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| System Name | RBMK-1000 |
|---|---|
| Processor | AMD Ryzen 7 5700G |
| Motherboard | Gigabyte B550 AORUS Elite V2 |
| Cooling | DeepCool Gammax L240 V2 |
| Memory | 2x 16GB DDR4-3200 |
| Video Card(s) | Galax RTX 4070 Ti EX |
| Storage | Samsung 990 1TB |
| Display(s) | BenQ 1440p 60 Hz 27-inch |
| Case | Corsair Carbide 100R |
| Audio Device(s) | ASUS SupremeFX S1220A |
| Power Supply | Cooler Master MWE Gold 650W |
| Mouse | ASUS ROG Strix Impact |
| Keyboard | Gamdias Hermes E2 |
| Software | Windows 11 Pro |
Toshiba Corporation's Semiconductor & Storage Products Company announced it will showcase a reference display of the world's first PCI Express (PCIe) single package SSD, integrating up to 256 GB in a single BGA package, at the 2015 International Consumer Electronics Show (CES), to be held from January 6 to January 9 in Las Vegas, U.S.A.
The "BG Series" SSDs on reference display will be products under development. Utilizing Toshiba's cutting-edge packaging technology applied in products like e・MMC, it is the world's first PCI Express single package SSD, available in capacities up to 256 GB in a 16 mm x 20 mm x 1.65 mm BGA package. Also to be showcased will be a reference display of the world's smallest removable module type SSD, which integrates the BGA single package SSD on a single-sided form factor.
The new SSDs incorporate PCI Express, a high speed serial I/O interface for PCs, as physical interface and NVM Express optimized for SSDs as command interface.
The single package type SSDs of the new series weigh below 1 g, reducing weight by approximately 98%, compared to 2.5-inch types widely used in PCs. It also reduces storage space by more than 95%. It can contribute to light-weight mobile PCs and also to longer battery life by increasing available space for battery packs.
View at TechPowerUp Main Site
The "BG Series" SSDs on reference display will be products under development. Utilizing Toshiba's cutting-edge packaging technology applied in products like e・MMC, it is the world's first PCI Express single package SSD, available in capacities up to 256 GB in a 16 mm x 20 mm x 1.65 mm BGA package. Also to be showcased will be a reference display of the world's smallest removable module type SSD, which integrates the BGA single package SSD on a single-sided form factor.
The new SSDs incorporate PCI Express, a high speed serial I/O interface for PCs, as physical interface and NVM Express optimized for SSDs as command interface.
The single package type SSDs of the new series weigh below 1 g, reducing weight by approximately 98%, compared to 2.5-inch types widely used in PCs. It also reduces storage space by more than 95%. It can contribute to light-weight mobile PCs and also to longer battery life by increasing available space for battery packs.
View at TechPowerUp Main Site
