Lenovo started offering the Ryzen 9 7900 and Ryzen 7 7700 processors as options for its prebuilt desktops, confirming that the 7900 and 7700 will be OEM-exclusives, at least initially. That doesn't mean these chips won't make it to the retail channel, as OEM-only parts from AMD in the past have somehow found their way to retailers, who bought them in trays, and sold them piecemeal as combos with motherboards and CPU coolers. The 7900 is a 12-core/24-thread part, just like its retail-channel sibling, the 7900X. The 7700 is an 8-core/16-thread part, again, similar to the 7700X. Not much else is known about these chips, except for their base frequency of just 3.60 GHz (compared to 4.70 GHz for the 7900X, and 4.50 GHz for the 7700X). Both chips are expected to feature a lowered TDP, with just 65 W for the 7700 (down from 105 W for the 7700X), and possibly 65 W or 105 W for the 7900 (down from 170 W for the 7900X).

TechPowerUp in partnership with Team Group are giving away six pieces of Team Group T-Force gaming hardware. We've actually been at this since November 14, and entries close tomorrow, November 25. That leaves you with a day to fill up a tiny form and answer a couple of quizzy questions on Team Group; for a chance to win a T-Force Delta RGB DDR5-6400 CL40 32 GB (2x 16 GB) memory kit, or one of five Vulcan Z 1 TB SSDs! The Delta RGB DDR5 would be a great addition to your next-generation desktop build, as its DDR5-6400 frequency goes great with the latest "Raptor Lake" and "Zen 4" processors! The Vulcan Z 1 TB makes for a decent game storage drive to add some room to your game library. Both look great when powered up and viewed through a tempered glass panel! Hurry up!

For more details, and to participate, visit this page. Entries close November 25 (tomorrow).

AMD Ryzen 7000-series "Zen 4" desktop processors got their first round of price-cuts on leading retailer Newegg, as the company has a hard time justifying their launch-prices in the wake of Intel's 13th Gen Core "Raptor Lake" and declining demand in the PC components market. The new pricing sees the top Ryzen 9 7950X 16-core/32-thread chip priced at USD $574, down from $700 (an 18% price-cut). The 12-core/24-thread Ryzen 9 7900X sees its price go down from $550 to $474 (down 14%).

The 8-core/16-thread Ryzen 7 7700X gets a $50 price-cut sending its price down from $400 to roughly $350. The 6-core/12-thread Ryzen 5 7600X gets a similar $50 cut, which means the chip can now be had for roughly $250, down from its $300 launch price. All four SKUs face stiff competition from the aggressively priced 13th Gen Core SKUs, which include the i9-13900K, the i7-13700K, and the i5-13600K. Prices of Socket AM5 motherboards are another big put-off as they're a major contributor to platform costs, which is restricted to DDR5 memory. The Intel platform currently includes entry-level chipset options, as well as motherboards with DDR4 support.

AMD will build "Zen 4" based Ryzen Threadripper processors in an attempt to meet competition from Intel, which is rumored to launch HEDT processors of its own based on "Sapphire Rapids." While Intel's chip tops out at 60-core/120-thread and has a constellation of task-specific hardware-accelerators, AMD will arm its processors with raw CPU core-count, going as high up as 96-core/192-thread. The company has assigned the codename "Storm Peak" for these chips.

The Ryzen Threadripper 7000-series "Storm Peak" processor engineering samples surfaced on the Einstein@Home user database. As many as three OPNs have surfaced, "AMD Eng Sample: 100-000000884-21_N" and "AMD Eng Sample: 100-000000884-20_Y," which are 96-core/192-thread; and the "AMD Eng Sample: 100-000000454-20_Y," which is 64-core/128-thread. "Storm Peak" is likely just a variation of EPYC "Genoa," geared for higher frequencies.

AMD, in its technical presentation for the new Radeon RX 7900 series "Navi 31" GPU, gave us an elaborate explanation on why it had to take the chiplets route for high-end GPUs, devices that are far more complex than CPUs. The company also enlightened us on what sets chiplet-based packages apart from classic multi-chip modules (MCMs). An MCM is a package that consists of multiple independent devices sharing a fiberglass substrate.

An example of an MCM would be a mobile Intel Core processor, in which the CPU die and the PCH die share a substrate. Here, the CPU and the PCH are independent pieces of silicon that can otherwise exist on their own packages (as they do on the desktop platform), but have been paired together on a single substrate to minimize PCB footprint, which is precious on a mobile platform. A chiplet-based device is one where a substrate is made up of multiple dies that cannot otherwise independently exist on their own packages without an impact on inter-die bandwidth or latency. They are essentially what should have been components on a monolithic die, but disintegrated into separate dies built on different semiconductor foundry nodes, with a purely cost-driven motive.

A reliable source with CPU and platform leaks, ECSM_Official, made some new predictions about release timelines of upcoming desktop processors, and how 2023 could play out for Intel and AMD. 2022 is done, with no new desktop processor SKUs expected to launch from either brands. Intel is expected to flesh out its 13th Gen Core "Raptor Lake" desktop processor family in Q1 2023, with the addition of "locked" non-K SKUs spanning all four brand extensions (i3/i5/i7/i9). Besides these, Intel is expected to launch its new flagship, the Core i9-13900KS, with boost frequencies hitting the 6 GHz mark, in an attempt to ward off the threat from "Zen 4" with 3D Vertical Cache, a technology that springboarded "Zen 3" gaming performance to match that of "Alder Lake."

Both the i9-13900KS and AMD Ryzen 7000X3D processors are expected to launch toward the middle of H1-2023 (March-April). AMD is only expected to launch 6-core/12-thread and 8-core/16-thread SKUs with the 3DV cache technology. These would be single-CCD packages. There's no word on dual-CCD ones with 12-core or 16-core counts, so a Ryzen 9 7950X3D is not on the horizon. AMD is expected to debut its entry-level A620 motherboard chipset in Q2-2023. This chipset reportedly lacks CPU overclocking capability, is expected to lack PCIe Gen 5, and caps memory speed to DDR5-4800.

AIC Inc., (from now on referred to as "AIC"), a leading provider in enterprise storage and server solutions, today revealed its new edge server appliance powered by 4th Gen AMD EPYC processors (codename Genoa). The new server, EB202-CP, is designed to deliver superior performance in a compact size while offering excellent cost efficiency. Combined with the 4th Gen AMD EPYC processors, EB202-CP is expected to drive the innovations in AI, training simulation, autonomous vehicles and edge applications. AIC will showcase EB202-CP at SC22 expo from November 14th to 17th, 2022.

AIC EB202-CP is a 2U rackmount server with 22 inches in depth. It supports eight E1.S/ E3.S or U.2 SSDs which are front-serviceable and hot-swappable. The E1.S/ E3.S drives are Enterprise and Datacenter SSD Form Factor (EDSFF) that enables EB202-CP to provide high-density all-flash NVMe for half petabyte storage capabilities and enhance IOPS and space utilization. EB202-CP has great expansion functionality and supports up to two double-stack GPU or accelerator cards, two FHHL/HHHL PCIe 5.0 cards and an OCP 3.0 card. Based on AIC server board Capella, EB202-CP supports single 4th Gen AMD EPYC processor and eight DDR5 DIMMs. The 4th Gen AMD EPYC processors, built on "Zen 4" architecture, are optimized for general-purpose workloads across enterprise, cloud and edge. This new generation of AMD EPYC features the world's highest-performing x86 processor, PCIe 5.0 ready, and enables low TCO. It also delivers leadership energy efficiency as well as state-of-the-art security features.

Yesterday, AMD announced its latest addition to the data center family of processors called EPYC Genoa. Named the 4th generation EPYC processors, they feature a Zen 4 design and bring additional I/O connectivity like PCIe 5.0, DDR5, and CXL support. To disrupt the cloud, enterprise, and HPC offerings, AMD decided to manufacture SKUs with up to 96 cores and 192 threads, an increase from the previous generation's 64C/128T designs. Today, we are learning more about the performance and power aspects of the 4th generation AMD EPYC Genoa 9654, 9554, and 9374F SKUs from 3rd party sources, and not the official AMD presentation. Tom's Hardware published a heap of benchmarks consisting of rendering, compilation, encoding, parallel computing, molecular dynamics, and much more.

In the comparison tests, we have AMD EPYC Milan 7763, 75F3, and Intel Xeon Platinum 8380, a current top-end Intel offering until Sapphire Rapids arrives. Comparing 3rd-gen EPYC 64C/128T SKUs with 4th-gen 64C/128T EPYC SKUs, the new generation brings about a 30% increase in compression and parallel compute benchmarks performance. When scaling to the 96C/192T SKU, the gap is widened, and AMD has a clear performance leader in the server marketplace. For more details about the benchmark results, go here to explore. As far as comparison to Intel offerings, AMD leads the pack as it has a more performant single and multi-threaded design. Of course, beating the Sapphire Rapids to market is a significant win for team red, so we are still waiting to see how the 4th generation Xeon stacks up against Genoa.

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today introduced AMD EPYC 9004 Series processor-based server platforms highlighting energy efficiency and performance breakthroughs designed for next generation server architecture for data centers. "Facing the post-COVID economy world, data centers are required to build on more environmentally friendly, secure and flexible features to respond to the growing of teleworking, video streaming, IoT and 5G," said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure BU. "TYAN's new server platforms powered by 4th Gen AMD EPYC processors efficiently enable data centers by doing more tasks with the same number of servers."

"We designed 4th Gen AMD EPYC processors to give our customers exactly what they said they needed, high performance, exceptional energy efficiency and low total cost of ownership," said Ram Peddibhotla, corporate vice president, EPYC product management, AMD. "With the latest "Zen 4" architecture that incorporates modern security by design, 4th Gen AMD EPYC processors are an outstanding choice for IT professionals looking to optimize their data centers for leadership performance while helping address environmental goals."

SK hynix announced that its DRAM, and CXL solutions have been validated with the new AMD EPYC 9004 Series processors, which were unveiled during the company's "together we advance_data centers" event on November 10. SK hynix has worked closely with AMD to provide fully compatible memory solutions for the 4th Gen AMD EPYC processors.

4th Gen AMD EPYC processors are built on an all-new SP5 socket and offer innovative technologies and features including support for advanced DDR5 and CXL 1.1+ memory expansion. SK hynix 1ynm, 1a nm 16 Gb DDR5 and 1a nm 24Gb DDR5 DRAM support 4800 Mbps on 4th Gen AMD EPYC processors, which deliver up to 50% more memory bandwidth than DDR4 product. SK hynix also provides CXL memory device that is a 96 GB product composed of 24 Gb DDR5 DRAMs based on 1a nm. The company expects high customer satisfaction of this product with flexible configuration of bandwidth and capacity expanded cost-efficiently.

GIGABYTE Technology, an industry leader in high-performance servers and workstations, today announced its portfolio of products ready to support the new AMD EPYC 9004 Series Processors in the first wave of GIGABYTE solutions that will target a wide range of demanding workloads that include GPU-centric, high-density, edge, and general computing. A new x86 platform, a new socket, and a wealth of highly performant technologies provided new opportunities for GIGABYTE to tailor products for leading data centers. So far, GIGABYTE has released twenty-two new servers and motherboards to support the new AMD "Zen 4" architecture. Both single-socket and dual-socket options are available to handle big data and digital transformation. The ongoing collaboration between GIGABYTE and AMD has allowed for a comprehensive portfolio of computing solutions that are ready for the market.

The new 4th Gen AMD EPYC processors feature substantial compute performance and scalability by combing high core counts with impressive PCIe and memory throughput. In terms of out of the box performance, AMD estimates found that 4th Gen AMD EPYC CPUs are the highest performing server processors in the worldi. With the advancement to 5 nm technology and other performant innovations, the new AMD EPYC 9004 series processors move to a new SP5 socket. The new architecture leads the way to faster data insights with high performance and built-in security features, and this platform targets HPC, AI, cloud, big data, and general enterprise IT.

AMD at a special media event titled "together we advance_data centers," formally launched its 4th generation EPYC "Genoa" server processors based on the "Zen 4" microarchitecture. These processors debut an all new platform, with modern I/O connectivity that includes PCI-Express Gen 5, CXL, and DDR5 memory. The processors come in CPU core-counts of up to 96-core/192-thread. There are as many as 18 processor SKUs, differentiated not just in CPU core-counts, but also the way the the cores are spread across the up to 12 "Zen 4" chiplets (CCDs). Each chiplet features up to 8 "Zen 4" CPU cores, depending on the model; up to 32 MB of L3 cache, and is built on the 5 nm EUV process at TSMC. The CCDs talk to a centralized server I/O die (sIOD), which is built on the 6 nm process.

The processors AMD is launching today are the EPYC "Genoa" series, targeting general purpose servers, although they can be deployed in large cloud data-centers, too. To large-scale cloud providers such as AWS, Azure, and Google Cloud, AMD is readying a different class of processor, codenamed "Bergamo," which is plans to launch later. In 2023, the company will launch the "Genoa-X" line of processor for technical-compute and HPC applications, which benefit from large on-die caches, as they feature the 3D Vertical Cache technology. There will also be "Siena," a class of EPYC processors targeting the telecom and edge-computing markets, which could see an integration of more Xilinx IP.

The SiSoft SANDRA user database has just been pinged by two new unreleased AMD Ryzen 7000 series "Zen 4" processor models, the Ryzen 7 7700 and Ryzen 5 7600. These chips have the same 8-core/16-thread and 6-core/12-thread core-counts as the 7700X and 7600X, respectively; but with lower clock speeds, and more importantly, a lower TDP of just 65 W. This would put their package power tracking (PPT) limit around 90 W, down from the 105 W and 140 W of the their "X" siblings.

The 7600 and 7700 come with a base frequency of 3.80 GHz, as detected by SANDRA. Every other specification, such as cache size, is the unchanged from the 7600X or 7700X. There's no word on the availability, but it's likely that AMD would debut these chips in the OEM channel first, especially given that the 7600 has the potential to undercut sales of the embattled 7600X. Things could get interesting as Intel debuts the lower end of its 13th Gen Core i5 series, which are rumored to be based on the "Alder Lake" microarchitecture, and 6P+4E SKUs.

AMD (NASDAQ:AMD) today announced revenue for the third quarter of 2022 of $5.6 billion, gross margin of 42%, operating loss of $64 million, net income of $66 million and diluted earnings per share of $0.04. On a non-GAAP(*) basis, gross margin was 50%, operating income was $1.3 billion, net income was $1.1 billion and diluted earnings per share was $0.67.

"Third quarter results came in below our expectations due to the softening PC market and substantial inventory reduction actions across the PC supply chain," said AMD Chair and CEO Dr. Lisa Su. "Despite the challenging macro environment, we grew revenue 29% year-over-year driven by increased sales of our data center, embedded and game console products. We are confident that our leadership product portfolio, strong balance sheet, and ongoing growth opportunities in our data center and embedded businesses position us well to navigate the current market dynamics."

AMD on Monday issued a statement refuting reports of performance deltas noticed for its Ryzen 7000-series "Zen 4" desktop processors observed between Windows 11 and Windows 10 operating systems when gaming. The company said that while it is investigating the reports, it has not been able to reproduce these performance deltas, and maintains that Ryzen 7000 series should perform consistently between both operating systems. Architecturally, "Zen 4" isn't different from "Zen 3" with the exception of its AVX-512 ISA that even Windows 10 supports. Windows 10 has awareness for "Zen 4" multi-core topology since it isn't any different from Ryzen 5000 "Vermeer." AMD stated that it continues to work with game developers to ensure their titles are optimized for Ryzen processors.The statement from AMD on the matter follows.

AMD is preparing to expand its Ryzen 7000-series "Zen 4" desktop processor series with new SKUs, one of which is the Ryzen 7 7700 (non-X). Given past trends with non-X SKUs for the Ryzen 5000-series, the 7700 is very likely an OEM-only SKU to be featured in pre-built desktops. The inclusion of an iGPU with the Ryzen 7000-series changes things dramatically for AMD, as it makes these processors suitable for even home- and commercial desktops that lack discrete graphics. The Ryzen 7 7700 has the same 8-core/16-thread configuration as the Ryzen 7 7700X, but likely lower clock-speeds, due to the lower power-limits. The chip has a TDP of 65 W, compared to the 105 W of the 7700X; which means its package power tracking (PPT) power limit will be closer to 90 W, than the 140 W of the 7700X. This will also significantly lower the cooling requirements for the processor, and OEMs could use cost-effective air coolers. The exact clock-speeds, though, remain under the wraps.

AMD earlier this week released basic enablement for the GNU Compiler Collections (GCC), which extend "Zen 4" microarchitecture awareness. The "basic enablement patch" for the new Zenver4 target is essentially similar to Zenver3, but with added support for the new AVX-512 instructions, namely AVX512F, AVX512DQ, AVX512IFMA, AVX512CD, AVX512BW, AVX512VL, AVX512BF16, AVX512VBMI, AVX512VBMI2, GFNI, AVX512VNNI, AVX512BITALG, and AVX512VPOPCNTDQ. Besides AVX-512, "Zen 4" is largely identical to its predecessor, architecturally, and so the enablement is rather basic. This should come just in time for software vendors to prepare for next-generation EPYC "Genoa" server processors, or even small/medium businesses building servers with Ryzen 7000-series processors.

With the arrival of AMD's Ryzen 7000 series desktop processors based on the new Zen 4 architecture, the world's leading computer brand, GIGABYTE today announces its B650E and B650 motherboards ready to power these next-gen CPUs. Sporting the new AM5 socket, the AORUS B650E and B650 gaming motherboards are equipped with a direct digital power design and a full-covered cooling module to keep the circuitry cool. These AORUS motherboards come with PCIe 5.0 connectivity and support for DDR5 memory, which are AMD EXPO and Intel XMP capable of up to DDR5-6600 and beyond. The AORUS gaming motherboards are also equipped with the DIY-friendly PCIe and M.2 device fast installation and removal design, making future upgrades quick and easy.

Power delivery and thermal design have always been the top factors when it comes to CPU performance. To meet the needs of gamers looking for powerful yet stable system performance, the AORUS B650E and B650 gaming motherboards are designed with a maximum 16+2+2-phase twin digital power, covered by a massive heatsink that has four times more surface than the previous generation to ensure the smoothest power delivery even under loads. Other thermal designs, such as 8 mm mega-heatpipes and dedicated heatsinks on key components, greatly improves the system's stability and overall performance. With the friendly design of PCIe and M.2 EZ-Latch features on the AORUS B650 gaming motherboards, GIGABYTE makes components swapping a whole lot easier.

GIGABYTE Technology, (TWSE: 2376), an industry leader in high-performance servers and workstations, today announced supporting products for the new AMD AM5 platform starting with two GIGABYTE motherboards, MC13-LE0 & MC13-LE1, that pair a consumer CPU with IPMI management functionalities via BMC. Additionally, a new desktop workstation, W332-Z00, was released using the same motherboard series platform that supports remote management, but the W332 does so with a Realtek NIC that enables DASH.

The new GIGABYTE products designed to support host systems are deceivingly powerful with a small micro-ATX form factor motherboard and enterprise rich out-of-band management features on top of PCIe Gen 5 and DDR5 technologies. These new client friendly products will be found in office settings under a desk rather than a rack in a data center, as they be managed from anywhere, provided there is a network connection. Furthermore, these new products are purpose built for the mainstream AMD B650E chipset with AMD Zen 4 architecture for AMD Ryzen 7000 Series desktop processors.

An alleged AMD client product roadmap slide leaked to the web confirms the Ryzen 7000X3D series. This also builds on a confirmation by Robert Hallock that 3DV Cache technology remains a continued part of the company's client processor roadmap. The 3DV Cache tech played in instrumental role in shoring up gaming performance of AMD's previous-generation "Zen 3" microarchitecture to levels matching or exceeding those of the Intel "Alder Lake," with a performance uplift in the range of 10 to 25 percent. The expectations for 3DV Cache to work a similar miracle with "Zen 4" are set rather high.

While "Zen 4" has achieved gaming performance parity with "Alder Lake," Intel's next-generation "Raptor Lake" is right around the corner, with the company claiming 10-15% single-threaded performance uplifts that should restore the its gaming performance leadership over AMD. The alleged AMD roadmap does not specify when exactly the Ryzen 7000X3D comes out, but is part of the block that spans Q3-2022, deep into 2023. Rumors are abuzz that the company could unveil the 7000X3D in the first half of 2023.

The popular PlayStation 3 emulator for PCs, RPCS3, just received a major update that lets it take advantage of the AVX-512 instruction-set on processors based on the AMD Zen 4 microarchitecture (the recently launched Ryzen 7000 series). RPCS3 emulates the PS3's CELL Broadband Engine SoC entirely on CPU, and does not use your GPU to draw any raster graphics. To emulate both a CPU and GPU of that time entirely on a multi-threaded CPU of today is no easy task, but is helped greatly by leveraging the latest instruction-sets. RPCS3 supports an AVX-512 code-path on Intel processors such as the Core i9-11900K "Rocket Lake," but the company has been fidgeting with AVX-512 support on its client processors since 12th Gen "Alder Lake." The developer of RPCS3 in a tweet confirmed that they have enabled AVX-512 support for AMD Zen 4 with the latest build.

The world-records set by those with access to AMD Ryzen 9 7950X "Zen 4" 16-core/32-thread processors, keep tumbling in. The latest such is a Cinebench R23 nT score of a stunning 50395 points. This was achieved with a 6.70 GHz overclock under extreme cooling using an LN2 evaporator. Another feat from the same source sees a 6.45 GHz all-core overclock under extreme cooling, which yields an impressive 48235 points in the same test. Both feats come from Sampson, who's been leading HWBot charts under the AMD Overclocking team.

The highest known/leaked Cinebench R23 score yielded with a Core i9-13900K "Raptor Lake" sample so far, is 40616 points, although serious official OC feats with the processor are yet to start. The Intel chip is already in the news for an 8 GHz frequency record. Any attempt to take the crown from the 7950X will involve pushing the 8 P-cores to insane frequencies, but then it will boil down to the 16 E-cores, and just how far those can be pushed. The highest post-launch CB R23 score obtained on a current-gen i9-12900K is 26299, and for the 5950X this is 26291.

The first reliable benchmark figures of AMD's Ryzen 7000-series CPUs have arrived, courtesy of SiSoftware. The benchmark suite software developer has released benchmark figures for the Ryzen 5 7600X and Ryzen 9 7950X. Keep in mind that these benchmarks are limited to the different tests in SiSoftware Sandra. Also note that the graphs for the Ryzen 5 7600X have typos, as the SiSoftware wrote Ryzen 5 7760X instead of 7600X and the Core i5-12600K is listed as a Core i7 CPU. Starting with the 7600X, the CPU appears to perform similar to, or slightly slower than the Intel Core i5-12600K in the arithmetic tests. On the other hand, it handily crushes the older Ryzen 5 5600X in every test here, by somewhere between 17 and 36 percent depending on the test.

Moving on to the vector SIMD tests, AMD's Zen 4 architecture shows much greater performance improvements, beating the Intel Core i5-12600K in all but one of the tests, where it loses by a fairly small margin. Here it beats the Ryzen 5 5600X by anything from 28 to a massive 86 percent. Where AMD's Zen 4 architecture really kicks things up a notch is in the image processing test, at least compared to the Zen 3 architecture, thanks to its AVX512 capabilities. As such, it's over twice as fast in many of the tests, but it still loses out in half of the tests to Intel's Core i5-12600K. AMD has also improved the inter-thread/core latency in the same module, by a not insignificant amount. Where the Ryzen 5 7600X doesn't fare so well is when it comes to performance vs. power, largely due to the fact that AMD moved the TDP from 65 to 105 W, but it still offers better performance per Watt than Intel's current models.

Update 17:31 UTC: Updated with the Ryzen 7 7700X results.

It's game on for clock-speed records, as some of the first ones are being set with the AMD Ryzen 9 7950X "Zen 4" processors. The first such feat is an absolute clock-speed record of 7.25 GHz (7247 MHz), set without disabling any cores. This is probably the highest clock achieved on a single core for "Zen 4," set using a multiplier value of 72.5x, and a scorching 1.506 V juice. The second feat is even more impressive, even though it's a lower-clock speed in absolute terms. The 7950X was overclocked to 6.50 GHz across all cores (that's all 16 of its cores). This was set using a core voltage of 1.465 V. In both feats, extreme cooling solutions such as liquid-nitrogen evaporators were used, and this only the first round of OC feats with these chips. Interesting times ahead for 7950X vs. i9-13900K overclocking and benchmark feats. The 6.50 GHz all-core OC in particular could pose a formidable challenge to the i9-13900K, which can sustain its maximum (5 GHz+) all-core OC clocks only on its 8 P-cores.

Noctua today confirmed that all its CPU coolers and mounting-kits that support AMD AM4 also support the upcoming AM5 socket, except the NH-L9a-AM4 low-profile cooler and the NM-AM4-L9aL9i mounting-kit. For the latter, Noctua announced the new NM-AM5-L9aL9i kit that will be available free-of-charge from end of October. Mounting upgrade kits for older heatsink models that do not yet support AM4 will also be provided to customers at no additional cost.

"We have offered free-of-charge mounting upgrade kits to our customers ever since AMD introduced AM2 in 2006, and we're proudly continuing this tradition with the upcoming Ryzen 7000 series processors and their new AM5 socket", says Roland Mossig (Noctua CEO). "While all our current multi-socket coolers already support AM5 out of the box and don't require any updates, customers will be able to upgrade the NH-L9a as well as most older coolers at no additional cost, so even 15-year-old coolers can be used on the latest processors!"