Apple's M-series chips frighten Intel, AMD, and Microsoft like nothing else can, as they have the potential to power MacBooks to grab a sizable share of the notebook market share. This is based squarely on the phenomenal performance/Watt on offer with Apple's chips. A user installed Windows 11 Arm on a virtual machine running on an M2-powered MacBook, opened up CPU-Z (which of course doesn't detect the chip since it's on a VM). They then ran a CPU-Z Bench session for a surprising result—a single-threaded score of 749.5 points, with a multithreaded score of 3822.3 points.

The single-thread score in particular is comparable to Intel's 12th Gen Core "Alder Lake" chips (their "Golden Cove" P-cores); maybe not on the fastest Core i9-12900K, but of the mid-range Core i5 chips, such as the i5-12600. It's able to do this at a fraction of the power and heat output. It is on the backs of this kind of IPC that Apple is building bigger chips such as the M3 Pro and M3 Max, which are able to provide HEDT or workstation-class performance, again, at a fraction of the power.

Toward the end of 2024, Intel will update its client processor product stack with the introduction of the new "Arrow Lake" microarchitecture targeting both the desktop and mobile segments. On the desktop side of things, this will herald the new Socket LGA1851 with more SoC connectivity being shifted to the processor; and on the mobile side of things, there will be a much-needed increase in CPU core counts form the current 6P+8E+2LP. This low maximum core-count for "Meteor Lake" is the reason why Intel couldn't debut it on the desktop platform, and couldn't use it to power enthusiast HX-segment mobile processors, either—it had to tap into "Raptor Lake Refresh," and use the older 14th Gen Core nomenclature one last time.

All hopes are now pinned on "Arrow Lake," which could make up Intel's second Core Ultra mobile lineup; its first desktop Core Ultra, and possibly push "Meteor Lake" to the non-Ultra tier. "Arrow Lake" carries forward the Xe-LPG graphics architecture for the iGPU that Intel debuted with "Meteor Lake," but there's a key difference between the desktop- and mobile "Arrow Lake" chips concerning this iGPU, and it has not just to do with the Xe core counts. It turns out, that while the desktop "Arrow Lake-S" processor comes with an iGPU based on the Xe-LPG graphics architecture; the mobile "Arrow Lake" chips spanning the U-, P-, and H-segments will use a newer version of this architecture, called the Xe-LPG+.

ASUS IoT, the global AIoT solution provider, today announced the launch of its new lineup of industrial motherboards and edge AI computers powered by the latest Intel Core (14th gen) processors. These cutting-edge solutions offer supreme computing performance, enhanced power efficiency, and accelerated connectivity, making them ideal for a wide range of industrial applications. One of the key features of these new solutions is the accelerated transfer speeds and enhanced power efficiency offered by DDR5 memory. Compared to DDR4, DDR5 memory provides 50% faster transfer speeds and 8% improved power efficiency, ensuring reliability with ECC technology.

ASUS IoT industrial motherboards also support double-speed PCI Express (PCIe) 5.0, which doubles the speed of PCIe 4.0, while maintaining full backward compatibility for system flexibility. This allows for faster data transfer and expandability, meeting the demands of modern industrial applications. The integrated Intel UHD Graphics technology in ASUS IoT motherboards supports up to 8K60 HDR video and multiple 4K60 displays, providing vivid graphics and powerful AI acceleration. This makes them ideal for various applications, including retail, healthcare and AI in smart factories.

By the end of 2023, MSI unveiled its groundbreaking support for memory capacities of up to 256 GB. Now, both MSI Intel and AMD motherboards official support these capacities, with 4 DIMMs enabling 256 GB and 2 DIMMs supporting 128 GB. This advancement enhances multitasking capabilities and ensures seamless computing operations.

Intel Motherboard - 700 & 600 Series Platform, BIOS Rolling Out
The supported platforms for this memory capacity enhancement include Intel 700 and 600 series DDR5 motherboards. Gamers looking to benefit from these enhancements will need to upgrade to the own dedicated BIOS. MSI is currently diligently working on releasing the BIOS, with the first batch already available below. The rest of the models will be released in late February and March.

NVIDIA is anticipating supply issues for its upcoming Blackwell GPUs, which are expected to significantly improve artificial intelligence compute performance. "We expect our next-generation products to be supply constrained as demand far exceeds supply," said Colette Kress, NVIDIA's chief financial officer, during a recent earnings call. This prediction of scarcity comes just days after an analyst noted much shorter lead times for NVIDIA's current flagship Hopper-based H100 GPUs tailored to AI and high-performance computing. The eagerly anticipated Blackwell architecture and B100 GPUs built on it promise major leaps in capability—likely spurring NVIDIA's existing customers to place pre-orders already. With skyrocketing demand in the red-hot AI compute market, NVIDIA appears poised to capitalize on the insatiable appetite for ever-greater processing power.

However, the scarcity of NVIDIA's products may present an excellent opportunity for significant rivals like AMD and Intel. If both companies can offer a product that could beat NVIDIA's current H100 and provide a suitable software stack, customers would be willing to jump to their offerings and not wait many months for the anticipated high lead times. Intel is preparing the next-generation Gaudi 3 and working on the Falcon Shores accelerator for AI and HPC. AMD is shipping its Instinct MI300 accelerator, a highly competitive product, while already working on the MI400 generation. It remains to be seen if AI companies will begin the adoption of non-NVIDIA hardware or if they will remain a loyal customer and agree to the higher lead times of the new Blackwell generation. However, capacity constrain should only be a problem at launch, where the availability should improve from quarter to quarter. As TSMC improves CoWoS packaging capacity and 3 nm production, NVIDIA's allocation of the 3 nm wafers will likely improve over time as the company moves its priority from H100 to B100.

Senao Networks, a leading network solution provider, proudly announces its launch of SX904 SmartNIC based on the Intel NetSec Accelerator Reference Design. This cutting-edge NIC, harnessing the power of PCIe Gen 4 technology and fueled by the Intel Xeon D processor, sets an unprecedented standard in high-performance network computing. Senao will showcase a system demonstration at the Intel booth during the upcoming MWC in Barcelona. As transformative shift in networking edge, enterprises are increasingly leaning on scalable edge infrastructure. In order to cater the demands of workloads, low latency, local data processing, and robust security, SX904 marks a significant leap forward.

The combination of Intel XeonD processor, PCIe Gen 4 technology, dual 25 Gbps SFP28 support, and DDR4 ECC memory support enables the SX904 to achieve unparalleled data transfer rates and maximum bandwidth utilization, ideal for modern server architectures. It provides higher performance from the latest Intel Xeon D processor and Intel Ethernet Controller E810 and supports the latest Intel Platform Firmware Resilience, BMC, and TPM 2.0. SX904 enables the seamless offload of applications optimized for Intel architecture with zero changes, optimizing performance transmission effortlessly into an Intel-based server in PCIe add-in-card form factor.

US Commerce Secretary, Gina Raimondo, was a notable guest speaker during yesterday's Intel Foundry Direct Connect Keynote—she was invited on (via a video link) to discuss the matter of strengthening the nation's semiconductor industry, and staying competitive with global rivals. During discussions, Pat Gelsinger (Intel CEO) cheekily asked whether a "CHIPS Act Part Two" was in the pipeline. Raimondo responded by stating that she is till busy with the original $52 billion tranche: "I'm out of breath running as fast as I can implementing CHIPS One." Earlier this week, her department revealed a $1.5 billion planned direct fund for GlobalFoundries: "this investment will enable GF to expand and create new manufacturing capacity and capabilities to securely produce more essential chips for automotive, IoT, aerospace, defense, and other vital markets."

Intel is set to receive a large grant courtesy of the US government's 2022-launched CHIPS and Science Act—exact figures have not been revealed to the public, but a Nikkei Asia report suggests that Team Blue will be benefiting significantly in the near future: "While the Commerce Department has not yet announced how much of the funding package's $52 billion it would grant Intel, the American chipmaker is expected to get a significant portion, according to analysts and officials close to the situation." Raimondo stated that: "Intel is an American champion company and has a very huge role to play in this revitalization." The US Commerce Chief also revealed that she had spoken with artificial intelligence industry leaders, including OpenAI's Sam Altman, about the ever-growing demand for AI-crunching processors/accelerators/GPUs. The country's semiconductor production efforts could be bolstered once more, in order to preserve a competitive edge—Raimondo addressed Gelsinger's jokey request for another batch of subsidies: "I suspect there will have to be—whether you call it Chips Two or something else—continued investment if we want to lead the world...We fell pretty far. We took our eye off the ball."

We're happy to share that Framework Laptop 16's are now in customer hands. It's been an excellent journey over the last two years designing and building an ultra-upgradeable, high-performance machine, and we're excited to see the early feedback. As always with Framework products, the first shipment is just the beginning, and we're looking forward to continuing to deliver on longevity, upgradeability, and repairability as we go. We've seen more press reviews go live as well, including by far the most thorough one, a deep dive from Jarrod's Tech that includes both a broad range of benchmarks and subjective evaluation of the overall experience. Framework Laptop 16 pre-orders are still open as we continue to manufacture our way through the pre-order batches. Most of our factory capacity, which we doubled last year, is now allocated to getting you Framework Laptop 16's as quickly as we can.

We recently uploaded the first set of developer documentation around Framework Laptop 16 internals on GitHub, adding to the existing material we have for the Expansion Bay and Input Module systems. The new release includes drawings and connector part numbers for the Mainboard to enable re-use. We'll continue to build out this documentation over time, like we have for Framework Laptop 13.

Samsung Electronics today announced the Galaxy Book4 series will be available in selected markets starting February 26. The latest premium PC lineup from Samsung delivers intelligent and powerful experiences that bring together highly optimized performance, a vivid touchscreen display and enhanced connectivity. The Galaxy Book4 series, including the Galaxy Book4 Ultra, Galaxy Book4 Pro and Galaxy Book4 Pro 360, launched in Korea on January 2 and experienced record-breaking interest, outselling last year's Galaxy Book3 series by 1.5 times during the first week of sales.

"We're excited for users to experience the intelligence, connectivity and productivity made possible by the Galaxy Book4 series, taking our premium PC lineup to the next level," said TM Roh, President and Head of Mobile eXperience Business at Samsung Electronics. "The Galaxy Book4 series delivers the powerful performance and multi-device connectivity that consumers expect from a high-performance PC in today's market."

Users of Intel's 13th Gen unlocked K-series processors such as Core i9-13900K, i7-13700K, are reporting stability issues when gaming even at stock clock-speeds. Hassan Mujtaba of Wccftech and Tom's Hardware have isolated the issues to power limit unlocks. Most Z690 and Z790 chipset motherboards include BIOS-level unlocks for the power limits, particularly the Maximum Turbo Power (interchangeable with PL2). By default, the i9-13900K and i7-13700K come with a PL2 value of 253 W, but you can get the motherboard to unlock this to unlimited, which basically tells the processor that it has 4096 W of power on tap, so not technically a "stock" configuration anymore.

Of course, neither your PSU nor your CPU VRM are capable of delivering 4096 W, and so the processor tends to draw as much power as it needs, to maintain the best possible P-core boost frequencies, before running into thermal limits. At stock frequencies with stock boost bins, unlocked power limits can drive the power draw of i9-13900K as far high as 373 W under a multithreaded load, in our testing, when compared to 283 W with the power limits in place. It turns out, that unlocking the power limits can come with long-term costs, besides the literal cost of electricity—the processor's stability with gaming workloads can degrade with certain hardware combos and settings.

Intel CEO Pat Gelsinger, speaking at the Intel Foundry Services (IFS) Direct Connect event, confirmed to Tom's Hardware that he hopes to turn IFS into the West's premier foundry company, and a direct technological and volume rival to TSMC. He said that there is a clear line of distinction between Intel Products and Intel Foundry, and that later this year, IFS will be more legally distinct from Intel, becoming its own entity. The only way Gelsinger sees IFS being competitive to TSMC, is by making its most advanced semiconductor manufacturing nodes and 3D chip packaging innovations available to foundry customers other than itself (Intel Products), even if it means providing them to companies that directly compete with Intel products, such as AMD and Qualcomm.

Paul Alcorn of Tom's Hardware asked CEO Gelsinger "Intel will now offer its process nodes to some of its competitors, and there may be situations wherein your product teams are competing directly with competitors that are enabled by your crown jewels. How do you plan to navigate those types of situations and maybe soothe ruffled feathers on your product teams?" To this, Gelsinger responded "Well, if you go back to the picture I showed today, Paul, there are Intel products and Intel foundry, There's a clean line between those, and as I said on the last earnings call, we'll have a setup separate legal entity for Intel foundry this year," Gelsinger responded. "We'll start posting separate financials associated with that going forward. And the foundry team's objective is simple: Fill. The. Fabs. Deliver to the broadest set of customers on the planet."

During his keynote address today at Intel Foundry Direct Connect, Intel's inaugural foundry event, CEO Pat Gelsinger introduced four members of the company's Foundry Advisory Committee. The committee advises Intel on its IDM 2.0 strategy, including creation and development of a thriving systems foundry for the AI era.
The advisory committee includes leaders from the semiconductor industry and academia, two of whom are also members of Intel's board of directors:

• Chi-Foon Chan, former Co-CEO of Synopsys; former Microprocessor Group general manager at NEC; director at PDF Solutions.
• Joe Kaeser, former CEO of Siemens; supervisory board chair at Siemens Energy and Daimler Truck; supervisory board member at Linde; former member of the board of NXP semiconductor; member of the board of trustees at the World Economic Forum.
• Tsu-Jae King Liu, vice chair of the Foundry Advisory Committee; dean of College of Engineering at the University of California, Berkeley; Intel director; and director at MaxLinear.
• Lip-Bu Tan, chair of the Foundry Advisory Committee; former CEO of Cadence Design Systems; chairman of Walden International; and Intel director; director at Credo Technology Group and Schneider Electric.

The JEDEC Board of Directors presented its prestigious 2024 Distinguished Executive Leadership Award to Intel CEO, Pat Gelsinger, in a ceremony held at Intel's offices in Santa Clara, CA earlier this month. This award stands as JEDEC's highest honor and recognizes the most distinguished senior executives in the electronics industry who promote and support the advancement of JEDEC standards.

"Throughout Pat Gelsinger's distinguished career, he has consistently championed the development of open standards, as evidenced by Intel's contributions in this domain. Under his leadership, Intel has made a tremendous impact on many groundbreaking memory and IO technologies in JEDEC," said Mian Quddus, JEDEC Board of Directors Chairman. He added, "JEDEC is grateful for his invaluable support and that of the Intel team."

Intel Corp. today launched Intel Foundry as a more sustainable systems foundry business designed for the AI era and announced an expanded process roadmap designed to establish leadership into the latter part of this decade. The company also highlighted customer momentum and support from ecosystem partners - including Synopsys, Cadence, Siemens and Ansys - who outlined their readiness to accelerate Intel Foundry customers' chip designs with tools, design flows and IP portfolios validated for Intel's advanced packaging and Intel 18A process technologies.

The announcements were made at Intel's first foundry event, Intel Foundry Direct Connect, where the company gathered customers, ecosystem companies and leaders from across the industry. Among the participants and speakers were U.S. Secretary of Commerce Gina Raimondo, Arm CEO Rene Haas, Microsoft CEO Satya Nadella, OpenAI CEO Sam Altman and others.

Phoronix has spotted intriguing new Linux kernel patches for Intel Core Ultra "Meteor Lake" processors—the Monday morning notes reveal in-house software engineers are implementing default power profile adjustments. Meteor Lake CPUs have been operating on a default "balanced_performance" mode since their December 2023 launch—Linux adjustments will affect the processor's Energy Performance Preference (EPP) under Linux (similar to Windows Power Plans). Michael Larabel (Phoronix head honcho) laid out some history: "We've seen EPP overrides/tuning in the past within the Intel P-State driver for prior generations of Intel processors and this is much the same here. The ACPI EPP value is typically a range from 0 to 255 for indicating the processor/system power to performance preference."

He continued onto present day circumstances: "To date though the Intel P-State EPP override/tuning has been focused on the default "balanced_performance" mode while the first patch (from Monday) allows for model-specific EPP overrides for all pre-defined EPP strings. The second patch then goes ahead and updates the EPP values for Meteor Lake so that the balanced_performance default is now treated as 115 rather than 128 and the "performance" EPP is set to 16 rather than 0." Larabel is hopeful that a public release will coincide with the "upcoming Linux v6.9 cycle." Intel software engineers reckon that their tweaks/overrides have produced higher performance results—for "small form factor devices"—while reducing CPU temperatures and thermal throttling. Meteor Lake is considered to be quite energy inefficient when compared to the closest mobile processor architectures from AMD and Apple. Team Blue's next-gen Arrow Lake family is expected to launch later this year, but the current crop of CPUs require a bit of TLC and optimization in the meantime.

Feast your eyes on the first pictures of an Intel "Granite Rapids" Xeon processor wafer, courtesy of Andreas Schilling with HardwareLuxx.de. This is Intel's first commercial silicon built on the new Intel 3 foundry node, which is expected to be the company's final silicon fabrication node to implement FinFET technology; before the company switches to Nanosheets with the next-generation Intel 20A. Intel 3 offers transistor densities and performance competitive to TSMC N3 series, and Samsung 3GA series nodes.

The wafer contains square 30-core tiles, two of which make up a "Granite Rapids-XCC" processor, with CPU core counts going up to 56-core/112-threads (two cores left unused per tile for harvesting). Each of the 30 cores on the tile is a "Redwood Cove" P-core. In comparison, the current "Emerald Rapids" Xeon processor uses "Raptor Cove" cores, and is built on the Intel 7 foundry node. Intel is planning to overcome the CPU core-count deficit to AMD EPYC, including the upcoming EPYC "Turin" Zen 5 processors with their rumored 128-core/256-thread counts, by implementing several on-silicon fixed-function accelerators that speed up popular kinds of server workloads. The "Redwood Cove" core is expected to be Intel's first IA core to implement AVX10 and APX.

Starfield game patch version 1.9.67 just released, with official support for AMD FSR 3.0 and Intel XeSS. Support for the two performance enhancements was beta (experimental) until now. FSR 3.0 brings frame generation support to Starfield. The game had received DLSS 3 Frame Generation support in November 2023, but by then, FSR 3.0 support wasn't fully integrated with the game, as it had just began rolling out in September. The FSR 3.0 option now replaces the game's FSR 2.0 implementation. FSR 3.0 works on Radeon RX 7000 series and RX 6000 series graphics cards. The patch also fixes certain visual artifacts on machines with DLSS performance preset enabled.

Intel Foundry Services (IFS) and Cadence Design Systems Inc. today announced a multiyear strategic agreement to jointly develop a portfolio of key customized intellectual property (IP), optimized design flows and techniques for Intel 18A process technology featuring RibbonFET gate-all-around transistors and PowerVia backside power delivery. Joint customers of the companies will be able to accelerate system-on-chip (SoC) project schedules on process nodes from Intel 18A and beyond while optimizing for performance, power, area, bandwidth and latency for demanding artificial intelligence, high performance computing and premium mobile applications.

"We're very excited to expand our partnership with Cadence to grow the IP ecosystem for IFS and provide choice for customers," said Stuart Paann, Intel senior vice president and general manager of IFS. "We will leverage Cadence's world-class portfolio of leading IP and advanced design solutions to enable our customers to deliver high-volume, high-performance and power-efficient SoCs on Intel's leading-edge process technologies."

CTL, a global cloud-computing solution leader for education, announced today the introduction of the new CTL Chromebook NL73 Series. The new Chromebook, incorporating the Intel Processor N100 and Intel Processor N200, enables IT professionals to equip schools with the cloud-computing performance they need today and with the sustainability required for tomorrow.

"Since Chromebooks were widely deployed during the pandemic to remote students, new applications have come into use, requiring more processing power and cybersecurity measures than ever before," noted Erik Stromquist, CEO of CTL. "Chromebook users will need to level up their technology in 2024. Our new NL73 Series delivers not only the power to meet these new requirements but also CTL's flexible configuration options, purchase options, and whole lifecycle management services for the ultimate in sustainability."

A collaboration including Intel, Dell Technologies, Nvidia and the Ohio Supercomputer Center (OSC), today introduces Cardinal, a cutting-edge high-performance computing (HPC) cluster. Purpose-built to meet the increasing demand for HPC resources in Ohio across research, education and industry innovation, particularly in artificial intelligence (AI).

AI and machine learning are integral tools in scientific, engineering and biomedical fields for solving complex research inquiries. As these technologies continue to demonstrate efficacy, academic domains such as agricultural sciences, architecture and social studies are embracing their potential. Cardinal is equipped with the hardware capable of meeting the demands of expanding AI workloads. In both capabilities and capacity, the new cluster will be a substantial upgrade from the system it will replace, the Owens Cluster launched in 2016.

ASUS today announced brand-new ASUS Vivobook S series laptops for 2024, designed for a sleek and lightweight lifestyle. These laptops - all featuring ASUS Lumina OLED display options - are driven by the latest AI-enabled the latest Intel Core Ultra processors, and offer exceptional performance. The series comprises the 14.0-inch ASUS Vivobook S 14 OLED (S5406), the 15.6-inch ASUS Vivobook S 15 OLED (S5506), and the 16.0-inch ASUS Vivobook S16 OLED (S5606). These sleek, powerful and lightweight Intel Evo -certified ASUS Vivobook laptops offer the ultimate experience for those seeking on-the-go productivity and instant entertainment, with modern color options and minimalist, high-end aesthetics, making them the perfect choice for balanced mobility and performance.

ASUS Vivobook S 14/15/16 OLED are powered by Intel Core Ultra processors, with up to a 50-watt TDP and a built-in Neural Processing Unit (NPU) that provides power-efficient acceleration for modern AI applications. Moreover, ASUS Vivobook S series laptops all have dedicated Copilot key, allowing you effortlessly dive into Windows 11 AI-powered tools with just one press. Lifelike visuals are provided by world-leading ASUS Lumina OLED displays with resolutions up to 3.2K (S5606) along with 120 Hz refresh rates, a 100% DCI-P3 gamut and DisplayHDR True Black 600 certification. The stylish and comfortable ASUS ErgoSense keyboard now features customizable single-zone RGB backlighting, and there's an extra-large ErgoSense touchpad. As with all ASUS Vivobook models, the user experience is prioritized: there's a lay-flat 180° hinge, an IR camera with a physical shutter, a full complement of I/O ports, and immersive Dolby Atmos audio from the powerful Harman Kardon-certified stereo speakers.

AI workloads are split into two different categories: training and inference. While training requires large computing and memory capacity, access speeds are not a significant contributor; inference is another story. With inference, the AI model must run extremely fast to serve the end-user with as many tokens (words) as possible, hence giving the user answers to their prompts faster. An AI chip startup, Groq, which was in stealth mode for a long time, has been making major moves in providing ultra-fast inference speeds using its Language Processing Unit (LPU) designed for large language models (LLMs) like GPT, Llama, and Mistral LLMs. The Groq LPU is a single-core unit based on the Tensor-Streaming Processor (TSP) architecture which achieves 750 TOPS at INT8 and 188 TeraFLOPS at FP16, with 320x320 fused dot product matrix multiplication, in addition to 5,120 Vector ALUs.

Having massive concurrency with 80 TB/s of bandwidth, the Groq LPU has 230 MB capacity of local SRAM. All of this is working together to provide Groq with a fantastic performance, making waves over the past few days on the internet. Serving the Mixtral 8x7B model at 480 tokens per second, the Groq LPU is providing one of the leading inference numbers in the industry. In models like Llama 2 70B with 4096 token context length, Groq can serve 300 tokens/s, while in smaller Llama 2 7B with 2048 tokens of context, Groq LPU can output 750 tokens/s. According to the LLMPerf Leaderboard, the Groq LPU is beating the GPU-based cloud providers at inferencing LLMs Llama in configurations of anywhere from 7 to 70 billion parameters. In token throughput (output) and time to first token (latency), Groq is leading the pack, achieving the highest throughput and second lowest latency.

Chinese review outlets have received MSI Claw sample units—the "Please, Xiao Fengfeng" Bilibili video channel has produced several comparison pieces detailing how the plucky Intel Meteor Lake-powered handheld stands up against its closest rival; ASUS ROG Ally. The latter utilizes an AMD Ryzen Z1 APU—in Extreme or Standard forms—many news outlets have pointed out that the Z1 Extreme processor is a slightly reworked Ryzen 7 7840U "Phoenix" processor. Intel and its handheld hardware partners have not dressed up Meteor Lake chips with alternative gaming monikers—simply put, the MSI Claw arrives with Core Ultra 7-155H or Ultra 5-135H processors onboard. The two rival systems both run on Window 11, and also share the same screen size, resolution, display technology (IPS) and 16 GB LPDDR5-6400 memory configuration. The almost eight months old ASUS handheld seems to outperform its near-launch competition.

Xiao Fengfeng's review (Ultra 7-155H versus Z1 Extreme) focuses on different power levels and how they affect handheld performance—the Claw and Ally have user selectable TDP modes. A VideoCardz analysis piece lays out key divergences: "Both companies offer easy TDP profile switches, allowing users to adjust performance based on the game's requirements or available battery life. The Claw's larger battery could theoretically offer more gaming time or higher TDP with the same battery life. The system can work at 40 W TDP level (but in reality it's between 35 and 40 watts)...In the Shadow of the Tomb Raider test, the Claw doesn't seem to outperform the ROG Ally. According to a Bilibili creator's test, the system falls short at four different power levels: 15 W, 20 W, 25 W, and max TDP (40 W for Claw and 30 W for Ally)."

GIGABYTE, a global leader in high-performance computing solutions, collaborates with industry partner Xenon at SupercomputingAsia 2024, held at the Sydney International Convention and Exhibition Centre from February 19 to 22. This collaboration showcases cutting-edge technologies, offering diverse solutions that redefine the high-performance computing landscape.

GIGABYTE's Highlights at SCA 2024
At booth 19, GIGABYTE presents the G593-SD0, our flagship AI server, and the industry's first Nvidia-certified HGX H100 8-GPU Server. Equipped with 4th/5th Gen Intel Xeon Scalable Processors, it incorporates GIGABYTE's thermal design, ensuring optimal performance within its density-optimized 5U server chassis, pushing the boundaries of AI computing. Additionally, GIGABYTE introduces the 2U 4-node H263-S62 server, designed for 4th Gen Intel Xeon Scalable Processors and now upgraded to the latest 5th Gen, tailored for hybrid and private cloud applications. It features a DLC (Direct Liquid Cooling) solution to efficiently manage heat generated by high-performance computing. Also on display is the newly released W773-W80 workstation, supporting the latest NVIDIA RTX 6000 Ada and catering to CAD, DME, research, data and image analysis, and SMB private cloud applications. At SCA 2024, explore our offerings, including rackmount servers and motherboards, reflecting GIGABYTE's commitment to innovative and reliable solutions. This offers a valuable opportunity to discuss your IT infrastructure requirements with our sales and consulting teams, supported by GIGABYTE and Xenon in Australia.

Japanese tech billionaire and founder of the SoftBank Group, Masayoshi Son, is embarking on a hugely ambitious new project to build an AI chip company that aims to rival NVIDIA, the current leader in AI semiconductor solutions. Codenamed "Izanagi" after the Japanese god of creation, Son aims to raise up to $100 billion in funding for the new venture. With his company SoftBank having recently scaled back investments in startups, Son is now setting his sights on the red-hot AI chip sector. Izanagi would leverage SoftBank's existing chip design firm, Arm, to develop advanced semiconductors tailored for artificial intelligence computing. The startup would use Arm's instruction set for the chip's processing elements. This could pit Izanagi directly against NVIDIA's leadership position in AI chips. Son has a chest of $41 billion in cash at SoftBank that he can deploy for Izanagi.

Additionally, he is courting sovereign wealth funds in the Middle East to contribute up to $70 billion in additional capital. In total, Son may be seeking up to $100 billion to bankroll Izanagi into a chip powerhouse. AI chips are seeing surging demand as machine learning and neural networks require specialized semiconductors that can process massive datasets. NVIDIA and other names like Intel, AMD, and select startups have capitalized on this trend. However, Son believes the market has room for another major player. Izanagi would focus squarely on developing bleeding-edge AI chip architectures to power the next generation of artificial intelligence applications. It is still unclear if this would be an AI training or AI inference project, but given that the training market is currently bigger as we are in the early buildout phase of AI infrastructure, the consensus might settle on training. With his track record of bold bets, Son is aiming very high with Izanagi. It's a hugely ambitious goal, but Son has defied expectations before. Project Izanagi will test the limits of even his vision and financial firepower.