- Joined
- Mar 24, 2022
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| System Name | Lenovo LOQ 15 |
|---|---|
| Processor | Ryzen 7 7840HS |
| Memory | Crucial 32GB (2 x 16) DDR5 5600 SODIMM |
| Video Card(s) | RTX 4050 Mobile OC @ 2.8 GHz (dGPU)/ Radeon 780M (iGPU) |
| Storage | Micron MTFDKCD512TFK 512GB (Will Upgrade) |
| Display(s) | 1080p 144Hz Laptop Display |
| Audio Device(s) | Laptop Realtek Speakers (Dolby Atmos for Headphones) |
| Software | Windows 11 |
With the rise of multi-chiplet packages from companies such as AMD & Apple, there are challenges shown from current PHY technologies such as cost, reach, yields, etc, as explained about NuLink in the link below (no pun intended). Eliyan's tech solves this by ridding the need for interposers which solves multiple issues with current PHY technologies but then solves the low bandwidth drawback with NuLink connecters between each chiplet. This may also benefit single-chiplet packages with the removal of the interposer which could reduce cost & help production/yields or even benefit devices like phones in which the SoC and RAM are so close to each other that with NuLink's extended range, could bring new levels of bandwidth.
These are just the ideas going through my head but with Eliyan's tech being seemingly successful, how will you think this will benefit the chiplet/PCB world for the better and what potential does this have?
Edit: I do wonder how chip manufacturers are seeing this and how and when will they use this?
Link: https://www.nextplatform.com/2024/03/28/how-to-build-a-better-blackwell-gpu-than-nvidia-did/
These are just the ideas going through my head but with Eliyan's tech being seemingly successful, how will you think this will benefit the chiplet/PCB world for the better and what potential does this have?
Edit: I do wonder how chip manufacturers are seeing this and how and when will they use this?
Link: https://www.nextplatform.com/2024/03/28/how-to-build-a-better-blackwell-gpu-than-nvidia-did/
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