The WTF, I'm about to de-lid thread!

Vario · Mar 27, 2013

BiggieShady said:
I'm also interested, but link seems bad :

HTML:

<a href="http://www.fnarfbargle.com/private/1...d/IMG_0081.m4v" target="_blank">http://www.fnarfbargle.com/private/1...d/IMG_0081.m4v</a>

try this link: http://www.fnarfbargle.com/private/130315-Delid-vid/IMG_0081.m4v

BiggieShady · Mar 27, 2013

amp281 said:
try this link: http://www.fnarfbargle.com/private/130315-Delid-vid/IMG_0081.m4v

Thanks ... and wow :laugh:

... to think how many people destroyed their CPU by cutting the PCB :shadedshu

Vario · Mar 27, 2013

I can't freaking spread the coolaboratory pro right. I mean I got it on the die and spread it around and bolted it all up and my temps are horrible. I am going to try arctic silver 5 because this liquid metal shit is so hard to work with!!!! Any tips on the CLP?

Vario · Mar 27, 2013

amp281 said:
I can't freaking spread the coolaboratory pro right. I mean I got it on the die and spread it around and bolted it all up and my temps are horrible. I am going to try arctic silver 5 because this liquid metal shit is so hard to work with!!!! Any tips on the CLP?

I just tried the arctic silver 5 and my temps are a tiny bit better but still really bad. Like 30*C idle 75*C load with stock clocks.

Before was 25*C idle 55*C load at 4.0 ghz.

The IHS must not be contacting the die? I am not sure whats going on. I scraped off most of the black adhesive with my fingernail but it was tough to remove....

HELP!

Should I spread the as5 or the liquid pro on the die or just dot it on the die ?

RCoon · Mar 27, 2013

amp281 said:
I just tried the arctic silver 5 and my temps are a tiny bit better but still really bad. Like 30*C idle 75*C load with stock clocks.

Before was 25*C idle 55*C load at 4.0 ghz.

The IHS must not be contacting the die? I am not sure whats going on. I scraped off most of the black adhesive with my fingernail but it was tough to remove....

HELP!

Should I spread the as5 or the liquid pro on the die or just dot it on the die ?

Make a line of liquid pro down the length of the die, but make room for it to spread in the direction the IHS will slide when clamped down.

Vario · Mar 27, 2013

RCoon said:
Make a line of liquid pro down the length of the die, but make room for it to spread in the direction the IHS will slide when clamped down.

Okay I'll give it a shot. Thankfully the H100i makes removal easy.

Sasqui · Mar 27, 2013

amp281 said:
Should I spread the as5 or the liquid pro on the die or just dot it on the die ?

First, make sure you've removed as much of the stock black adhesive on the chip and IHS as possible. Drop the lid on top of the die, you should see a small gap where the black adhesive was and it should slide around easlity on top of the die... the die will be holding the IHS up.

Then, I used a razor blade to spread a thin AS5 layer on the die, put the chip in the socket, dabbed silicone on each corner of the IHS outside bottom corners, placed carfeully on the chip and locked the bracket. Then spread a layer of AS5 on the top of the IHS, installed the cooler carefully, screwing diagonal reatiner screws sucessively. Without even pressure, I suspect the IHS could lift off an edge or corner (which would NOT be good).

D007 · Mar 27, 2013

Why do they sell them lidded if they work this much better without? lol.. I iz confused..

BiggieShady · Mar 27, 2013

amp281 said:
The IHS must not be contacting the die

I don't know if it's possible but you might check if you deformed the IHS with the vise.

Aquinus · Mar 27, 2013

15th Warlock said:
This de-liding thing, do you guys get good results on SB processors too?

SB and SB-E chips can't be de-lidded because they're soldered to the lid. It's also why it has better thermal contact with it as well.

Sasqui · Mar 27, 2013

D007 said:
Why do they sell them lidded if they work this much better without? lol.. I iz confused..

They use grey poupon for thermal interface material. It's supposed to be the best out there, but I think that applies to a ham sandwich.

Vario · Mar 27, 2013

I can't even get it to the mid 20's again. I am at 35*C idle again. high 80's p95, stock! What the fuck!?

I never thought the thermal paste application would be the part that fucked me up.

What am I doing wrong? I have tried spreading as5 on chip, spreading liquid pro on chip, dotting chip with as5 and with liquid pro.

Sasqui · Mar 27, 2013

amp281 said:
I can't even get it to the mid 20's again. I am at 35*C idle again. high 80's p95, stock! What the fuck!?

I never thought the thermal paste application would be the part that fucked me up.

What am I doing wrong? I have tried spreading as5 on chip, spreading liquid pro on chip, dotting chip with as5 and with liquid pro.

This, maybe:

Sasqui said:
First, make sure you've removed as much of the stock black adhesive on the chip and IHS as possible. Drop the lid on top of the die, you should see a small gap where the black adhesive was and it should slide around easlity on top of the die... the die will be holding the IHS up.

Then, I used a razor blade to spread a thin AS5 layer on the die, put the chip in the socket, dabbed silicone on each corner of the IHS outside bottom corners, placed carfeully on the chip and locked the bracket. Then spread a layer of AS5 on the top of the IHS, installed the cooler carefully, screwing diagonal reatiner screws sucessively. Without even pressure, I suspect the IHS could lift off an edge or corner (which would NOT be good).

brandonwh64 · Mar 27, 2013

Sasqui said:
They use grey poupon for thermal interface material. It's supposed to be the best out there, but I think that applies to a ham sandwich.

Weres the pictures of the delid?

Vario · Mar 27, 2013

I mean it looks perfect... Heres pics. The lid is flat I checked it with a razor blade edge.

The resulting temp this last time (the 6th try) was 38*C Idle....!!!!!

There has to be something I'm missing right guys?

If I still have problems I might do direct die with the h100i, IDK.

phoen · Mar 27, 2013

amp281 said:
I mean it looks perfect... Heres pics. The lid is flat I checked it with a razor blade edge.

The resulting temp this last time (the 6th try) was 38*C Idle....!!!!!
http://i.imgur.com/WS4YISEl.jpg
http://i.imgur.com/hgDJVjDl.jpg
http://i.imgur.com/9iOItctl.jpg
http://i.imgur.com/CifdME3l.jpg
http://i.imgur.com/LWMpsqgl.jpg
http://i.imgur.com/Dx8aag2l.jpg
http://i.imgur.com/lDDTJWel.jpg

There has to be something I'm missing right guys?

If I still have problems I might do direct die with the h100i, IDK.

Not enough of CLP...

RCoon · Mar 27, 2013

My eyes could be deceiving me as im on my phone, but that's a very tiny amount of thermal paste

Vario · Mar 27, 2013

Really.. How much should be on it? I am really confused I figured it would spread once the pressure is applied to it. Is it safe if it comes off the die a little bit on the sides? I am a less is more thermal paste guy so this is all new to me.

The lid is definitely floating on top of the die before I clamped it so its contacting only the die as it should.

RCoon · Mar 27, 2013

Doesn't your paste tube have application markers on it? It might be worth using a plastic bag or glove to spread the paste yourself so you can ensure enough is covering the area. Twice as much on the ihs anyway

Sasqui · Mar 27, 2013

brandonwh64 said:
Weres the pictures of the delid?

http://media-cache-ec5.pinterest.com/upload/267682771573438321_eVKbAbwX_c.jpg

LOL, I have pics on my camera (at home) of just the die and lid opened up, no thermal pasteries. Will post tonight if I find the time.

RCoon said:
Doesn't your paste tube have application markers on it? It might be worth using a plastic bag or glove to spread the paste yourself so you can ensure enough is covering the area. Twice as much on the ihs anyway

Yes, and perhaps spread a thin layer on the inside of the IHS too.

15th Warlock · Mar 27, 2013

If I remember correctly, for the Coolaboratory TIM to work, they specifically ask you to paint both the whole die area and the heatsink area as well using the included brush.

This is the only TIM as far as I know where using more is actually beneficial for adequate heat transfer to occur.

Aquinus said:
SB and SB-E chips can't be de-lidded because they're soldered to the lid. It's also why it has better thermal contact with it as well.

Thanks, after seeing the results the OP obtained from this procedure I was wondering if my procs would benefit from it, thanks for clearing that out

dark2099 · Mar 27, 2013

For those who don't want to hunt through the Overclock.net thread, a proper link to the video.

Code:

http://www.fnarfbargle.com/private/130315-Delid-vid/IMG_0081.m4v

brandonwh64 · Mar 27, 2013

dark2099 said:
For those who don't want to hunt through the Overclock.net thread, a proper link to the video.

Code:

http://www.fnarfbargle.com/private/130315-Delid-vid/IMG_0081.m4v

That is a killer idea, Seems like its quicker and somewhat safer as long as you dont baseball swing the hammer.

Sasqui · Mar 27, 2013

brandonwh64 said:
That is a killer idea, Seems like its quicker and somewhat safer as long as you dont baseball swing the hammer.

I have a cut on my finger, lol. Despite that, I'd still rather do it by hand so I can feel the resistance. Hitting too hard and chipping the silicon would really suck.

Vario · Mar 27, 2013

15th Warlock said:
If I remember correctly, for the Coolaboratory TIM to work, they specifically ask you to paint both the whole die area and the heatsink area as well using the included brush.

This is the only TIM as far as I know where using more is actually beneficial for adequate heat transfer to occur.

Thanks, after seeing the results the OP obtained from this procedure I was wondering if my procs would benefit from it, thanks for clearing that out

I never recieved the brush or retail package just the syringe. Xoxide kind of dropped the ball. Also it doesnt want to disperse as I'm spreading it. It stays in a bead.

System Name	Computer of Theseus
Processor	Intel i9-12900KS: 50x Pcore multi @ 1.18Vcore (target 1.275V -100mv offset)
Motherboard	EVGA Z690 Classified
Cooling	Noctua NH-D15S, 2xThermalRight TY-143, 4xNoctua NF-A12x25,3xNF-A12x15, 2xAquacomputer Splitty9Active
Memory	G-Skill Trident Z5 (32GB) DDR5-6000 C36 F5-6000J3636F16GX2-TZ5RK
Video Card(s)	EVGA Geforce 3060 XC Black Gaming 12GB
Storage	1x Samsung 970 Pro 512GB NVMe (OS), 2x Samsung 970 Evo Plus 2TB (data 1 and 2), ASUS BW-16D1HT
Display(s)	Dell S3220DGF 32" 2560x1440 165Hz Primary, Dell P2017H 19.5" 1600x900 Secondary, Ergotron LX arms.
Case	Lian Li O11 Air Mini
Audio Device(s)	Audiotechnica ATR2100X-USB, El Gato Wave XLR Mic Preamp, ATH M50X Headphones, Behringer 302USB Mixer
Power Supply	Super Flower Leadex Platinum SE 1000W 80+ Platinum White
Mouse	Zowie EC3-C
Keyboard	Vortex Multix 87 Winter TKL (Gateron G Pro Yellow)
Software	Win 10 LTSC 21H2

System Name	Windows 10 64-bit Core i7 6700
Processor	Intel Core i7 6700
Motherboard	Asus Z170M-PLUS
Cooling	Corsair AIO
Memory	2 x 8 GB Kingston DDR4 2666
Video Card(s)	Gigabyte NVIDIA GeForce GTX 1060 6GB
Storage	Western Digital Caviar Blue 1 TB, Seagate Baracuda 1 TB
Display(s)	Dell P2414H
Case	Corsair Carbide Air 540
Audio Device(s)	Realtek HD Audio
Power Supply	Corsair TX v2 650W
Mouse	Steelseries Sensei
Keyboard	CM Storm Quickfire Pro, Cherry MX Reds
Software	MS Windows 10 Pro 64-bit

System Name	Computer of Theseus
Processor	Intel i9-12900KS: 50x Pcore multi @ 1.18Vcore (target 1.275V -100mv offset)
Motherboard	EVGA Z690 Classified
Cooling	Noctua NH-D15S, 2xThermalRight TY-143, 4xNoctua NF-A12x25,3xNF-A12x15, 2xAquacomputer Splitty9Active
Memory	G-Skill Trident Z5 (32GB) DDR5-6000 C36 F5-6000J3636F16GX2-TZ5RK
Video Card(s)	EVGA Geforce 3060 XC Black Gaming 12GB
Storage	1x Samsung 970 Pro 512GB NVMe (OS), 2x Samsung 970 Evo Plus 2TB (data 1 and 2), ASUS BW-16D1HT
Display(s)	Dell S3220DGF 32" 2560x1440 165Hz Primary, Dell P2017H 19.5" 1600x900 Secondary, Ergotron LX arms.
Case	Lian Li O11 Air Mini
Audio Device(s)	Audiotechnica ATR2100X-USB, El Gato Wave XLR Mic Preamp, ATH M50X Headphones, Behringer 302USB Mixer
Power Supply	Super Flower Leadex Platinum SE 1000W 80+ Platinum White
Mouse	Zowie EC3-C
Keyboard	Vortex Multix 87 Winter TKL (Gateron G Pro Yellow)
Software	Win 10 LTSC 21H2

System Name	Computer of Theseus
Processor	Intel i9-12900KS: 50x Pcore multi @ 1.18Vcore (target 1.275V -100mv offset)
Motherboard	EVGA Z690 Classified
Cooling	Noctua NH-D15S, 2xThermalRight TY-143, 4xNoctua NF-A12x25,3xNF-A12x15, 2xAquacomputer Splitty9Active
Memory	G-Skill Trident Z5 (32GB) DDR5-6000 C36 F5-6000J3636F16GX2-TZ5RK
Video Card(s)	EVGA Geforce 3060 XC Black Gaming 12GB
Storage	1x Samsung 970 Pro 512GB NVMe (OS), 2x Samsung 970 Evo Plus 2TB (data 1 and 2), ASUS BW-16D1HT
Display(s)	Dell S3220DGF 32" 2560x1440 165Hz Primary, Dell P2017H 19.5" 1600x900 Secondary, Ergotron LX arms.
Case	Lian Li O11 Air Mini
Audio Device(s)	Audiotechnica ATR2100X-USB, El Gato Wave XLR Mic Preamp, ATH M50X Headphones, Behringer 302USB Mixer
Power Supply	Super Flower Leadex Platinum SE 1000W 80+ Platinum White
Mouse	Zowie EC3-C
Keyboard	Vortex Multix 87 Winter TKL (Gateron G Pro Yellow)
Software	Win 10 LTSC 21H2

System Name	HP Omen 17
Processor	i7 7700HQ
Memory	16GB 2400Mhz DDR4
Video Card(s)	GTX 1060
Storage	Samsung SM961 256GB + HGST 1TB
Display(s)	1080p IPS G-SYNC 75Hz
Audio Device(s)	Bang & Olufsen
Power Supply	230W
Mouse	Roccat Kone XTD+
Software	Win 10 Pro

The WTF, I'm about to de-lid thread!

Vario

BiggieShady

Vario

Vario

RCoon

Vario

Sasqui

D007

BiggieShady

Aquinus

Resident Wat-man

Sasqui

Vario

Sasqui

brandonwh64

Addicted to Bacon and StarCrunches!!!

Vario

phoen

New Member

RCoon

Vario

RCoon

Sasqui

15th Warlock

dark2099

brandonwh64

Addicted to Bacon and StarCrunches!!!

Sasqui

Vario

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Motherboard	MSI Z97-G45 Gaming
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Display(s)	34" LG 34CB88-P 21:9 Curved UltraWide QHD (34401440) FREE_SYNC*
Case	Rosewill
Audio Device(s)	Onboard + HD HDMI
Power Supply	Corsair HX750
Mouse	Logitech G5
Keyboard	Corsair Strafe RGB & G610 Orion Red
Software	Win 10

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Memory	2x 32GB (64GB) Gskill trident 6000 CL30 @28 1T
Video Card(s)	RTX 4090 Gigagbyte gaming OC @ +200/1300
Storage	(M2's) 2x Samsung 980 pro 2TB, 1xWD Black 2TB, 1x SK Hynix Platinum P41 2TB
Display(s)	65" LG OLED 120HZ
Case	Lian Li dyanmic Evo11 with distro plate
Power Supply	Thermaltake 1350
Software	Microsoft Windows 11 x64

System Name	Apollo
Processor	Intel Core i9 9880H
Motherboard	Some proprietary Apple thing.
Memory	64GB DDR4-2667
Video Card(s)	AMD Radeon Pro 5600M, 8GB HBM2
Storage	1TB Apple NVMe, 4TB External
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Storage	Samsung 840 Pro 256GB / WD VelociRaptor 150GB / WD Caviar Green 1TB / WD Caviar Black 500GB
Display(s)	Asus VG236HE 120Hz - 23"
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Audio Device(s)	Realtek Onboard
Power Supply	Corsair Professional Series HX850
Software	Windows 7 Ultimate x64

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Storage	2TB Samsung 980 Pro OS - 4TB Nextorage G Series Games - 8TBs WD Black Storage
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Keyboard	Asus ROG Strix Scope EVA Edition
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Case	Fractal Meshify 2 XL
Audio Device(s)	fiio K9 to Hifiman Sundara's via 4.4mm balanced cable
Power Supply	Seasonic Prime TX 850w
Mouse	Corsair Harpoon Wireless RGB
Keyboard	Corsair K70 RGB PRO
Software	Windows 11 x64