A Closer Look
The heatsink is a really simple piece of metal covered by fins to increase the surface area. Despite its basic design the heatsink does a great job at keeping the card cool.
All RV710 cards support CrossFire without a dongle. Data exchange between the two cards happens via the PCI-Express bus.
An external power connector is not needed. The card will draw all its power from the PCI-Express bus.
The GDDR3 memory chips are made by Samsung and carry the model number K4W1G1646D-EC12. With a latency of 1.2 ns they should be good for at least 833 MHz.
This is AMD's new RV710 graphics processor. It is made in a 55 nm process at TSMC using 242 million transistors. The die size is 73 mm² which makes it ones of the smallest GPUs on the market today.