Thursday, January 12th 2012
AMD Trinity APU Pictured in its Three Package Options
At CES, AMD is grabbing some eyeballs with a fascinating real-world capability demo of the AMD "Trinity" accelerated processing unit. At the same booth, AMD displayed the Trinity silicon in three different packages, for three different form-factors. The first one (to the left), also pictured in the earlier article, is a compact FP2 BGA (ball-grid array) package, designed for ultra-compact notebooks, ultrabooks, etc.
The second one (center) is the FS1r2 uPGA package for mainstream notebooks with slightly relaxed space and board footprint constraints. Unlike the FP2 BGA package, the FS1r2 uPGA is socketed, with extremely tiny pins. The FS1r2 uPGA is significantly bigger than FP2 BGA. The third, more familiar-looking package is the FM2, for desktops. FM2 is an updated version of FM1, on which current Llano A-series desktop APUs are based. Unfortunately, FM1 and FM2 are not compatible in any way. Learn more about the FM2 package in our older article detailing it, here.
The second one (center) is the FS1r2 uPGA package for mainstream notebooks with slightly relaxed space and board footprint constraints. Unlike the FP2 BGA package, the FS1r2 uPGA is socketed, with extremely tiny pins. The FS1r2 uPGA is significantly bigger than FP2 BGA. The third, more familiar-looking package is the FM2, for desktops. FM2 is an updated version of FM1, on which current Llano A-series desktop APUs are based. Unfortunately, FM1 and FM2 are not compatible in any way. Learn more about the FM2 package in our older article detailing it, here.