Intel Announces Cascade Lake Advanced Performance and Xeon E-2100

[GC_PaNzerFIN]

Multi Chip Package LOL!

Your own engineering marketing team thinks its crap!

 

[jmcosta]

View attachment 109929

G̶l̶u̶e̶l̶e̶s̶s̶ ̶D̶e̶s̶i̶g̶n̶

There are 3 or 4 different types of heterogeneous designs, intel probably did a small silicon bridge into the package instead of an organic interposer.

It was unprofessional to have "glued together" on the sliders but that statement was correct, and that made AMD CPUs cost effective but introduced many problems from having poor connection density between dies.

maybe this new technique will solve several issues in one fell swoop.

 

[xorbe]

When did the term mcm become mcp.

 

[R0H1T]

There are 3 or 4 different types of heterogeneous designs, intel probably did a small silicon bridge into the package instead of an organic interposer.

It was unprofessional to have "glued together" on the sliders but that statement was correct, and that made AMD CPUs cost effective but introduced many problems from having poor connection density between dies.

maybe this new technique will solve several issues in one fell swoop.

Unlikely, they made EMIB for that & this one doesn't even use EMIB. It will in all likelihood be a worse glued together solution than AMD EPYCs & then there's Rome, Intel's in a potential downward spiral atm & this looks nothing short of a desperate move.

 

[m4dn355]

There are 3 or 4 different types of heterogeneous designs, intel probably did a small silicon bridge into the package instead of an organic interposer.

It was unprofessional to have "glued together" on the sliders but that statement was correct, and that made AMD CPUs cost effective but introduced many problems from having poor connection density between dies.

maybe this new technique will solve several issues in one fell swoop.

Technique of gluing together dies, what's next in intel's hypocrisy agenda - intel fabric?!

 

[mat9v]

Technique of gluing together dies, what's next in intel's hypocrisy agenda - intel fabric?!

Well, they have UPI with roughly the same throughput as external IF links, so...
But, yeah, they will have to come up with some high bandwidth bus to connect future MCM products and it will be similar to IF and it will be internal to their chips. Unless they will do some serious magic with Mesh topology like it is rumored EPYC2 is using.

 

[Mysteoa]

Its possible that Cascade Lake doesn't have HT, because I don't think they will be able to power and cool it if it had HT.

 

[jigar2speed]

If 48 is the best Intel can do right now, they are toast against 64 core EYPC that should be announced today. Oh and don't forget the price, performance and watt usage.

 

[Xajel]

Oooh, finally they hired a good glue expert.

 

[phill]

It's like everything for guys, higher numbers always equals better....

 

[Aquinus]

Damage control PR & Marketing in the professional server space is much less effective than in the less informed customer market.

Although buying corporate customers still works, AMD EPYC is flying past intel.

You mean like how you can spin up VMs using EPYC hardware at AWS now?

Put that into perspective for a moment. Amazon was exclusively Intel and now they're including AMD as an option for VMs in AWS. The more companies like Amazon that do that, the more it's going to hurt Intel. Intel has a stranglehold on the server market, but that also means that they have the most to lose.

 

[Deleted member 158293]

You mean like how you can spin up VMs using EPYC hardware at AWS now?

Put that into perspective for a moment. Amazon was exclusively Intel and now they're including AMD as an option for VMs in AWS. The more companies like Amazon that do that, the more it's going to hurt Intel. Intel has a stranglehold on the server market, but that also means that they have the most to lose.

Indeed AWS is a big crack in the intel wall. Also HPE, Oracle, and even Dell went on the record with a VP giving a small video blurb. Admittedly Dell probably just did that video to distance themselves from any more collusion accusations with intel... again. Doubt much will come out of that in the short or medium term. But still, AMD was able to create their own opening here through great engineering, not questionable deals. Now AMD needs to work out and emphasize a TCO (total cost of ownership) offer corporations just can't refuse, even if possibly indirectly bribed to do so.