Welcome to the halfway point of 2025 and it's the slowest week of new releases we've had in a while, with this week's major release being a JPRG from SEGA. This is followed by another Asian game, but in a very different style, some zombie killing, but in a cute Asian way, another RPG, but about teenagers, a 25th anniversary remaster of a classic and finally a 2.5D platformer.

Persona5: The Phantom X / This week's major release / Thursday 26 June
The Persona series, which has sold over 23.5 million copies worldwide, welcomes its first mobile/PC release with its newest entry. Featuring a brand-new story and a cast of captivating new characters, the world of P5X offers an experience that both Persona5 fans and newcomers alike can enjoy. Steam link

Thanks to a new comparison video from the YouTube channel MxBenchmarkPC, the Paris Tech Demo by Scans Factory is put through its paces on an RTX 5080, running side by side in Unreal Engine 5.6 and version 5.4 with hardware Lumen enabled. That way, we get to see what Epic Games has done with the hardware optimization in the latest release. In GPU‑limited scenarios, the upgrade is immediately clear, with frame rates jumping by as much as 25% thanks to better utilization of graphics resources, even if that means the card draws a bit more power to deliver the boost. When the CPU becomes the bottleneck, Unreal Engine 5.6 really pulls ahead, smoothing out frame-time spikes and delivering up to 35% higher throughput compared to the older build. Beyond the raw numbers, the new version also refines Lumen's visuals. Lighting feels more accurate, and reflections appear crisper while maintaining the same level of shadow and ambient occlusion detail that developers expect.

Unreal Engine 5.6 was officially launched earlier this month, just after Epic Games wrapped its Unreal Fest keynote, where it teased many of these improvements. Hardware-accelerated ray tracing enhancements now shift more of the Lumen global illumination workload onto modern GPUs, and a Fast Geometry Streaming plugin makes loading vast, static worlds feel seamless and stutter-free. Animators will appreciate the revamped motion trails interface, which speeds up keyframe adjustments, and new device profiles automatically tune settings to hit target frame rates on consoles and high‑end PCs. To showcase what's possible, Epic teamed up with CD Projekt Red for a The Witcher IV tech demo that runs at a steady 60 FPS with ray tracing fully enabled on the current-gen PlayStation 5 console. If you're curious to dive in, you can download Unreal Engine 5.6 Paris - Fontaine Saint-Michel Tech Demo today and explore it for yourself on your PC.

NetEase Games and 24 Entertainment (Lin'an) Studio today unveiled Blood Message, a cinematic, single-player, linear story-driven action-adventure currently in development for PC and consoles. Powered by Unreal 5 Engine and enhanced with proprietary tools and technologies by the studio, Blood Message is NetEase Games' first AAA single-player title, blending brutal survival combat with profound Eastern storytelling.

Blood Message introduces a forgotten odyssey of loyalty and survival where players join Dunhuang's uprising, taking control of a nameless messenger and his young son in this immersive third-person action-adventure. Caught in the crossfire of a righteous uprising and driven by loyalty to both family and country, players will embark on a perilous eastward journey to deliver a message that holds the fate of their war-torn homeland. Amidst the shifting sands of history, they will etch a final tale of loyalty.

ASUS Republic of Gamers today announced ROG NUC (2025), the world's first sub-three-liter gaming mini PC powered by Intel Core Ultra 9 processors (Series 2), supporting up to 96 GB of RAM and equipped with the latest NVIDIA GeForce RTX 5080 Laptop GPU. Designed to cater to gamers and creators, this compact powerhouse pushes the boundaries of power and portability, delivering up to 4X faster rendering performance compared to previous models and redefining the capabilities of a mini PC.

Unmatched performance
At the heart of the new ROG NUC (2025) is an Intel Core Ultra 9 275HX processor (Series 2), reaching boost speeds of up to 5.4 GHz and supporting up to 96 GB of high-speed DDR5-6400 MT memory. Engineered with 24-core hybrid architecture, an integrated NPU, and a powerful GPU, this cutting-edge processor ensures seamless real-time rendering and effortlessly handles the demanding gaming and creative workloads.

NVIDIA's upcoming GB300 NVL72 "Blackwell Ultra" rack-scale systems are reportedly going to get a humanoid robot assembly, according to sources close to Reuters. As readers are aware, most of the traditional manufacturing processes in silicon manufacturing, PCB manufacturing, and server manufacturing are automated, requiring little to no human intervention. However, rack-scale systems required humans for final assembly up until now. It appears that Foxconn and NVIDIA have made plans to open up the first AI-powered humanoid robot assembly plant in Houston, Texas. The central plan is that, in the coming months as the plant is completed, humanoid robots will take over the final assembly process entirely removing humans from the manufacturing loop.

And this is not a bad thing. Since server assembly typically requires lifting heavy server racks throughout the day, the humanoid robot system will aid humans by doing the hard work, thereby saving workers from excessive labor. Initially, humans will oversee these robots in their operations, with fully autonomous factories expected later on. The human element here will primarily involve inspecting the work. NVIDIA has been laying the groundwork for humanoid robots for some time, as the company has developed NVIDIA Isaac, a comprehensive CUDA-accelerated platform designed for humanoid robots. As models from Agility Robotics, Boston Dynamics, Fourier, Foxlink, Galbot, Mentee Robotics, NEURA Robotics, General Robotics, Skild AI, and XPENG require models that are aware of their surroundings, NVIDIA created Isaac GR00T N1, the world's first open humanoid robot foundation model, available for anyone to use and finetune.

OXS, a pioneer in gaming audio technology, today proudly unveils the launch of the A2 ANC Gaming Headset, a cutting-edge addition to the world of gaming accessories. Featuring a 40 mm neodymium driver and Xspace spatial audio technology, the A2 ANC seamlessly bridges the worlds of gaming, work, and everyday listening with immersive sound and unparalleled versatility. The OXS A2 ANC Wireless Gaming Headset is available from the OXS Website and Amazon US / Amazon UK in black and white colorways at MSRP $129.99 / £129.99

Precision-engineered for clarity, ultra-low latency, and adaptive noise cancellation, the Storm A2 enhances every aspect of audio engagement. Whether deep in battle or settling into a music session, less than 20 ms latency ensures fluid, responsive gameplay while advanced Active Noise Cancellation (ANC) eliminates distractions. When focus shifts, intuitive ANC ON and Passthrough modes adjust to changing environments—perfect for work, travel, or on-the-go listening.

Samsung has achieved better production results for its advanced memory technology, according to Sedaily, as cited by TrendForce. The company's sixth-generation 10 nm DRAM, called 1c DRAM, now shows yield rates of 50-70% in testing. This represents a significant improvement from last year's results, which were below 30%. Samsung takes a different path from its rivals, while SK Hynix and Micron stick with 1b DRAM technology for HBM4 products, Samsung opts to create the newer 1c DRAM. This choice comes with more risk; however, it might bring bigger rewards, as the improved production rates enable Samsung to expand its manufacturing operations. The company plans to increase 1c DRAM production at its Hwaseong and Pyeongtaek facilities with expansion activities expected to begin before the end of this year.

These developments also support Samsung's HBM4 production schedule since the company aims to begin mass production of HBM4 products later this year. Yet, experts in the field point out that the product is still in its early stages and needs ongoing monitoring. Samsung planned to begin mass-producing sixth-gen 10 nm DRAM by late 2024. Instead, the company chose to remake the chip's design. This decision caused delays of more than one year however it was made to achieve better performance and yields. The new DRAM products will be manufactured at Samsung's Pyeongtaek Line 4 facility as these chips will serve both mobile and server applications. Separately, HBM4-related production will take place at Pyeongtaek Line 3.

Intel's high-end "Arrow Lake" processors have just become significantly more affordable, with the Core Ultra 7 265K and 265KF now priced below $250 US at major American retailers. In recent weeks, Intel has officially reduced its suggested retail prices from $399 to $309 and from $384 to $294, and retailers have pushed the savings even further. Today, shoppers can pick up the unlocked Core Ultra 7 265K for $239.99 and the graphics-disabled 265KF for $229.99 at Micro Center, reflecting a roughly 40 percent discount off launch pricing. In addition to these cuts, Micro Center is bundling the 265K with an ASUS Z890 AYW Gaming Wi-Fi motherboard and a 32 GB G.Skill Ripjaws S5 DDR5-6000 memory kit for $499, saving buyers approximately $70 compared to purchasing the components separately. Newegg's deal includes a free 16 GB Patriot Viper Venom DDR5-6400 kit with the 265K, while Amazon's Spring Bundle features two full-price PC games, Dying Light: The Beast and Civilization VII, plus software licenses valued at $159.

Internationally, similar markdowns are appearing across Intel's Arrow Lake‑S lineup. In the UK, LambdaTek lists the Core Ultra 9 285 K at £481.18, the 265K at £234.04, and the 265KF at £230.97. The mid-range Core Ultra 5 245 K and 245KF both dip under £220. With their 20 cores and strong multithreaded performance, the Core Ultra 7 265K and 265KF now stand out in the sub‑$250 segment, especially when bundled with motherboards, memory, and games. Consumers should balance these productivity gains against expected Arrow Lake gaming results and keep an eye on AMD's upcoming 3D V‑Cache processors, which promise to intensify competition in the under‑$300 market later this year.

Next-generation consumer and automotive audio is becoming increasingly sophisticated, and market drivers such as generative AI-based audio processing, immersive soundscapes, and advanced infotainment in software-defined vehicles demand stepped-up audio DSP performance. However, a single DSP can no longer meet escalating compute needs, while multiple DSPs pose significant programming challenges.

Today, OEMs and SoC vendors must perform all multicore hardware design and software development on their own while facing increased time-to-market pressures. At the same time, programmers are grappling with the complexity of software-based synchronization of shared memory regions and the proper partitioning of tasks across the multicore cluster. This can result in designs falling short of performance expectations.

AMD is giving finishing touches to the Ryzen 5 9600X3D processor, which could improve the company's standing in the mid-range, against Intel's Core i5-14600K and Core Ultra 5 245K. This came to light when AMD inadvertently leaked the SKU in its processor support list for the recently launched Radeon AI R9700 graphics card. The Ryzen 5 9600X3D will likely be a 6-core/12-thread processor based on the "Granite Ridge" silicon with 3D V-Cache memory. The processor is based on the latest "Zen 5" microarchitecture.

3D V-Cache is 64 MB of stacked cache on top of the 32 MB on-die cache, for a total of 96 MB last-level cache. Clock speeds of the 9600X3D could end up similar to those of the 9600X, given that AMD has changed the way the L3D (3D V-Cache die) stacks with the CCD (CPU complex die), inverting them, such that the L3D serves as a base tile for the CCD on top, giving the 9600X3D similar thermal and overclocking characteristics to the regular 9600X. The introduction of 3D V-Cache could significantly improve the gaming performance of the 9600X3D over the 9600X, giving gamers in the sub-$300 processor market segment a compelling alternative to the i5-14600K and the 245K.

The first decent high-resolution images of Logitech's upcoming MX Master 4 mouse has leaked, courtesy of the EUIPO or European Union Intellectual Property Office, which is somewhat embarrassing when you consider that the EUIPO claims to protect your intellectual property. Anyhow, the mouse appears to have been given some major design updates, without straying too far from its predecessor. Most notably, it now has two buttons that cover the entire front of the mouse, which makes it look a lot cleaner than the MX Master 3s that has a bit of plastic on the right side of the right button. They also almost appear to be translucent, but that could just be the renders.

Gone are all the ridges on the thumb rest and read of the mouse and the thumb rest button appears to now be the entire side surface, rather than just the bottom of the thumb rest. It's unclear what the circle made up of dots is meant to symbolise though, but it appears that Logitech has come up with some new kind of functionality for the thumb rest button. A third thumb button has also been added in front of the previous two and the thumb scroll-wheel appears to be protruding rather than being slightly recessed as it is on the MX Master 3s. Finally there's an LED just behind the scroll-wheel lock button, which most likely is a battery/charge indicator. The MX Master 4 should be launching any time now, as the first leak was already a couple of weeks ago.

Microsoft has confirmed it's developing a next-gen Xbox console with AMD as Xbox president Sarah Bond shared this news in a 60-second YouTube video promising to offer "an Xbox experience not tied to one store or limited to a single device." Bond announced Microsoft is teaming up with AMD for a "strategic multi-year partnership." This collaboration will involve co-engineering silicon "across a range of devices, including our next-generation Xbox consoles for your living room and your hands." The two companies will also join forces to build the next generation of Xbox Cloud Gaming. Microsoft is making it crystal clear that its next-gen Xbox platform will focus on multiple devices and won't be tied to its own store for games.

"This is all about creating a gaming platform that stays with you so you can enjoy the games you like on different devices wherever you want—giving you an Xbox experience not restricted to one store or linked to a single device," Bond explains. "That's why we're working with the Windows team to make sure Windows becomes the top platform for gaming". This comes right after Microsoft announcement of its partnership with ASUS to roll out two Xbox Ally handhelds in the coming months. These devices will feature a new full-screen Xbox interface running on Windows allowing Xbox Ally devices to access other platforms like Steam.Update Jun 19th: AMD comments on Microsoft partnership (YouTube video included)

Eurocom launches the 16" Nightsky ARX516, a cutting-edge laptop that redefines performance, portability, and precision. Designed for professionals, creators, and gamers, the Nightsky ARX516 delivers unmatched power with the latest AMD Ryzen AI 9 HX 370 processor with AMD Radeon 890M iGPU and NVIDIA GeForce RTX 5070 graphics.

"The Nightsky ARX516 is a game-changer for AMD enthusiasts and those who demand a performance class laptop for all of their computing needs including AI computing on the go, in a sleek, portable form factor, with added TPM for security and MIL-STD-810H specs, so the laptop built for heavy duty everyday use and designed to endure everyday wear and tear—even the unintentional kind." said Mark Bialic, Eurocom President. "Whether you're a creative professional, a gamer, or a power user, this laptop is designed to exceed expectations with a powerful combination of AMD Ryzen AI 9 HX 370 processor and NVIDIA GeForce RTX 5070 graphics."

ASRock today introduced the Radeon AI PRO R9700 Creator graphics card. The card is based on the PRO R9700 GPU AMD launched earlier this week, which is targets both the edge AI acceleration and professional visualization markets. The R9700 is based on the 4 nm "Navi 48" silicon, which it maxes out, with all 64 CU being enabled for 4,096 stream processors, 128 AI accelerators, and 64 RT accelerators. A key difference between the RX 9070 XT gaming GPU and the PRO R9700 is memory, with the latter getting 32 GB of it—double the size. This should help with fairly large AI models. The card also uses PCI-Express Gen 5 memory pooling features in workstations with up to four of these.

To make the card capable of exactly this, ASRock designed its PRO R9700 Creator graphics card to have a strictly 2-slot form-factor, with a lateral blower-based cooling solution that has cutouts behind the blower, and clearance of the backplate toward the tail-end, to help with airflow to adjacent cards. The card also implements the 16-pin 12V-2x6 power connector. This is ASRock's second card from this generation to do so, the other being the Radeon RX 9070 XT Taichi. The connector is located at the tail-end of the card, and not the top. This is important, as the card becomes capable of 3U rackmount chassis installations, something not possible with top-oriented power inputs, particularly with the strict cable bending restrictions of 12V-2x6. The card is 27.1 cm long and 11.1 cm tall. Display outputs include four DisplayPort 2.1a.

Just as the RDNA 4 rollout cycle is completing, the rumor mill for the next generation of Radeon GPUs is intensifying. According to @Kepler_L2 on X, a reliable leaker, AMD is equipping its next-generation UDNA-based GPUs with the HDMI 2.2 display protocol, capable of supporting 64 and 80 Gbit/s, meaning that the highest-end bandwidth of 96 Gbit/s (Ultra96) is not expected to arrive until the next generation. The HDMI Forum, the consortium behind the HDMI standard, officially released the HDMI 2.2 specifications in January during CES. The HDMI forum also foresees HDMI 2.2 cables hitting the shelves sometime in Q3 or Q4 of 2025, which means the rollout is near. However, AMD's next-generation GPUs will not utilize its entire feature spectrum in the coming GFX13 GPU architecture.

The HDMI 2.2 update introduces a future-proof Fixed Rate Link architecture that delivers up to 96 Gbps of bandwidth, enabling uncompressed 4K at 240 Hz or 8K at 60 Hz with full 4:4:4 chroma, and paving the way for even higher resolutions, such as 10K and 12K at 120 Hz. It accommodates both uncompressed and visually lossless compressed formats, as well as advanced chroma sampling options. This massive data throughput meets the growing demands of immersive audiovisual experiences from next-generation gaming and augmented and virtual reality to professional light-field displays, large-format digital signage, medical imaging, and machine-vision systems by doubling payload capacity every two to three years. The Ultra96 HDMI cable is designed to handle all HDMI 2.2 features. This cable is accompanied by the new Latency Indication Protocol, which ensures precise lip-sync and audio-video alignment across complex multi-hop setups involving receivers, soundbars, and other downstream devices.

GeForce NOW is throwing open the vault doors to welcome the legendary Borderland series to the cloud. Whether a seasoned Vault Hunter or new to the mayhem of Pandora, prepare to experience the high-octane action and humor that define the series that includes Borderlands Game of the Year Enhanced, Borderlands 2, Borderlands 3 and Borderlands: The Pre-Sequel. Members can explore it all before the highly anticipated Borderlands 4 arrives in the cloud at launch.

In addition, leap into the flames and save the day in the pulse-pounding FBC: Firebreak from Remedy Entertainment on GeForce NOW. It's all part of the 13 new games in the cloud this week, including the latest Genshin Impact update and advanced access for REMATCH. Plus, GeForce NOW's Summer Sale is still in full swing. For a limited time, get 40% off a six-month GeForce NOW Performance membership - perfect for diving into role-playing game favorites like the Borderlands series or any of the 2,200 titles in the platform's cloud gaming library.

KIOXIA America, Inc. today announced the development and prototype demonstration of its new KIOXIA CD9P Series PCIe 5.0 NVMe SSDs. These next-generation drives are the latest SSDs built with KIOXIA's 8th generation BiCS FLASH TLC-based 3D flash memory. KIOXIA BiCS FLASH features CBA (CMOS directly Bonded to Array) technology, a breakthrough architecture that significantly boosts power efficiency, performance, and storage density, while doubling the capacity available per SSD compared with the previous generation model.

As GPU-accelerated AI servers drive up the demands on storage infrastructure, maintaining high throughput, low latency, and consistent performance is critical - including keeping valuable GPUs highly utilized. The KIOXIA CD9P Series is purpose-built for these next-generation environments, delivering the speed and responsiveness required by AI, machine learning, and high-performance computing (HPC) workloads to ensure GPUs stay fed with data and operating at maximum efficiency.

To expand its growing influence in the data center market, NVIDIA recently launched the NVLink Fusion program. This initiative enables select partners to integrate their custom-designed chips into the NVIDIA system framework. For example, a partner can connect its custom CPU to an NVIDIA GPU using the 900 GB/s NVLink-C2C interface. However, this collaboration comes with significant restrictions. Any custom chip must be connected to an NVIDIA product, and the company maintains firm control over the critical software that manages these connections. This means partners cannot create truly independent, mix-and-match systems. NVIDIA retains control over the essential communication controller and PHY layers in the NVLink Fusion, which initializes and manages these links. It also mandates a license for third-party hardware to use its NVLink Switch chips.

In response, a growing coalition of tech giants, including AMD, Google, and Intel, is championing an open-standard alternative. Their UALink Consortium released its 1.0 specification in April 2025, defining a public standard for linking up to 1,024 accelerators from any vendor. While NVIDIA currently offers superior raw bandwidth, UALink represents a move toward greater flexibility and cost efficiency. According to reports, eight companies expressed interest in NVLink Fusion. However, the frustration of working with a communication link with limited visibility results in designs that are not always optimal and efficient. NVIDIA sets these standards from the beginning, so any company willing to work with NVLink Fusion is aware of these limitations from the outset. Cloud hyperscalers, such as AWS, GCP, and Azure, have expressed interest among the reported eight customers, so they might swallow this pill and continue working with NVIDIA to gain access to the IP despite the limited information available.

When storage speed and flexibility matter most, why compromise? Whether you're a creative pro managing massive media libraries, a gamer juggling terabytes of AAA titles, or a developer running virtual environments, your workflow deserves storage that's as fast, flexible, and beautiful as your Mac Mini M4 setup.

Introducing the Satechi USB4 Slim NVMe SSD Enclosure—a high-performance, travel-friendly storage solution designed to unlock the full potential of your device. Inspired by the sleek simplicity of Apple's USB SuperDrive and built for modern pros, this enclosure combines USB4 technology, expandable capacity, and a premium, minimalist design.

GL.iNet, a leader in secure network solutions, is proud to announce the launch of Flint 3 (GL-BE9300), its first tri-band Wi-Fi 7 home router. Engineered for home users, remote workers, gamers, and small offices, Flint 3 delivers next-generation wireless performance with unmatched flexibility, speed, and control.

Next-Generation Wi-Fi 7 Performance
Flint 3 is powered by the latest Wi-Fi 7 technology, supporting Multi-Link Operation (MLO) across 2.4 GHz, 5 GHz, and 6 GHz bands. This dramatically reduces interference and latency by combining multiple wireless channels into a single stable connection. With max speeds of 688 Mbps (2.4 GHz), 2882 Mbps (5 GHz), and 5765 Mbps (6 GHz), Flint 3 ensures responsive, and constant connectivity, even in congested device environments.

Sycom is a Japan-based OEM that specializes in build-to-order (BTO) gaming PCs and components such as graphics cards. Last year, the company released the Silent Master GeForce RTX 40-series "Ada" graphics cards that come with a custom cooling solution that uses an aluminium fin-stack heatsink, and a pair of large 120 mm Noctua case fans for ventilation; and this week, they launched the Silent Master RTX 50-series "Blackwell" graphics card series.

The series includes three models, the RTX 5070 Ti, the RTX 5070, and the RTX 5060 Ti 16 GB. At this point, it's not known if Sycom designed the heatsink or PCB—there's a possibility that these are sourced from a graphics card OEM without the cooler shroud and fans, and topped up with a custom cooler shroud, backplate, and a pair of Noctua-sourced high-end fans. The RTX 5070 Ti and RTX 5070 cards come with larger coolers that use a pair of 120 mm NF-A12x25 (25 mm-thick), while the RTX 5060 Ti 16 GB card comes with a pair of 92 mm NF-A9x14. All three cards lack any form of factory overclock, their main claim to fame is their low noise. Unlike the ASUS Noctua Edition graphics cards, the three cards have relatively well managed card thickness of 3.5-slot or under. All three cards are being sold under the BTO (build to order) model, exclusively in Japan.

Alphacool International GmbH, based in Braunschweig, has been a pioneer in PC water cooling technology for over 20 years. With one of the most comprehensive product portfolios in the industry and over 20 years of experience, Alphacool is now expanding its portfolio with the new Eisblock Aurora Arc B580 Steel Legend + Challenger with Backplate.

The GPU water cooler is precisely tailored to fit the layout of ASRock's Intel Arc B580 Steel Legend and Challenger graphics cards. An updated fin structure, optimized water flow, and an improved jetplate ensure high cooling performance. The chrome-plated copper base offers excellent thermal conductivity and long-lasting durability. Subtle RGB lighting complements the elegant design and provides even illumination.

KOORUI, a rising global monitor brand, has launched the G2741L, a 27-inch gaming monitor equipped with Dual Mode Display, offering two distinct viewing modes in one device. Users can easily switch between a high-refresh-rate mode for smooth gaming and a standard mode tailored for work or daily use. With just one click, the G2741L delivers versatile performance for both play and productivity.

Designed for today's multi-purpose gamers and creators, the KOORUI G2741L features an innovative FHD 320 Hz / UHD 160 Hz Dual Mode, allowing users to switch between ultra-fast refresh rates for competitive gaming and ultra-high-definition resolution for cinematic visuals and creative tasks. No longer must users choose between performance and clarity—they can now have both.

TrendForce's latest investigations reveal that several negative factors weighed on the enterprise SSD market in the first quarter of 2025. These include production challenges for next-gen AI systems and persistent inventory overhang in North America. As a result, major clients significantly scaled back orders, causing the ASP of enterprise SSDs to plunge nearly 20%. This led to QoQ revenue declines for the top five enterprise SSD vendors, reflecting a period of market adjustment.

However, conditions are expected to improve in the second quarter. As shipments of NVIDIA's new chips ramp up, demand for AI infrastructure in North America is rising. Meanwhile, Chinese CSPs are steadily expanding storage capacity in their data centers. Together, these trends are set to reinvigorate the enterprise SSD market, with overall revenue projected to return to positive growth.

AAEON's UP brand (stock code: 6579) today announced the release of two new developer boards based on the new Intel Core 3 processor platform (formerly Twin Lake), the UP TWL and UP TWLS. Those familiar with the UP 710S, released by the company late last year, will no doubt see a pattern emerging with the continuation of the slimmer, more advanced features hosted by the UP TWLS, while the developer community will note the more classic features of the UP TWL, including the return of the Raspberry Pi-compatible 40-pin GPIO that came to be a signature of AAEON's UP Brand portfolio.

Both boards offer a choice of the Intel Core 3 Processor N355, Intel Processor N250, or Intel Processor N150 CPU, the latest in Intel's processing technology focused on low power, energy-efficient performance. However, it is clear from the circuit board design of each that the boards are tailored for different deployment environments, with AAEON slimming down the height of the UP TWLS to just 25.13 mm by placing both its I/O and CPU on the same side.

ASUS today announced the Pro WS Platinum series of power supplies, available in 3000-, 2200- and 1600-watt variants. These heavy-duty PSUs are built to power multiple GeForce RTX 5090 or NVIDIA RTX PRO 6000 graphics cards. Each unit features PCIe connectors upgraded with gold-plated copper pins for cooler operation as well as increased durability and improved power-delivery efficiency. These PSUs also feature dual-ball fan bearings and extruded aluminium heatsinks for long-lasting performance—all in a compact design. Plus, a 10-year warranty offers peace of mind over the long term.

Surprisingly compact but ready for the most powerful workstations
Whether a workstation handles hefty 3D rendering or next-gen AI workloads, these PSUs will deliver the power needed to thrive. The three variants of the ASUS Pro WS Platinum series each provide a different power ceiling, so users can select the one that best suits their needs. The 3000 W model is built to provide rock-solid, stable power delivery for up to four GeForce RTX 5090 graphics cards. The 2200 W model can power up to four GeForce RTX 5080 cards. The 1600 W model provides enough power to support up to two GeForce RTX 5090 graphics cards.

EIZO Corporation (TSE: 6737) today announced the release of the FlexScan EV2740S - a 27-inch 4K UHD (3840 x 2160) resolution monitor designed with energy efficiency in mind. It expands EIZO's lineup of FlexScan 4K UHD monitors and is equipped with features for streamlined operations, offering exceptional support for the increasingly diverse needs of modern business environments.

Previously, EIZO's 27-inch 4K offering for business was limited to the EV2740X - a Premium model. With the introduction of the EV2740S, which delivers essential performance and the sharp clarity of 4K, EIZO broadens its range to provide users with greater flexibility and choice based on their specific needs. The monitor's 4K UHD resolution displays four times more information compared to standard Full HD (1920 x 1080). This allows users to view more information at once on its 27-inch screen, greatly reducing the need to scroll or frequently switch windows.

Alphacool International GmbH from Braunschweig is a pioneer in PC water cooling technology. With one of the industry's most comprehensive product portfolios and over 20 years of experience, Alphacool is now expanding its Enterprise Solutions series with the new ES 1-Slot GPU water cooler for the NVIDIA H200 141 GB - a cooling solution specifically designed for professional use.

The cooler impresses with its compact 1-slot design, making it ideal for use in racks and cases with limited space. The space-saving rear-facing port layout simplifies integration into existing water cooling loops - even under demanding installation conditions. The cooling block is made from high-quality, chrome-plated copper, which is significantly more durable than conventional nickel plating. This combination offers reliable protection against corrosion, scratches, and thermal stress - ideal for continuous 24/7 operation in professional environments.

Intel's presentation at the VLSI Symposium in Japan offered a detailed look at the upcoming Intel 18A process, which is set to enter mass production in the second half of 2025. This node combines Gate-All-Around transistors with the PowerVia backside power delivery network, resulting in a completely new metal stack architecture. By routing power through the rear of the die, Intel has been able to tighten interconnect pitches on critical layers while relaxing spacing on the top layer, improving yield and simplifying fabrication. In standardized power, performance, and area tests on an Arm core sub-block, Intel 18A demonstrated roughly 15% higher performance at the same power draw compared to Intel 3. When operating at 1.1 volts, clock speeds increase by up to 25% without incurring additional energy costs, and at around 0.75 volts, performance can rise by 18%, or power consumption can drop by nearly 40%.

Under the hood, the process features significant cell height reductions: performance‑tuned cells measure 180 nanometers tall, while high‑density designs sit at 160 nanometers, both smaller than their predecessors. The front‑side metal layers have been reduced from between 12 and 19 on Intel 3 to between 11 and 16 on Intel 18A, with three additional rear metal layers added for PowerVia support. Pitches on layers M1 through M10 have been tightened from as much as 60 nanometers down to 32 nanometers before easing again in the upper layers. Low-NA EUV exposure is used on layers M0 through M4, cutting the number of masks required by 44% and simplifying the manufacturing flow. Intel plans to debut 18A in its low‑power "Panther Lake" compute chiplet and the efficiency‑core‑only Clearwater Forest Xeon 7 family. A cost-optimized 17-layer variant, a balanced 21-layer option, and a performance-focused 22-layer configuration will address different market segments.