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System Name | RBMK-1000 |
---|---|
Processor | AMD Ryzen 7 5700G |
Motherboard | Gigabyte B550 AORUS Elite V2 |
Cooling | DeepCool Gammax L240 V2 |
Memory | 2x 16GB DDR4-3200 |
Video Card(s) | Galax RTX 4070 Ti EX |
Storage | Samsung 990 1TB |
Display(s) | BenQ 1440p 60 Hz 27-inch |
Case | Corsair Carbide 100R |
Audio Device(s) | ASUS SupremeFX S1220A |
Power Supply | Cooler Master MWE Gold 650W |
Mouse | ASUS ROG Strix Impact |
Keyboard | Gamdias Hermes E2 |
Software | Windows 11 Pro |
AMD will debut TSMC's ambitious System-on-Integrated-Chips (SoIC) technology with its upcoming HPC chips, according to a DigiTimes report. A step toward rivaling Intel's Foveros 3-D chip stacking technology, SoIC will enable AMD to stack logic, memory, and I/O as separate chips within a single package. The article references a next-generation "HPC" chip, although it didn't delve into what this could be. Logically, AMD would want to integrate its EPYC and MI accelerator lines into a single package that can be used in HPCs. Such a product would combine its Zen-series x86-64 serial processing, with CDNA-series scalar processing, expertise in memory, leveraging large on-die victim-caches, and high-bandwidth memory (HBM); along with next-gen I/O.

View at TechPowerUp Main Site

View at TechPowerUp Main Site