Wednesday, August 27th 2008
NVIDIA GPU Failures Caused by Material Problem, Sources Claim
NVIDIA has recently been experiencing higher-than-normal failure rates with some of its GPUs. Charlie Demerjian from The Inq. speculates that NVIDIA could actually have a much larger problem than what it admits to - it is quite possible, according to Demerjian, that not only mobile GPUs are affected, but the desktop G92 and G94 could also carry the fault.
The failures, some sources say, are caused by a solder bump that connects the I/O termination of the silicon chip to the pad on the substrate. In Nvidia's GPUs, this solder bump is created using high-lead. A thermal mismatch between the chip and the substrate has substantially grown in recent chip generations, apparently leading to fatigue cracking. What supports the theory that a high-lead solder bump in fact is at fault is the fact that Nvidia ordered an immediate switch to use eutectic solders instead of high-lead versions in the last week of July. Eutectic solders are believed to solve the problem of fatigue cracking.
The failures, some sources say, are caused by a solder bump that connects the I/O termination of the silicon chip to the pad on the substrate. In Nvidia's GPUs, this solder bump is created using high-lead. A thermal mismatch between the chip and the substrate has substantially grown in recent chip generations, apparently leading to fatigue cracking. What supports the theory that a high-lead solder bump in fact is at fault is the fact that Nvidia ordered an immediate switch to use eutectic solders instead of high-lead versions in the last week of July. Eutectic solders are believed to solve the problem of fatigue cracking.