SK hynix presented its leading memory solutions optimized for AI servers and AI PCs at Dell Technologies World (DTW) 2025 in Las Vegas from May 19-22. Hosted by Dell Technologies, DTW is an annual conference which introduces future technology trends. In line with DTW 2025's theme of "Accelerate from Ideas to Innovation," a wide range of products and technologies aimed at driving AI innovation was showcased at the event.
Based on its close partnership with Dell, SK hynix has participated in the event every year to reinforce its leadership in AI. This year, the company organized its booth into six sections: HBM, CMM (CXL Memory Module)-DDR5, server DRAM, PC DRAM, eSSDs, and cSSDs. Featuring products with strong competitiveness across all areas of DRAM and NAND flash for the AI server, storage and PC markets, the booth garnered strong attention from visitors.
In the HBM section, SK hynix presented samples of its 12-layer HBM4, capable of processing over 2 terabytes (TB) of data per second with industry-leading speed optimized for AI, alongside the 12-layer HBM3E, the industry's best-performing and highest-capacity HBM on the market. Currently under development, HBM4 is a next-generation HBM set to offer enhanced base die performance and reduced power consumption. SK hynix recently became the first in the world to provide samples of HBM4 to major customers, reaffirming its leadership in AI memory. At the exhibition, the company also displayed its HBM3E paired with the B100, NVIDIA's latest Blackwell GPU, highlighting its strong partnerships with global customers.
The CMM-DDR5 section featured SK hynix's high-capacity 96 and 128 gigabyte (GB) CMM-DDR5 products. As a DDR5 memory module based on CXL technology, CMM-DDR5 offers 50% greater capacity and 30% more bandwidth compared to conventional configurations. A video demo captured significant attention from visitors by showcasing how SK hynix's CMM-DDR5 delivers stable performance while overcoming capacity limitations in systems equipped with server processors from major CPU manufacturers.
In the server DRAM section, SK hynix presented a lineup of DDR5-based memory modules for servers. The spotlight was on the DDR5 RDIMM and MRDIMM products built using the 1c node, the sixth generation of the 10 nm process technology. The company also showcased various DRAM solutions designed to maximize AI server performance and reduce power consumption, including its 96 GB DDR5 RDIMM, 256 GB 3DS DDR5 RDIMM, and DDR5 MRDIMM in both 96 GB and 256 GB capacities.
Visitors to the PC DRAM section explored SK hynix's key DRAM offerings for the on-device AI market. These included LPCAMM2, which integrates multiple LPDDR5X chips into a single module for power efficiency and high performance, and GDDR7, the industry's best-performing graphics memory product.
Various next-generation NAND products were displayed in the eSSD/cSSD section. Notably, the booth featured a Dell server system (R7625) equipped with the PS1010. A PCIe 5.0 eSSD which combines multiple 176-layer 4D NAND chips, the PS1010 is optimized for AI-driven applications and data centers.
In addition, the section also featured PS1012 and PCB01 SSDs which are leading the AI server and PC markets. The PS1012, boasting a significant capacity of 61 TB, is a PCIe 5.0/QLC-based eSSD, meeting the rapidly increasing demand for high-capacity eSSDs.
The PCB01, a cSSD product boasting sequential read speeds of 14 GB per second and sequential write speeds of 12 GB per second, was demonstrated during the exhibition. Offering excellent performance and compatibility in a desktop environment with an Intel PC processor, this cSSD is expected to play a key role in the on-device AI market, including in AI PCs.
Meanwhile, SK hynix shared insights on AI memory and next-generation technologies through its presentation sessions.
Technical Leaders Gyoyoung Lee and Jungwon Park from SSD Product Planning gave a joint presentation on "Key Things to Consider for Your AI storage." Additionally, Technical Leader Santosh Kumar from DRAM Technology Planning (DRAM TP) at SK hynix America emphasized the future value of CMM products with his presentation on "Why Do We Need CMM Devices in the AI Era?"
Through DTW 2025, SK hynix observed the rapid growth in demand for AI memory and storage across AI servers, PCs and the broader industry. Moving forward, the company will continue to strengthen technological collaboration based on one-team partnerships with customers, providing high-performance products in a timely manner to meet market needs.
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Based on its close partnership with Dell, SK hynix has participated in the event every year to reinforce its leadership in AI. This year, the company organized its booth into six sections: HBM, CMM (CXL Memory Module)-DDR5, server DRAM, PC DRAM, eSSDs, and cSSDs. Featuring products with strong competitiveness across all areas of DRAM and NAND flash for the AI server, storage and PC markets, the booth garnered strong attention from visitors.
In the HBM section, SK hynix presented samples of its 12-layer HBM4, capable of processing over 2 terabytes (TB) of data per second with industry-leading speed optimized for AI, alongside the 12-layer HBM3E, the industry's best-performing and highest-capacity HBM on the market. Currently under development, HBM4 is a next-generation HBM set to offer enhanced base die performance and reduced power consumption. SK hynix recently became the first in the world to provide samples of HBM4 to major customers, reaffirming its leadership in AI memory. At the exhibition, the company also displayed its HBM3E paired with the B100, NVIDIA's latest Blackwell GPU, highlighting its strong partnerships with global customers.
The CMM-DDR5 section featured SK hynix's high-capacity 96 and 128 gigabyte (GB) CMM-DDR5 products. As a DDR5 memory module based on CXL technology, CMM-DDR5 offers 50% greater capacity and 30% more bandwidth compared to conventional configurations. A video demo captured significant attention from visitors by showcasing how SK hynix's CMM-DDR5 delivers stable performance while overcoming capacity limitations in systems equipped with server processors from major CPU manufacturers.
In the server DRAM section, SK hynix presented a lineup of DDR5-based memory modules for servers. The spotlight was on the DDR5 RDIMM and MRDIMM products built using the 1c node, the sixth generation of the 10 nm process technology. The company also showcased various DRAM solutions designed to maximize AI server performance and reduce power consumption, including its 96 GB DDR5 RDIMM, 256 GB 3DS DDR5 RDIMM, and DDR5 MRDIMM in both 96 GB and 256 GB capacities.
Visitors to the PC DRAM section explored SK hynix's key DRAM offerings for the on-device AI market. These included LPCAMM2, which integrates multiple LPDDR5X chips into a single module for power efficiency and high performance, and GDDR7, the industry's best-performing graphics memory product.
Various next-generation NAND products were displayed in the eSSD/cSSD section. Notably, the booth featured a Dell server system (R7625) equipped with the PS1010. A PCIe 5.0 eSSD which combines multiple 176-layer 4D NAND chips, the PS1010 is optimized for AI-driven applications and data centers.
In addition, the section also featured PS1012 and PCB01 SSDs which are leading the AI server and PC markets. The PS1012, boasting a significant capacity of 61 TB, is a PCIe 5.0/QLC-based eSSD, meeting the rapidly increasing demand for high-capacity eSSDs.
The PCB01, a cSSD product boasting sequential read speeds of 14 GB per second and sequential write speeds of 12 GB per second, was demonstrated during the exhibition. Offering excellent performance and compatibility in a desktop environment with an Intel PC processor, this cSSD is expected to play a key role in the on-device AI market, including in AI PCs.
Meanwhile, SK hynix shared insights on AI memory and next-generation technologies through its presentation sessions.
Technical Leaders Gyoyoung Lee and Jungwon Park from SSD Product Planning gave a joint presentation on "Key Things to Consider for Your AI storage." Additionally, Technical Leader Santosh Kumar from DRAM Technology Planning (DRAM TP) at SK hynix America emphasized the future value of CMM products with his presentation on "Why Do We Need CMM Devices in the AI Era?"
Through DTW 2025, SK hynix observed the rapid growth in demand for AI memory and storage across AI servers, PCs and the broader industry. Moving forward, the company will continue to strengthen technological collaboration based on one-team partnerships with customers, providing high-performance products in a timely manner to meet market needs.
View at TechPowerUp Main Site | Source