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Kingspec XG7000 Pro 512 GB

512 GB
Capacity
IG5236
Controller
TLC
Flash
PCIe 4.0 x4
Interface
M.2 2280
Form Factor
Front
DRAM
Pro SSD (YT)
DRAM
Flash
Pro SSD (YT)
Flash
SSD Controller
Controller
NAND Die
NAND Die
The Kingspec XG7000 Pro is a solid-state drive in the M.2 2280 form factor, launched in 2022. It is available in capacities ranging from 512 GB to 2 TB. This page reports specifications for the 512 GB variant. With the rest of the system, the Kingspec XG7000 Pro interfaces using a PCI-Express 4.0 x4 connection. The SSD controller is the IG5236 (Rainier) from InnoGrit, a DRAM cache chip is available. Kingspec has installed 128-layer TLC NAND flash on the XG7000 Pro, the flash chips are made by YMTC. To improve write speeds, a pseudo-SLC cache is used, so bursts of incoming writes are soaked up more quickly. The cache is sized at 87 GB, once it is full, writes complete at 1200 MB/s. Copying data out of the SLC cache (folding) completes at 360 MB/s. Thanks to support for the fast PCI-Express 4.0 interface, performance is excellent. The XG7000 Pro is rated for sequential read speeds of up to 7,200 MB/s and 2,800 MB/s write.
At its launch, the SSD was priced at 67 USD. Kingspec guarantees an endurance rating of 300 TBW, a very low value compared to other SSDs.

Solid-State-Drive

Capacity: 512 GB
Variants: 512 GB 1 TB 2 TB
Overprovisioning: 35.2 GB / 7.4 %
Production: Active
Released: 2022
Price at Launch: 67 USD
Part Number: XG7000-512GB-PRO
Market: Consumer

Physical

Form Factor: M.2 2280 (Double-Sided)
Interface: PCIe 4.0 x4
Protocol: NVMe 1.4
Power Draw: Unknown (Idle)
Unknown (Avg)
5.0 W (Max)

Controller

Manufacturer: InnoGrit
Name: IG5236 (Rainier)
Architecture: ARM 32-bit Cortex-R5
Core Count: Quad-Core
Frequency: 667 MHz
Foundry: TSMC FinFET
Process: 12 nm
Flash Channels: 8 @ 1,200 MT/s
Chip Enables: 4
Controller Features: DRAM (enabled)

NAND Flash

Manufacturer: YMTC
Name: Xtacking 2.0 (CDT1B)
Type: TLC
Technology: 128-layer
Speed: 1600 MT/s
Capacity: 4 chips @ 1 Tbit
ONFI: 4.1
Topology: Charge Trap
Die Size: 60 mm²
(8.5 Gbit/mm²)
Dies per Chip: 2 dies @ 512 Gbit
Planes per Die: 4
Decks per Die: 2
Word Lines: 141 per NAND String
90.8% Vertical Efficiency
Read Time (tR): 50 µs
Program Time (tProg): 620 µs
Block Erase Time (tBERS): 20 ms
Die Read Speed: 1280 MB/s
Die Write Speed: 70 MB/s
Endurance:
(up to)		 3000 P/E Cycles
Page Size: 16 KB
Block Size: 2304 Pages
Plane Size: 1980 Blocks

DRAM Cache

Type: DDR4-2666 CL19
Name: SK Hynix H5AN4G6NBJR-VKC
Capacity: 512 MB
(1x 512 MB)
Organization: 4Gx16

Performance

Sequential Read: 7,200 MB/s
Sequential Write: 2,800 MB/s
Random Read: Unknown
Random Write: Unknown
Endurance: 300 TBW
Warranty: Unknown
MTBF: 1.0 Million Hours
SLC Write Cache: approx. 87 GB
(dynamic only)
Speed when Cache Exhausted: approx. 1200 MB/s
Cache Folding Speed: 360 MB/s

Features

TRIM: Yes
SMART: Yes
Power Loss Protection: No
Encryption:
  • Unknown
RGB Lighting: No
PS5 Compatible: Yes

Reviews

Same Drive

This section lists other SSDs in our database using the exact same hardware components

Notes

NAND Die:

Read Time (tR): Maximum is 50 µs, typical is lower
Typical Program Time (tPROG): 620 µs
Maximum Program Time (tPROG): Maximum is 910 µs
Block Erase Time (tBERS): Maximum is 20 ms, typical is lower
Array Eficiency of over 92%
YMTC 128L Xtacking 2.0 cell architecture consists of two decks connected through deck-interface buffer layer which is the same process with KIOXIA 112L BiCS 3D NAND structure. Cell size, CSL pitch, and 9-hole VC layouts keep the same design and dimension (horizontal/vertical WL and BL pitches) with previous 64L Xtacking 1.0 cell. Total number of gates is 141 (141T) including selectors and dummy WLs for the TLC operation.
This layout has a 1x 4 Plane layout, each one lineup side by side
Jun 1st, 2024 17:15 EDT change timezone

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