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- Oct 24, 2004
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Hello,
I bought 2 adaptec RAID cards and those babies can run pretty hot (70°C / 160°F) even with decent case cooling.
That's why i decided to clean the main chips and apply a new thermal compound layer.
The thing is, Adaptec used those pink "gum like" thermal pads and it's a real pain to remove completly / properly. So far i did my best to remove most of the dried pad using a cutter's sharp edge across the surface, and 98% came off nicely. The remaining 2 % is still sticky and leave a thin layer all across the heatsink and the chip.
My question is, how do you deal with thermal compound removal in order to restore the flattest & cleanest surface possible ?.
Thanks in advance for your advices.
edit : added picture
I bought 2 adaptec RAID cards and those babies can run pretty hot (70°C / 160°F) even with decent case cooling.
That's why i decided to clean the main chips and apply a new thermal compound layer.
The thing is, Adaptec used those pink "gum like" thermal pads and it's a real pain to remove completly / properly. So far i did my best to remove most of the dried pad using a cutter's sharp edge across the surface, and 98% came off nicely. The remaining 2 % is still sticky and leave a thin layer all across the heatsink and the chip.
My question is, how do you deal with thermal compound removal in order to restore the flattest & cleanest surface possible ?.
Thanks in advance for your advices.

edit : added picture