Way back in January 2021, we heard a spectacular rumor about "Navi 31," the next-generation big GPU by AMD, being the company's first logic-MCM GPU (a GPU with more than one logic die). The company has a legacy of MCM GPUs, but those have been a single logic die surrounded by memory stacks. The RDNA3 graphics architecture that the "Navi 31" is based on, sees AMD fragment the logic die into smaller chiplets, with the goal of ensuring that only those specific components that benefit from the TSMC N5 node (6 nm), such as the number crunching machinery, are built on the node, while ancillary components, such as memory controllers, display controllers, or even media accelerators, are confined to chiplets built on an older node, such as the TSMC N6 (6 nm). AMD had taken this approach with its EPYC and Ryzen processors, where the chiplets with the CPU cores got the better node, and the other logic components got an older one.

Greymon55 predicts an interesting division of labor on the "Navi 31" MCM. Apparently, the number-crunching machinery is spread across two GCD (Graphics Complex Dies?). These dies pack the Shader Engines with their RDNA3 compute units (CU), Command Processor, Geometry Processor, Asynchronous Compute Engines (ACEs), Rendering Backends, etc. These are things that can benefit from the advanced 5 nm node, enabling AMD to the CUs at higher engine clocks. There's also sound logic behind building a big GPU with two such GCDs instead of a single large GCD, as smaller GPUs can be made with a single such GCD (exactly why we have two 8-core chiplets making up a 16-core Ryzen processors, and the one of these being used to create 8-core and 6-core SKUs). The smaller GCD would result in better yields per wafer, and minimize the need for separate wafer orders for a larger die (such as in the case of the Navi 21).

Here is the first picture of a next-generation AMD EPYC "Genoa" processor with its integrated heatspreader (IHS) removed. This is also possibly the first picture of a "Zen 4" CPU Complex Die (CCD). The picture reveals as many as twelve CCDs, and a large sIOD silicon. The "Zen 4" CCDs, built on the TSMC N5 (5 nm EUV) process, look visibly similar in size to the "Zen 3" CCDs built on the N7 (7 nm) process, which means the CCD's transistor count could be significantly higher, given the transistor-density gained from the 5 nm node. Besides more number-crunching machinery on the CPU core, we're hearing that AMD will increase cache sizes, particularly the dedicated L2 cache size, which is expected to be 1 MB per core, doubling from the previous generations of the "Zen" microarchitecture.

Each "Zen 4" CCD is reported to be about 8 mm² smaller in die-area than the "Zen 3" CCD, or about 10% smaller. What's interesting, though, is that the sIOD (server I/O die) is smaller in size, too, estimated to measure 397 mm², compared to the 416 mm² of the "Rome" and "Milan" sIOD. This is good reason to believe that AMD has switched over to a newer foundry process, such as the TSMC N7 (7 nm), to build the sIOD. The current-gen sIOD is built on Global Foundries 12LPP (12 nm). Supporting this theory is the fact that the "Genoa" sIOD has a 50% wider memory I/O (12-channel DDR5), 50% more IFOP ports (Infinity Fabric over package) to interconnect with the CCDs, and the mere fact that PCI-Express 5.0 and DDR5 switching fabric and SerDes (serializer/deserializers), may have higher TDP; which together compel AMD to use a smaller node such as 7 nm, for the sIOD. AMD is expected to debut the EPYC "Genoa" enterprise processors in the second half of 2022.

Here's the first picture of AMD Socket SP5, the huge new CPU socket the company is building its next-generation EPYC "Genoa" enterprise processors around. "Genoa" will be AMD's first server products to implement the new "Zen 4" CPU cores, and next-gen I/O, including DDR5 memory and PCI-Express Gen 5. SP5, much like its predecessor SP3, is a land-grid array (LGA) socket, and has 6,096 pins.

The vast pin-count enables power to support CPU core-counts of up to 96 on the EPYC "Genoa," and up to 128 on the EPYC "Bergamo" cloud processor; a 12-channel DDR5 memory interface (24 sub-channels); and up to 128 PCI-Express 5.0 lanes. The socket's retention mechanism and processor installation procedure appears similar to that of the SP3, although the thermal requirements of SP5 will be entirely new, with processors expected to ship with TDP as high as 400 W, compared to 280 W on the current-generation EPYC "Milan." AMD is expected to debut EPYC "Genoa" in the second half of 2022.

AMD today announced a definitive agreement to acquire Pensando for approximately $1.9 billion before working capital and other adjustments. Pensando's distributed services platform includes a high-performance, fully programmable packet processor and comprehensive software stack that accelerate networking, security, storage and other services for cloud, enterprise and edge applications.

"To build a leading-edge data center with the best performance, security, flexibility and lowest total cost of ownership requires a wide range of compute engines," said Dr. Lisa Su, AMD chair and CEO. "All major cloud and OEM customers have adopted EPYC processors to power their data center offerings. Today, with our acquisition of Pensando, we add a leading distributed services platform to our high-performance CPU, GPU, FPGA and adaptive SoC portfolio. The Pensando team brings world-class expertise and a proven track record of innovation at the chip, software and platform level which expands our ability to offer leadership solutions for our cloud, enterprise and edge customers."

As unreliable as Geekbench can be as a comparative benchmark, it's also an excellent source for upcoming hardware leaks and in this case more details about AMD's upcoming Zen 4 based Genoa server and workstation processors has leaked. Someone with access to a 32-core engineering sample thought it was a good idea to run geekbench on it and upload the results. As the engineering sample CPU is locked at 1.2 GHz, the actual benchmark numbers aren't particularly interesting, but the one interesting titbit we get is that AMD has increased the L2 cache to 1 MB per core, or twice as much as its predecessor.

What seems to be missing from this engineering sample is any kind of 3D V-Cache, as it only has a total of 128 MB L3 cache. Despite the gimped clock speed, the Genoa CPU is close to an EPYC 7513 in the single core tests and that CPU has a 2.6 GHz base clock and a 3.65 GHz boost clock, both system running Ubuntu 20.04 LTS. It manages to beat it in a couple of the sub-tests, such as Navigation, SQLite, HTML5, gaussian blur and face detection and it's within a few points in things like speech recognition and rigid body physics. This is quite impressive considering the Genoa engineering sample is operating at less than half the clock speed, or possibly even at a third of the clock speed of the EPYC 7513. AMD is said to be launching its Zen 4 based Genoa CPUs later this year and models with up to 96 core and 192 threads, with 12-channel DDR5 memory and PCIe 5.0 support are expected.

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today announced availability of high-performance server platforms supporting new 3rd Gen AMD EPYC Processors with AMD 3D V-Cache technology for the modern data center. "The modern data center requires a powerful foundation to balance compute, storage, memory and IO that can efficiently manage growing volumes in the digital transformation trend," said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure Business Unit. "TYAN's industry-leading server platforms powered by 3rd Gen AMD EPYC processors with AMD 3D V-Cache technology give our customers better energy efficiency and increased performance for a current and future of highly complex workloads."

"3rd Gen AMD EPYC processors with AMD 3D V-Cache technology continue to drive a new standard for the modern data center with breakthrough performance for technical computing workloads due to 768 MB of L3 cache, enabling faster time-to-results on targeted workloads. Fully socket compatible with our 3rd Gen AMD EPYC platforms, customers can adopt these processors to transform their data center operations to achieve faster product development along with exceptional energy savings," said Ram Peddibhotla, corporate vice president, EPYC product management, AMD.

Super Micro Computer, Inc. (SMCI), a global leader in high-performance computing, storage, networking solutions, and green computing technology, announces breakthrough performance with the 3rd Gen AMD EPYC Processors with AMD 3D V-Cache Technology in Supermicro advanced servers. The high density, performance-optimized, and environmentally friendly SuperBlade and multi-node optimized TwinPro and the dual-processor optimized Ultra systems will show significant performance improvement when using the new AMD EPYC 7003 Processors with AMD 3D V-Cache for technical computing applications.

"Supermicro servers, leveraging new AMD CPUs, will deliver the increased performance gains our manufacturing customers are looking for to run higher-resolution simulations to design better and more optimized products using the latest CAE applications," said Vik Malyala, President, EMEA, senior vice president, WW FAE, solutions and business. "Our high-performance server platforms will solve more complex problems for engineers and researchers with the new 3rd Gen AMD EPYC Processors with AMD 3D V-Cache."

Super Micro Computer, Inc. (SMCI), a global leader in enterprise computing, storage, networking solutions, and green computing technology, has announced a revolutionary technology that simplifies large scale GPU deployments and is a future proof design that supports yet to be announced technologies. The Universal GPU server provides the ultimate flexibility in a resource-saving server.

The Universal GPU system architecture combines the latest technologies supporting multiple GPU form factors, CPU choices, storage, and networking options optimized together to deliver uniquely-configured and highly scalable systems. Systems can be optimized for each customer's specific Artificial Intelligence (AI), Machine Learning (ML), and High-Performance Computing (HPC) applications. Organizations worldwide are demanding new options for their next generation of computing environments, which have the thermal headroom for the next generation of CPUs and GPUs.

It will be an unexpectedly busy March for AMD, with the company launching three distinct products across its processor lines. The first one, which we reported earlier this morning, speaks of a late-March availability of the Ryzen 7 5800X3D 8-core/16-thread Socket AM4 processor, which AMD claims offers gaming performance on par with the Core i9-12900K "Alder Lake." It turns out, there are two more surprises.

Apparently the company is ready with Ryzen Threadripper PRO 5000 series workstation processors. Designed for Socket sWRX8 motherboards based on the only chipset option available—the AMD WRX80, these are the first Threadripper products based on the "Zen 3" microarchitecture, and feature 8-channel DDR4 memory, and up to 128 PCI-Express Gen4 lanes for workstation connectivity. Unfortunately, you can't buy one of these in the retail channel, as AMD is making them OEM-only. The first pre-built workstations will arrive as early as next week (March 8). At this point we still don't know if these chips use the newer "Zen 3" CCD with 3D Vertical Cache, or the conventional "Zen 3" CCD with 32 MB planar L3 cache.

AMD announced the expansion of Amazon Web Services Inc. (AWS) AMD EPYC processor-based offerings with the general availability of compute optimized Amazon EC2 C6a instances. According to AWS, the C6a instances offer up to 15% better compute price performance over previous generation C5a instances for a variety of compute focused workloads.

The C6a instances support compute-intensive workloads such as batch processing, distributed analytics, ad serving, highly scalable multiplayer gaming, and video encoding. This is the second AWS EC2 instance type powered by 3rd Gen AMD EPYC processors, following the release of the M6a instances. These instances continue the collaboration between AWS and AMD providing AWS EC2 customers access to the performance and price performance capabilities of the latest generation of AMD EPYC processors.

AMD (NASDAQ: AMD) today announced that AMD EPYC processors will power the new C2D virtual machine offering from Google Cloud, bringing customers strong performance and compute power for high-performance (HPC) memory-bound workloads in areas like electronic design automation (EDA) and computational fluid dynamics (CFD). This announcement continues the momentum for AMD EPYC processors, marking the third family of instances powered by 3rd Gen EPYC processors at Google Cloud, joining the T2D and N2D instances.

With the help of AMD EPYC processors and its high core density, the C2D VMs will provide the largest VM sizes within compute optimized family at Google Cloud. As well, because of the EPYC processor's performance for compute focused workloads, Google Cloud showcased the C2D VMs can provide up to 30 percent better performance for targeted workloads compared to previous generation EPYC based VMs at a comparable size.

The AMD Milan-X EPYC 7773X 3D V-Cache is a 64-core, 128-thread server processor with 804 MB of cache that is currently shipping to global data centers. These processors are not yet officially available in retail channels but Chinese content creator kenaide has managed to acquire and test two qualification sample chips on a SuperMicro dual-socket motherboard. The AMD EPYC 7773X is detected as 100-000000504-04 CPU by CPU-Z confirming that it's an engineering sample with clock speeds 100 MHz below the 2.2 GHz and 3.5 GHz base and boost speeds of the official processor.

The processors each feature 32 MB L2, 256 MB L3, and 512 MB of 3D V-Cache for a total of 1608 MB cache in the configuration that was benchmarked with Cinebench R23 and 3DMark. The processors were also "overclocked" to 4.8 GHz using the EPYC Milan/Rome ES/QS Overclocking tool by increasing their power limit to 1500 W from 280 W and boosting the voltage to 1.55 V. This 4.8 GHz clock speed is only a target with the actual speed reached not reported and no benchmarks for the overclocked processors shared.

AMD (NASDAQ:AMD) today announced revenue for the fourth quarter of 2021 of $4.8 billion, operating income of $1.2 billion, net income of $974 million and diluted earnings per share of $0.80. On a non-GAAP basis, operating income was $1.3 billion, net income was $1.1 billion and diluted earnings per share was $0.92. For full year 2021, the company reported revenue of $16.4 billion, operating income of $3.6 billion, net income of $3.2 billion and diluted earnings per share of $2.57. On a non-GAAP basis, operating income was $4.1 billion, net income was $3.4 billion and diluted earnings per share was $2.79.

"2021 was an outstanding year for AMD with record annual revenue and profitability," said AMD President and CEO Dr. Lisa Su. "Each of our businesses performed extremely well, with data center revenue doubling year-over-year driven by growing adoption of AMD EPYC processors across cloud and enterprise customers. We expect another year of significant growth in 2022 as we ramp our current portfolio and launch our next generation of PC, gaming and data center products."

Server processors tend to be one of the most profitable businesses for AMD and Intel. Thus, investment groups and analysts closely monitor happenings in the server and data center world. A report from Mizuho Securities (investment bank) Managing Director Jordan Klein states that many upcoming changes on the server processor front are coming this year. Mr. Klein cites sources over at Insupur Systems, one of the most prominent server vendors. More precisely, Dolly Wu is the VP and GM of Datacenter/Cloud at Inspur. According to the report, AMD and Intel will change their strategy in the server market going forward in 2022.

As far as AMD is concerned, the company plans to increase the pricing of its EPYC processors by 10-30%. This increase should be a bit easier on the strategic cloud customers. The report also indicates that as the demand far exceeds the supply of EPYC processors, AMD increases prices and makes a "take it or leave it" offer, resulting in most customers accepting the increased costs. Another interesting tidbit from the report was the talk about Intel. The blue team laid out its strategy to launch highly-anticipated Sapphire Rapids Xeons in Q2 of 2022. However, it will maybe get delayed to Q3 of 2022. Intel doesn't plan to increase prices to remain competitive with AMD, so the server space will see Intel fighting to regain the lost market share.

AMD announced Amazon Web Services (AWS) has expanded its AMD EPYC processor-based offerings with the general availability of the new Amazon EC2 Hpc6a instances, which are purpose-built for high performance computing (HPC) workloads in the cloud. According to AWS, Amazon EC2 Hpc6a instances deliver up to 65 percent better price-performance compared to similar Amazon EC2 instances. Hpc6a will help customers run their most compute-intensive HPC workloads like, genomics, computational fluid dynamics, weather forecasting, financial risk modeling, EDA for semiconductor design, computer-aided engineering, and seismic imaging.

Throughout the HPC industry, there has been a growing preference for AMD as showcased by AMD EPYC processors powering 73 supercomputers on the latest Top500 list and holding 70 HPC world records. The new Hpc6a instances bring the leadership performance and capabilities of 3rd Gen AMD EPYC processors to compute-optimized Amazon EC2 instances used for highly complex HPC workloads.

In recent years, government institutions have been funding the development of home-grown hardware that will power the government infrastructure. This trend was born out of a desire to design chips with no back doors implemented so that no foreign body could monitor the government's processes. Today, Russian company Baikal Electronics managed to boot up the Baikal-S processor with 48 cores based on Arm Instruction Set Architecture (ISA). The processor codenamed BE-S1000 manages to operate 48 cores at a 2.0 GHz base frequency, with a maximum boost of 2.5 GHz clock speed. All of that is achieved at the TDP of 120 Watts, making this design very efficient.

When it comes to some server configurations, the Baikal-S processor run in up to four sockets in a server board. It offers a home-grown RISC-V processor for safe boot and management, so the entire SoC is controlled by a custom design. Baikal Electronics provided some benchmark numbers, which you can see in the slides below. They cover SPEC2006 CPU Integer, Coremark, Whetstone, 7Zip, and HPLinkpack performance. Additionally, the company claims that Baikal-S is in line with Intel Xeon Gold 6148 Skylake design and AMD EPYC 7351 CPU based on Zen1 core. Compared to Huawei's Kunpeng 920, the Baikal-S design provides 0.86x performance.

The semicondustor market in 3Q21 is red hot with total revenue of the global top 10 IC design (fabless) companies reaching US$33.7 billion or 45% growth YoY, according to TrendForce's latest investigations. In addition to the Taiwanese companies MediaTek, Novatek, and Realtek already on the list, Himax comes in at number ten, bringing the total number of Taiwanese companies on the top 10 list to 4.

Qualcomm has been buoyed by continuing robust demand for 5G mobile phones form major mobile phone manufacturers with further revenue growth from its processor and radio frequency front end (RFFE) departments. Qualcomm's IoT department benefited from strong demand in the consumer electronics, edge networking, and industrial sectors, posting revenue growth of 66% YoY, highest among Qualcomm departments. In turn, this drove Qualcomm's total 3Q21 revenue to US$7.7 billion, 56% growth YoY, and ranking first in the world.

Managing massive datasets is excessively complex and costly. Today, Seagate Technology Holdings plc, a world leader in mass-data storage infrastructure solutions, announced the new Exos Application Platform (AP) with a new controller featuring 2nd Gen AMD EPYC processors. The efficient, scalable, affordable end-to-end compute and storage platform delivers integrated compute and storage in a single enclosure optimizing rack space utilization, power efficiency, heat dissipation, and storage density.

The need for advanced storage solutions continues to rise to unprecedented levels with the ever-increasing growth in data generation. According to a report commissioned by Seagate and conducted by the research firm IDC, Rethink Data, enterprise data is expected to grow at an average rate of 42.2% over the next two years. The survey, which was conducted by IDC, also found that only 32% of data available to enterprises is put to work. The remaining 68% is unleveraged.

Just yesterday, thanks to the Linux driver update, we found information stating that AMD's upcoming EPYC Genoa processor generation based on Zen 4 core IP will have a 12-channel memory controller. However, we didn't know how AMD engineered the memory controller of this processor generation and some of its maximum capabilities. However, there is an exciting discovery. According to the report from ComputerBase, with information exclusive to them, AMD will enable up to 12 TB of DDR5 memory spread across 12 memory channels. The processor supports DDR5-5200 memory, but when all 24 memory slots (two per channel) are populated, the DDR5 maximum speed drops to 4000 MT/s.

It is unclear why this is the case, and if any difficulties were designing the controller, so the maximum speed drops when every slot is used. One reassuring thing is that the bandwidth created by 12 memory channels should be sufficient to make up for the lost speed of DDR5 memory reduction.

Thanks to a Linux driver update, we now know that AMD's upcoming Zen 4 based EPYC CPUs will support up to 12 channels of DDR5 memory, an upgrade over the current eight. The EDAC driver, or Error Detection and Correction driver update from AMD contained details of the memory types supported by AMD's upcoming server and workstation CPUs and although this doesn't tell us much about what we'll see from the desktop platform, some of this might spill over to a future Ryzen Threadripper CPU.

The driver also reveals that there will be support for both RDDR5 and LRDDR5, which translates to Registered DDR5 and Load-Reduced DDR5 respectively. LRDDR5 is the replacement for LRDIMMs, which are used in current servers with very high memory densities. Although we don't know when AMD is planning to announce Zen 4, even less so the new EPYC processors, it's expected that it will be some time in the second half next year.

AMD apparently finds itself with quite a bit of undigested 7 nm "Renoir" silicon, which it plans to repackage as Socket AM4 processors, reports VideoCardz, citing sources on ChipHell forums. The most interesting aspect of this leak is that the silicon variant, codenamed "Renoir X," comes with a disabled iGPU. This is hence a case of AMD harvesting enough "Renoir" dies with faulty iGPU components, to sell them off as desktop processors. It is also learned that these chips don't feature all of the 8 "Zen 2" CPU cores present on the silicon, but rather AMD is looking to carve out entry-level SKUs, such as the Ryzen 3 or Athlon. The company lacks Athlon desktop SKUs based on "Zen 2" or later, although traditionally the company sought to include some basic iGPU solution with its Athlon SKUs.

In related news, the source reports that AMD will refresh its Ryzen desktop processor family with the new "Vermeer S" Ryzen processors. Built on the existing Socket AM4 package, these use AMD's "Zen 3" CCDs that feature 3D Vertical Cache (3DV Cache), much like the recently announced EPYC "Milan X" server processors. AMD claimed that the 3DV Cache technology has a significant performance uplift on performance akin to a generational update. These could be the company's first response to Intel Core "Alder Lake," although since they're based on the older AM4 platform, could only feature DDR4 and PCIe Gen 4. Much like the Ryzen 3000XT series, these appear to be a stopgap product lineup, with AMD targeting late-Q2/early-Q3 for next-generation "Raphael" Socket AM5 processors based on the "Zen 4" architecture, with DDR5 and PCIe Gen 5.

AMD (NASDAQ: AMD) announced Amazon Web Services, Inc. (AWS) has expanded its AMD EPYC processor-based offerings with the general availability of general-purpose Amazon EC2 M6a instances. The M6a instances are powered by 3rd Gen AMD EPYC processors delivering, according to AWS, up to 35% better price-performance compared to the previous M5a instances and a 10% lower cost than comparable x86-based EC2 instances.

"Our 3rd Gen AMD EPYC processors provide Amazon EC2 users excellent scalability and impressive price-performance compared to previous generation Amazon EC2 M5a instances. This announcement shows our strong collaboration as well as highlights our overall momentum in cloud infrastructure," said Lynn Comp, corporate vice president, Cloud Business, AMD. "Our work with AWS exemplifies our commitment to giving end users innovation and performance for their cloud environments and workloads."

AMD later this month is preparing to address investors as part of a yet-unknown event. The company typically hosts Financial Analyst Day events around Q1-Q2, and goes to the investors with substantial material on the current state of the organization, the products on offer, what's on the horizon, and how it could impact the company's financials. An alleged presentation related to the November 2021 event was leaked to the web. The presentation provides a guided tour of the entire product portfolio of the company, spanning server processors, compute accelerators, consumer graphics, some client processors, and the semi-custom business.

The presentation outlines that the company has so far successfully executed its roadmaps for the client-CPU, server-CPU, graphics, and compute-accelerator segments. In the client CPU segment, it shows a successful execution up to 2021 with the "Zen 3" microarchitecture. In the server space, it mentions successful execution for its EPYC processors up to "Zen 3" with its "Milan" processors, and confirms that its next-generation "Zen 4" microarchitecture, and its sister-architecture, the "Zen 4c," will be built on the 5 nm silicon fabrication node (likely TSMC N5). The presentation also details the recently announced "Milan-X" processor for existing SP3 platforms, which debuts the 3D Vertical Cache technology, bringing up to 96 MB of L3 cache per CCD, and up to 768 MB of L3 cache (804 MB L1+L2+L3 cache) per socket.Update 10:54 UTC: The presentation can now be found on the AMD Investor Relations website.

During this year's Supercomputing Conference 2021 (SC21), AMD is showcasing its expanded presence and growing preference in the high performance computing (HPC) industry with the exceptional innovation and adoption of AMD data center processors and accelerators. Customers across the industry continue to expand their use of AMD EPYC processors and AMD Instinct accelerators to power cutting-edge research needed to address some of the world's biggest challenges in climate, life sciences, medicine, and more.

Growing preference for AMD is showcased in the latest Top500 list. AMD now powers 73 supercomputers, compared to 21 in the November 2020 list, a more than 3x year-over-year increase. Additionally, AMD powers four out of the top ten most powerful supercomputers in the world, as well as the most powerful supercomputer in EMEA. Finally, AMD EPYC 7003 series processors, which launched eight months ago, are utilized by 17 of the 75 AMD powered supercomputers in the list, demonstrating the rapid adoption of the latest generation of EPYC processors.

The 58th annual edition of the TOP500 saw little change in the Top10. The Microsoft Azure system called Voyager-EUS2 was the only machine to shake up the top spots, claiming No. 10. Based on an AMD EPYC processor with 48 cores and 2.45GHz working together with an NVIDIA A100 GPU and 80 GB of memory, Voyager-EUS2 also utilizes a Mellanox HDR Infiniband for data transfer.

While there were no other changes to the positions of the systems in the Top10, Perlmutter at NERSC improved its performance to 70.9 Pflop/s. Housed at the Lawrence Berkeley National Laboratory, Perlmutter's increased performance couldn't move it from its previously held No. 5 spot.