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| System Name | RBMK-1000 |
|---|---|
| Processor | AMD Ryzen 7 5700G |
| Motherboard | Gigabyte B550 AORUS Elite V2 |
| Cooling | DeepCool Gammax L240 V2 |
| Memory | 2x 16GB DDR4-3200 |
| Video Card(s) | Galax RTX 4070 Ti EX |
| Storage | Samsung 990 1TB |
| Display(s) | BenQ 1440p 60 Hz 27-inch |
| Case | Corsair Carbide 100R |
| Audio Device(s) | ASUS SupremeFX S1220A |
| Power Supply | Cooler Master MWE Gold 650W |
| Mouse | ASUS ROG Strix Impact |
| Keyboard | Gamdias Hermes E2 |
| Software | Windows 11 Pro |
Team Group Inc will be announcing at CeBIT 2010 the world-first limited edition overclocking memory Xtreem LV DDR3 2400 to set again a new barrier for overclocking memory. Team not only enhances the bandwidth of the module to 19,200MB/sec, but also sets users at the tip of the pyramid as the target customer group. The Xtreem LV DDR3 2400 will be delivered in limited edition and considered as the most stunning star product that Team displays at CeBIT 2010.
Based on the memory architecture evolution on Intel Core i7 and Core i5, Team raises the frequency of the Xtreem LV DDR3 by 20% from 2000MHz to 2400MHz. Also, by continuing the high frequency and low latency tradition of the Xtreem LV memory, the Xtreem LV DDR3 2400 can fully display the configuration 9-10-10-30 (tCL-tRCD-tRP-tRAS) at a low operating voltage at 1.6V without sacrificing either performance or stability. All these have witnessed the extraordinary R&D capacity and capability of Team. In addition to the unchanged genuine chip policy, Team ensures chip quality with the exclusive sorting technology to screen chips. In order to further ensure the optimal performance and flawless quality of the Xtreem LV DDR3 2400, Team applies the 24-hour burn-in test and industry-approved MemTest software to perform the OQC inspection of all modules before shipping to assure the stability and exceptional performance of every Xtreem LV DDR3 2400.
The Xtreem LV DDR3 2400 from Team has a conventional 8-layered PCB design and is covered with the X-mark heat-sink labeled for the Xtreem series. In addition to the clean appearance as found in all Team Xtreem memory modules, a groove has been added to the heat-sink for power users to install fans on top to enhance ventilation.
View at TechPowerUp Main Site
Based on the memory architecture evolution on Intel Core i7 and Core i5, Team raises the frequency of the Xtreem LV DDR3 by 20% from 2000MHz to 2400MHz. Also, by continuing the high frequency and low latency tradition of the Xtreem LV memory, the Xtreem LV DDR3 2400 can fully display the configuration 9-10-10-30 (tCL-tRCD-tRP-tRAS) at a low operating voltage at 1.6V without sacrificing either performance or stability. All these have witnessed the extraordinary R&D capacity and capability of Team. In addition to the unchanged genuine chip policy, Team ensures chip quality with the exclusive sorting technology to screen chips. In order to further ensure the optimal performance and flawless quality of the Xtreem LV DDR3 2400, Team applies the 24-hour burn-in test and industry-approved MemTest software to perform the OQC inspection of all modules before shipping to assure the stability and exceptional performance of every Xtreem LV DDR3 2400.
The Xtreem LV DDR3 2400 from Team has a conventional 8-layered PCB design and is covered with the X-mark heat-sink labeled for the Xtreem series. In addition to the clean appearance as found in all Team Xtreem memory modules, a groove has been added to the heat-sink for power users to install fans on top to enhance ventilation.
View at TechPowerUp Main Site
