.

The official Intel statement regarding its new leadership appointment states: "Intel will deliver competitive accelerated computing products and build scalable systems with easy-to-program software on a predictable cadence. Deepak Patil will serve as the CVP and General Manager of the Accelerated Computing Systems and Graphics (AXG) group. Deepak recently held the position of DCAI Chief Technology and Strategy Officer. Having held senior engineering leadership positions across the high-tech industry, including being a founding member of Microsoft Azure and leading Dell's APEX as-a-service business, he understands the important role that software and open ecosystems play in enabling application developers and service providers to bring innovative solutions to market, at scale."

Early details of MediaTek's next generation mobile chipset have emerged this week, courtesy of renowned leaker Digital Chat Station via their blog on Weibo. The successor to MediaTek's current flagship Dimensity 9200 mobile chipset will likely be called "Dimensity 9300" - a very imaginative bump up in numbering - with smartphone brand Vivo involved as a collaborator. The tipster thinks that the fabless semiconductor company has contracted with TSMC for fabrication of the Dimensity 9300 chipset - and the foundry's N4P process has been selected by MediaTek, which could provide a bump in generational performance when compared to the older 4 nm and 5 nm standards used for past Dimensity SoC ranges. It should be noted that the current generation Dimensity 9200 chipset is presently manufactured via TSMC's N4P process.

MediaTek is seeking to turnaround its fortunes in the area of flagship mobile chipsets - industry watchdogs have cited a limited uptake of the Taiwanese company's Dimensity 9200 SoC as a motivating factor in the creation of a very powerful successor. Digital Chat Station suggests that the upcoming 9300 model will pack enough of a hardware punch to rival Qualcomm's forthcoming Snapdragon 8 Gen 3 SoC - both chipsets are touted to release within the same time period of late 2023. According to previous speculation, Qualcomm has also contracted with TSMC's factory to pump out the Snapdragon 8 Gen 3 via the N4P (4 nm) process.

Samsung and LG are among an number of tech companies reportedly pushing for radical changes in the cinema viewing experience. In a piece published by the Hollywood Reporter last week, new behind-the-scenes information has come to light about an effort to replace the (some will say tried and true) traditional cinema theater projection system with LED walls. The vast majority of international theater chains rely on a front projection method (via a back of the booth), and very few locations have a more state-of-the-art LED display-based system in place. The Culver Theater (naturally located in Culver City, CA) is one of a hundred cinemas worldwide to possess a Samsung Onyx LED display - although the tech on show is said to be of an older standard. Industry insiders have been invited to attend demonstrations of a newer generation LED wall technology destined for cinemas in the future, and early impressions are purported to be mixed.

A cinema-based LED wall display functions in a similar way to how a modern LED-based flat screen TV works - although on a much greater massive scale - with particular benefits of the technology resulting in fantastic performance in terms of high dynamic range and peak brightness. The main downside of having a tightly packed array of large LED panels is the resultant heat output - critics of the technology state that it will be difficult to implement an adequate cooling system (through air conditioning) to tame the wall's temperature increasing properties. The power required to operate the LED panel array (plus required cooling solution) is said to be much higher than that of an old-fashioned projector's relatively modest draw from the electricity supply. An LED wall will also completely negate the traditional placement of loudspeakers behind a cinema's front-placed screen - and sound engineers will need to explore a different method of front audio channel output within the context of a next generation LED theater room.

Intel Foundry Services (IFS) and Arm today announced a multigeneration agreement to enable chip designers to build low-power compute system-on-chips (SoCs) on the Intel 18A process. The collaboration will focus on mobile SoC designs first, but allow for potential design expansion into automotive, Internet of Things (IoT), data center, aerospace and government applications. Arm customers designing their next-generation mobile SoCs will benefit from leading-edge Intel 18A process technology, which delivers new breakthrough transistor technologies for improved power and performance, and from IFS's robust manufacturing footprint that includes U.S.- and EU-based capacity.

"There is growing demand for computing power driven by the digitization of everything, but until now fabless customers have had limited options for designing around the most advanced mobile technology," said Pat Gelsinger, CEO of Intel Corporation. "Intel's collaboration with Arm will expand the market opportunity for IFS and open up new options and approaches for any fabless company that wants to access best-in-class CPU IP and the power of an open system foundry with leading-edge process technology."

Insider sources at Microsoft have spoken of continued efforts to modernize the core of its operating system, with the work-in-progress Windows 12 cited as the ideal candidate for substantial updates. The engineering team is reported to be integrating a modular design, which will allow for a reduced operating system footprint - similar in principle to ChromeOS. According to a Windows Report article the operating system development team is hard at work on a spiritual successor to the abandoned Windows Core OS project. Their newest effort is reported to be called "Windows CorePC" and Microsoft is aiming to hit the same goals it set for its Windows 10X edition, which was cancelled in mid-2021, but they will also target native support for legacy applications on devices that require necessary access.

Windows Core OS was shutdown after years of development and internal testing - it was hoped that a modular Universal Windows Platform-first (UWP-F) operating system would be more lightweight and gain stronger security features, as well as greater access to regular updates. The inside sources stated that Windows Core OS will not be developed any further, at least not for desktop computer purposes. The Microsoft team is anticipating that its new CorePC project will lead onto new configurations of Windows that feature a capability of scaling up and down depending on hardware variations. Windows PCs and devices, in some user case scenarios, do not require full breadth of legacy Win32 application support. CorePC will enable different configurations of Windows to be installed on a custom basis.

Apple's engineering team is rumored to be adjusting performance targets set for its next generation mobile SoC - the A17 Bionic - due to issues at the TSMC foundry. The cutting edge 3 nm process is proving difficult to handle, according to industry tipsters on Twitter. The leaks point to the A17 Bionic's overall performance goals being lowered by 20%, mainly due to the TSMC N3B node not meeting production targets. The factory is apparently lowering its yield and execution targets due to ongoing problems with FinFET limitations.

The leakers have recently revealed more up-to-date A17 Bionic's Geekbench 6 scores, with single thread performance at 3019, and multi-thread at 7860. Various publications have been hyping the mobile SoC's single thread performance as matching that of desktop CPUs from Intel and AMD, more specifically 13th-gen Core i7 and 'high-end' Ryzen models. Naturally the A17 Bionic cannot compete with these CPUs in terms of multi-thread performance.

Ayar Labs, a leader in the use of silicon photonics for chip-to-chip optical connectivity, today announced public demonstration of the industry's first 4 terabit-per-second (Tbps) bidirectional Wavelength Division Multiplexing (WDM) optical solution at the upcoming Optical Fiber Communication Conference (OFC) in San Diego on March 5-9, 2023. The company achieves this latest milestone as it works with leading high-volume manufacturing and supply partners including GlobalFoundries, Lumentum, Macom, Sivers Photonics and others to deliver the optical interconnects needed for data-intensive applications. Separately, the company was featured in an announcement with partner Quantifi Photonics on a CW-WDM-compliant test platform for its SuperNova light source, also at OFC.

In-package optical I/O uniquely changes the power and performance trajectories of system design by enabling compute, memory and network silicon to communicate with a fraction of the power and dramatically improved performance, latency and reach versus existing electrical I/O solutions. Delivered in a compact, co-packaged CMOS chiplet, optical I/O becomes foundational to next-generation AI, disaggregated data centers, dense 6G telecommunications systems, phased array sensory systems and more.

Today at MWC 2023, Lenovo unveiled its latest PC and Chromebook solutions to help embrace dispersed hybrid working styles and provide advanced features that empower users across a broad selection of requirements and needs. Encompassing a progressive and contemporary design philosophy, the latest PC solutions, including a comprehensive refresh across the ThinkPad portfolio, focus on improvements in system performance, increased use of more sustainable materials, and continued enhancements to user experience. ThinkPad Z13 and Z16 second generation Windows 11 laptops enhance key areas of hardware and software functionality to help users maintain a creative edge. ThinkPad Z13 also presents a new Flax Fiber top cover, using bio-based materials, for a unique individual look and feel. Lenovo also introduced a redesigned fourth generation ThinkPad X13 and X13 Yoga with narrower bezels, new colors, materials and features to facilitate hybrid work and mobility. The ThinkPad portfolio for 2023 is completed with fourth generation ThinkPad T14s, T14 and second generation T16 workhorse laptops along with the fourth generation ThinkPad L13, L13 Yoga, L14 and L15, designed for businesses with a wide range of mobile computing needs.

Value-conscious businesses seeking focused productivity features can select a fifth generation ThinkPad E14 with new 16:10 displays or a new 16-inch form factor in the ThinkPad E16. Frequent travellers will like the additional protection provided by the new ThinkPad Professional Sleeve, available in 13-inch and 14-inch sizes to support a broad selection of laptops. The highly versatile ThinkCentre Tiny-in-One Gen 5 Monitor offers improved audio-visual capabilities and redesigned features capable of supporting multiple work scenarios. Finally, consumers can enjoy the flexibility offered by the latest IdeaPad Duet 3i, a Windows 11 detachable laptop that seamlessly transitions between clamshell and tablet modes; or relish the ChromeOS eco-system with the latest IdeaPad Slim 3 Chromebook featuring a range of audio, visual, and connectivity upgrades.

MaxLinear, Inc., a leader in home gateway solutions that unlock multi-gig home connectivity, today announced that its highly-integrated AnyWAN home gateway SoC has been certified for XGS-PON and G-PON as part of the Broadband Forum BBF.247 Optical Network Unit (ONU) Certification Program. scalable quad-core CPU, packet routing accelerator for up to 30 million packets per second, and all required high-speed interfaces for home gateways and home routers. The platform supports important WAN access technologies required by telco service providers and cable MSOs, making it one of the most scalable home gateway solutions on the market. With its XFI and PCIe gen4 interfaces and the embedded 2.5GE PHYs, AnyWAN is an ideal SoC for the next generation of fixed-wireless-access gateways with 5G WAN and Wi-Fi 7.

AnyWAN SoC variants with embedded 10G PON MAC support most 10G PON standards, including XGS-PON, G-PON, and NG-PON2. The chips are well suited for next-gen Wi-Fi 7 multi-gig fiber home gateways units (HGU). "Our innovation and investment in bringing AnyWAN to market provides all service providers and cable MSOs with a cost-efficient, quicker time-to-market choice when transitioning to 10G PON networks," said Will Torgerson, Vice President and General Manager, Broadband Group for MaxLinear. "While G-PON is the fiber technology with the largest installed based today, many customers are looking to XGS-PON as a technology option."

Since 2022, DRAM suppliers have been adjusting their product mixes so as to assign more wafer input to server DRAM products while scaling back the wafer input for mobile DRAM products. This trend is driven by two reasons. First, the demand outlook is bright for the server DRAM segment. Second, the mobile DRAM segment was in significant oversupply during 2022. Moving into 2023, the projections on the growth of smartphone shipments and the increase in the average DRAM content of smartphones remain quite conservative. Therefore, DRAM suppliers intend to keep expanding the share of server DRAM in their product mixes. According to TrendForce's analysis on the distribution of the DRAM industry's total bit output for 2023, server DRAM is estimated to comprise around 37.6%, whereas mobile DRAM is estimated to comprise around 36.8%. Hence, server DRAM will formally surpass mobile DRAM in terms of the portion of the overall supply within this year.

Qualcomm Technologies' 6th generation modem-to-antenna solution is the first ready to support 5G Advanced, the next phase of 5G. It introduces a new architecture, a new software suite and includes numerous world's first features to push the boundaries of connectivity including coverage, latency, power efficiency and mobility. Snapdragon X75 technologies and innovations empower OEMs to create next generation experiences across segments including smartphones, mobile broadband, automotive, compute, industrial IoT, fixed wireless access and 5G private networks.

Snapdragon X75 is the first Modem-RF System with a dedicated hardware tensor accelerator, Qualcomm 5G AI Processor Gen 2, enabling over 2.5 times better AI performance compared to Gen 1 and introduces Qualcomm 5G AI Suite Gen 2 with new AI-powered optimizations to achieve better speeds, coverage, mobility, link robustness and location accuracy. The Qualcomm 5G AI Suite features advanced AI-based capabilities including world's first sensor-assisted mmWave beam management and AI-enhanced GNSS Location Gen 2, which uniquely optimize Snapdragon X75 for superior 5G performance.

IonQ, Inc. (NYSE: IONQ), an industry leader in quantum computing, today announced plans to open the first known dedicated quantum computing manufacturing facility in the U.S., located in the suburbs of Seattle, Washington. The new facility will house IonQ's growing R&D and manufacturing teams, as they develop systems to meet continued customer demand. With public support from U.S. Senator Patty Murray (D-WA) - an early proponent of the CHIPS and Science Act - and Congresswoman Suzan DelBene, US representative from Washington's 1st congressional district,today's announcement is part of IonQ's broader intent to invest $1 billion through expansion in the Pacific Northwest over the next 10 years.

"IonQ making the decision to open the first ever quantum computing manufacturing facility in the country right here in Bothell is a very big deal—and it's great news for Washington state," said Senator Murray. "Opening this facility will absolutely help ensure Washington state continues to be a leader in innovation and cutting-edge technologies—but it also means jobs that will be an investment in our families and their futures. These are the kinds of investments that happen when we pass legislation like the CHIPS and Science Act to invest in American manufacturing and build the economy of the future right here at home."

Ventana Micro Systems Inc. today announced its Veyron family of high performance RISC-V processors. The Veyron V1 is the first member of the family, and the highest performance RISC-V processor available today. It will be offered in the form of high performance chiplets and IP. Ventana Founder and CEO Balaji Baktha will make the public announcement during his RISC-V Summit keynote today.

The Veyron V1 is the first RISC-V processor to provide single thread performance that is competitive with the latest incumbent processors for Data Center, Automotive, 5G, AI, and Client applications. The Veyron V1 efficient microarchitecture also enables the highest single socket performance among competing architectures.

HaptX Inc., the leading provider of realistic haptic technology, today announced the availability of pre-orders of the company's new HaptX Gloves G1, a ground-breaking haptic device optimized for the enterprise metaverse. HaptX has engineered HaptX Gloves G1 with the features most requested by HaptX customers, including improved ergonomics, multiple glove sizes, wireless mobility, new and improved haptic functionality, and multiplayer collaboration, all priced as low as $4,500 per pair - a fraction of the cost of the award-winning HaptX Gloves DK2.

"With HaptX Gloves G1, we're making it possible for all organizations to leverage our lifelike haptics," said Jake Rubin, Founder and CEO of HaptX. "Touch is the cornerstone of the next generation of human-machine interface technologies, and the opportunities are endless." HaptX Gloves G1 leverages advances in materials science and the latest manufacturing techniques to deliver the first haptic gloves that fit like a conventional glove. The Gloves' digits, palm, and wrist are soft and flexible for uninhibited dexterity and comfort. Available in four sizes (Small, Medium, Large, and Extra Large), these Gloves offer the best fit and performance for all adult hands. Inside the Gloves are hundreds of microfluidic actuators that physically displace your skin, so when you touch and interact with virtual objects, the objects feel real.

Apple today announced the next generation of Apple TV 4K—more powerful, entertaining, and affordable than ever, and offering impressive cinematic quality. Driven by the A15 Bionic chip that delivers faster performance and more fluid gameplay, the new Apple TV 4K features endless entertainment options for everyone to enjoy on the biggest screen in the home. HDR10+ support joins Dolby Vision on Apple TV 4K, so users can watch their favorite movies and TV shows in the best quality possible across more TVs. Running tvOS, the powerful and intuitive OS for the living room, and featuring the popular Siri Remote, Apple TV 4K simplifies the way users discover and enjoy their favorite content. Its seamless integration with other Apple devices and services magically transforms the living room in different ways for the entire family, while also adding convenience as a smart home hub.

The new Apple TV 4K is available in two configurations: Apple TV 4K (Wi-Fi), which offers 64 GB of storage; and Apple TV 4K (Wi-Fi + Ethernet), which offers support for Gigabit Ethernet for fast networking and streaming, Thread mesh networking protocol to connect even more smart home accessories, and twice the storage for apps and games (128 GB). Customers can order the new Apple TV 4K with Siri Remote today at a new starting price of $129, with availability beginning Friday, November 4.

Apple today announced the new iPad Pro with the M2 chip, delivering the ultimate combination of portability, versatility, and unbelievable performance. The new iPad Pro features a next-level Apple Pencil hover experience and superfast wireless connectivity, along with the world's most advanced mobile display, pro cameras, Face ID, Thunderbolt, and a four-speaker audio system. New features in iPadOS 16—including Stage Manager, full external display support, desktop-class apps, and Reference Mode—take pro workflows on iPad even further. Enabled by its advanced hardware and iPadOS 16, iPad Pro has an incredible ecosystem of powerful pro apps unlike any other device of its kind. The new iPad Pro is available to order starting today, and in stores beginning Wednesday, October 26.

"The next-generation iPad Pro pushes the boundaries of what's possible on iPad, bringing even more versatility, power, and portability to the ultimate iPad experience," said Greg Joswiak, Apple's senior vice president of Worldwide Marketing. "Powered by the M2 chip, the new iPad Pro features incredible performance and the most advanced technologies, including a next-level Apple Pencil hover experience, ProRes video capture, superfast wireless connectivity, and powerful iPadOS 16 features. There's nothing else like it."

XPG, a fast-growing provider of systems, components, and peripherals for gamers, Esports pros, and tech enthusiasts, today announces a new series of high performance power supply units. With the newly announced NVIDIA GeForce RTX 40 series GPUs, end users who plan on updating to these latest graphics cards will now need power supply units with a new type of connector. XPG actively works to provide the most up-to-date technology in all their products and happily upgrades/updates product specifications to meet the latest standards where possible. In order to meet the needs of gamers looking to upgrade soon, XPG has developed a new series of power supplies that are both ATX 3.0 compliant and PCIE 5.0 ready.

The 12VHPWR (12 + 4 pin) connector is now required for the next generation of top-tier gaming performance. Meaning you will need a compatible PSU to upgrade. In light of this new connector type and the updated Intel ATX 3.0 specifications, XPG CYBERCORE II series models will come equipped with this new connector type and an updated internal platform.

Towards the latter half of August, multiple EVGA employees involved in technical marketing and engineering had let us know privately that they were leaving the company for other ventures. When pushed further, several hinted towards some decisions being made by EVGA's management, including CEO Andrew Han, that would jeopardize their future. Some even went far enough to say they would share more in a few weeks time about how they felt exactly about their time there, the various issues that kept them from doing their best, and also that at least a couple of ex-employees were let go. TechPowerUp was doing due diligence in collecting the facts while keeping emotions aside from contacts who were understandably not in the best of moods, and one thing common across the board was there was something major coming up dealing with the EVGA GPU product line.

Today EVGA decided to throw a massive curve ball by formally announcing the company is canceling its plans to carry the next generation of graphics cards. Given EVGA's revenue sheets point to nearly 80% contribution from being an NVIDIA add-in card partner, this effectively also means an end to a long partnership with NVIDIA. The company's CEO confirmed as much to a few media channels citing poor margins and a challenging, stressful relationship that was no longer fruitful. There are no plans for EVGA to partner with AMD or Intel at this time when it comes to graphics cards and the company stressed they will continue to sell and support current-gen GPUs having retained enough units for RMA purposes too.

Opening a new era of neural graphics that marries AI and simulation, NVIDIA today announced the NVIDIA RTX 6000 workstation GPU, based on its new NVIDIA Ada Lovelace architecture. With the new NVIDIA RTX 6000 Ada Generation GPU delivering real-time rendering, graphics and AI, designers and engineers can drive cutting-edge, simulation-based workflows to build and validate more sophisticated designs. Artists can take storytelling to the next level, creating more compelling content and building immersive virtual environments. Scientists, researchers and medical professionals can accelerate the development of life-saving medicines and procedures with supercomputing power on their workstations—all at up to 2-4x the performance of the previous-generation RTX A6000.

Designed for neural graphics and advanced virtual world simulation, the RTX 6000, with Ada generation AI and programmable shader technology, is the ideal platform for creating content and tools for the metaverse with NVIDIA Omniverse Enterprise. Incorporating the latest generations of render, AI and shader technologies and 48 GB of GPU memory, the RTX 6000 enables users to create incredibly detailed content, develop complex simulations and form the building blocks required to construct compelling and engaging virtual worlds.

Last year Cooler Master unveiled a milestone in the history of contemporary technology: the very first small form factor power supply in the market with 850 W, V SFX Gold series. Today, Cooler Master takes the successor and pushes the limit to the maximum. Introducing V SFX Platinum, a series of small form factor power supply focused on high density and maximum power. While increasing the efficiency rate from Gold to Platinum, we also added ATX 3.0 and PCI-e Gen 5 connector so even with the Mini-ITX build; this will be your last stop when choosing the right power supply.

High Density / Performance-Focused
The V SFX Platinum comes with 2 different wattages: 1100 W and 1300 W targeting Mini-ITX system builders who wants to go bold with their setup, but doesn't have enough juice from the power supply. It also comes with a free SFX-ATX bracket that unlocks the limitations between each form factors, giving end-users more freedom and potential builds in the future. The V SFX Platinum are built with Full Bridge LLC design, quiet 92 mm silent fan and 100% Japanese capacitors. By adding PCIe Gen 5 connector, V SFX Platinum can unlock it's true potential and power up all Nvidia RTX 40 series GPU in the future.

The demand for data is insatiable, from 5G to the cloud to smart cities. As a society we want more autonomy, information to fuel our decisions and habits, and connection - to people, stories, and experiences.

To address these demands, the cloud infrastructure of tomorrow will need to handle the coming data explosion and the effective processing of evermore complex workloads … all while increasing power efficiency and minimizing carbon footprint. It's why the industry is increasingly looking to the performance, power efficiency, specialized processing and workload acceleration enabled by Arm Neoverse to redefine and transform the world's computing infrastructure.

The recent 80 Gbps USB4 Version 2.0 standard looks set to get company from Thunderbolt at 80 Gbps in the not too distant future, as Intel has demoed its next generation Thunderbolt hardware to the media during its Technology Tour 2022 in Israel. It doesn't appear that Intel showed too much of the upcoming technology, but the company did apparently show it running at 80 Gbps, or if you want to be picky, two times 40 Gbps in dual link mode, much in the same way USB4 Version 2.0 will operate.

According to Tom's Hardware, Intel hasn't set the marketing name in stone quite yet, so it's not clear what Intel will be calling its next generation of Thunderbolt. What is clear is that Intel will continue to deliver on its own Thunderbolt products, despite USB4 having almost feature parity with Thunderbolt, apart from some Intel platform specific features. What is also unknown, is a potential availability date for Intel's next generation of Thunderbolt, but an educated guess will be before USB4 Version 2.0 launches.

Today, AMD (NASDAQ: AMD) announced "together we advance_PCs," a livestream premiere to unveil next generation AMD PC products. Chair and CEO Dr. Lisa Su, CTO and EVP Mark Papermaster, and other AMD executives will present details on the latest "Zen 4" architecture that powers upcoming AMD Ryzen processors and the all new AM5 platform built around the latest technologies including DDR5 and PCIe 5.0, all designed to drive a new era of performance desktop PCs.

The show will premiere at 7 p.m. ET on Monday, August 29, on the AMD YouTube channel. A replay can be accessed a few hours after the conclusion of the event at AMD.com/Ryzen.

Following the recent passage of the U.S. CHIPS and Science Act last week, GlobalFoundries (Nasdaq: GFS) (GF), a global leader in feature-rich semiconductor manufacturing and Qualcomm Technologies, Inc. today announced they are more than doubling their existing strategic global long-term semiconductor manufacturing agreement previously entered into by GF's and Qualcomm's respective subsidiaries. Today's announcement secures wafer supply and commitments to support U.S.-based manufacturing through capacity expansion at GF's most advanced semiconductor manufacturing facility, in Malta, New York.

The announcement was made in Washington D.C. at a CEO Summit co-hosted by GF, Ford Motor Company, and Applied Materials, which included National Economic Council Director Brian Deese, Under Secretary of Defense for Acquisition & Sustainability Dr. William LaPlante, and National Security Council Senior Director for Technology & National Security, Tarun Chhabra underscoring the importance of domestic manufacturing to national and economic security. The Summit included CEOs and senior leaders from across the semiconductor supply chain from tool and wafer manufacturers to key suppliers to end users of chips manufactured in the U.S.