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AMD Ryzen 5 7400F De-Lid Reveals Thermal Paste Instead of STIM

btarunr

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Priced at the equivalent of $116, the China-exclusive Ryzen 5 7400F is a 6-core/12-thread processor powered by the older "Zen 4" microarchitecture, but which is based on the "Raphael" MCM, giving it a comprehensive PCIe Gen 5 I/O (as opposed to designing such a chip based on the "Phoenix Point" monolithic silicon with its PCIe Gen 4 I/O). The chip benefits from the full 32 MB on-die L3 cache being enabled on the "Zen 4" CCD, besides the full 1 MB per core L2 cache, and that I/O, but misses out on the iGPU. At its price, the 7400F is attracting a segment of value-conscious gamers.

To bring this chip at its price point, AMD had to cut costs somewhere, and Chinese PC enthusiast "Melon Master" soon found out where. On de-lidding (removing IHS) of the Ryzen 5 7400F, it was found that the chip does not use a soldered TIM like the other Ryzen 7000 series "Raphael" processors, instead using more cost-effective thermal paste, as is common in entry-level chips from both AMD and Intel. Harukaze5719 comments that this could be the reason the chip has a fairly noticeable Cinebench R23 performance delta against the Ryzen 5 7500F that's globally available, and has STIM, but is priced at $145. The 7400F and 7500F share the same base frequency of 3.70 GHz, but while the former boosts up to 4.70 GHz, the latter goes all the way up to 5.00 GHz.



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So delidded versions should clock as high or higher if the cooling is adequate?
 
So delidded versions should clock as high or higher if the cooling is adequate?
Could be that 7500Fs are better binned chips. Just my pure guess though.
 
I miss the old days when we never needed IHS's on CPU and had direct die cooling.
 
It's a 100-buck CPU, not using solder is perfectly acceptable.

I miss the old days when we never needed IHS's on CPU and had direct die cooling.
I don't miss cracked dies due to overtorque.
 
It's a 100-buck CPU, not using solder is perfectly acceptable.


I don't miss cracked dies due to overtorque.
It's not acceptable, we all learned from the fiasco when Intel used paste on their 4th Gen CPU's.
 
we all learned from the fiasco
Only happened to overclocked SKUs like 4670K and 4770K and their younger siblings, 4690K and 4790K. These were by no mean 100-dollar chips. Even in today's money. i3s had perfectly reasonable temperatures.

I don't like it but only the overclockers suffered from this decision.
 
It's not acceptable, we all learned from the fiasco when Intel used paste on their 4th Gen CPU's.
They used TIM from 3rd to 8th gen CPUs. 9th gen had soldered IHS only in K SKUs, I don't know about the later ones.
 
The Ryzen 8000G APUs are also on conventional TIM. I'm considering deliding mine since it does run hot asf.
 
I doubt many consumers will be aware of that fact. Soldered vs cheap toothpaste between die and headspreader. (TIM)

I'm not sure if AMD does itself a good service when they sell such garbage. Regardless if 100€ or not, this is garbage. Make it easier for the consumer to change the TIM - or sell a proper product
 
I doubt many consumers will be aware of that fact. Soldered vs cheap toothpaste between die and headspreader. (TIM)

I'm not sure if AMD does itself a good service when they sell such garbage. Regardless if 100€ or not, this is garbage. Make it easier for the consumer to change the TIM - or sell a proper product
Like it would have matered. Those people don't change even the regular paste. Only sales will show if it's garbage.
 
Like it would have matered. Those people don't change even the regular paste. Only sales will show if it's garbage.
Yeah, and so far this is a China exclusive. Wouldn't be surprised if this would be an OEM-only CPU IF this is released in the West. I'm pretty sure that a typical prebuilt user doesn't even know what thermal paste is.
 
They used TIM from 3rd to 8th gen CPUs. 9th gen had soldered IHS only in K SKUs, I don't know about the later ones.
And it sucked on all of them.

Data point for you... My old Kaby Lake 7700k, I tested before and after replacing the TIM under the lid w/ liquid metal. 20 degC difference under full load. Way too significant to just laugh off.
 
And it sucked on all of them.

Data point for you... My old Kaby Lake 7700k, I tested before and after replacing the TIM under the lid w/ liquid metal. 20 degC difference under full load. Way too significant to just laugh off.
Had about the same difference with 7700K. After delid, OC'd stably to 5.2GHz (AVX -2 offset).
 
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