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Eurocom Announces Sky X9E VR-Ready Gaming Notebook

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Temps are awesome with the CPU delidded and Liquid Ultra on the die and IHS.
:respect:
Did you have any issues getting enough mounting pressure on the heatsink after delidding?
 
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:respect:
Did you have any issues getting enough mounting pressure on the heatsink after delidding?
Thank you.

No, not at all. I applied CLU to the die, then held the IHS in place while I clamped it back down again. I then applied CLU to the IHS and heat sink copper plate. It was very simple to do. I did not glue the IHS back onto the CPU PCB with silicon as some folks have. The only thing holding it is the CPU retention clamp.
 
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Thank you.

No, not at all. I applied CLU to the die, then held the IHS in place while I clamped it back down again. I then applied CLU to the IHS and heat sink copper plate. It was very simple to do. I did not glue the IHS back onto the CPU PCB with silicon as some folks have. The only thing holding it is the CPU retention clamp.
I need to do this so badly. Thank you very much for the info!
 
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