Intel Launches B365 Express Chipset on 22nm Process, Possibly a Re-branded Z170

Intel today introduced the B365 Express desktop motherboard chipset as an in-between to its B360 Express and H370 Express chipsets. This model is part of Intel's optical enlargement of its motherboard chipsets to the 22 nm HKMG+ silicon fabrication node, to free up 14 nm++ for processors. Despite this, the TDP of the chipset remains unchanged at 6 Watts. The B365 has a couple of feature additions and subtractions over B360. To begin with it has a wider PCI-Express downstream root-complex, with 20 gen 3.0 lanes, on par with H370 Express. The B360, if you'll recall, only has 12 downstream PCIe lanes. This means B365 motherboards will have additional M.2 and U.2 connectivity.

According to the ARK specifications page for the B365 Express, this chip completely lacks integrated 10 Gbps USB 3.1 gen 2 connectivity. Perhaps the expanded downstream PCIe is really meant for motherboard vendors to use third-party USB 3.1 gen 2 controller chips. You still get eight 5 Gbps USB 3.0 ports (notice we didn't say USB 3.1 gen 1, because don't expect fast-charging features). The chipset also loses the latest generation Wireless AC integrated MAC. All of these point to the possibility of the B365 Express being a re-branded Z170 with locked CPU overclocking. Adding credence to this theory is the fact that while the B360 uses ME version 12, the B365 uses the older ME version 11. Much like the H310C, the B365 could include platform support for Windows 7.