Amid all the attention the next-generation "Lion Cove" P-cores powering the upcoming "Lunar Lake" and "Arrow Lake" microarchitectures get as they compete with AMD's "Zen 5," it's easy to lose sight of the next-generation "Skymont" E-cores that will feature in both the upcoming Intel microarchitectures, and as standalone cores in the "Twin Lake" low-power processor. Pictures from an Intel presentation, possibly to PC OEMs, got leaked to the web. These are just thumbnails, we can't see the whole slides, but the person who took the pictures captioned them in a now-deleted social media post on the Chinese microblogging platform Weibo.

And now, the big reveal—the "Skymont" E-core is said to offer a double-digit IPC gain over the "Crestmont" E-core powering the current "Meteor Lake" processor, which in itself posted a roughly 4% IPC gain over the "Gracemont" E-cores found in the "Raptor Lake" and "Alder Lake" microarchitectures. Such an IPC gain over "Gracemont" should make the "Skymont" E-core match the IPC of the "Sunny Cove" or "Willow Cove" P-cores powering the "Ice Lake" and "Tiger Lake" microarchitectures, respectively, which were both within the 90th percentile of the AMD "Zen 3" core in IPC.

Starting Q3 2024 in time for the holiday season, Intel's upcoming client processors (code-named Lunar Lake) will power more than 80 new laptop designs across more than 20 original equipment manufacturers, delivering AI performance at a global scale for Copilot+ PCs. Lunar Lake will get the Copilot+ experiences, like Recall, via an update when available. Building on the success of Intel Core Ultra processors and with the addition of Lunar Lake, Intel will ship more than 40 million AI PC processors this year.

"With breakthrough power efficiency, the trusted compatibility of x86 architecture and the industry's deepest catalog of software enablement across the CPU, GPU and NPU, we will deliver the most competitive joint client hardware and software offering in our history with Lunar Lake and Copilot+," said Michelle Johnston Holthaus, Intel executive vice president and general manager of the Client Computing Group.

Intel has prepared the Core Ultra 5-238V, a Lunar Lake-MX CPU that integrates 32 GB of LPDDR5X memory into the CPU package. This new design represents a significant departure from the traditional approach of using separate memory modules, promising enhanced performance and efficiency, similar to what Apple is doing with its M series of processors. The Core Ultra 5-238V is the first of its kind for Intel to hit mass consumers. Previous attempt was with Lakefield, which didn't take off, but had advanced 3D stacked Foveros packaging. With 32 GB of high-bandwidth, low-power LPDDR5X memory directly integrated into the CPU package, the Core Ultra 5-238V eliminates the need for separate memory modules, reducing latency and improving overall system responsiveness. This seamless integration results in faster data transfer rates and lower power consumption with LPDDR5X memory running at 8533 MT.

Applications that demand intensive memory usage, such as video editing, 3D rendering, and high-end gaming, will be the first to experience performance gains. Users can expect smoother multitasking, quicker load times, and more efficient handling of memory-intensive tasks. The Core Ultra 5-238V is equipped with four big Lion Cove and four little Skymont cores, in combination with seven Xe2-LPG cores based on Battlemage GPU microarchitecture. The bigger siblings to Core Ultra 5, the Core Ultra 7 series, will feature eight Xe2-LPG cores instead of seven, with the same CPU core count, while all of them will run the fourth generation NPU.

Intel is readying the new N250 "Twin Lake" line of low-power processors that succeed the N200 series "Alder Lake-N" series. These are chips built on the latest process node Intel is using for its Core and Xeon processors, but only features E-cores (efficiency codes) from the latest microarchitecture. Chips from the N200 series are popular with low-cost notebooks, thin-clients, embedded systems, kiosks and point-of-sale terminals, NAS, and consumer electronics. "Twin Lake" is codename for the new processor series, these are likely monolithic processor dies that use a client ringbus layout, and one E-core cluster that makes up the compute muscle.

While "Alder Lake-N" is powered by "Gracemont" E-cores, the new "Twin Lake" chips are expected to feature "Skymont" E-core clusters. Intel is expected to debut "Skymont" E-cores with its upcoming Core Ultra 200V series "Lunar Lake-MX" mobile processors. "Skymont" is technically two generations ahead of "Gracemont," as Intel introduced the "Crestmont" cores with its current Core Ultra 100 "Meteor Lake" processor family. Not a lot is known about "Skymont" at this point, except that it's expected to feature IPC increases, and perform close to Intel's P-cores from 3-4 generations ago, such as the "Willow Cove" cores powering the 11th Gen Core "Tiger Lake" processors, looking at past trends of the "Gracemont" core performing similar to a "Skylake" core with HTT disabled.

Intel's CEO, Pat Gelsinger, has confirmed that the upcoming 18A process of the Panther Lake CPU generation is on schedule for a mid-2025 release, which aligns with the initial projection. This development marks a significant milestone in the company's ongoing efforts to integrate AI capabilities into its processors. The mid-2025 release date is expected to follow the debut of Intel's Arrow Lake process in late 2024 or early 2025, a release that holds the promise of significant advancements in AI computing. During Intel's Q1 2024 Quarterly Results, Gelsinger expressed confidence in the company's AI capabilities, stating that the Core Ultra platform currently delivers leadership AI performance and that the next-generation platforms, Lunar Lake and Arrow Lake, will launch later this year, tripling AI performance. He also mentioned that the Panther Lake generation, set to release in 2025, will grow AI performance up to an additional 2x.

The Panther Lake generation represents the culmination of three generations of work in a short time and is expected to continue Intel's iterative approach. This transition is marked by a shift from a hybrid architecture, a combination of different types of processors, to a disaggregated die, where different components of the processor are separated, as AI computing becomes increasingly prominent. This strategic move is aimed at optimizing AI performance and flexibility. This marks the third generation of the Intel Core Ultra series, following Ultra 100 (Meteor Lake), Ultra 200 (Arrow Lake), and Lunar Lake (200V). Intel's release strategy mirrors the pattern set by the Hybrid Architecture, with Alder Lake debuting in 2021, followed by Raptor Lake in 2022, and a refreshed Raptor Lake released last year to bridge the gap until LGA 1851 was ready. However, Intel's roadmap has seen adjustments in the past, such as the initial promise of an Arrow Lake release before the end of 2024, which was later retracted. The mid-2025 release of Panther Lake aligns with rumors of Arrow Lake's late 2024 or early 2025 debut, suggesting that the 18A process CPU generation could debut several months after Arrow Lake.

Hardware leaker Raichu, known for accurately predicting Intel's moves, has unveiled intriguing details about the company's forthcoming desktop CPU lineup. According to the leaks, Intel is supposed to introduce a big shift in its desktop CPU naming convention with the arrival of the Core Ultra 200 series, codenamed Arrow Lake-S. This next-generation lineup promises to deliver one of the most significant performance leaps for desktop processors in recent years, marking a substantial departure from Intel's current naming strategy—a change that hasn't been witnessed in over a decade. The Core Ultra 200 series is expected to encompass a diverse range of tiers and variants, catering to various user needs. This includes the overclockable K models for enthusiasts, F variants without integrated graphics, and potentially low-power T models for energy-efficient SKUs. According to Raichu's leaks, the unlocked K-Series models are rumored to include the high-end Core Ultra 9 285K, the mid-range Core Ultra 7 265K, and the budget-friendly Core Ultra 5 245K. While the absence of a 290K part has raised eyebrows, these names resemble Intel's mobile CPU naming conventions.

To enjoy the Core Ultra 200 series, users will need to upgrade to new motherboards featuring the 800-series chipsets and the LGA-1851 socket. Unlike the Core Ultra 200V Lunar Lake models for mobile devices, details about the desktop version have remained scarce, shrouding the impending launch in an air of mystery. While Raichu's leaks carry significant weight, it's essential to approach such information cautiously. There's a possibility that SKUs like the 290K may still be introduced, as a new KS version, aligning with Intel's traditional naming conventions. The Core Ultra 200 series promises to cater to a wide range of desktop users, from the performance-hungry enthusiasts eyeing the Core Ultra 9 285K to budget-conscious consumers seeking the value proposition of the Core Ultra 5 245K. The Core Ultra 7 265K is expected to strike a balance between performance and affordability, targeting the mid-range segment. As more leaks and official information surface, we will continue to provide updates on this release from Intel.

Intel at its VISION conference, confirmed that its next-generation processor for the ultraportable and thin-and-light segments, the Core Ultra "Lunar Lake," will feature an over four-fold increase in NPU performance, which will be as fast as 45 TOPS. This is a significant figure, as Microsoft recently announcedthat Copilot will perform several tasks locally (on the device), provided it has an NPU capable of at least 40 TOPS. The current AI Boost NPU found in Core Ultra "Meteor Lake" processor is no faster than 10 TOPS, and the current AMD Ryzen 8040 series features a Ryzen AI NPU with 16 TOPS on tap. AMD's upcoming Ryzen "Strix Point" processor is rumored to feature a similar 40 TOPS-class NPU performance as "Lunar Lake."

Intel also confirmed that notebooks powered by Core Ultra "Lunar Lake" processors will hit the shelves by Christmas 2024 (December). These notebooks will feature not just the 45 TOPS NPU, but also debut Intel's Arc Xe2 "Battlemage" graphics architecture as the processor's integrated graphics solution. With Microsoft's serious push for standardizing AI assistants, the new crop of notebooks could also feature Copilot as a fixed-function button on their keyboards, similar to the Win key that brings up the Start menu.

Microsoft, Intel, and AMD are attempting to jumpstart demand in the PC industry again, under the aegis of the AI PC—devices with native acceleration for AI workloads. Both Intel and AMD have mobile processors with on-silicon NPUs (neural processing units), which are designed to accelerate the first wave of AI-enhanced client experiences on Windows 11 23H2. Microsoft's bulwark with democratizing AI has been Copilot, as a licensee of Open AI GPT-4, GPT-4 Turbo, Dali, and other generative AI tools from the Open AI stable. Copilot is currently Microsoft's most heavily invested application, with its most capital and best minds mobilized to making it the most popular AI assistant. Microsoft even pushed for the AI PC designator to PC OEMs, which requires them to have a dedicated Copilot key akin to the Start key (we'll see how anti-competition regulators deal with that).

The problem with Microsoft's tango with Intel and AMD to push AI PCs, is that Copilot doesn't really use an NPU, not even at the edge—you input a query or a prompt, and Copilot hands it over to a cloud-based AI service. This is about to change, with Microsoft announcing that Copilot will be able to run locally on AI PCs. Microsoft identified several kinds of Copilot use-cases that an NPU can handle on-device, which should speed up response times to Copilot queries, but this requires the NPU to have at least 40 TOPS of performance. This is a problem for the current crop of processors with NPUs. Intel's Core Ultra "Meteor Lake" has an AI Boost NPU with 10 TOPS on tap, while the Ryzen 8040 "Hawk Point" is only slightly faster, with a 16 TOPS Ryzen AI NPU. AMD has already revealed that the XDNA 2-based 2nd Generation Ryzen AI NPU in its upcoming "Strix Point" processors will come with over 40 TOPS of performance, and it stands to reason that the NPUs in Intel's "Arrow Lake" or "Lunar Lake" processors are comparable in performance; which should enable on-device Copilot.

Intel Core Ultra "Lunar Lake-MX" will be the company's bulwark against Apple's M-series Pro and Max chips, designed to power the next crop of performance ultraportables. The MX codename extension denotes MoP (memory-on-package), which sees stacked LPDDR5X memory chips share the package's fiberglass substrate with the chip, to conserve PCB footprint, and give Intel greater control over the right kind of memory speed, timings, and power-management features suited to its microarchitecture. This is essentially what Apple does with its M-series SoCs powering its MacBooks and iPad Pros. Igor's Lab scored the motherlode on the way Intel has restructured the various components across its chiplets, and the various I/O wired to the package.

When compared to "Meteor Lake," the "Lunar Lake" microarchitecture sees a small amount of "re-aggregation" of the various logic-heavy components of the processor. On "Meteor Lake," the CPU cores and the iGPU sat on separate tiles—Compute tile and Graphics tile, respectively, with a large SoC tile sitting between them, and a smaller I/O tile that serves as an extension of the SoC tile. All four tiles sat on top of a Foveros base tile, which is essentially an interposer—a silicon die that facilitates high-density microscopic wiring between the various tiles that are placed on top of it. With "Lunar Lake," there are only two tiles—the Compute tile, and the SoC tile.

Samsung's next-generation Galaxy Book 5 Pro premium thin-and-light notebook is expected to incorporate Intel's upcoming Core Ultra "Lunar Lake" processor, and Arc Xe2 graphics, which "Lunar Lake" implements with its iGPU solution. Intel is expected to debut both "Lunar Lake" and "Battlemage" toward the end of 2024. A prototype of this Samsung notebook is already up and running, probably using engineering samples of the two chips. It came to light as keen-eyed enthusiasts noticed new benchmark entries on the SiSoft SANDRA online database. Here, the processor is shown featuring an 8-core (4P+4E) configuration, while the iGPU features a 4 Xe2 core configuration, which works out to 512 unified shaders. The P-cores of the CPU tick at 2.80 GHz, the E-cores at 1.65 GHz, and the iGPU at 1.85 GHz.

There is some confidence behind removing HTT (Hyper-Threading technology) for the P-cores of its upcoming processor generations. Apparently "Lunar Lake" 17 W U-segment processors offer a substantial multithreaded performance gain of almost 50% over the current-generation "Meteor Lake," enabling Intel to do away with the power- or cache overheads that come with HTT. "Lunar Lake" will be Intel's third microarchitecture powering mobile processors under the Core Ultra brand; and its U-segment SKUs meant for ultraportables will come with processor base power values of 17 W. Intel will probably revise its platform specifications for the U-segment to denote 17 W, up from the current 15 W. Bionic Squash, a reliable source with Intel leaks, suggests so. The processors will come with a configurable base power of up to 30 W.

Intel "Lunar Lake" microarchitecture has a lot in common with the upcoming "Arrow Lake." For starters, both microarchitectures use the same combination of "Lion Cove" P-core architecture, and "Skymont" E-core architecture; however "Lunar Lake" comes with changes in the core-configuration, and the use of more advanced foundry nodes for some of its tiles. "Lunar Lake," much like "Meteor Lake," comes with a design priority for mobile platforms, which is why Intel is planning to launch this shortly after "Arrow Lake," with some reports even speaking of a late-2024 debut for the U-segment.

Intel CEO Pat Gelsinger engaged with press/media representatives following the conclusion of his IFS Direct Connect 2024 keynote speech—when asked about Team Blue's ongoing relationship with TSMC, he confirmed that their manufacturing agreement has advanced from "5 nm to 3 nm." According to a China Times news article: "Gelsinger also confirmed the expansion of orders to TSMC, confirming that TSMC will hold orders for Intel's Arrow and Lunar Lake CPU, GPU, and NPU chips this year, and will produce them using the N3B process, officially ushering in the Intel notebook platform that the outside world has been waiting for many years." Past leaks have indicated that Intel's Arrow Lake processor family will have CPU tiles based on their in-house 20A process, while TSMC takes care of the GPU tile aspect with their 3 nm N3 process node.

That generation is expected to launch later this year—the now "officially confirmed" upgrade to 3 nm should produce pleasing performance and efficiency improvements. The current crop of Core Ultra "Meteor Lake" mobile processors has struggled with the latter, especially when compared to rivals. Lunar Lake is marked down for a 2025 launch window, so some aspects of its internal workings remain a mystery—Gelsinger has confirmed that TSMC's N3B is in the picture, but no official source has disclosed their in-house manufacturing choice(s) for LNL chips. Wccftech believes that Lunar Lake will: "utilize the same P-Core (Lion Cove) and brand-new E-Core (Skymont) core architecture which are expected to be fabricated on the 20A node. But that might also be limited to the CPU tile. The GPU tile will be a significant upgrade over the Meteor Lake and Arrow Lake CPUs since Lunar Lake ditches Alchemist and goes for the next-gen graphics architecture codenamed "Battlemage" (AKA Xe2-LPG)." Late January whispers pointed to Intel and TSMC partnering up on a 2 nanometer process for the "Nova Lake" processor generation—perhaps a very distant prospect (2026).

HXL (@9550pro) has highlighted an intriguing pinned post on the Chinese Zhihu community site—where XZiar, a self described "Central Processing Unit (CPU) expert," has shared a very fuzzy/low quality screenshot of a Windows Task Manager session. The information on display indicates that a "Genuine Intel(R) 0000 1.0 GHz" processor was in use—perhaps a very early Lunar Lake (LNL) engineering sample (ES1). XZiar confirmed the pre-release nature of the onboard chip, and teased its performance prowess: "It's good to use the craftsmanship that others have stepped on. It can run 2.8 GHz with only A1 step, and it is very smooth."

The "A1" designation implies that the leaked sample is among the first LNL processor prototypes to exit manufacturing facilities—Intel previewed its "Lunar Lake-MX" SoC package to press representatives last November. XZiar's followers have pored over the screenshot and ascertained that the leaked example sports a "8-core + 8-thread, without Hyperthreading, 4P+4LPE" configuration. Others were confused by the chip's somewhat odd on-board cache designations—L1: 836 KB, L2: 14 MB and L3: 12 MB—XZiar believes that prototype's setup "is obviously not up to par," when a replier compares the spec to an N300 series processor. It is theorized that Windows Task Manager is simply not fully capable of detecting the sample's full makeup, but XZiar reckons that 12 MB of L3 cache is the correct figure.

Intel appears to working on an intriguing next generation adaptive sharpening filter—as revealed in mid-week published patch notes. Lunar Lake's display engine seems to be the lucky recipient here—its Xe2 "Battlemage" graphics architecture is expected to debut later this year. Second generation Intel Arc integrated graphics solutions have been linked to mobile Lunar Lake (LNL) processors—driver enablement was uncovered by Phoronix last September. The notes reveal that Team Blue is exploring a more intelligent approach to improving visual enhancements across games and productivity applications.

Author, Nemesa Garg (an engineer at Intel India) stated: "Many a times images are blurred or upscaled content is also not as crisp as original rendered image. Traditional sharpening techniques often apply a uniform level of enhancement across entire image, which sometimes result in over-sharpening of some areas and potential loss of natural details. Intel has come up with Display Engine based adaptive sharpening filter with minimal power and performance impact. From LNL onwards, the Display hardware can use one of the pipe scaler for adaptive sharpness filter. This can be used for both gaming and non-gaming use cases like photos, image viewing. It works on a region of pixels depending on the tap size."

Intel is reportedly pitching Microsoft to work on an "all American" semi-custom SoC for Microsoft's next Xbox generation that succeeds the Series X/S. The company's main pitch to Microsoft is the fact that the chip would be made entirely in the US, including its silicon fabrication and packaging. Microsoft currently relies on AMD for its SoC, which combines an AMD "Zen 2" CPU with a powerful RDNA2 iGPU that meets DirectX 12 Ultimate requirements.

Intel's semi-custom chip could be functionally the same, albeit based on its next generation CPU and graphics microarchitectures. Strengthening Intel's case is the fact that it now has a contemporary high performance gaming graphics architecture in Xe "Alchemist," and is on course to launch its successor, the Xe² "Battlemage," later this year. The company also made huge strides with chiplet-based SoCs as demonstrated with "Meteor Lake." Intel's semi-custom SoC for Microsoft could combine any of its upcoming CPU microarchitectures, such as "Lunar Lake," or "Panther Lake," and an iGPU based on "Battlemage" or Xe³ "Celestial." This chip could also integrate a next generation NPU if the platform calls for one. This wouldn't be Intel's first rodeo with powering a console; in fact the very first Microsoft Xbox was powered by a Pentium 3 "Coppermine" CPU, paired with a discrete GeForce 3 GPU supplied by NVIDIA.

Intel, Microsoft, and a fabless semiconductor company making analog, mixed-signal, and audio DSP, Cirrus Logic, have collaborated on a new reference laptop design to showcase the upcoming Lunar Lake mobile CPUs. The goal is to enable "cool, quiet, and high-performance" laptops that push the boundaries of efficiency, thickness, and acoustics. The reference design incorporates three key components from Cirrus Logic - the CP9314 power converter chip, CS42L43 audio codec, and CS35L56 amplifier. The CP9314 is the most critical element, using advanced power conversion technology to improve Lunar Lake's power efficiency significantly. This enables thinner and quieter laptops with longer battery life. The codec and amplifier chips also play a role, providing high-quality audio with next-generation features like spatial audio support.

Together, these Cirrus Logic components aim to highlight Lunar Lake's capabilities for efficiency, performance, and immersive experiences in a thin and light form factor. While details remain scarce on the Lunar Lake CPUs themselves, they are expected to arrive later this year, likely in the second half. If the reference laptops live up to their promises, Lunar Lake could help Intel regain leadership in mobile computing efficiency, which has been lacking since the introduction of Apple's M series SoCs, which have superior battery life. With expert collaboration from Microsoft and Cirrus Logic on the peripheral hardware and software, Lunar Lake may usher in a new generation of cool, quiet, and powerful laptops.

Pat Gelsinger, CEO of Intel Corporation, has outlined future performance expectations for the company's Core range of processors. In a recent fourth quarter 2023 earnings call he declared: "The Core Ultra platform delivers leadership AI performance today with our next-generation platforms launching later this year, Lunar Lake and Arrow Lake tripling our AI performance. In 2025 with Panther Lake, we will grow AI performance up to an additional 2x." Team Blue's Intel Core Ultra "Meteor Lake" mobile processors arrived right at the tail end of last year, as a somewhat delayed answer to AMD's Ryzen 7040 "Phoenix" APU series—both leveraging their own AI-crunching NPU technologies. Gelsinger believes that the launch of Lunar Lake and Arrow Lake Core product lines will bring significant (3x) AI processing improvements over Meteor Lake. He seemed to confident in a delay-free release schedule for the new year and beyond: "We are first in the industry to have incorporated both gate-all-around and backside power delivery in a single process node, the latter unexpected two years ahead of our competition. Arrow Lake, our lead Intel 20A vehicle will launch this year."

He proceeded to gush about their next node advancement: "Intel 18A is expected to achieve manufacturing readiness in second half 2024, completing our five nodes in four year journey and bringing us back to process leadership. I am pleased to say that Clearwater Forest, our first Intel 18A part for servers has already gone into fab and Panther Lake for clients will be heading into Fab shortly." Industry experts posit that Core "Panther Lake" parts could borrow elements from the next generation Xeon "Clearwater Forest" efficiency-focused family—possibly the latter's "Darkmont" E-cores, to accompany "Cougar Cove" P-cores. The Intel CEO is quite excited about the manufacturing outlay for 2025: "I'll just say, hey, we look at this every single day and we're scrutinizing carefully our progress on 18A. And obviously the great news that we just described those Clearwater Forest taping out, that gives us a lot of confidence that 18A is healthy. That's a major product for us. Panther Lake following that shortly."

According to sources close to Seoul Economy, and reported by DigiTimes, Intel has reportedly chosen Samsung as a supplier for its next-generation Lunar Lake processors, set to debut later this year. The report notes that Samsung will provide LPDDR5X memory devices for integration into Intel's processors. This collaboration could be a substantial win for Samsung, given Intel's projection to distribute millions of Lunar Lake CPUs in the coming years. However, it's important to note that this information is based on a leak and has not been officially confirmed. Designed for ultra-portable laptops, the Lunar Lake-MX platform is expected to feature 16 GB or 32 GB of LPDDR5X-8533 memory directly on the processor package. This on-package memory approach aims to minimize the platform's physical size while enhancing performance over traditional memory configurations. With Lunar Lake's exclusive support for on-package memory, Samsung's LPDDR5X-8533 products could significantly boost sales.

While Samsung is currently in the spotlight, it remains unclear if it will be the sole LPDDR5X memory provider for Lunar Lake. Intel's strategy involves selling processors with pre-validated memory, leaving the door open for potential validation of similar memory products from competitors like Micron and SK Hynix. Thanks to a new microarchitecture, Intel has promoted its Lunar Lake processors as a revolutionary leap in performance-per-watt efficiency. The processors are expected to utilize a multi-chipset design with Foveros technology, combining CPU and GPU chipsets, a system-on-chip tile, and dual memory packages. The CPU component is anticipated to include up to eight cores, a mix of four high-performance Lion Cove and four energy-efficient Skymont cores, alongside advanced graphics, cache, and AI acceleration capabilities. Apple's use of on-package memory in its M-series chips has set a precedent in the industry, and with Intel's Lunar Lake MX, this trend could extend across the thin-and-light laptop market. However, systems requiring more flexibility in terms of configuration, repair, and upgrades will likely continue to employ standard memory solutions like SODIMMs and/or the new CAMM2 modules that offer a balance of high performance and energy efficiency.

Intel in its 2024 International CES presentation, unveiled its two new upcoming client microarchitectures, "Arrow Lake" and "Lunar Lake." Michelle Johnston Holthaus, EVP and GM of Intel's client computing group (CCG), in her keynote address, held up a next-generation Core Ultra "Lunar Lake" chip. This is the Lunar Lake-MX package, with MOP (memory on package). You have a Foveros base tile resembling "Meteor Lake," with on-package LPDDR5x memory stacks. With "Lunar Lake," Intel is reorganizing components across its various Foveros tiles—the Compute and Graphics tiles are combined into a single tile built on an Intel foundry node that's possibly the Intel 20A (we have no confirmation); and a smaller SoC tile that has all of the components of the current "Meteor Lake" SoC tile, and is possibly built on a TSMC node, such as N3.

"Lunar Lake" will pick up the mantle from "Meteor Lake" in the U-segment and H-segment (that's ultraportables, and thin-and-light), when it comes out later this year (we predict in the second half of 2024), with Core Ultra 2-series branding. Intel also referenced "Arrow Lake," which could finally bring light to the sluggish pace of development in its desktop segment. When it comes out later this year, "Arrow Lake" will debut Socket LGA1851, "Arrow Lake" will bring the AI Boost NPU to the desktop, along with Arc Xe-LPG integrated graphics. The biggest upgrade of course will be its new Compute tile, with its "Lion Cove" P-cores, and "Skymont" E-cores, that possibly offer a large IPC uplift over the current combination of "Raptor Cove" and "Gracemont" cores on the "Raptor Lake" silicon. It's also possible that Intel will try to bring "Meteor Lake" with its 6P+8E Compute tile, Xe-LPG iGPU, and NPU, to the LGA1851 socket, as part of some mid-range processor models. 2024 will see a Intel desktop processor based on a new architecture, which is the big takeaway here.

FinalWire Ltd. today announced the immediate availability of AIDA64 Extreme 7.00 software, a streamlined diagnostic and benchmarking tool for home users; the immediate availability of AIDA64 Engineer 7.00 software, a professional diagnostic and benchmarking solution for corporate IT technicians and engineers; the immediate availability of AIDA64 Business 7.00 software, an essential network management solution for small and medium scale enterprises; and the immediate availability of AIDA64 Network Audit 7.00 software, a dedicated network audit toolset to collect and manage corporate network inventories.

The new AIDA64 update introduces a revamped user interface with a configurable toolbar, as well as AVX-512 accelerated benchmarks for AMD Threadripper 7000 processors, AVX2 optimized benchmarks for Intel Meteor Lake processors, and supports the latest AMD and Intel CPU platforms as well as the new graphics and GPGPU computing technologies by AMD, Intel and NVIDIA.

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During the Q3 2023 earnings call, Intel CEO Pat Gelsinger was answering some questions from analysts regarding the company's future and its position on emerging competition. One of the most significant problems the company could face is the potential Arm-based chip development not coming from x86 vendors like Intel and AMD. Instead, there could be fierce competition in the near future with the recently announced Qualcomm Snapdragon Elite X, possible NVIDIA Arm-based PC processor, and in the future, even more Arm CPU providers that Intel would have to compete against in the client segment. During the call, Pat Gelsinger noted that "Arm and Windows client alternatives, generally, they've been relegated to pretty insignificant roles in the PC business. And we take all competition seriously. But I think history as our guide here, we don't see these potentially being all that significant overall. Our momentum is strong. We have a strong roadmap."

Additionally, the CEO noted: "When thinking about other alternative architectures like Arm, we also say, wow, what a great opportunity for our foundry business." If the adoption of Arm-based CPUs for Windows PCs becomes more present, Intel plans to compete with its next-generation x86 offerings like Meteor Lake, Arrow Lake, Lunar Lake, and even Panther Lake in the future. As stated, the CEO expects the competition to manufacture its chips at Intel's foundries so that Intel can provide a platform for these companies to serve the PC ecosystem.

Intel's next-generation Lunar Lake processor has appeared in the SiSoftware Sandra benchmarking suite, and the online database has revealed many details, thanks to a spotting by @Olrak29 of X/Twitter. Considering Intel's Meteor Lake is still two months away from its launch, the presence of Lunar Lake's benchmarks is indeed intriguing. Interestingly, Intel showcased a Lunar Lake laptop at the Intel Innovation 2023 event, and this SiSoft entry might be related to that demo. The data from SiSoft details the system as a "Genuine Inte l(R) 0000 1.00 GHz (5M 20c 3.91 GHz + 2.61 GHz, 3.3 GHz IMC, 4x 2.5 MB + 4 MB L2, 2x 8 MB L3)," hinting at a "Lunar Lake Client System (Intel LNL-M LP5 RVP1)." Deciphering these details, the Lunar Lake system adopts a 4+4 core configuration, utilizing a mix of Lion Cove and Skymont architecture cores tailored for performance and efficiency.

Moreover, the benchmark report pegs this CPU as a low-power laptop variant with a 17 W TDP. While it operates at a 1.0 GHz base frequency, it reached a speed of 3.91 GHz during the testing. However, these numbers should be taken cautiously since it's likely an engineering sample. Cache details are outlined, suggesting a 2.5 MB L2 cache per P-core, an added 4 MB L2 cache for E-cores, and a 16 MB L3 cache. No details on the integrated GPU were revealed, although it's anticipated that Lunar Lake will house Intel's Xe2-LPG graphics and LPDDR5 system memory. Intel has shared that Lunar Lake is scheduled for a 2024 release in mobile/laptop devices, targeting performance-per-watt leadership. Arrow Lake processors, catering to desktops, might share the core architecture and are anticipated to launch around the same timeframe.

Team Blue's marketing team has kicked into hype mode—Meteor Lake is launching at the tail end of 2023—with a shift in naming conventions comes another rebranding of internal technologies. The previously identified versatile processing unit (VPU) is now going under a different moniker: "Intel will usher in the age of the AI PC with the upcoming Intel Core Ultra processors, code-named Meteor Lake, featuring Intel's first integrated neural processing unit, or NPU, for power-efficient AI acceleration and local inference on the PC. Intel confirmed Core Ultra will launch Dec. 14." Michael Larabel, principal author at Phoronix, has noticed that newly updated versions of the Linux kernel have the "IVPU" accelerator driver bundled in. This will: "support Meteor Lake's VPU/NPU, while a patch is pending to extend that support for next-generation Arrow Lake processors."

In his opinion, there are some shared aspects across the two CPU generations: "Intel's Arrow Lake NPU appears very similar to that of Meteor Lake with the driver enablement coming down to adding new PCI IDs...(with) this patch adding the new Arrow Lake PCI IDs to the existing Meteor Lake driver code paths for this DRM accelerator driver is all that's needed to enable the VPU." Team Blue jumped two generations ahead at this week's Innovation event—Lunar Lake showed up in a live demo. Larabel believes that this late 2024 CPU family will revolve the dial to a greater degree: "The VPU/NPU with Lunar Lake brings more significant changes with the open-source driver changes already underway there. With Lunar Lake is the new VPU4 IP and the Linux 6.6 kernel with its updated IVPU driver already has initial support there."

Intel at the 2023 InnovatiON event surprised audiences with a live demo of a reference notebook powered by a Core "Lunar Lake" processor. What's surprising about this is that "Lunar Lake" won't come out until 2025 (at least), and succeeds not just the upcoming "Meteor Lake" architecture, but also its succeeding "Arrow Lake," which debuts in 2024. Intel is expected to debut "Meteor Lake" some time later this year. What's also surprising is that Intel has proven that the Intel 18A foundry node works. The Compute tile of "Lunar Lake" is expected to be based on Intel 18A, which is four generations ahead of the current Intel 7, which will be succeeded by Intel 4, Intel 3, and Intel 20A along the way.

The demo focused on the generative AI capabilities of Intel's third generation NPU, the hardware backend of AI Boost. Using a local session of a tool similar to Stable Diffusion, the processor was made to generate the image of a giraffe wearing a hat; and a GPT program was made to pen the lyrics of a song in the genre of Taylor Swift from scratch. Both tasks were completed on stage using the chip's NPU, and in timeframes you'd normally expect from discrete AI accelerators or cloud-based services.

Thanks to the latest report from Phoronix, we know that Intel is working on supporting the latest "Xe2" graphics architecture for their upcoming Lunar Lake processors. Today, the latest enablement comes in the Mesa Linux drivers. By employing a new technique that allows for importing prior-generation XML files within the Intel Mesa driver code, Intel engineers have managed to streamline the overall file size. This is significant not just for the efficiency it brings but also because it signifies the beginning of work on enabling Xe2 graphics support. It suggests a thoughtful approach to building upon existing architectures, making it easier to adapt and evolve the software support for each new generation of Intel graphics.

Even though we are at the early stage and Lunar Lake is far away, the progress on Xe2 doesn't stop at Mesa driver changes. There is already some work at the kernel level, and new merge requests for draft compiler changes and shader compiler patches have also been spotted. This proactive development strategy positions Intel well in offering robust open-source graphics support for Linux, and it sends a strong signal to the developer community about Intel's dedication to the platform. After the Linux kernel driver works, this Mesa driver will enable better OpenGL/Vulkan API compatibility, so Lunar Lake arrives with proper software support.