ASUS IoT, a global leader in AIoT solutions, today announced the release of MDS-M700—an all-new medical box PC expertly engineered to deliver exemplary performance and service in diverse healthcare settings. As display and video capture technologies advance to ultra-high definition (UHD) resolutions, MDS-M700 is at the forefront, boasting support for 4K UHD imaging that offers unparalleled clarity and precision in visualizing human tissue, vessels and body structures. MDS-M700 meets medical safety industry standards, including CE, FCC, and IEC 60601-1-2 certifications.

With the growing demand for digital operating rooms and intelligent healthcare, MDS-M700 is engineered to be a trustworthy medical box PC. With an ultra-low noise level of 45 dB and a seamless one-piece cover, MDS-M700 helps to maintain a hygienic environment with resistance to alcohol, making it ideal for sterile settings such as surgery centers, operating rooms and training facilities. Powered by Intel Core (13th gen) processors, and optional NVIDIA RTX A5000/A4000 GPU cards, MDS-M700 delivers exceptional computing performance while operating quietly across a spectrum of applications.

The latest TrendForce report reveals a notable 7.9% jump in 4Q23 revenue for the world's top ten semiconductor foundries, reaching $30.49 billion. This growth is primarily driven by sustained demand for smartphone components, such as mid and low-end smartphone APs and peripheral PMICs. The launch season for Apple's latest devices also significantly contributed, fueling shipments for the A17 chipset and associated peripheral ICs, including OLED DDIs, CIS, and PMICs. TSMC's premium 3 nm process notably enhanced its revenue contribution, pushing its global market share past the 60% threshold this quarter.

TrendForce remarks that 2023 was a challenging year for foundries, marked by high inventory levels across the supply chain, a weak global economy, and a slow recovery in the Chinese market. These factors led to a downward cycle in the industry, with the top ten foundries experiencing a 13.6% annual drop as revenue reached just $111.54 billion. Nevertheless, 2024 promises a brighter outlook, with AI-driven demand expected to boost annual revenue by 12% to $125.24 billion. TSMC, benefiting from steady advanced process orders, is poised to far exceed the industry average in growth.

Qualcomm Snapdragon X Elite is about to make landfall in the ultraportable notebook segment, powering a new wave of Windows 11 devices powered by Arm, capable of running even legacy Windows applications. The Snapdragon X Elite SoC in particular has been designed to rival the Apple M3 chip powering the 2024 MacBook Air, and some of the "entry-level" variants of the 2023 MacBook Pros. These chips threaten the 15 W U-segment and even 28 W P-segment of x86-64 processors from Intel, such as the Core Ultra "Meteor Lake," and Ryzen 8040 "Hawk Point." Erdi Özüağ, prominent tech journalist from Türkiye, has access to a Qualcomm-reference notebook powered by the Snapdragon X Elite X1E80100 28 W SoC. He compared its performance to an off-the-shelf notebook powered by a 28 W Intel Core Ultra 7 155H "Meteor Lake" processor.

There are three tests that highlight the performance of the key components of the SoCs—CPU, iGPU, and NPU. A Microsoft Visual Studio code compile test sees the Snapdragon X Elite with its 12-core Oryon CPU finish the test in 37 seconds; compared to 54 seconds by the Core Ultra 7 155H with its 6P+8E+2LP CPU. In the 3DMark test, the Adreno 750 iGPU posts identical performance numbers to the Arc Graphics Xe-LPG of the 155H. Where the Snapdragon X Elite dominates the Intel chip is AI inferencing. The UL Procyon test sees the 45 TOPS NPU of the Snapdragon X Elite score 1720 points compared to 476 points by the 10 TOPS AI Boost NPU of the Core Ultra. The Intel machine is using OpenVINO, while the Snapdragon is using Qualcomm SNPE SDK for the test. Don't forget to check out the video review by Erdi Özüağ in the source link below.

ECS Industrial Computer Co., Ltd., also known as ECSIPC, proudly unveils its latest generation of mini PCs for quad-display industrial applications, the LIVA Z5 series, which includes the LIVA Z5 Plus, LIVA Z5E Plus, and LIVA Z5F Plus. Committed to providing industry-specific value solutions, ECSIPC focuses on developing niche products and solutions for vertical industry applications. ECSIPC has achieved success in various application areas, including educational electronic whiteboards in Europe and the US, airport real-time flight systems in India, image projection for Japan's Shinkansen bullet trains, and electronic menu and POS systems for KFC in South America, while also exploring applications in vending machines and digital signage.

The newly launched LIVA Z5 series is powered by Intel 13th and 14th generation Core processors, delivering significant performance improvements with up to 10 cores capable of efficiently handling various demanding tasks. The series has Wi-Fi 6E speeds up to 9.6 Gbps for enhanced data transmission efficiency, allowing seamless playback of high-quality audiovisual content. Additionally, the multi-storage design accommodates PCIe Gen 4 M.2 NVMe SSDs and a 2.5-inch SSD or HDD, offering greater storage flexibility. The series ensures high-speed data processing in industrial environments with two 2.5G Base-T (2.5G) ports. At the same time, support for vPro and physical TPM significantly enhances the value of industrial applications.

Intel is revamping its foundry play, and the company is set on its goals of becoming a strong contender to rivals such as TSMC and Samsung. Under Pat Gelsinger's lead, Intel recently split (virtually, under the same company) its units into Intel Product and Intel Foundry. During the SPIE 2024 conference for optics and photonics, Anne Kelleher, Intel's senior vice president, revealed that the 14A (1.4 nm) process offers a 15% performance-per-watt improvement over the company's 18A (1.8 nanometers) process. Additionally, the enhanced 14A-E process boasts a further 5% performance boost from the regular A14 node, being a small refresh. Intel's 14A process is set to be the first to utilize High-NA extreme ultraviolet (EUV) equipment, delivering a 20% increase in transistor logic density compared to the 18A node.

The company's aggressive pursuit of next-generation processes poses a significant threat to Samsung Electronics, which currently holds the second position in the foundry market. As part of its IDM 2.0 strategy, Intel hopes to reclaim its position as a leading foundry player and surpass Samsung by 2030. The company's collaboration with American companies, such as Microsoft, further solidifies its ambitions. Intel has already secured a $15 billion chip production contract with Microsoft for its 1.8 nm 18A process. The semiconductor industry is closely monitoring Intel's progress, as the company's advancements in process technology could potentially reshape the competitive landscape. With Samsung planning to mass-produce 2 nm process products next year, the race for dominance in the foundry market is heating up.

Intel today announced the release of Continuous Profiler to open source -- serving as an example of the company's open ecosystem approach to catalyze innovation and boost productivity for developers. The optimization agent is actively used by companies including ironSource, ShareChat and Snap Inc. to identify production bottlenecks and optimization opportunities. Developed by Intel Granulate and contributed to the open source community, Continuous Profiler is a solution that combines multiple profilers into one view as a flame graph. This unified view offers developers, performance engineers and DevOps a continuous and autonomous way to identify runtime inefficiencies.

"Continuous Profiler has been at the heart of what we've been doing at Intel Granulate. By helping developers identify bottlenecks in the code, businesses can optimize their applications more easily and effectively," said Asaf Ezra, general manager of Intel Granulate. Determining why central processing units (CPUs) are busy is a routine task for performance analysis in any testing and production environment. Continuous Profiler delivers a flame graph of the hottest code paths. "This visualized view makes it immediately obvious where CPU is consumed so you can find cost savings, eliminate bottlenecks, improve throughput, and reduce latency and performance regressions," said Brendan Gregg, Intel Fellow. "In today's complex environment, however, flame graphs can unearth so many performance wins that it becomes laborious to apply them all. Intel Granulate automates this task, allowing companies to realize these performance wins now and in the future as Intel develops more optimizations."

Pricing of Intel's upcoming enthusiast-segment desktop processor, the Core i9-14900KS, has been confirmed to be $749, according to a MicroCenter listing. This price is identical to what the company asked for the previous generation i9-13900KS and i9-12900KS. As a Special Edition SKU, the i9-14900KS may not be available in all markets you'd normally find the i9-14900K in, also the chip is expected to have higher cooling- and power requirements. Based on the "Raptor Lake Refresh" silicon, this 8P+16E core processor is expected to come with maximum boost frequencies of 6.20 GHz, and generally better overclocking headroom than the regular i9-14900K. The Core i9-14900KS is expected to go on sale this Thursday, March 14, 2024. Whether it beats the AMD Ryzen 7 7800X3D at gaming is the $749 question we'll answer soon.

There is some confidence behind removing HTT (Hyper-Threading technology) for the P-cores of its upcoming processor generations. Apparently "Lunar Lake" 17 W U-segment processors offer a substantial multithreaded performance gain of almost 50% over the current-generation "Meteor Lake," enabling Intel to do away with the power- or cache overheads that come with HTT. "Lunar Lake" will be Intel's third microarchitecture powering mobile processors under the Core Ultra brand; and its U-segment SKUs meant for ultraportables will come with processor base power values of 17 W. Intel will probably revise its platform specifications for the U-segment to denote 17 W, up from the current 15 W. Bionic Squash, a reliable source with Intel leaks, suggests so. The processors will come with a configurable base power of up to 30 W.

Intel "Lunar Lake" microarchitecture has a lot in common with the upcoming "Arrow Lake." For starters, both microarchitectures use the same combination of "Lion Cove" P-core architecture, and "Skymont" E-core architecture; however "Lunar Lake" comes with changes in the core-configuration, and the use of more advanced foundry nodes for some of its tiles. "Lunar Lake," much like "Meteor Lake," comes with a design priority for mobile platforms, which is why Intel is planning to launch this shortly after "Arrow Lake," with some reports even speaking of a late-2024 debut for the U-segment.

As of two days ago, the NVX System Integrators store (via Carousell Singapore) has allowed customers to pre-order the oft-leaked Intel Core i9-14900KS CPU—a S$1059 (~$794 USD) spend secures a "BX8071514900KS" Special Edition retail package for in-store pick only. Another pre-release discovery arrives courtesy of the ever vigilant tech watcher; momomo_us—SE Computer, a store located in the bustling streets of Kowloon, Hong Kong, has listed the incoming flagship Raptor Lake Refresh part with a price of HK$5500 (~$709.70 USD). An accompanying image appears to be a placeholder, since warehouse leaks have displayed "Special Edition" text on Intel's signature blue retail boxes.

Privileged members of the overclocking community are already playing around with Intel's selectively-binned 14th Gen Core processor—but mere mortals will have to wait patiently for an official retail rollout. VideoCardz has spent part of their weekend doing detective work—several early store listings point to a possible March 14 commencement. The graphics card news specialist has scoured online entities across Asia, France and Canada for price comparison purposes: "it appears that the KS 'Special Edition' variant is set to cost 19 to 30% more than the K variant. Pricing varies depending on the size of the retailer, where the offer was placed, and the region it is being sold." They thoroughly recommend that potential customers avoid pre-ordering the Intel Core i9-14900KS—asking prices could stabilize post-launch, and e-tailers rarely sell through the first batch of niche "KS" CPUs.

The US government is reported to be preparing a very healthy $3.5 billion investment in Intel Corporation—a mid-week published Bloomberg article proposes that the White House has authored a new "fast-moving spending bill." Congressional aides believe that Team Blue—upon official approval/signing off of funds—will be tasked with the production of advanced semiconductors for military and intelligence programs. Bloomberg posits that the resources will be sourced from a "Secure Enclave" project, seemingly linking to a wider tranche of funds within the US government's CHIPS and Science Act. The agreement/contract is expected to run over a period of three years. According to Bloomberg: "the Senate is expected to pass the legislation by a Saturday (March 9) deadline."

Reports from last November suggested that Intel leadership and US government representatives had engaged in negotiations regarding funds for military and intelligence chip applications—the construction costs for new manufacturing facilities were estimated to be in the $3 billion to $4 billion range. A Commerce Department statement was submitted to Bloomberg, but they only commented on an overall $10 billion budget: "We are still reviewing the effect of the appropriations text on the program...(we look) forward to continuing to work with Congress on implementing the Chips and Science Act in a manner the promotes our economic and national security." TSMC, Micron and Samsung are expected to receive "multi-billion-dollar awards" in the near future—these multinational corporations will assist in a bolstering of North American chip manufacturing capabilities.

HP Inc. today announced the industry's largest portfolio of AI PCs leveraging the power of AI to enhance productivity, creativity, and user experiences in hybrid work settings.

In an ever-changing hybrid work landscape, workers are still struggling with disconnection and digital fatigue. HP's 2023 Work Relationship Index reveals that only 27% of knowledge workers have a healthy relationship with work, and 83% believe it's time to redefine our relationships with work. Most employees believe AI will open new opportunities to enjoy work and make their jobs easier, but they need the right AI tools and technology to succeed.

IBM has announced the official opening of the new IBM X-Force Cyber Range in Washington, DC. The range includes new custom training exercises specifically designed to help U.S. federal agencies, their suppliers and critical infrastructure organizations more effectively respond to persistent and disruptive cyberattacks, and threats posed by AI. The state-of-the-art facility is designed to help everyone from legal and mission-critical leaders, to the C-Suite and technical security leaders prepare for a real-world cyber incident. According to IBM's 2023 Cost of a Data Breach report the global average cost of a data breach reached $4.45 million, with the US facing the highest breach costs across all regions. Organizations that formed an incident response (IR) team and tested their IR plan experienced faster incident response times and lower costs than organizations that did neither. In fact, the report found that high levels of IR planning and testing saved industry and government nearly $1.5 million in breach costs and 54 days from the data breach lifecycle.

"From national security threats to supply chain disruptions impacting the goods and services we rely on every day, cyberattacks on government and critical infrastructure can have ramifications that go far beyond the balance sheet," said Alice Fakir, Partner, Lead of Cybersecurity Services, US Federal Market for IBM Consulting. "The elite and highly customizable cyber response training we provide at our new DC range helps organizations and federal agencies better defend against existing and emerging threats, and also addresses federal mandates like those in the Biden Administration's Executive Order 14028 focused on improving the nation's cybersecurity."

Intel may be launching its enthusiast-segment desktop processor, the Core i9-14900KS Special Edition next week, but the chip is already in the hands of several elite overclockers, such as Pakhtunov from OCN. Once he got his hands on one of these, Pakhtunov wasted little time in de-lidding the chip, cleaning it up, grabbing some pics, before throwing it back in the arena for some before-and-after comparisons.

With its stock integrated heatspreader (IHS) in place, a Cinebench 2024 load sees a boost frequency on the P-cores of 5.90 GHz, in which the processor draws a staggering 376 W (as reported by the motherboard's ACPI to software); and a temperature of 85°C, when cooled with a Deepcool LS720 SE 360 mm AIO CLC. With the IHS removed, and at the same 5.90 GHz clocks and Cinebench 2024 load, sees the temperatures drop to 75°C, and power-draw to 366 W. The story repeats with the more brutal Y-cruncher stress test. The original chip with the IHS in place, and a 5.90 GHz boost on the P-cores, pulls a staggering 432 W, and 89°C temperatures. Remove the IHS, and the temperature drops to 82°C, with 409 W package power. It's worth noting here, that with the IHS removed, Pakhtunov used a liquid-metal TIM application between the die and the cold-plate.

TAITRA (Taiwan External Trade Development Council) has announced Pat Gelsinger, CEO of Intel Corporation, as a keynote speaker at COMPUTEX 2024 on June 4. Embracing COMPUTEX's theme of artificial intelligence (AI), Gelsinger will showcase Intel's next-generation data center and client computing products bringing AI Everywhere by making the technology accessible through exceptionally engineered platforms, secure solutions and open ecosystems support.

Gelsinger will detail how Intel's AI portfolio - including AI-accelerated Intel Xeon, Intel Gaudi and Intel Core Ultra processor families - unlocks new possibilities in the data center and cloud and across the world's network and edge applications, and how it ushers in the age of the AI PC, transforming the future of productivity and creativity. Gelsinger will also discuss how Intel Xeon processors deliver exceptional performance-per-watt efficiencies, freeing up server capacity for more AI tasks while delivering optimal total cost of ownership (TCO) and power-saving sustainability benefits.

Intel is rumored to be preparing to tease its Core Ultra 2-series "Arrow Lake" processor at the 2024 Computex, which gets underway this June. The series itself isn't expected to launch before Q4-2024, but Computex is the only major global event between June and January for Intel to unveil or tease its next-generation processor, so here we are. At this point we don't know which exact platform of "Arrow Lake" Intel is planning to tease—whether these are the mobile variants, or the Socket LGA1851 desktop "Arrow Lake-S." An unveiling of the latter would almost definitely entail PC motherboard vendors being allowed to show off their first compatible motherboards at Computex—the perfect platform for them to do so.

The Core Ultra "Arrow Lake" retains a Foveros Tiled (chiplet) construction of "Meteor Lake," but with advancements to the chip's Compute tile, which is built on the Intel 20A foundry node, and rocks new "Lion Cove" P-cores and "Skymont" E-cores; an updated I/O tile, and an iGPU based on the updated Xe-LPG+ graphics architecture. Since the processor now serves practically all PCH functions, the mobile "Arrow Lake" is a single-chip solution, whereas the desktop "Arrow Lake-S" is expected to remain 2-chip. There will be more I/O from the CPU, though, which is why the socket has 151 more pins than the LGA1700.

Intel's "AI Everywhere" hype campaign has generated the most noise in mainstream and enterprise segments. Team Blue's Gaudi—a family of deep learning accelerators—does not hit the headlines all that often. Their current generation model, Gaudi 2, is overshadowed by Team Green and Red alternatives—according to Intel's official marketing spiel: "it performs competitively on deep learning training and inference, with up to 2.4x faster performance than NVIDIA A100." Habana, an Intel subsidiary, has been working on optimizing Large Language Model (LLM) inference on Gaudi 1 and 2 for a while—their co-operation with Hugging Face has produced impressive results, as of late February. Siddhant Jagtap, an Intel Data Scientist, has demonstrated: "how easy it is to generate text with the Llama 2 family of models (7b, 13b and 70b) using Optimum Habana and a custom pipeline class."

Jagtap reckons that folks will be able to: "run the models with just a few lines of code" on Gaudi 2 accelerators—additionally, Intel's hardware is capable of accepting single and multiple prompts. The custom pipeline class: "has been designed to offer great flexibility and ease of use. Moreover, it provides a high level of abstraction and performs end-to-end text-generation which involves pre-processing and post-processing." His article/blog outlines various prerequisites and methods of getting Llama 2 text generation up and running on Gaudi 2. Jagtap concluded that Habana/Intel has: "presented a custom text-generation pipeline on Intel Gaudi 2 AI accelerator that accepts single or multiple prompts as input. This pipeline offers great flexibility in terms of model size as well as parameters affecting text-generation quality. Furthermore, it is also very easy to use and to plug into your scripts, and is compatible with LangChain." Hugging Face reckons that Gaudi 2 delivers roughly twice the throughput speed of NVIDIA A100 80 GB in both training and inference scenarios. Intel has teased third generation Gaudi accelerators—industry watchdogs believe that next-gen solutions are designed to compete with Team Green H100 AI GPUs.

Intel is reportedly launching its new enthusiast-segment desktop processor, the Core i9-14900KS, on March 14, 2024. The i9-14900KS is marked by Intel as a Special Edition product, meaning that it may not be available in all the markets that you'd otherwise find the regular i9-14900K in; and the processor has higher system- and cooling requirements to achieve its advertised performance levels. Given that Intel priced the previous generation i9-13900KS and i9-12900KS at $740, we don't expect pricing of the i9-14900KS to be any different.

The i9-14900KS is based on the same "Raptor Lake Refresh" silicon as the i9-14900K, but from better bins. It should come with higher overclocking headroom, and better performance out of the box. This is because Intel has dialed up the maximum boost frequencies by 100-200 MHz on both the P-cores and E-cores. The P-cores now boost up to 6.20 GHz using the Thermal Velocity Boost algorithm, whereas the i9-14900K boosts up to 6.00 GHz. With its launch just over a week away, retail boxes of the i9-14900KS are already beginning to leak from sources among brick-and-mortar retailers. Once such source in Vietnam grabbed these snaps of the processor box.

NVIDIA's Compute Unified Device Architecture (CUDA) has long been the de facto standard programming interface for developing GPU-accelerated software. Over the years, NVIDIA has built an entire ecosystem around CUDA, cementing its position as the leading GPU computing and AI manufacturer. However, rivals AMD and Intel have been trying to make inroads with their own open API offerings—ROCm from AMD and oneAPI from Intel. The idea was that developers could more easily run existing CUDA code on non-NVIDIA GPUs by providing open access through translation layers. Developers had created projects like ZLUDA to translate CUDA to ROCm, and Intel's CUDA to SYCL aimed to do the same for oneAPI. However, with the release of CUDA 11.5, NVIDIA appears to have cracked down on these translation efforts by modifying its terms of use, according to developer Longhorn on X.

"You may not reverse engineer, decompile or disassemble any portion of the output generated using Software elements for the purpose of translating such output artifacts to target a non-NVIDIA platform," says the CUDA 11.5 terms of service document. The changes don't seem to be technical in nature but rather licensing restrictions. The impact remains to be seen, depending on how much code still requires translation versus running natively on each vendor's API. While CUDA gave NVIDIA a unique selling point, its supremacy has diminished as more libraries work across hardware. Still, the move could slow the adoption of AMD and Intel offerings by making it harder for developers to port existing CUDA applications. As GPU-accelerated computing grows in fields like AI, the battle for developer mindshare between NVIDIA, AMD, and Intel is heating up.

Simply NUC, Inc, a leading custom computing company, proudly announced the expansion of the Onyx product line with Onyx Pro, a revolutionary Mini Workstation designed to cater to diverse computing needs. Powered by the Intel Core i9 vPro "Raptor Lake" 13900H CPU, Intel IRIS Xe integrated graphics, and featuring optional graphics cards such as NVIDIA T1000, Radeon Pro WX 3200, and Intel Arc A40, the Onyx Pro redefines computing in a compact form factor.

"Introducing the Onyx Pro marks a pivotal moment for Simply NUC." said Jonny Smith, CEO of Simply NUC "Powered by Intel Core i9 vPro "Raptor Lake", it's our first product with 10G fiber (x2) and standard quad network ports. With unmatched performance, AI-readiness, and advanced networking, Onyx Pro sets a new standard for compact workstations."

In a move that could intensify competition with Intel in the cutting-edge chip manufacturing space, Samsung Foundry has reportedly decided to rebrand its second-generation 3 nm-class fabrication technology, previously known as SF3, to a 2 nm-class manufacturing process called SF2. According to reports from ZDNet, the renaming of Samsung's SF3 to SF2 is likely an attempt by the South Korean tech giant to simplify its process nomenclature and better compete against Intel Foundry, at least visually. Intel is set to roll out its Intel 20A production node, a 2 nm-class technology, later this year. The reports suggest that Samsung has already notified its customers about the changes in its roadmap and the renaming of SF3 to SF2. Significantly, the company has reportedly gone as far as re-signing contracts with customers initially intended to use the SF3 production node.

"We were informed by Samsung Electronics that the 2nd generation 3 nm [name] is being changed to 2 nm," an unnamed source noted to ZDNet. "We had contracted Samsung Foundry for the 2nd generation 3 nm production last year, but we recently revised the contract to change the name to 2 nm." Despite the name change, Samsung's SF3, now called SF2, has not undergone any actual process technology alterations. This suggests that the renaming is primarily a marketing move, as using a different process technology would require customers to rework their chip designs entirely. Samsung intends to start manufacturing chips based on the newly named SF2 process in the second half of 2024. The SF2 technology, which employs gate-all-around (GAA) transistors that Samsung brands as Multi-Bridge-Channel Field Effect Transistors (MBCFET), does not feature a backside power delivery network (BSPDN), a significant advantage of Intel's 20A process. Samsung Foundry has not officially confirmed the renaming.

Panasonic Connect today announced the latest iterations of its TOUGHBOOK G2 and 33 detachable rugged tablets. The 10.1-inch G2mk2 and 12-inch 33mk3 deliver market-leading ruggedness, battery life, customisation, connectivity and performance that provide the modern mobile worker with a balanced solution, regardless of the task, application or environment.

Unrivalled performance for any application
Panasonic's TOUGHBOOK G2mk2 and 33mk3 devices feature market-leading performance, enhanced connectivity and increased modularity to adapt to different mobile worker requirements.

Over the weekend, there have been a series of leaks from sources such as Golden Pig Upgrade, and High Yield YT, surrounding Intel's next-generation desktop processor, the Core Ultra 2-series "Arrow Lake-S." The lineup is likely to continue the new client processor naming scheme Intel introduced with the Core Ultra 1-series "Meteor Lake" on the mobile platform. "Arrow Lake-S" is rumored to debut the new Socket LGA1851, which retains cooler-compatibility with LGA1700. Although Intel has nucleated all I/O functions of the traditional PCH to "Meteor Lake," making it a single-chip solution on the mobile platform; and although the mobile "Arrow Lake" will continue to be single-chip; the desktop "Arrow Lake-S" will be a 2-chip solution. This is mainly because the desktop platform demands a lot more PCIe lanes, for a larger number of NVMe storage devices, or high bandwidth devices such as Thunderbolt and USB4 hubs, etc.

Another key finding in this latest series of leaks, is that unlike "Meteor Lake," the desktop "Arrow Lake-S" will do away with low-power island E-cores located in the SoC tile of the processor. All CPU cores are located in the Compute tile, which is expected to be built in the Intel 20A foundry node—the company's first node to implement GAAFETs (nanosheets), with backside power delivery; as well as an advanced 2nd generation EUV lithography. Intel's 1st Gen EUV is used on the current FinFET-based Intel 4 and Intel 3 foundry nodes.

MSI Claw A1M, the company's ambitious attempt at a handheld gaming console based on the Intel Core Ultra "Meteor Lake" processor, instead of AMD Ryzen Z1 "Zen 4," goes on sale from March 8, 2024. This is according to a now-retracted Newegg store listing that mentions the release dates of the three Claw A1M models. The lineup is led by the Claw A1M powered by a Core Ultra 155H processor, 16 GB of LPDDR5-6400 memory, and 1 TB of NVMe SSD storage; for $799. For $50 less at $749, you get the same device, but with 512 GB of NVMe SSD storage. For a further $100 less, at $699, you get a model with the Core Ultra 5 135H processor, but the same 16 GB LPDDR5 memory, and 512 GB SSD, as the $749 model.

All three models feature a physically identical body design, including the controller layout, and lighting. Performance between the Core Ultra 7 155H and Core Ultra 5 135H models, is bound to differ. The 155H has a 6P+8E+2LP CPU core configuration, but more importantly, maxes out the Graphics Tile, with all 8 Xe cores being enabled (1,024 unified shaders). The Core Ultra 5 135H has a 4P+8E+2LP CPU core config, while its iGPU has 7 Xe cores. The star attraction with this console is its 7-inch touchscreen with 1080p resolution at 120 Hz refresh rate. Comms on all three models include Wi-Fi 7 and Bluetooth 5.4.

The AI infrastructure of today is mostly fueled by the expansion that relies on GPU-accelerated servers. Google, one of the world's largest hyperscalers, has noted that CPUs are still a leading compute for AI/ML workloads, recorded on their Google Cloud Services cloud internal analysis. During the TechFieldDay event, a speech by Brandon Royal, product manager at Google Cloud, explained the position of CPUs in today's AI game. The AI lifecycle is divided into two parts: training and inference. During training, massive compute capacity is needed, along with enormous memory capacity, to fit ever-expanding AI models into memory. The latest models, like GPT-4 and Gemini, contain billions of parameters and require thousands of GPUs or other accelerators working in parallel to train efficiently.

On the other hand, inference requires less compute intensity but still benefits from acceleration. The pre-trained model is optimized and deployed during inference to make predictions on new data. While less compute is needed than training, latency and throughput are essential for real-time inference. Google found out that, while GPUs are ideal for the training phase, models are often optimized and run inference on CPUs. This means that there are customers who choose CPUs as their medium of AI inference for a wide variety of reasons.

The existence of Intel's upcoming Core i9-14900KS processor has been confirmed by a series of insider leaks and premature retail listings—an "alleged" example was photographed and appeared online right at the start of 2024. French e-tail listings produced evidence of two packages—a traditional retail box version, and a barebones tray option for OEM purposes. Earlier today, the I_Leak_VN social media account uploaded proof of a single "Special Edition" box sitting in an unnamed Vietnamese warehouse—it is not immediately clear whether units have reached retail facilities, or have just arrived on Southeast Asian shores. The embargo-busting post seemingly corroborates global insider information/whispers about distribution networks receiving stock—possibly in preparation for a rumored mid-March launch. VideoCardz believes that Vietnamese customers will be paying roughly $765 a pop—30% pricier than the current cost of 14th Gen Core flagship ownership.