- Joined
- Oct 9, 2007
- Messages
- 47,890 (7.38/day)
- Location
- Dublin, Ireland
System Name | RBMK-1000 |
---|---|
Processor | AMD Ryzen 7 5700G |
Motherboard | Gigabyte B550 AORUS Elite V2 |
Cooling | DeepCool Gammax L240 V2 |
Memory | 2x 16GB DDR4-3200 |
Video Card(s) | Galax RTX 4070 Ti EX |
Storage | Samsung 990 1TB |
Display(s) | BenQ 1440p 60 Hz 27-inch |
Case | Corsair Carbide 100R |
Audio Device(s) | ASUS SupremeFX S1220A |
Power Supply | Cooler Master MWE Gold 650W |
Mouse | ASUS ROG Strix Impact |
Keyboard | Gamdias Hermes E2 |
Software | Windows 11 Pro |
Having reacted rather sharply to the ongoing global economic slump by planning massive workforce and production cuts, one would expect Intel to be conservative with its development potential. In a contradiction to just that, a recent conversation EETimes had with Mark Bohr, director of Intel's technology and manufacturing group, the director said that the company is on course with its plans to introduce the newer 32 nm silicon fabrication technology by late 2009.
"The 32 nm technology is getting ready to go into the manufacturing phase, we are lining up fabs to support it and we expect great demand. We are on track for shipping products in the fourth quarter and have 22 nm technology in development for 2011" said Mr. Bohr. The conversation previewed some of the papers Intel plans to present at the International Solid-State Circuits Conference that convenes next week.
Intel follows a "tick-tock" model of product development cycle, wherein, the company designs new microprocessor designs and silicon fabrication technologies in alternation. In each cycle, an architecture gets to be made on at least two successive fabrication technologies before itself being succeeded by a newer design. Currently Intel employs the 45 nm High-K metal gate manufacturing technology, on which it introduced later variants of the Core 2 series CPUs, and has introduced its Nehalem architecture, with Core i7 being its first commercial implementation.
View at TechPowerUp Main Site
"The 32 nm technology is getting ready to go into the manufacturing phase, we are lining up fabs to support it and we expect great demand. We are on track for shipping products in the fourth quarter and have 22 nm technology in development for 2011" said Mr. Bohr. The conversation previewed some of the papers Intel plans to present at the International Solid-State Circuits Conference that convenes next week.
Intel follows a "tick-tock" model of product development cycle, wherein, the company designs new microprocessor designs and silicon fabrication technologies in alternation. In each cycle, an architecture gets to be made on at least two successive fabrication technologies before itself being succeeded by a newer design. Currently Intel employs the 45 nm High-K metal gate manufacturing technology, on which it introduced later variants of the Core 2 series CPUs, and has introduced its Nehalem architecture, with Core i7 being its first commercial implementation.
View at TechPowerUp Main Site
Last edited: