Today's NAS servers are getting increasingly powerful, and rising beyond their mandate of providing storage over the network, with media and production/creation capabilities being added to them via fast x86 processors and GPUs. SilverStone is targeting this market with its new CS381 pedestal chassis. Measuring 400mm (W) x 225mm (H) x 232mm (D), with a volume of 30 liters, the case offers eight 3.5-inch hot-swap caddies behind a lockable front bezel. These 8 caddies are split into two columns of 4 caddies, each, which have SATA 6 Gbps and miniSAS 12G HD backplanes. There are also two concealed 2.5-inch mounts for your SSDs.

The CS381 has room for a micro-ATX motherboard with room for a full-height graphics card, but a CPU cooler only as tall as 6 cm, which is plenty of room for the pump-block of an AIO CLC. You can use a CLC with a 240 mm x 120 mm radiator thanks to the two 120 mm rear exhausts. An SFX/SFX-L power-supply bay allows you to deploy a reasonably powerful PSU. Two additional 120 mm fans can be mounted along the sides. Front-panel connectivity includes two USB 3.0 ports, and HDA jacks. The company didn't reveal pricing.

Experience the sensation of evolution in bloodbath battle! The latest masterpiece in Apacer Gaming series, Apacer AS2280P2 PRO M.2 PCIe "PANTHER" SSD; equipped with "battle armor". When the battle is fierce, the "battle armor" will evolve from orange to a dazzling golden color when temperature rises, cheering on gamers even more! The sequential read/write speed of Apacer AS2280P2 PRO can reach up to 1,580/950 MB/s, and the random write performance can even reach up to 92,160 IOPs, bringing the best gaming experiences for gamers with their best performances.

Gamers may have had the experience of almost being defeated during a battle, but then their characters suddenly leveled up and their HP/MP were instantly filled, the battle situation was reversed all of sudden! Apacer is dedicated to creating unique gaming experiences for gamers, AS2280P2 PRO SSD is equipped with a creative "battle armor" that changes color with temperature, reproducing the exciting sensation when leveling up during death battles. The "battle armor" displays a passionate orange color under room temperature, but when it heats up during battles, it will evolve into a dazzling golden armor, accompanying players to enjoy killing enemies on the battlefield.

If a recent MSRP price-list leak is anything to go by, motherboards based on the AMD X570 chipset will cost a pretty penny, beating even Intel's premium Z390 Express chipset on average motherboard pricing. Those looking for an affordable motherboard for the Ryzen 3000 series processors have the option of choosing existing AMD 400-series chipset based motherboards, and taking advantage of the USB BIOS Flashback feature that's almost universally available on the AMD platform. You lose out on PCI-Express gen 4.0 with the older platforms, which may not be a big compromise when it comes to graphics cards, but would limit your M.2 NVMe SSD performance upgrade path. One possible option would be to wait for affordable variants of AMD's 500-series chipsets, which are sourced from ASMedia.

According to DigiTimes, ASMedia will tape out its next-generation AMD-platform chipset silicon, and is on track to shipping its new chipsets to motherboard manufacturers by Q4-2019. This would pin availability of the first motherboards based on these chipsets to at least Q1 2020. These chipsets not only feature PCI-Express gen 4.0 downstream lanes, but also boards based on these will be built to AMD's PCB requirements for the new platform, enabling a PCI-Express 4.0 x16 slot for discrete graphics, and revised CPU VRM and memory wiring specifications that improve overclocking over the previous generation platform. For now there are two SKUs in the works, the B550, which succeeds the B450, and the A520, succeeding the A320.Image Credit: Hardware.info

Thermaltake today rolled out one of the first few low-profile top-flow air CPU coolers that feature addressable-RGB lighting, the UX100 ARGB. The cooler features a classic "fin bunch" design, in which radially-projecting aluminium fins bunch up at the center to form the base. A 120 mm fan is suspended along a shroud over this fin-bunch, which features a silicone LED diffuser along the bore of the shroud.

There are 15 aRGB LEDs studded into this diffuser, which take in 3-pin standard input for addressable-RGB control via software. The fan features a hydraulic bearing, takes in 3-pin DC input, spinning at 1,800 RPM, pushing 38.82 CFM of air, with a noise output of 26.92 dBA. The cooler measures 122.3 mm x 122.3 mm x 66.1 mm, and can handle thermal loads of up to 65W. Among the CPU socket types supported are AM4 and LGA115x (no HEDT sockets supported). The company didn't reveal pricing.

ASUS today expanded its ROG Strix LC line of all-in-one liquid CPU coolers with a new top variant that comes with a large 360 mm x 120 mm radiator for better cooling. The ROG Strix LC series had debuted in May with 120 mm and 240 mm variants. ASUS bundles three of the same 120 mm fans it includes with the pricier Ryuo series, which take in 4-pin PWM input, spin between 800 to 2,500 RPM, pushing up to 80.95 CFM of air, with a noise output of up to 29.7 dBA, each. Characteristic to the ROG Strix LC series, the pump-block features spirally-projecting RGB LED diffusers along the sides, and an illuminated ROG logo on top. All lighting is controlled by addressable-RGB (ASUS Aura Sync RGB). The cooler supports nearly all modern CPU socket types, including AM4, LGA115x, and LGA2066. The pump-block supports the Asetek-standard AIO CLC retention module AMD Ryzen Threadripper processors include in their PIB packages.

In recent conversations with Intel customers, two words kept coming up: disruption and opportunity. Disruption because almost every single executive I talk with has seen business disrupted in one way or another or is worried about keeping up with new technology trends and keeping a competitive edge. And opportunity because when these customers discuss their needs -- be it how to better leverage data, how to modernize their infrastructure for 5G or how to accelerate artificial intelligence (AI) and analytics workloads -- they realize the massive prospects in front of them.

To help our customers capitalize on the opportunities ahead, Intel has created a new organization that combines our network infrastructure organization with our programmable solutions organization under my leadership. This new organization is called the Network and Custom Logic Group.
Both original organizations executed on record design wins and revenues in 2018. Their merger allows Intel to bring maximum value to our customers by delivering unprecedented and seamless access to Intel's broad portfolio of products, from Intel Xeon processors SoC, FPGA, eASIC, full-custom ASIC, software, IP, and systems and solutions across the cloud, enterprise, network, embedded and IoT markets. To that end, FPGA and custom silicon will continue to be important horizontal technologies. And this is just the beginning of a continuum of Custom Logic Portfolio of FPGA, eASIC, and ASIC to support our customers' unique needs throughout their life cycles. No other company in the world can offer that.

When we said AMD was readying a presentation on their Ryzen 9 3950X CPUs to awe crowds at E3, we weren't thinking of something of this magnitude. But apparently, it's true: a Geekbench test result has shown AMD's $750, 16 core, 32 thread Ryzen 9 9 3950X beating Intel's 18 core, 36 thread $2,000 i9-9980XE monster. Now, you may be thinking: ok, it beat it because of AMD's announced 4.7 GHz boost, and did so only on single threaded performance, obviously... but you would be wrong.

The Geekbench scores show AMD's Ryzen 9 3950X delivering 5,868 points in single, and 61,072 points in multicore workloads. Intel's i9-9980XE, on the other hand, scores just 5,391 single core, and 46,876 multicore points (on average and at stock clocks of 3,000 MHz base and 3,400 MHz boost). This is an incredible performance difference (particularly in the multicore score), and was apparently done with an engineering sample for AMD's upcoming chip that didn't even run at its announced 4.3 GHz base and 4.7 GHz boost clocks, but at 3.3 GHz and 4.3 GHz respectively. AMD's 105 W TDP, 16 core chip beats Intel's 185 W TDP, 18 core one... Where has the world come? Take the usual dosage of NaCl, and let's keep things in perspective - even if AMD's Ryzen 9 3950X equals, and doesn't beat, Intel's i9-9980XE, it's still a huge win for the red company. Almost as big a win as that huge stone on Lisa's hand.

In another iD Software game supporting ray tracing (we already know Wolfenstein: Young Blood will support it), id Software's Marty Stratton confirmed that DOOM Eternal will also support the graphics technology. In what capacity, it is unclear as of yet; whether for a global illumination solution, like Metro: Exodus, or just for reflections and shadows like most games seem to be using, is unknown at this point. Looking back at how the "original" DOOM looked, and considering changes to graphics technologies under the new iD Tech 7 engine, however, DOOM Eternal really is looking to be one of the best looking games - at least on the PC platform.

As Marty Stratton put it, "RTX makes it look, you know, amazing. There are great benefits but it doesn't necessarily expand our audience or that the way that the way that something like Stadia does so, but absolutely people can look forward to DOOM Eternal and id Tech 7 supporting ray tracing. Absolutely. I mean we love that stuff, the team loves it and I think we'll do it better than anybody honestly."

AnandTech, who spoke with the USB Promoter Group at Computex, have shared that the new protocol is expected to manifest in physical, consumer products by the end of 2020. The specification for the next-generation bus is currently on version 0.7, with the USB Promoter Group expecting it to be finalized by this Summer. Then it's just a matter of manufacturers developing new products powered by the latest protocol.

USB 4.0 borrows heavily from Intel's thunderbolt 3 technology - which, if you'll remember, was made available as an open specification very recently. Intel's contribution of the Thunderbolt 3 protocol will enable USB 4.0 to achieve speeds of up to 40 Gbps with multiple data and display protocols being able to share available bandwidth. Additionally, USB 4.0 will make use of USB Type-C's interface, ensuring backwards compatibility not only with it, but also USB 2.0, USB 3.0 and Thunderbolt 3. Due to the many improvements in data transfer speeds and ability to stream multiple data and display protocols, the USB Promoter Group is looking at the possibility of changing USB's trademark logo for the next generation interface, alongside a revised branding scheme.

CORSAIR, a world leader in PC gaming peripherals and enthusiast components, today announced the launch of the NIGHTSWORD RGB and M55 RGB PRO, two brand-new gaming mouse designs that join the company's portfolio of high-performance gaming peripherals. The NIGHTSWORD RGB boasts the latest cutting-edge technology, including an 18,0000 DPI optical sensor and a smart tunable weight system that tracks the current mouse weight and center of gravity in real-time. The M55 RGB PRO is a new ambidextrous gaming mouse, with a symmetrical design optimized for multiple grip styles. The new mice broaden CORSAIR's already formidable lineup, adding even more options to suit players of all kinds, from esports professionals to newcomers to PC gaming.

Early June, TechPowerUp in partnership with German PC cooling, casing, and power-supply experts Be Quiet!, who share our OCD for low-noise, brought you a sweet chance to upgrade your PC's case, power, and CPU cooling ahead of Summer. The results are in, and we have our three winners! The first randomly-selected entry from our Giveaway pool gets a combo of a Silent Base 601 Window Black case, a Straight Power 11 650W PSU, and a Dark Rock Slim CPU cooler. The next lucky winner gets the same case and CPU cooler. The third lucky winner gets the cooler. Without further ado, the winners!

• Eliott "FreedomEclipse," from the U.K., hits the jackpot, wins a Silent Base 601 Window Black case, a Straight Power 11 650W PSU, and a Dark Rock Slim CPU cooler (one of each)
• Bryan, from Texas, United States, wins a Silent Base 601 Window Black case and a Dark Rock Slim CPU cooler (one each)
• Tsvetomir from Sofia, Bulgaria, wins a Dark Rock Slim CPU cooler

A huge Congratulations to you three! Happy Gaming this Summer!

Today at NXT BLD in London, Lenovo is launching the next generation of its ThinkPad P Series with the release of five new ThinkPads, including the ThinkPad P73, ThinkPad P53, ThinkPad P1 Gen 2, and ThinkPad P53s and P43s. The new portfolio is designed to meet the ever-changing power and portability needs of modern professionals across industries - both in the office and beyond without sacrificing our legendary engineering know-how, reliability and security.

Innovation can now happen anywhere - accomplished on movie sets, in the field and on the plot of land where the latest architecture masterpiece comes to life. The need for on-location power also requires real mobility - from the meeting room, to the office, to the presentation and back. Because of this, industry professionals are seeking similar power and performance they have come to expect from desktop workstations in their mobile workstations - and our new ThinkPad mobile workstations are meeting this demand.

AMD Ryzen 3000 "Matisse" processors are multi-chip modules of two kinds of dies - one or two 7 nm 8-core "Zen 2" CPU chiplets, and an I/O controller die that packs the processor's dual-channel DDR4 memory controller, PCI-Express gen 4.0 root-complex, and an integrated southbridge that puts out some SoC I/O, such as two SATA 6 Gbps ports, four USB 3.1 Gen 2 ports, LPCIO (ISA), and SPI (for the UEFI BIOS ROM chip). It was earlier reported that while the Zen 2 CPU core chiplets are built on 7 nm process, the I/O controller is 14 nm. We have confirmation now that the I/O controller die is built on the more advanced 12 nm process, likely GlobalFoundries 12LP. This is the same process on which AMD builds its "Pinnacle Ridge" and "Polaris 30" chips. The 7 nm "Zen 2" CPU chiplets are made at TSMC.

AMD also provided a fascinating technical insight to the making of the "Matisse" MCM, particularly getting three highly complex dies under the IHS of a mainstream-desktop processor package, and perfectly aligning the three for pin-compatibility with older generations of Ryzen AM4 processors that use monolithic dies, such as "Pinnacle Ridge" and "Raven Ridge." AMD innovated new copper-pillar 50µ bumps for the 8-core CPU chiplets, while leaving the I/O controller die with normal 75µ solder bumps. Unlike with its GPUs that need high-density wiring between the GPU die and HBM stacks, AMD could make do without a silicon interposer or TSVs (through-silicon-vias) to connect the three dies on "Matisse." The fiberglass substrate is now "fattened" up to 12 layers, to facilitate the inter-die wiring, as well as making sure every connection reaches the correct pin on the µPGA.

The Dominus Extreme Kit is made specifically for Asus ROG Dominus Extreme EEB motherboard and Intel LGA 3647 Narrow Socket P Processors. It is made from premium materials and finest standards of craftsmanship to ensure maximum cooling performance. From military standard Viton O-ring to the Digital-RGB LED lighting, all of our exceptionally high-quality materials are carefully selected. The water block features a nickel-plated copper cold plate, acrylic top for an elegant look and optimal cooling for your extreme hardware.