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Intel and Submer, a company specializing in immersion cooling, are set to unveil a creative immersion cooling system at the OCP Global Summit. This system can efficiently dissipate 1,000 W of power in a single-phase liquid cooling setup designed for deployment in data centers. Unlike traditional water cooling, immersion cooling systems offer higher efficiency and reliability. The solution developed by Submer and Intel is based on a Forced Convection Heat Sink (FCHS) and leverages a heat exchanger for heat transfer with a second liquid. The primary advantage of immersion cooling is its lack of active components on the cooling element, making it possible for immersed systems to operate without them for extended periods.
In this new system, a copper cooler is housed with two fans at one end to enhance liquid flow through the heat sink using forced convection. However, this active cooling component contradicts the traditional passive concept of immersion cooling based on natural convection. In its initial phase, Submer and Intel utilized Xeon processors with an 800 W TDP, with plans to increase that figure to 1,000 W in the next step. This Forced Convection Heat Sink (FCHS) offers the advantages of easy manufacturing and cost-effective usage while effectively dissipating up to 1,000 W of waste heat, making it a compelling option for immersion cooling. There are even possibilities of being 3D printed, according to Submer, and the plan is to achieve cooling of 1kW+ chip. We expect to hear more about the system during the OCP Global Summit, running from October 17 to 19, as currently, we only have a lower-resolution image from Submer's press release.
View at TechPowerUp Main Site | Source
In this new system, a copper cooler is housed with two fans at one end to enhance liquid flow through the heat sink using forced convection. However, this active cooling component contradicts the traditional passive concept of immersion cooling based on natural convection. In its initial phase, Submer and Intel utilized Xeon processors with an 800 W TDP, with plans to increase that figure to 1,000 W in the next step. This Forced Convection Heat Sink (FCHS) offers the advantages of easy manufacturing and cost-effective usage while effectively dissipating up to 1,000 W of waste heat, making it a compelling option for immersion cooling. There are even possibilities of being 3D printed, according to Submer, and the plan is to achieve cooling of 1kW+ chip. We expect to hear more about the system during the OCP Global Summit, running from October 17 to 19, as currently, we only have a lower-resolution image from Submer's press release.
View at TechPowerUp Main Site | Source
