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GIGABYTE has continued to push a white aesthetic (ICE) across a good number of displayed products on the show floor at this year's CES. The TPU crew got a close peek at a couple of new motherboard offerings—first up is the Taiwanese manufacturer's Z790 AORUS PRO X model with a white PCB and matching livery. The "X" designation denotes that this motherboard is good-to-go with Intel's latest 14th gen desktop CPU offerings. Their AORUS Z790 X Gen Motherboards boast "leading performance in DDR5 memory, the upgraded DIY-friendly innovations, and the all-new BIOS redesigned as user-centered, the AORUS Z790 X Gen Motherboards are built to fully unleash the next-gen power."
According to GIGABYTE's placard this white Z790 model features a 18+1+2 Twin Digital VRM design on an eight-layer PCB, VRM Thermal Armor Advanced with an 8 mm heatpipe, as well as Thermal Guard XL and Ext. for M.2 slot cooling purposes. EZ-Latch Click and M.2 EZ-Latch Plus are present, therefore creating a "seamless" DIY experience. Wi-Fi 7 connectivity (with an Ultra-high gain antenna) ensure that cutting-edge wireless standards are catered for.
Next up is the X670E AORUS PRO X board—bringing the aforementioned white aesthetic for enthusiasts wanting to build on AMD's Ryzen 7000 series processors. The upcoming 8000G "Phoenix" APU series will also be supported on this AM5 platform (via a model-specific BIOS update to version F20). The white X670E AORUS PRO X model comes equipped with a 16+2+2 Twin Digital VRM solution (on an eight-layer PCB). Like its Intel-oriented sibling, it sports GIGABYTE's M.2 Thermal Guards (XL and Ext.) as well as EZ-Latch Click and M.2 EZ-Latch Plus.
GIGABYTE also fielded a more mid-range non-PRO offering—with their extravagantly named B650 AORUS ELITE X ICE model sitting alongside its pale partners. A slightly pruned feature set is in play here—you get a 12+2+2 Twin Digital VRM design (6-Layer PCB), VRM Thermal Armor Advanced (6 mm heatpipe), M.2 Thermal Guards, and Wi-Fi 6E.
This motherboard supports AMD's Ryzen 7000 CPU series according to the included placard, but the official GIGABYTE site also informs us of compatibility with the incoming 8000G processors (via an F20 BIOS update).
View at TechPowerUp Main Site | Source
According to GIGABYTE's placard this white Z790 model features a 18+1+2 Twin Digital VRM design on an eight-layer PCB, VRM Thermal Armor Advanced with an 8 mm heatpipe, as well as Thermal Guard XL and Ext. for M.2 slot cooling purposes. EZ-Latch Click and M.2 EZ-Latch Plus are present, therefore creating a "seamless" DIY experience. Wi-Fi 7 connectivity (with an Ultra-high gain antenna) ensure that cutting-edge wireless standards are catered for.
Next up is the X670E AORUS PRO X board—bringing the aforementioned white aesthetic for enthusiasts wanting to build on AMD's Ryzen 7000 series processors. The upcoming 8000G "Phoenix" APU series will also be supported on this AM5 platform (via a model-specific BIOS update to version F20). The white X670E AORUS PRO X model comes equipped with a 16+2+2 Twin Digital VRM solution (on an eight-layer PCB). Like its Intel-oriented sibling, it sports GIGABYTE's M.2 Thermal Guards (XL and Ext.) as well as EZ-Latch Click and M.2 EZ-Latch Plus.
GIGABYTE also fielded a more mid-range non-PRO offering—with their extravagantly named B650 AORUS ELITE X ICE model sitting alongside its pale partners. A slightly pruned feature set is in play here—you get a 12+2+2 Twin Digital VRM design (6-Layer PCB), VRM Thermal Armor Advanced (6 mm heatpipe), M.2 Thermal Guards, and Wi-Fi 6E.
This motherboard supports AMD's Ryzen 7000 CPU series according to the included placard, but the official GIGABYTE site also informs us of compatibility with the incoming 8000G processors (via an F20 BIOS update).
View at TechPowerUp Main Site | Source
