MSI announced today that the new MEG X670E GODLIKE, MEG X670E ACE, MPG X670E CARBON WIFI and PRO X670-P WIFI to the brand-new AMD X670 Motherboard product lineup. These new X670 motherboards come with support for the upcoming AMD Ryzen 7000 Series processors. We always make sure our goal is to bring every new product as exciting as possible, especially with the new AMD processors and platform. As a world-leading motherboard brand, MSI wants to offer nothing but excitement. Integrated with the newest technologies and packed full of features, MSI is ready to move into the next generation. Let us introduce you to our brand new X670 motherboards.

AMD Ryzen 7000 Series processors are the first to use the 5 nm FinFET process from TSMC as well as introducing a brand-new platform and socket from AMD. AMD Ryzen 7000 Series processors bring new features like PCIe 5.0, DDR5 Memory support and much more! The X670 chipset is divided into two segments - X670 Extreme and X670. X670E supports PCIe 5.0 through both the PCIe slot and M.2 slot whereas X670 motherboards support PCIe 5.0 through the M.2 slot exclusively. In addition to PCIe 5.0 and DDR5 support, all MSI X670E & X670 motherboards specification have been upgraded including rear USB Type-C will now support up to DisplayPort 2.0 output. Even more, MEG motherboards' frmont USB 3.2 Gen 2x2 Type-C will support 60 W Power Delivery. The VRM design has also been upgraded with up to 24+2 Power Phases with 105 A Smart Power Stage.

Although AMD didn't provide too many details during its Computex 2022 keynote speech about the upcoming AM5 platform, the company did announce that there will be at least three chipsets for the platform and showed pictures of some upcoming motherboards. ASUS has kindly filled in some more details about its upcoming ROG Crosshair X670E Extreme, which will be one of its higher-end models. Sadly the pictures posted are kind of tiny and the company didn't provide a shot of the rear I/O. That said, ASUS did point out some of its new features that we can expect to find on the ROG Crosshair X670E Extreme.

For starters, the board will have a pair of PCIe 5.0 x16 slots, although each slot is likely to only have eight lanes each, when both slots are in use, but ASUS doesn't mention any details here. The board has support for up to five M.2 NVMe SSDs, four of which support PCIe 5.0. Only two are onboard, with the other three being via ASUS' proprietary ROG PCIe 5.0 M.2 card and ROG GEN-Z.2 card. ASUS also promises USB4 support, as well as a USB 3.2 Gen 2x2 header with Quick Charge 4+ as well as up to 60 W charging support, for cases with a front USB-C port. On top of the rear I/O is an AniMe Matrix LED display that can be user customised.

AMD today unveiled its next-generation Ryzen 7000 desktop processors, based on the Socket AM5 desktop platform. The new Ryzen 7000 series processors introduce the new "Zen 4" microarchitecture, with the company claiming a 15% single-threaded uplift over "Zen 3" (16-core/32-thread Zen 4 processor prototype compared to a Ryzen 9 5950X). Other key specs about the architecture put out by AMD include a doubling in per-core L2 cache to 1 MB, up from 512 KB on all older versions of "Zen." The Ryzen 7000 desktop CPUs will boost to frequencies above 5.5 GHz. Based on the way AMD has worded their claims, it seems that the "+15%" number includes IPC gains, plus gains from higher clocks, plus what the DDR4 to DDR5 transition achieves. With Zen 4, AMD is introducing a new instruction set for AI compute acceleration. The transition to the LGA1718 Socket AM5 allows AMD to use next-generation I/O, including DDR5 memory, and PCI-Express Gen 5, both for the graphics card, and the M.2 NVMe slot attached to the CPU socket.

Much like Ryzen 3000 "Matisse," and Ryzen 5000 "Vermeer," the Ryzen 7000 "Raphael" desktop processor is a multi-chip module with up to two "Zen 4" CCDs (CPU core dies), and one I/O controller die. The CCDs are built on the 5 nm silicon fabrication process, while the I/O die is built on the 6 nm process, a significant upgrade from previous-generation I/O dies that were built on 12 nm. The leap to 5 nm for the CCD enables AMD to cram up to 16 "Zen 4" cores per socket, all of which are "performance" cores. The "Zen 4" CPU core is larger, on account of more number-crunching machinery to achieve the IPC increase and new instruction-sets, as well as the larger per-core L2 cache. The cIOD packs a pleasant surprise—an iGPU based on the RDNA2 graphics architecture! Now most Ryzen 7000 processors will pack integrated graphics, just like Intel Core desktop processors.

CORSAIR, a world leader in high-performance gear and systems for gamers, content creators, and PC enthusiasts, today unveiled its innovative first gaming and streaming laptop, the CORSAIR VOYAGER a1600 AMD Advantage Edition. Combining a powerful AMD Ryzen 6000 Series processor, AMD Radeon RX 6800M mobile graphics with CORSAIR and Elgato's vast ecosystem of exclusive software and technologies, the CORSAIR VOYAGER a1600 is a laptop like no other. Whether you're an aspiring content creator, avid gamer, or a full-time streamer, the CORSAIR VOYAGER a1600 AMD Advantage Edition laptop can do everything you need and more.

Packing a wide array of state-of-the-art tech into an impressively thin 19.8 mm form-factor, the CORSAIR VOYAGER a1600 boasts up to an 8-core, 16-thread AMD Ryzen 9 6900HS processor and AMD Radeon RX 6800M mobile graphics to game at maximum settings and cruise through resource-heavy applications like Adobe After Effects or OBS Studio. Moreover, this combination of cutting-edge AMD components unlocks the suite of exclusive AMD smart technologies, such as AMD Smart Access Memory, which helps unlock high performance by providing select AMD Ryzen processors with address to the entire high-speed GDDR6 graphics memory, further enhancing the CORSAIR VOYAGER a1600's high-end performance. The CORSAIR VOYAGER a1600 stays cool thanks to an advanced compact vapor chamber cooling system that evenly spreads heat, achieving lower temperatures with a thinner profile than traditional cooling methods.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced to present the latest gaming products at COMPUTEX 2022. The innovations include its flagship gaming solutions powered by Intel 12th gen processors. The perfect combination of the IF Design Awarded Z690 AORUS XTREME motherboard, high-end key components, and big size monitors provide remarkable gaming experience. The Project Stealth kit enables an easy and simple assembly experience with special interface and cables hidden design while further enhances the system airflow for optimized cooling effect. Meanwhile, the new gaming PC, Model S delivers powerful, cool, and silent operation even on 3A games with its slick and neat aesthetics.

Moreover, the latest AMD Socket AM5 motherboards including gaming series of X670 AORUS XTREME, MASTER, PRO AX and X670 AERO D for designers will be first exposed in this exhibition as well. Users can take a sneak peek at the advanced design and extensive features of PCIe 5.0 graphics slot, M.2 Gen5 interface, exclusive PCIe/M.2 EZ-latch on GIGABYTE motherboards.

Phison Electronics Corp., a leading provider of NAND controller and flash storage solutions, announced today a strategic collaboration with AMD and Micron to build a cooperative PCIe Gen5 ecosystem of compatible products that elevate the gaming and creator experience. Phison's role includes delivering a class-leading PCie Gen5 SSD controller - PS5026-E26 - that features nearly a 2x performance increase over the previous generation flagship while adhering to the same power limitations of the M.2 form factor.

"We are pleased to announce our cooperative effort with Micron and AMD to advance the technological development of PCIe Gen5 storage offerings, as this validates Phison's commitment to upholding customer-centric values," said Leo Huang, Sr. Director, Product Marketing, Phison. "The E26 controller enables gamers to compete at the highest level and helps content creators to maximize the overall system performance to increase productivity." The need for high-speed storage has increased with the popularity of 5G Wireless availability worldwide. Global markets including desktop PC, notebooks, gaming consoles, cloud servers and even mobile devices will benefit from increased data transfer rates and the bandwidth available for multitask purposes. The ecosystem consisting of AMD's AM5 platform, Phison's PS5026-E26 controller, Micron's DDR5 DRAM and Replacement Gate 3D NAND allow for platform acceleration across the entire system to meet the requirements for today's always-connected lifestyle.

AMD in its Computex 2022 presentation announced several design wins for its Ryzen 6000U line of high-performance processors for ultra-thin notebooks. With configurable TDPs of 15 W and 28 W, these processors feature an 8-core/16-thread "Zen 3" CPU, an iGPU with up to 12 RDNA2 compute units, and a modern I/O that combines DDR5 memory with PCI-Express Gen 4, to bring gaming to ultra-thin form-factors without the need for a discrete GPU. The iGPU meets DirectX 12 Ultimate feature requirements, and AMD leverages technologies such as FidelityFX Super Resolution (FSR), to further improve gaming performance.

Among the new design wins are the ASUS Zenbook S 13 OLED, a 13-inch ultra-thin weighing only 1 kg, and capable of average 60 FPS in "Godfall," taking advantage of FSR. The Lenovo Yoga Slim 7 Pro X is another notebook in this class capable of 1080p gaming, powered by the Ryzen 7 6800HS, with up to 122 FPS in CS:GO, up to 266 FPS in "League of Legends," up to 59 FPS in "Shadow of the Tomb Raider," up to 64 FPS in "Final Fantasy: XIV," and up to 46 FPS in "Deus Ex: Mankind Divided."

MediaTek today announced the Filogic 880 and Filogic 380 Wi-Fi 7 platform solutions for high-bandwidth applications in the operator, retail, enterprise and consumer electronics markets. This pair of chips will be among the first Wi-Fi 7 solutions to hit the market, allowing device makers to deliver cutting-edge products with the latest connectivity technology. Filogic 880 is a complete platform that combines a Wi-Fi 7 access point with a new advanced host processor solution to provide the industry's best router and gateway solution for operator, retail and enterprise markets. It offers a scalable architecture that can support up to penta-band 4x4 with a maximum speed of 36 Gbps. Filogic 380 is designed to bring Wi-Fi 7 connectivity to all client devices, including smartphone, tablet, TVs, notebooks, set-top boxes and OTT streaming devices. The chip's dual concurrent 2x2 capability will be optimized "out-of-the-box" for these devices as MediaTek also supplies the corresponding platform solutions. This helps to streamline the design process, maximize performance and accelerate time-to-market.

"Our wireless connectivity solutions are designed to deliver the fastest performance using the most advanced technologies, and represent MediaTek's commitment to drive Wi-Fi 7 adoption in a large number of new markets," said Alan Hsu, corporate vice president and general manager of the Intelligent Connectivity business at MediaTek. "With Filogic 880 and Filogic 380, our customers can deliver fast, reliable and always-on connected experiences to meet the industry's growing connectivity demands." MediaTek's Filogic 880 combines a Wi-Fi 7 access point with a powerful application processor and network processing unit (NPU) to support maximum Wi-Fi, Ethernet and packet processing performance. The chip offers a wide range of interfaces and peripherals, making it easy to customize designs for various end products and applications.

MediaTek today announced the Dimensity 1050 system-on-chip [SoC], its first mmWave 5G chipset that will power the next generation of 5G smartphones with seamless connectivity, displays, gaming and power efficiency. Through dual connectivity using mmWave and sub-6 GHz, the Dimensity 1050 will deliver the speeds and capacity required to provide smartphone users with an incredible experience, even in some of the most densely populated areas. The Dimensity 1050 combines mmWave 5G and sub-6 GHz to fluidly migrate between network bands, and is built on the ultra-efficient TSMC 6 nm production process with an octa-core CPU. Supporting 3CC carrier aggregation on sub-6 (FR1) spectrum and 4CC carrier aggregation on mmWave (FR2) spectrum, the Dimensity 1050 will be capable of delivering up to 53 percent faster speeds and greater reach to smartphones compared to LTE + mmWave aggregation alone. The SoC integrates two premium Arm Cortex-A78 CPUs with speeds reaching 2.5 GHz and the latest Arm Mali-G610 graphics engine.

"The Dimensity 1050, and its combination of sub-6 GHz and mmWave technologies, will deliver end-to-end 5G experiences, uninterrupted connectivity and superior power efficiency to meet everyday user demands," said CH Chen, Deputy General Manager of Wireless Communications Business Unit at MediaTek. "With faster, more reliable connections, and advanced camera technology this chip delivers powerful features to help device makes to differentiate their smartphone product lines." In addition to 5G optimizations, the Dimensity 1050 offers Wi-Fi optimizations alongside MediaTek's HyperEngine 5.0 gaming technology to ensure lower-latency connections with the new tri-band - 2.4 GHz, 5 GHz and 6 GHz - that extends game time and performance. Additionally, high-end UFS 3.1 storage and LPDDR5 memory ensure ultra-fast data streams to accelerate apps, social feeds and faster FPS in games.

iFixit accidentally listed their lineup of Steam Deck replacement parts for purchase before removing them shortly thereafter. The company listed several key components of the Steam Deck on their UK store including the Motherboard, Screen, Speakers, Fan, and Adhesive. These components do not come cheaply with the bare motherboard excluding an SSD costing £289.99 (360 USD) while the base models screen costs £59.99 (75 USD) with the premium anti-glare screen costing £89.99 (110 USD). These parts have all now been removed from the website with iFixit promising to officially release them soon while honoring any orders that were placed before the removal. The complete list of parts and their prices offered by iFixit can be found below.

iFixitEarlier today we published some pages related to our upcoming parts launch with Valve. These went live earlier than we planned, so we ended up taking them down. If you did get a parts order in, we'll honor it.

Today, noblechairs release their latest product to celebrate the 10th anniversary of one of the most popular and endearing games on the market by introducing the officially licensed noblechairs HERO - The Elder Scrolls V: Skyrim 10th Anniversary Edition gaming chair. Designed to take distinctive elements from the game, this is a must-have for Skyrim enthusiasts. Featuring a premium all-black base, with the Seal of Akatosh on the headrest and the exquisite 10th Anniversary logo embroidered on the rear of the chair, the bolster of the chair also features words of power and dragon leather accents - but don't worry, no dragons were harmed in the making of this chair!

Winning over 250 product awards, noblechairs is the proud bearer of a long and stellar line of positive feedback from its many wonderful customers. As a company dedicated to providing a premium range of comfortable gaming chairs, all with durability and ergonomics in mind, noblechairs is a German brand that takes pride in being seen as one of the best on the market. Including award-winning features such as the adjustable backrest with an internal lumbar support mechanism, 4D armrests, and a rocking mechanism, the Skyrim 10th Anniversary Edition is fully ergonomic with additional lumbar support.

Akasa, has recently released a set of case fans in the Alucia line of products, adding to the Alucia H4. The Alucia SC series come in 120 mm (SC12) and 140 mm (SC14) sizes, which makes these fans great for cases of all shapes and sizes. Perfect for a stealthy PC build with no lighting effects, the fans are jampacked with features; no PC can be complete without Akasa's high performance Alucia SC fans!

The most important factor of a case fan is arguably the airflow - a high level of which can circulate air more efficiently around the PC case. Alucia does not back down, with the powerful, optimized fan blade design producing 56.3 CFM (SC12) and 84.3 CFM (SC14) of airflow; this shows the amazing aerodynamic efficiency possible from these fans.

We're expecting to see a wide range of AM5 motherboards next week during Computex, but we're already being treated to some early leaks ahead of the show. The most recent leak was picked up by @9550pro on Twitter, but was originally posted on Baidu. What we're looking at here though, isn't actually a picture of a motherboard, but rather the placement map for the SMD components used during motherboard assembly. These pictures are often used to make sure things like the solder mask and components were applied properly during production. However, it does give us a good look at the overall layout of the ASUS X670 Prime-P WiFi and the fact that the X670 chipset does indeed consist of two parts. What is also clear is that we're looking at a PCIe 5.0 x16 slot here, as these slots are SMD components rather than through hole.

Other things that are clearly visible, includes support for three M.2 slots, of which the one closest to the CPU might be PCIe 5.0, but there's really no way of telling by just looking at the connector placement. There's also a space for a WiFi module at the bottom of the rear I/O, but beyond that, it's hard to make out the proper port layout. However, there appears to be at least one USB-C port at the rear, as well as a header for another one at the front of the motherboard, next to a USB 3.0 header. The board also appears to feature 14 power phases and obviously four DDR5 DIMM slots. The chip between the two chipsets are either a Super I/O chip or possibly a PCIe redriver. In addition to the x16 PCIe 5.0 slot, the X670 Prime-P appears to be getting a single PCIe x1 slot and two PCIe x4 slots, both which appear to get physical x16 slots. Finally the board should have two SATA ports mounted at a 90-degree angle, as well as four ports at the bottom edge of the PCB. ASUS seems to have gone for a solar system pattern on the PCB itself, so it'll be interesting to see what the actual boards will look like.

It appears that ASRock got a little bit too excited and posted a Computex video earlier today that contained a brief glimpse of its upcoming X670E Taichi motherboard. The screenshot that was captured by Wccftech doesn't give away too much details, but the board appears to have at least three M.2 slots and a pair of PCIe x16 slots, of which at least one is meant to be of the PCIe 5.0 variety. The rest of the board is covered in heatsinks and various shrouds. The board will feature Realtek's ALC4082 USB attached audio codec, as well as a ESS ES9218 DAC. It is also said to sport a 26-phase VRM setup. The board is also expected to have Thunderbolt 4 support. The video has unfortunately been taken down, so we'll have to wait until next week to find out more details.

In related news, @momomo_us has leaked details of several upcoming AM5 motherboards, of which four models are from ASRock and two from ASUS. The ASRock models are the X670E Taichi mentioned above, the X670 PG Riptide, X670 Phantom Gaming 4 and the X670 Steel Legend. The two ASUS models are the ProArt X670E-Creator WiFi and the ProArt B650-Creator. Finally Gigabyte has revealed that the company will be displaying its X670 Aorus Xtreme, X670 Master, X670 Pro AX and X670 AERO D at Computex next week. The company mentions PCIe 5.0 for both graphics and the M.2 interface, which pretty much cements the earlier rumors about AMD offering PCIe 5.0 support for the M.2 interface on the AM5 platform.

The rumour mill never seems to stop churning when it comes to TSMC and now the company is said to be looking at the tiny nation of Singapore for a future fab. This time the information comes via the Wall Street Journal rather than the usual Taiwanese sources and although the publication points out that no decision has been made at this point in time, it says that TSMC is apparently in talks with the Economic Development Board of Singapore. The official statement from the TSMC on the matter is that the company "doesn't rule out any possibility but does not have any concrete plan at this time".

The potential Singapore Fab would be producing 28 to 7 nm chips, in other words, quite far from TSMC's cutting edge nodes. However, TSMC is already building a similar facility in the southern city of Kaohsiung in Taiwan that's scheduled for opening in 2024. As such, the nodes used in a future facility in Singapore might change depending on when the fab will open and it might end up producing chips on more advanced nodes as well. As these fabs take a few years to get going, they're not projects that are started on a whim. We should also mention that TSMC already has a joint venture in Singapore together with NXP, called SSMC, which also produces for third parties.

Google Cloud and AMD today announced a technology partnership in which AMD will run electronic design automation (EDA) for its chip-design workloads on Google Cloud, further extending the on-premises capabilities of AMD data centers. AMD will also leverage Google Cloud's global networking, storage, artificial intelligence, and machine learning capabilities to further improve upon its hybrid and multicloud strategy for these EDA workloads.

Scale, elasticity, and efficient utilization of resources play critical roles in chip design, particularly given that the demand for compute processing grows with each node advancement. To remain flexible and scale easily, AMD will add Google Cloud's newest compute-optimized C2D VM instance, powered by 3rd Gen AMD EPYC processors, to its suite of resources focused on EDA workloads. By leveraging Google Cloud, AMD anticipates being able to run more designs in parallel, giving the team more flexibility to manage short-term compute demands, without reducing allocation on long-term projects.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced today a new technology partnership with MAINGEAR, developing the newly developed Project Stealth computer assembly kit and MAINGEAR Stealth custom gaming PC's. Through the perfect combination of standard ATX compatible components with non-proprietary connectors consisting of a custom motherboard, graphics card and case, Project Stealth eliminates the headaches of cable clutter, installation challenges, and obstructed airflow. The innovative design makes assembling a clean and sleek PC build easier than ever before

When it comes to PC builds, beginners or experienced users alike might find it a difficult process. Since most cables are designed to connect to the front side of motherboards, cable chaos inside the case becomes a major concern in a system build. Others may also struggle with inserting USB, audio, PSU connectors, and front panel headers on the motherboards due to limited interior space in the chassis. In response to these challenges, GIGABYTE developed Project Stealth, utilizing MAINGEAR's revolutionary patent and design that shifts all connectors to back of the motherboard. Through this innovation, Project Stealth provides an exceptional solution composed of the Z690 AORUS ELITE STEALTH motherboard, RTX 3070 GAMING OC STEALTH graphics card, and AORUS C300G STEALTH case.

Qualcomm Technologies, Inc. announced another milestone in making extended reality (XR) the next computing platform with the Wireless AR Smart Viewer Reference Design, powered by the Snapdragon XR2 Platform. The cord-free reference design helps OEMs and ODMs more seamlessly and cost-efficiently prototype and bring to market lightweight, premium AR glasses to enable immersive experiences that unlock the metaverse.

Greater Performance, Sleeker Device: The purpose-built, premium Snapdragon XR2 Platform now packs powerful performance into a slim, smaller AR glass form factor. The AR reference design hardware, developed by Goertek, has a 40% thinner profile and a more ergonomically balanced weight distribution for increased comfort. SeeYA provides the dual micro-OLED binocular display enabling 1920 x 1080 per eye and frame rates up to 90 Hz and a no-motion-blur feature to deliver a seamless AR experience. Dual monochrome cameras and one RGB camera on the smart viewer enable six-degrees of freedom (6DoF) head tracking and hand tracking with gesture recognition to achieve AR precision.

Qualcomm Technologies, Inc. announced its latest lineup of mobile platforms, Snapdragon 8+ Gen 1 and Snapdragon 7 Gen 1, to power the next generation of premium and high-tier Android smartphones. The Company's newest flagship platform, Snapdragon 8+, is a premium-tier powerhouse delivering power and performance enhancements for the ultimate boost across all on-device experiences. Snapdragon 7 offers a selection of high-end, in-demand features and technologies and enables them for more people around the world. According to the latest findings from Counterpoint Research, IDC, and Strategy Analytics, Qualcomm Technologies is the global leader in premium Android smartphone SoC industry share.

"In the mobile segment, our primary focus is to deliver new, groundbreaking features and technologies to the industry, and for our customers' flagship devices. We implement these features first in our Snapdragon 8-series and then waterfall them down our mobile roadmap," said Christopher Patrick, senior vice president and general manager, mobile handsets, Qualcomm Technologies, Inc. "The new Snapdragon 8+ and 7 Gen 1 both deliver breakthrough user experiences in their respective tiers."

The new mini PC will be listed in the Minisforum's new product series - Neptune Series, which is for all their mini PCs with discrete graphics. Some of the upcoming products including AMD Ryzen 9 5900HX with AMD Radeon RX 6650M, AMD Ryzen 9 6900HX with AMD Radeon RX 6650M and Intel 12th gen Alder Lake with AMD discrete graphics. The first one will be HX90G, which is equipped with Ryzen 9 5900HX and Radeon RX6650M. It is also the world's first mini PC with AMD discrete graphics.

The HX90G will have the latest body design which is only 2.8L. It will have 7 heat pipes (3 for CPU and 4 for GPU) and dual smart fan inside, liquid metal for both CPU and GPU, The excellent heat dissipation design enables the HX90G to maintain relatively low noise even in full load. Besides CPU+GPU under 100% usage will consume 50 W and 100 W separately. It will use a 260 W power adapter. According to Minisforum, Radeon RX 6650M can run at 100% without performance loss.

Silicon Power unleashes its newest PCIe 4.0 SSD, the UD90, featuring storage capacities up to 1 TB with 3D NAND flash technology. Give your system the power of PCIe 4.0 with the budget-friendly UD90. Providing the best bang for your buck, it reaches read speeds up to 4,800 MB/s and write speeds up to 4,200 MB/s. It also boasts 2x faster data transfer rates than its predecessor, PCIe 3.0, for sustained use and dependable performance. With this much efficiency, the UD90 allows you to maximize your creative output at an unbeatable value.

Don't lose your train of thought with slow load times! Designed with content creators in mind, the UD90 is built to handle the demanding levels of multi-tasking that's required of creative production, effortlessly. With support for NVMe 1.4 and Host Memory Buffer (HMB) technology, the UD90 offers uninterrupted productivity via higher performance and lower latency for seamless execution across applications.

here's another hot new ZADAK product on the market, and this one is going to take gamers one step beyond. It's the TWSG4S M.2 PCIe Gen4 x4 SSD, and it delivers read-write speeds that many Gen4 x4 SSDs can't - 7,400 and 7,000 MB/s, respectively. This is an ideal expansion SSD for new game consoles and PCs, giving players the chance to dominate their games. It ships with two powerful heatsinks in the box. One is made of ultra-thin graphene and the other of aluminium, and they reduce the operating temperatures by 15% and 35% respectively.

Either will fit inside the PS5, but notebooks will only permit the installation of the graphene heatsink. PC gamers will quickly see the advantages of this SSD, but it's also fully compliant with the technical requirements and physical dimensions of Sony's PS5, so console gamers will love it too. One of the most unique features of this product is the design. Sure, there's an aesthetic similarity that makes it the perfect partner for the PS5 in looks. But it also features a heat dissipation portal that's been crafted to suggest the dimensions of the PS5's DualSense controller. It's subtle, like the tiny PlayStation symbols that adorn the DualSense itself, but gamers will appreciate the difference.

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SPC Gear, the gaming label of the European manufacturer SilentiumPC, is proud to announce, for the very first time, the addition of two wireless gaming mice to its portfolio. The new lightweight and highly precise SPC Gear LIX and LIX Plus Wireless use 2,4 GHz wireless connectivity that ensures a stable connection without delays, while the long battery life and quick charging times allow the mice to be used for extended periods of time. The honeycomb structure of the mouse is what makes the LIX series so lightweight, also aiding in breathability of the hand. The mice have been equipped with high-class components that allow users to gain an advantage over their opponents on the virtual battlefield. In addition, the addressable RGB backlighting makes the mouse truly stand out among the competition.

Stable and lag-free 2,4 GHz wireless connectivity gives the user unparalleled precision and convenience without any boundaries. This solution helps to keep the desk tidy and improves the overall comfort of use. Thanks to the magnetic compartment on the bottom of the mouse, users don't need to worry about losing the USB wireless receiver.

EK, the leading computer cooling solutions provider, is introducing new Vector² water blocks, this time for the MSI TRIO and SUPRIM GeForce RTX 3090 Ti GPUs. This product series contains a dedicated GPU water block with an included aluminium backplate and an alternative nickel-plated backplate. The EK-Quantum Vector² Trio RTX 3090 Ti D-RGB is a complete liquid cooling solution that includes a new Vector² water block, a black-anodized aluminium backplate, and a mounting mechanism. Minimalistic straight lines dominate the new look of the next-gen water blocks.

The 3rd-generation Vector cooling engine combines the jet plate with a 3D machined Plexi insert to improve flow distribution and thermal performance. This new cooling engine is still based on an Open Split-Flow cooling engine design, which proved to be a superior solution for GPU water blocks. It is characterized by low hydraulic flow restriction, meaning it can be used with weaker water pumps or pumps running on low-speed settings and still achieve top performance. Great care was taken to achieve a symmetrical flow domain by utilizing an internal bridge to secondary components. This was done to ensure the cooling of secondary components without sacrificing flow distribution over the GPU core.

NiceHash, one of the largest mining software providers in the world, has today announced that the company had updated its QuickHash miner with the capability to unlock 90% of the performance for NVIDIA's Lite Hash Rate (LHR) version 3. Currently, there are only two cards available with LHRv3 on the market, and those are NVIDIA GeForce RTX 3080 12 GB version and RTX 3050, which are limited in the software to have poor hash rate when mining. This is done to get these cards away from the hands of miners and into the hands of consumers. However, engineers working at NiceHash have presented QuickMiner v0.5.4.2 Release Candidate, which unlocks 90% of that LHRv3 capability.

Previously, the company has already presented its work and enabled 100% unlock for LHRv2 cards and has now almost the entire stack covered. It is a matter of time before LHRv3 unlock goes up to 100%. NiceHash advises using NVIDIA driver version 512.15 or higher to get the latest unlock. Some stability issues have been fixed in the release, so users will experience no BSODs upon running the mining software.

Taiwanese ASMedia appears to become the first peripheral chipset company to launch a USB4 host-controller chipset, based on reports from an event the company held this week. ASMedia is at least the first company to get certified by the USB-IF, as its ASM4242 host-controller is the first of its kind to get certified. The ASM4242 was certified alongside the ASM2464PD device controller, although it's unclear exactly what type of device controller this is, but the PD in the model name indicates that it has native support for USB PD power delivery, without the need of any additional chips. This should allow for simpler implementation, as well as it would be saving some PCB space that the extra components no longer take up.

The ASM4242 is said to have a PCIe 4.0 x4 interface and does as such support up to 64 Gbps of bandwidth. As this is a two port controller, it's still not quite enough to enable both ports to operate at the full 40 Gbps that USB4 Gen 3x2 supports, but it should be enough for most consumer implementations. ASMedia has also added support for DP Alt Mode and USB4 is of course also backwards compatible with Thunderbolt 3. ASMedia is already sampling its partners. We should hopefully get a better look at what ASMedia is working on next week, but DigiTimes mentions that ASMedia has also developed PCIe 5.0 controllers of some kind and have finished the tape-out of said products.

SK hynix Inc. today announced availability of the "Platinum P41" PCIe Gen4 NVMe SSD that distills technical excellence driven by unmatched speeds and reliability. The Platinum series represents the company's flagship retail lineup geared towards gamers and content creators looking to turbo-boost PC performance. Launched as SK hynix's first PCIe 4.0 SSD built with advanced 176-layer NAND flash memory, the Platinum P41 is now available for purchase on Amazon in the U.S. in 500 GB, 1 TB and 2 TB capacity options.

Designed to excel among PCIe 4.0 SSDs, the Platinum P41 offers sequential read speeds up to 7,000 MB/s and sequential write speeds up to 6,500 MB/s with an industry-leading endurance rating of up to 1,200 TBW. The Platinum P41 also provides further assurance of reliability with an SK hynix in-house "Aries" controller, which in itself contributes to the superior read/write speeds.

Foxconn's ambitions as a semiconductor player are growing with yet another potential joint venture being announced, this time in Malaysia. Hang on, Foxconn doesn't make semiconductors you might be thinking right now, but the company has actually owned semiconductor fabs since 2016, when it acquired Sharp and ended up with an 8-inch fab in Fukuyama in Japan. Foxconn has also tried to buy an 8-inch fab in Malaysia in 2020, as well as trying to take over Taiwanese non-volatile memory manufacturer Macronix at one point. It seems like the company has decided to take a different route this year, with news of a joint venture in India and now plans of another joint venture with Dagang NeXchange Berhad (DNex) in Malaysia.

The two companies have signed a memorandum of understanding (MOU), although it's a subsidiary of Foxconn, Big Innovation Holding Limited (BIH) that actually signed the paperwork. The MOU is about building a 12-inch fab according to Focus Taiwan/CNA which reports that the fab will be making chips using 40 to 28 nm processes. It's possible that this will be for the various EV projects that Foxconn is involved with and it would be a less risky way to enter the semiconductor market for Foxconn. The fab is said to be able to output 40,000 wafers a month once it starts, although when this will be is anyone's guess at the moment. Foxconn's focus is on what the company calls the 3 plus 3 initiative, which relates to electrical vehicles, robotics and healthcare solutions, which are built in AI, semiconductors and communication technologies, all presumably from within Foxconn. Time will tell if Foxconn manages to pull this off, but until the construction of the fab has started, this is nothing more than a potential project for Foxconn.

Sony Electronics Inc. today announced their newest addition to the LinkBuds series: LinkBuds S. The latest model empowers a new sound experience through Sony's sensing technology and partner collaboration, while retaining a "Never Off" wearing experience perfect for staying connected to online and offline worlds due to their ultra-small and lightweight design with natural ambient sound. By leveraging sensor and spatial sound technology, they deliver new and immersive sound for AR games such as Niantic's game Ingress. for consumers looking for new options for entertainment beyond music and calls. The model also makes music listening easier than ever with a new and unique "Auto Play" feature. By detecting the listener's environment, such as wearing LinkBuds S, the feature enables their music to play automatically, delivered accordingly to their activity.

LinkBuds S are perfect for streaming content all day long. Consumers can enjoy music, video, or social media content just as the creator intended with Sony's highly acclaimed noise canceling technology and high-resolution capability. Sony Electronics has engineered these remarkably small and lightweight truly wireless headphones with comfort in mind. LinkBuds S combine a shape that matches the human ear with an ergonomic design for a more stable fit to avoid discomfort in the ear that gets in the way of entertainment.

Alphacool's NexXxoS HPE radiator is now also available as ST20 variant. The compact slim radiator can be mounted very flexibly and space-saving even in the tightest cases due to its low height of only 20 mm.

Technically and functionally, the NexXxos HPE ST20 is comparable to the HPE-30 and HPE-45 versions. All water-bearing parts and the cooling fins are still made of pure copper. The number of water channels and copper fins inside the radiator has been increased with the result that a larger volume of water is now in direct contact with the cooling fins and the cooling surface is used much more efficiently. Thanks to the technical innovations, the heat transfer has been improved enormously compared to the previous NexXxos models and the cooling performance has been increased significantly.

In today's times when most brands are moving towards digitalization, there is a brand that still believes in retro-themed designs for products that come into use in our day-to-day activities. We are talking about the brand called Lofree here. Lofree is a well-known brand that has got all the praises for having a unique design approach for modern products. They specialize in designing products such as mechanical keyboards, Bluetooth table speakers, table fans, etc. Today, Lofree took it to the internet and released three new products at a launch event. The launch event was also streamed online on their official WeChat channel. Lofree has added three new products to their Mechanical Keyboard catalog: the Wanderfree Moment, the 1% Mechanical Keyboard, and the Gift Box Wireless Mechanical Keyboard.

Chinese company Machenike have recently launched the first gaming laptop to feature the new high-end Intel Arc A730M graphics card. The Machenike Discovery Edition 2022 gaming system features a 14-core Intel Core i7-12700H paired with an Arc A730M GPU and 16 GB of 4800 MHz DDR5 memory to power the 16" 1440p 165 Hz screen. The Intel Arc A730M features 24 Xe-Cores and is paired with 12 GB of 12 Gbps GDDR6 memory on a 192-bit memory bus. This is the second fastest Arc Alchemist Mobile GPU currently announced just behind the Arc A770M which features a further 8 Xe-Cores, faster 16 Gbps memory, and a 256-bit memory bus. The Machenike Discovery Edition 2022 is now available to pre-order in China with a limited starting price of 8499 RMB (1255 USD).

Many companies, including Intel and AMD, have stopped product shipments to Russia amidst the war in Ukraine in the past few months. This has left the Russian state without any new processors from the two prominent x86 designers, thus slowing down the country's technological progress. To overcome this issue, it seems like the solution is embedded in the Chinese Zhaoxin x86 CPUs. According to the latest report from Habr, a motherboard designer called Dannie is embedding Chinese Zhaoxin x86 CPUs into motherboards to provide the motherland with an x86-capable processor. More precisely, the company had designed a BX-Z60A micro-ATX motherboard that embeds Zhaoxin's KaiXian KX-6640MA SoC with eight cores based on LuJiaZui microarchitecture. The SoC is clocked at a frequency range of 2.1-2.7 GHz, carries 4 MB of L2 cache, 16 lanes of PCIe 3.0, and has integrated graphics, all in a 25 Watt TDP.

As far as the motherboard is concerned, it supports two DDR4 memory slots, two PCIe x16 connectors, M.2-2280 and M.2-2230 slots, and three SATA III connectors for storage. For I/O you have USB ports, DisplayPort, HDMI, VGA/D-Sub, GbE, 3.5-mm audio, and additional PS/2 ports. This is a pretty decent selection; however, we don't know the pricing structure. A motherboard with KaiXian KX-6640MA SoC like this is certainly not cheap, so we are left to wonder if this will help Russian users deal with the newly imposed restriction on importing US tech.

The NVIDIA GeForce GTX 1630 graphics card is set to be launched on May 31st according to a recent report from VideoCardz. The GTX 1630 is based on the GTX 1650 featuring a 12 nm Turing TU117-150 GPU with 512 CUDA cores and 4 GB of GDDR6 memory on a 64-bit memory bus. This is a reduction from the 896 CUDA cores and 128-bit memory bus found in the GTX 1650 however there is an increase in clock speeds with a boost clock of 1800 MHz at a TDP of 75 W. This memory configuration results in a maximum theoretical bandwidth of 96 GB/s which is exactly half of what is available on the GDDR6 GTX 1650. The NVIDIA GeForce GTX 1630 may be announced during NVIDIA's Computex keynote next week.

GeIL, is excited to announce the market launch of its EVO V DDR5 RGB Hardcore Gaming Memory kits providing high-frequency modules ranging from 4800 MHz to 6600 MHz and available in large kit capacities of 32 GB to 64 GB. The unique heatspreader design features active cooling and fascinating RGB lighting effects and is available in titanium gray or glacier white color themes.

GeIL EVO V DDR5 RGB Hardcore Gaming Memory offers unparalleled memory performance and stability to meet the intensive demand of hardcore gamers and overclockers across Intel's latest platforms. GeIL has crafted a break-through cooling solution for EVO V modules that integrates a stunning RGB light bar and two micro cooling fans into a single molded aluminium heatshield. Most importantly, the physical height of the heatspreader allows it to be compatible with most CPU coolers on the market without any mechanical interference.

XPG, a provider of high-performance products for Gamers, Esports Pros, and Tech Enthusiasts, is pleased to announce that the warranty period for the XPG PYLON 80 Plus Bronze certified power supply unit has been extended to 5 years. Previously the unit's warranty was limited to 3 years. XPG actively works to ensure the highest level of quality and reliability in all their products and happily extends that guarantee to the gamers.

The XPG PYLON is an 80 Plus Bronze certified power supply unit that can reach efficiency levels as high as 89%, delivering performance nearly rivaling that of Gold certified power supplies. It was designed for 24/7 continuous power system operation and comes in four wattage options - 450 W, 550 W, 650 W and 750 W - to meet the specific needs of various types of users and performance scenarios. All models feature DC-to-DC circuit 100% +12V. XPG PYLON complies with the Intel ATX Power Supply Design Guide's sleep mode function requirements and features a power delivery system that remains consistent and efficient, making it ideal for supporting mid to high-end graphic cards and CPUs. Its 120 mm Fluid Dynamic Bearing (FDB) fan runs nearly silent for a quiet user experience. Combined with its 105°C Japanese main capacitors, the XPG PYLON is whisper-quiet, highly efficient, and built to last.

GIGABYTE Technology, an industry leader in high-performance servers and workstations, today announced a new supercharged, scalable server, G492-PD0, that supports an Ampere Altra Max or Altra processor with NVIDIA HGX A100 Tensor Core GPUs for the highest performance in cloud infrastructure, HPC, AI, and more. Leveraging Ampere's Altra Max CPU with a high core count, up to 128 Armv8.2 cores per socket with Arm's M1 core, the G492-PD0 delivers high performance efficiently and with minimized total cost of ownership.

GIGABYTE developed the G492-PD0 in response to a demand for high-performing platform choices beyond x86, namely the Arm-based processor from Ampere. This new G492 server was tailored to handle the performance of NVIDIA's baseboard accelerator without compromising or throttling CPU or GPU performance. This server joins the existing line of GIGABYTE G492 servers that support the NVIDIA HGX A100 8-GPU baseboard on the AMD EPYC platform (G492-ZL2, G492-ZD2, G492-ZD0) and Intel Xeon Scalable (G492-ID0).

AMD has historically thrown brute memory bus width at solving memory-management problems in its graphics architectures, but the Infinity Cache technology launched with RDNA2 proved to be a game changer, as GPUs with narrow 256-bit memory interfaces could compete with NVIDIA's offerings that have 384-bit wide memory interfaces and faster GDDR6X memory types. It looks like the competition between NVIDIA "Ada" and AMD RDNA3 graphics architectures is about to heat up, as rumors are emerging of AMD giving its biggest next-gen ASIC, the "Navi 31," a 384-bit wide memory interface.

This 50 percent increase in memory bus width, runs in concert with two associated rumors—one, that the company will use faster 20 Gbps GDDR6 memory chips; and two, that AMD may increase the size of the on-die Infinity Cache memory. Samsung is already mass-producing 20 Gbps and 24 Gbps GDDR6 memory chips. These are regular GDDR6 memory chips with JEDEC-standard signaling, and not GDDR6X, an exclusive memory type innovated by NVIDIA and Micron Technology, which leverages PAM4 signaling to increase data-rates. A theoretical "Navi 31" with 20 Gbps GDDR6 memory speeds would enjoy 960 GB/s of memory bandwidth, a massive 87.5 percent bandwidth increase over the RX 6900 XT. The on-die Infinity Cache operates at speeds measured in several TB/s. The increased bus width could also signal an increase in memory sizes, with the RX 6950 XT successor featuring at least 24 GB of memory.

Back in January, we heard the first reports of Intel significantly increasing the on-die cache sizes on its 13th Gen Core "Raptor Lake-S" desktop processor, with the sum total of L2 and L3 caches on the silicon being 68 MB. A CPU-Z screenshot from the same source as the January story, confirmed the cache sizes. The "Raptor Lake-S" die in its full configuration features eight "Raptor Cove" performance cores (P-cores), and sixteen "Gracemont" efficiency cores (E-cores), making it a 24-core/32-thread chip.

Each "Raptor Cove" P-core features 2 MB of dedicated L2 cache even in its client variant, as previously reported, which is an increase from the 1.25 MB L2 cache of the "Golden Cove" P-cores on "Alder Lake-S." The sixteen "Gracemont" E-cores are spread across four E-core clusters, just like the eight E-cores of "Alder Lake-S" are spread across two such clusters. The four cores in each cluster share an L2 cache. Intel has doubled the size of this L2 cache from 2 MB on "Alder Lake" chips, up to 4 MB. The shared L3 cache on the silicon has increased in size to 36 MB. Eight P-cores with 2 MB each, and four E-core clusters with 4 MB, each, total 32 MB of L2 cache. Add this to 36 MB of L3 cache, and you get 68 MB of L2+L3 cache. Intel is expected to debut "Raptor Lake" in the second half of 2022 alongside the 700-series chipset, and backwards compatibility with 600-series chipset. It could go down as Intel's last client processor built on a monolithic silicon.

EK, the leading computer cooling solutions provider, is introducing new Vector² water blocks, this time for the EVGA FTW3 GeForce RTX 3090 Ti GPUs. This product series contains a dedicated GPU water block with an included aluminium backplate, an ultimate GPU cooling enclosure in the form of a set of water blocks and active backplate, but also an alternative nickel-plated backplate and side cover to customize your water-cooled FTW3 3090 Ti GPU to your own desires.

The EK-Quantum Vector² FTW3 RTX 3090 Ti D-RGB is a complete liquid cooling solution that includes a new Vector² water block, a black-anodized aluminium backplate, and a mounting mechanism. Minimalist straight lines dominate the new look of the next-gen water blocks. The 3rd-generation Vector cooling engine combines the jet plate with a 3D machined Plexi insert to improve flow distribution and thermal performance. This new cooling engine is still based on an Open Split-Flow cooling engine design, which proved to be a superior solution for GPU water blocks. It is characterized by low hydraulic flow restriction, meaning it can be used with weaker water pumps or pumps running on low-speed settings and still achieve top performance. Great care was taken to achieve a symmetrical flow domain by utilizing an internal bridge to secondary components. This was done to ensure the cooling of secondary components without sacrificing flow distribution over the GPU core.