Pro Overclocker der8auer Delids the AMD Ryzen 5 2600 Processor

[Hood]

This is not about TIM vs. solder. This is about solder vs. liquid metal with a reduced gap between the IHS and die.

Obviously. My point is, all the crowing about how great and necessary solder is, and it's beaten by goop from a tube (liquid metal is just another Thermal Interface Material, after all, with different ingredients). Also obvious to me, install IHS so it's closer to the die, and it transfers heat better.

 

[lexluthermiester]

I am actually somewhat surprised liquid metal beats straight Indium solder...

So am I. Logically it really shouldn't.

My point is, all the crowing about how great and necessary solder is, and it's beaten by goop from a tube (liquid metal is just another Thermal Interface Material, after all, with different ingredients).

4 degrees improvement is hardly worth the effort.

 

[bug]

Must be the reduced gap width since a 73 W/(m·K) metal TIM shouldnt be able to beat a ~80 W/(m·K) Indium alloy...

This has to be about something else than conductivity (as counterintuitive as that sounds). Geometry maybe - think a thinner layer.