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Intel's Skylake-X, Kaby Lake-X HEDT CPUs to use TIM; Won't be Soldered

But it's durable. 3 years working well, and 5+ years still working properly. And all you need to do is powering down PC on night each day for 30 days.

I had my suspicions when they named it SKY-X instead of SKY-E.

My favorite all time best has always been GELID GC Extreme. Noctua NT-H1 is fantastic but GELID is slight better.
 
Those CPUs are joke. TIM, 28 lanes and up to 11MB cache... lol
 
Those CPUs are joke. TIM, 28 lanes and up to 11MB cache... lol

They are suppose to rebalanced their cache hierarchy but I would like to see reviews on it asap. But my concern is more towards PCI Express 30 lanes. Consumer have to shell out for top tiers 7900X in order to get 44 Lanes.

On Side Note I think there is a mistake on this chart. Look at the memory support for 7800X. Unless i7 7800X is unique its memory support is 1200Mhz effective.

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That's honestly complete bullshit. There's no technical reason to do so as the main reason why Intel abandoned solder in their mainstream lineup was that the dies were so small they were liable to crack if you use solder instead of TIM.

But to do it with their HEDT line-up as well is just stupid and greedy.
 
40 lanes you mean, not 44.
 
Those CPUs are joke. TIM, 28 lanes and up to 11MB cache... lol
6+8 = 14MB instead of 15MB
8+11 = 19MB instead of 20 MB.
And caches are no longer inclusive. Which we don't know how well it would work. I think Intel did mistake of not having large L3 cache. These cores require larger data pool. And when these CPUs ran with only two cores active, large L3 caches wer VERY helpful. (Do you remember that mainstream CPU with 128 MB L4 cache?)
 
Yeah... you have no idea what you are talking about.

And your wannabe smug comment shows you don't either. The reason why I said AS5 is because it has very long durability. Unlike normal grease which dries up, cracks and becomes useless. You don't want that in an enclosed IHS that can't be easily replaced. AS5 has 10 years lifespan as far as I can rmemeber. That's why. But sure, I don't have a clue...

I'm not gonna be expecting liquid metal either knowing how stingy Intel is. On 4 digits priced CPU's. Then again, they should use TIM: One more reason to go with AMD instead...
 
6+8 = 14MB instead of 15MB
8+11 = 19MB instead of 20 MB.
And caches are no longer inclusive. Which we don't know how well it would work. I think Intel did mistake of not having large L3 cache. These cores require larger data pool. And when these CPUs ran with only two cores active, large L3 caches wer VERY helpful. (Do you remember that mainstream CPU with 128 MB L4 cache?)

Remember when C2D Extreme Edition used 4MB of L2 cache. And this CPU is very responsive till this day.

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That's honestly complete bullshit. There's no technical reason to do so as the main reason why Intel abandoned solder in their mainstream lineup was that the dies were so small they were liable to crack if you use solder instead of TIM.

But to do it with their HEDT line-up as well is just stupid and greedy.
Yup, Presler & Wolfdale dies for example were small also and they were soldered back then.
 
And your wannabe smug comment shows you don't either. The reason why I said AS5 is because it has very long durability. Unlike normal grease which dries up, cracks and becomes useless. You don't want that in an enclosed IHS that can't be easily replaced. AS5 has 10 years lifespan as far as I can rmemeber. That's why. But sure, I don't have a clue...

I'm not gonna be expecting liquid metal either knowing how stingy Intel is. On 4 digits priced CPU's. Then again, they should use TIM: One more reason to go with AMD instead...

A lot of companies use a common base of thermal paste, including retail products and also stock solutions. We are talking industrial companies such as Dow Corning, ShinEtsu, Schlegel, Ziitek etc. I can't speak for all of them, but the ones I know of all have a requirement to be stable for a minimum period of 6 years and 20-25k operation hours given the much harsher conditions for the industrial applications they are intended for, so the vast majority of thermal pastes used by companies already follow this. The exceptions are those that tinker around and come up either with a modified formulation or a new one entirely, such as SentraTeam and their phase change PCM.

The stock TIM Intel uses is among the more reliable already, and actually has a higher thermal conductivity than AS-5. That was why I was saying it makes zero sense to switch over to that specific retail TIM.
 
How can you not be amazed by Intel's lack of respect towards their HEDT customers.

I mean more like, how do you feel like that intel used crappy TIM once again on these expensive CPU's?

I am being direct but INTEL has a good history of utilizing cheap TIM on their past mainstream CPU's haswell,skylake,kabylake etc.

Seriously Intel? A freaking TIM instead of solder or other more durable solution? And we all know they'll be using the most garbage TIM they get from china in generic buckets..


That is why Intel is so popular:roll:
 
(Do you remember that mainstream CPU with 128 MB L4 cache?)
Yes, pretty much best gaming CPU right now on the market. :) (Source: Overclock.net)
 
Honestly, not even being sarcastic, good. Now I wont crack the core.


Exactly, and that is why my 5930K isn't De-lidded... if it had tim it would be by now
 
So what? Overclocking is a hobby, not a way of life. In the game of CPU one-up-man-ship, factory clocks are already very close to the speed the chip can comfortably run. Most OCing is a joke these days, so maybe this is a way to separate the noobs from the hard-core guys, by requiring a delid to get serious OCs. As others here have noted, that requires either huge balls or a large trust fund when delidding $1000-$2000 hardware!
 
And your wannabe smug comment shows you don't either. The reason why I said AS5 is because it has very long durability. Unlike normal grease which dries up, cracks and becomes useless. You don't want that in an enclosed IHS that can't be easily replaced. AS5 has 10 years lifespan as far as I can rmemeber. That's why. But sure, I don't have a clue...

I'm not gonna be expecting liquid metal either knowing how stingy Intel is. On 4 digits priced CPU's. Then again, they should use TIM: One more reason to go with AMD instead...


There is Arctic MX4 which performs great and lasts very long (8 years). I am using it for all my clients hardware for years. Never failed, never dissapointed me.

Liquid metal is overrated.

AS5 is shit.
 
So do we have an unconfirmed rumor here? Or does someone actually have these chips in their hands already and have de-lidded them to check?

Second, why is everyone jumping to conclusions? Has anyone seen benchmarks? Power draw? Temps?
 
So do we have an unconfirmed rumor here? Or does someone actually have these chips in their hands already and have de-lidded them to check?

Second, why is everyone jumping to conclusions? Has anyone seen benchmarks? Power draw? Temps?
This is already posted on the OP.

 
Which models did he de-lid? Were there any other benchmarks or before/after temps posted?

He literally says in the video.
 
So do we have an unconfirmed rumor here? Or does someone actually have these chips in their hands already and have de-lidded them to check?

Second, why is everyone jumping to conclusions? Has anyone seen benchmarks? Power draw? Temps?
I was under the impression it was only for the quad core HEDT CPUs aka Core i7-7740K, and Core i5-7640K. Everything else above in the product stack is still soldered.
 
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