TechPowerup IC Diamond Results Thread

PLEASE READ THOROUGHLY BEFORE TESTING/POSTING YOUR IC DIAMOND OR PERIHELION TEST RESULTS!!!



PLEASE ONLY POST WITH RESULTS WHEN YOU HAVE FULL RESULTS, OTHERWISE YOUR POST MAY NOT BE SEEN BY ALL IF YOU RESERVE THE POST FOR LATER RESULTS WITH IC7. PEOPLE TEND TO GO TO THE NEWEST POST, SO IF YOU WANT IT TO BE SEEN BY ALL, POST YOUR RESULTS ONCE YOU HAVE THEM ALL. ALL OTHER DISCUSSION/SUPPORT POSTS, GO RIGHT AHEAD!!

PLEASE BE SURE TO BENCHMARK YOUR CPU TEMPS WITH YOUR CURRENT TIM AND RECORD YOUR RESULTS BEFORE USING IC7 FOR TESTING. WE NEED BEFORE AND AFTER PLEASE!

ALSO, PLEASE MAKE SURE YOU DON'T CHANGE ANY VARIABLE OTHER THAN THE THERMAL COMPOUND USED FOR BEFORE/AFTER (I.E. SAME VOLTS/CLOCKS, COOLER, AND OTHER HARDWARE)


APPLICATION METHOD


For all those participating in the ICD giveaway, please follow this link to the Innovation Cooling website for more information on the products:

Innovation Cooling

Proper application is the key to this product. The nature and consistency of this product is likely quite different from what most of you are used to in a Thermal Compound. We don't recommend use of traditional methods of applying the TIM like razor blades, lines, Rice size, etc. ARE ALL Big BIG NO NO's. Through extensive end user testing, the best overall application method has been determined to be a pea sized amount directly in the center of the CPU. The TIM should be adequately spread via the down force of the CPU cooler (a sufficient amount of down force will provide best results; minimum 50psi of down force should be the goal for optimum results. please see the Innovation Cooling website for more info). Also, for coolers/surfaces that have many peaks and valleys, it may be beneficial to wet the surface(s) with a small amount of ICD to initially fill the voids in the mounting surfaces...then proceed with recommended application as usual. Please click on the link below for application methodology and shoot me a PM if you have any questions.
Keep in mind, ICD has been formulated with the specific goals of providing superior thermal conductivity with short set times, but also for long term stability and performance without pump/bake out through extended thermal cycling or usage. This stuff is very stable over long periods of time.



Please do feel free to navigate through the whole Innovation Cooling website as there is tonnes of information on there that might prove beneficial.


HOW TO POST RESULTS


THE FORMAT IS AS FOLLOWS (ALL TEMPS IN C):

OPTIONAL INFO: PROCESSOR, VOLTS/CLOCKS, HEAT SINK/COOLING USED, ETC.

Before Compound:
Ambient Temp:
Idle Temp:
Load Temp:

ICD
Ambient Temp:
Idle Temp:
Load Temp:

Cure Time- Cure Time averages 2 hours in most situations for sinks with adequate pressure loading with maybe .5C more overnight. Lightly pressure loaded sinks may take a day or more depending on the amount of pressure


If you have any problems or need support, please feel free to post here for now. Remember, proper application and good even heat sink pressure (goal should be minimum of 50psi or more) are crucial for peak performance. Too much or too little compound will impact your results so please do visit the Innovation Cooling website for Application Instructions with images and explanations. For those with direct touch heatpipe coolers, you might want to try wetting the contact surface of the cooler with a tiny amount of ICD to fill any small voids before proceeding with the normal application method.

If anyone has any questions, please feel free to post up. .


Contact/ Pressure Paper Instructions

The C/P is sourced from a company called Sensor Products and is the Ultra Low (LLLW) with a rage of
28 - 85 PSI (2 - 6 kg/cm²).

To apply (do not have paste installed, this done with a clean sink and IHS) Take one "A" & one "B" from the key envelopes and place shiny (uncoated) sides to metal - one to the sink shiny side and one to the IHS shiny sides to metal.

Mount your sink as you normally would then dismount and remove the paper - one will have a pink impression showing the areas of contact and the amount of pressure indicated by the density of the colour.

I will post a colour chart as soon as I find it on their site so you can estimate within about 10% your total pressure.

http://www.sensorprod.com/prescale/product-pages/prescale/prescale-instructions-2.pdf

Note C/P instructions added to the intro.

Contact/ Pressure Paper Instructions

The C/P is sourced from a company called Sensor Products and is the Ultra Low (LLLW) with a rage of
28 - 85 PSI (2 - 6 kg/cm²).

To apply (do not have paste installed, this done with a clean sink and IHS) Take one "A" & one "B" from the key envelopes and place shiny (uncoated) sides to metal - one to the sink shiny side and one to the IHS shiny sides to metal.

Mount your sink as you normally would then dismount and remove the paper - one will have a pink impression showing the areas of contact and the amount of pressure indicated by the density of the colour.

I will post a colour chart as soon as I find it on their site so you can estimate within about 10% your total pressure.

You Might try the C/P paper for trouble shooting

I thought this was an Interesting breakout of the numbers Delta' between compounds on the Water Cooling shrink considerably about 2C on the MX2 and MX3 and 2.75C on the MX4.

The only one cooler that bucked the trend was the Corsair and perhaps the EK block with better mounting schemes.




Below is a data sort of the test results The blue bars are air cooling all others are water cooling.

The Corsair results are marked in green and follow the usual distribution

OneMoar said:

I just put the tube in some hotwater for 5-10min and then mixed a few drops of rubbing alcohol into about a pea-sized blot and then placed 5 short-grain rice dots on the cpu and applyed the head-sink work quickly or it will stiffen right up

Click to expand...

On the larger IHS's over 30 X 30 mm people have been reporting better results with the 5 dot method - A 5.5mm bead on center with four dots 1/3 towards the corner edges. We are in process of updating application procedures with a video.

With adequate pressure of about 50PSI (which encompasses 80% of those sampled in the forums0 a 5.5mm bead on centre should work best.

If you are unsure about the 5.5mm bead you can peel back the label and use the gradations on the syringe which works out to .15- .2 ML

On the version we sell to the OEM's we add an acetate to thin for stencilling, silkscreen or ink roller application so ISP is fine just make sure you give it enough time to dry (10 min) or you will get EXPLOSIVE VOIDS for fast evaporation of the solvent.

Application Notes -Amount of Applied Compound
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There is always some debate on amount of applied compound to use, our approach is based on a best to worst case scenario with a one size fits all so the user can experience best odds of a successful mount out of the gate without having to redo his mount.
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Say that Intel has a spec of Flat and parallel // to .002. - At the extreme end you get something like the 2 images of the candidate below, to fill that gap/volume you need .05 ml volume of compound for a 30mmk X30mm area about the size of a grain of rice.
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Our difference with the rice method comes from the other side of the equation The heat sink base, while many HS bases are good some can be off as much as the IHS and to cover the contingency of irregular contour on both sink & IHS and as few people lap to correct the problem (5%?)and fewer lap to perfection so we add another .05 ml for a total of 0.1ml.
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Another factor associated with irregular contours is another mil or two layer of compound is added on the high spots depending on the pressure applied. To fill that gap we add another .05 ml for a total recommended amount of 1.5 ml which approx. equals our 5-5.5mm size bead on center.
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Thermal compound is a volume application to fill gaps, not one of weight, liquid spread-ability etc. and

Click to expand...

hat said:

Hmm, it seems like my temps may have actually went up after lapping the h70. The contact paper showed high pressure contact around the edges of the cpu ihs and virtually no contact in the center. After lapping there's more contact coming in from the edges, but still hardly any contact in the center... but there's still more contact so temps should be better. Maybe too much paste, especially since both surfaces should be flat now. Maybe it needs curing time as well.

Don't understand how the contact paper would be showing no contact in the center. There were scratches all across the ihs base and now there's only fine marks from the sandpaper (up to 1000 grit) on the base. The CPU has got to be flat since all the nikel is gone... nothing but copper all across the ihs. Hell I even drew an X across the ihs and it was all gone save the very edges were the ihs tapers off within not even a minute of sanding.

Click to expand...

For those that have the knack for lapping you can get great results, for people like me who lack the art of it I was surprised how bad my efforts were when I started checking it with the C/P paper. I now resort to my trusty belt sander for flatness, the edges end up a little rounded but at least flat within .001.

I do a final dressing with a set of Diamond Stones (DMT)

Check out the contact images below, 3 of them are lapped results guess which ones they are? Hint, 1A was a water block from our 2nd giveaway and was not lapped. I have only seen 4 or 5 lapping exercises that were in the near perfect category out of 50 examples.

Note - You can not put to much compound on, we have tested this with a synthetic copper IHS applied with IC Diamond and clamped with binder clips (60PSI) between 2 glass slides.

We then mic'ed the assembly at one min. intervals at room temperature (20C). The baseline for comparison is the average particle size. After 5 min the bond line thickness (BLT) to within 95% of the average particle size, overnight to 98%. Excess just squishes out.

Better too much than too little - too little is more of a waste as you end up redoing the mount and run into the problem of laplacian growth entrapping air into the final joint