A Look Inside and Component Analysis

Before reading this page, we strongly suggest a look at this article, which will help you understand a PSU's internal components better. Our main tool for the disassembly of the PSU is a Thermaltronics TMT-9000S soldering and rework station. It is of extreme quality and equipped with a matching de-soldering gun. We use an Andonstar HDMI Digital Microscope to identify the tiny parts.


This is an updated version of the Hydro G platform with some component and design changes in order to improve performance. On the primary side is a half-bridge design along with an LLC resonant converter, and the secondary side uses a synchronous design along with a couple of DC-DC converters for the generation of the minor rails. All electrolytic caps are provided by Japanese manufacturers, and the polymer caps are by Teapo, a pretty good Taiwanese manufacturer.


The secondary side doesn't have any proper heatsinks since the +12V FETs are installed to the solder side of the main PCB and are, as such, mostly cooled by the unit's chassis. The fewer and smaller the heatsinks on the secondary side, the more space is available for extra caps, which not only leads to better ripple filtering but a better transient response.


The AC receptacle holds an X and two Y caps. The other parts of the EMI filter, an X and two Y caps, two CM chokes, and an MOV, are installed on the main PCB.


An NTC thermistor limits inrush currents, and an electromagnetic relay bypasses the NTC thermistor once its job is done.


There is a single GBJ2506 bridge rectifier capable of handling enough amperes to support this PSU's capacity.


Under the PFC choke and on the solder side of the PCB is a Power Integrations SEN013DG IC; it is responsible for disconnecting the PFC converter when the PSU is in standby mode. This way, energy losses are restricted.


The APFC converter utilizes three Toshiba TK20A60W FETs and a CREE C3D06060A boost diode. The bulk caps are provided by Rubycon, and their combined capacity is 660 uF. We usually expect a capacity of over 700 uF for a 750 W PSU, but due to the proper design, the hold-up time is still much longer than the minimum allowed.


The daughter board holds an Infineon ICE2PCS02 IC. We find another IC at the front, a Fairchild KA393 dual differential comparator.


The 5VSB's PWM controller is a Power Integrations SC1226K, and the FET that regulates the rail is an International Rectifier IRFR1018E. FSP created one of the most efficient 5VSB circuits we have evaluated so far.


The main FETs are two STMicroelectronics STFI26NM60Ns. They are driven by a Silicon Labs Si8233BD.


The LLC resonant converter is the usual suspect, a Champion CM6901 IC.


The +12V FETs are four Toshiba TPHR8504PLs, installed on the solder side of the main PCB. Two small heatsinks on the primary side of the PCB cool down these FETs, though the main part in their cooling is being done by the chassis.


The electrolytic filtering caps are mainly provided by Chemi-Con and belong to their KZE and KY lines. Some Rubycon caps are also used. All of the above are rated at 105°C. The polymer caps are by Teapo.


The VRMs that handle the minor rails are installed on a vertical board. Their common PWM controller is an Anpec APW7159C, and a total of six Infineon BSC0901NS FETs are used by both rails.


The supervisor IC is a SITI PS223.


The modular board holds a number of Teapo caps and two electrolytic Chemi-Con caps for an extra ripple-filtering layer. This board is connected to the main PCB through several bus bars in order to minimize voltage drops, which restricts energy losses.


Soldering quality is good; however, some component leads could be shorter.


FSP uses a well-made fluid dynamic bearing fan by Protechnic Electric. Its model number is MGA13512XF-A25 (135 mm, 12 V, 0.38 A), and it is driven by a relaxed fan-speed profile.