ASRock Z77 OC Formula Intel LGA 1155 33

ASRock Z77 OC Formula Intel LGA 1155 Review

The Board - Layout »


Yes, that seriously was what I found when I opened the shipping container. The box is elegant, with nothing but a Lamborghini-board, a couple of technology logos, and the board's name written in gold on the front. Flipping the box over, I found what looks like a dashboard with a big spedometer in the middle denoting 7 GHz. Pretty ominous number, that.

There's a flap on the front that lifts up, inside of which we find small descriptions of all the usual board features with hardware-based stuff up top and more software-oriented features listed below. Like the rest of the box, this is not a traditional features-layout.

I flipped open the box lid to find the ASRock Z77 OC Formula board staring back at me, nestled within the ASRock cushion of foam, something that no other boardmaker does with board wrappings, and a packaging choice I personally really like. The foam is perfectly fitted to the board in such a way that even the middle piece somehow sits snug, providing nearly an inch of foam on all sides of the board. Pulling the foam-wrapped board out, I found the goodie-box below, inside of which I found papers on one side and a felt-looking bag on the other side. A felt bag?


There's so much stuff here I had to take two pictures to show it all properly. A full list is below:
  • 1x Felt Bag
  • 1x User Manual
  • 1x Software and Application Guide
  • 2x Quick Software guide
  • 1x I/O Shield
  • 1x SLI Bridge
  • 1x USB 3.0 front or rear panel bracket
  • 2x MOLEX-to-SATA Power Cables
  • 9x OC Stands
  • 6x SATA 6 Gb/s cables with locking pins
  • 4x GELID GC-Extreme Thermal Compound
  • 1x OC Formula Case Badge
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