- Joined
- Aug 19, 2017
- Messages
- 3,044 (1.08/day)
AMD is already looking ahead to its Zen 7 generation and is planning the final details for its next generation of Zen IP. The first hints come from YouTuber "Moore's Law Is Dead," which points to a few interesting decisions. AMD plans to extend its multi‑class core strategy that began with Zen 4c and continued into Zen 5. Zen 7 will reportedly include three types of cores: the familiar performance cores, dense cores built for maximum throughput, and a new low‑power variant aimed at energy‑efficient tasks, just like Intel and its LP/E-Cores. There is even an unspecified "PT" and "3D" core. By swapping out pipeline modules and tweaking their internal libraries, AMD can fine‑tune each core so it performs best in its intended role, from running virtual machines in the cloud to handling AI workloads at the network edge.
On the manufacturing front, Zen 7 compute chiplets (CCDs) are expected to be made on TSMC's A14 process, which will now include a backside power delivery network. This was initially slated for the N2 node but got shifted to the A16/A14 line. The 3D V‑Cache SRAM chiplets underneath the CCDs will remain on TSMC's N4 node. It is a conservative choice, since TSMC has talked up using N2‑based chiplets for stacked memory in advanced packaging, but AMD appears to be playing it safe. Cache sizes should grow, too. Each core will get 2 MB of L2 cache instead of the current 1 MB, and L3 cache per core could expand to 7 MB through stacked V‑Cache slices. Standard CCDs without V‑Cache will still have around 12 MB of shared L3, while dense‑core CCDs might pack 16 cores and 32 MB of L3. A bold rumour suggests an EPYC model could feature 33 cores per CCD, totaling 264 cores across eight CCDs. Zen 7 tape‑out is planned for late 2026 or early 2027, and we probably won't see products on shelves until 2028 or later. As always with early-stage plans, take these details with a healthy dose of scepticism. The final Zen 7 lineup could look quite different once AMD locks down its roadmap.
View at TechPowerUp Main Site | Source
On the manufacturing front, Zen 7 compute chiplets (CCDs) are expected to be made on TSMC's A14 process, which will now include a backside power delivery network. This was initially slated for the N2 node but got shifted to the A16/A14 line. The 3D V‑Cache SRAM chiplets underneath the CCDs will remain on TSMC's N4 node. It is a conservative choice, since TSMC has talked up using N2‑based chiplets for stacked memory in advanced packaging, but AMD appears to be playing it safe. Cache sizes should grow, too. Each core will get 2 MB of L2 cache instead of the current 1 MB, and L3 cache per core could expand to 7 MB through stacked V‑Cache slices. Standard CCDs without V‑Cache will still have around 12 MB of shared L3, while dense‑core CCDs might pack 16 cores and 32 MB of L3. A bold rumour suggests an EPYC model could feature 33 cores per CCD, totaling 264 cores across eight CCDs. Zen 7 tape‑out is planned for late 2026 or early 2027, and we probably won't see products on shelves until 2028 or later. As always with early-stage plans, take these details with a healthy dose of scepticism. The final Zen 7 lineup could look quite different once AMD locks down its roadmap.
View at TechPowerUp Main Site | Source
(yes, I know they're much better than ReRaptor)
