Capacity: | 3.8 TB (3840 GB) |
---|---|
Overprovisioning: | 519.7 GB / 14.5 % |
Production: | Active |
Released: | 2020 |
Part Number: | DPH311T4T003T8 |
Market: | Enterprise |
Form Factor: | U.2 |
---|---|
Interface: | PCIe 3.0 x4 |
Protocol: | NVMe 1.3 |
Power Draw: | Unknown |
Manufacturer: | Marvell |
---|---|
Name: | 88SS1098 Zao |
Architecture: | ARM 32-bit Cortex-R5 |
Core Count: | Quad-Core |
Foundry: | TSMC |
Process: | 28 nm |
Flash Channels: | 8 @ 800 MT/s |
Chip Enables: | 8 |
Controller Features: | DRAM (enabled) |
Manufacturer: | Toshiba |
---|---|
Name: | BiCS4 |
Part Number: | TH58LJT1V24BA8H |
Type: | TLC |
Technology: | 96-layer |
Speed: | 533 MT/s .. 800 MT/s |
Capacity: | 16 chips @ 2 Tbit |
Toggle: | 3.0 |
Topology: | Charge Trap |
Process: | 19 nm |
Dies per Chip: | 8 dies @ 256 Gbit |
Planes per Die: | 2 |
Decks per Die: | 2 |
Word Lines: |
109 per NAND String
88.1% Vertical Efficiency |
Read Time (tR): | 59 µs |
Program Time (tProg): | 625 µs |
Die Read Speed: | 551 MB/s |
Die Write Speed: | 56 MB/s |
Endurance: (up to) |
1500 P/E Cycles
(3000 in SLC Mode) |
Page Size: | 16 KB |
Block Size: | 1152 Pages |
Plane Size: | 1980 Blocks |
Type: | DDR4-2666 CL19 |
---|---|
Name: | NANYA A-Die NT5AD1024M8A3-HR |
Capacity: |
5120 MB
(5x 1024 MB) |
Organization: | 8Gx8 |
Sequential Read: | 3,500 MB/s |
---|---|
Sequential Write: | 3,100 MB/s |
Random Read: | 820,000 IOPS |
Random Write: | 130,000 IOPS |
Endurance: | 7008 TBW |
Warranty: | 5 Years |
MTBF: | 2.0 Million Hours |
Drive Writes Per Day (DWPD): | 1.0 |
Write Cache: | N/A |
TRIM: | Yes |
---|---|
SMART: | Yes |
Power Loss Protection: | Yes |
Encryption: |
|
RGB Lighting: | No |
PS5 Compatible: | No |
|
NAND Die:Read latency tR: 58 µs (ABL) |